CN201464508U - Pogo pin contact pad and probe card using the same - Google Patents
Pogo pin contact pad and probe card using the same Download PDFInfo
- Publication number
- CN201464508U CN201464508U CN 200920005231 CN200920005231U CN201464508U CN 201464508 U CN201464508 U CN 201464508U CN 200920005231 CN200920005231 CN 200920005231 CN 200920005231 U CN200920005231 U CN 200920005231U CN 201464508 U CN201464508 U CN 201464508U
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- China
- Prior art keywords
- spring needle
- needle contact
- contact mat
- probe
- connection pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000523 sample Substances 0.000 title claims abstract description 74
- 238000012360 testing method Methods 0.000 claims abstract description 26
- 238000009413 insulation Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- 239000013078 crystal Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 11
- 239000003292 glue Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 210000001364 upper extremity Anatomy 0.000 description 1
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- Measuring Leads Or Probes (AREA)
Abstract
一种弹簧针接触垫，设置于一探针卡上，供接收测试信号，所述弹簧针接触垫包括一导电层，一绝缘层，一屏蔽层和一I/O接垫，其特征在于：所述导电层，设在所述绝缘层下；所述绝缘层，设在所述导电层上；所述屏蔽层，设在所述绝缘层上；所述I/O接垫，设在所述绝缘层上；其中，所述屏蔽层环绕所述I/O接垫，所述测试信号经由所述I/O接垫输入所述探针卡。
A spring pin contact pad is arranged on a probe card for receiving a test signal. The spring pin contact pad includes a conductive layer, an insulating layer, a shielding layer and an I/O pad. The conductive layer is arranged under the insulating layer; the insulating layer is arranged on the conductive layer; the shielding layer is arranged on the insulating layer; the I/O pad is arranged on the insulating layer; wherein the shielding layer surrounds the I/O pad, and the test signal is input into the probe card via the I/O pad.
Description
Technical field
The utility model relates to a kind of probe (probe card), specifically, is a kind of spring needle contact mat (pogo pad) that is applied to probe.
Background technology
The test of crystal grain is a necessary operation in the semiconductor production process.Along with the development of semiconductor technology, the size of crystal grain is more and more littler and circuit complexity is more and more higher, for the also raising thereupon of requirement of test.Fig. 1 is the top view of known probe card.When test crystal grain, test machine contacts with spring needle contact mat 10 on the substrate 12 via the spring needle on the measuring head (pogo pin) and injects test signal, described test signal is via the circuit in connecting line or the substrate 12, be delivered to many probes of probe below, more described probe contacts the weld pad on the tested crystal grain, test signal is sent into tested crystal grain, the signal of the tested generation of crystal grain is returned to test machine via spring needle contact mat 10 and measuring head obtain test result again.
The known probe card is to make with the multilayer pressure type that changes.When forming the spring needle contact mat 10 of the superiors, be that the Copper Foil metal with full wafer invests on the substrate 12 with the adhesion sticker, again with chemical etching with described Copper Foil metal pattern, once form a plurality of spring needle contact mats 10.Fig. 2 shows the detail structure of spring needle contact mat 10.By patterning Copper Foil metal, I/O connection pad 102 is formed on the substrate 12 of probe with screen layer 104.I/O connection pad 102 is used for transmitting signal, and the screen layer 104 of outer rim provides the noise shielding function of horizontal direction around I/O connection pad 102, lowers the interference that extraneous noise causes test signal.
Yet chemical etching can't be removed adhesion glue fully, and this makes that adhesion glue is arranged between the spring needle contact mat 10 is residual, forms drain current path between adjacency channel (channel), thereby reduces the fiduciary level of test.In addition, because those spring needle contact mats 10 are to be formed on the probe card substrate by patterning Copper Foil metal one-time, for example Ri Bente Open equals the probe of the public Open of 2-222156 No., no matter therefore be when making or after using, in case the situation of bad characteristic or decay appears in spring needle contact mat 10 partly, just must make whole probe again, the No method is pulled down replacing with each other spring needle contact mat 10, so the with high costs and friendship phase of probe is long.
Therefore known probe exists above-mentioned all inconvenience and problem.
The utility model content
The purpose of this utility model is to propose a kind of spring needle contact mat.
Another purpose of the present utility model is to propose a kind of probe.
For achieving the above object, technical solution of the present utility model is:
A kind of spring needle contact mat is arranged on the probe, and for the acceptance test signal, described spring needle contact mat comprises a conductive layer, an insulation course, and a screen layer and an I/O connection pad is characterized in that:
Described conductive layer is located under the described insulation course;
Described insulation course is located on the described conductive layer;
Described screen layer is located on the described insulation course;
Described I/O connection pad is located on the described insulation course;
Wherein, described screen layer is around described I/O connection pad, and described test signal is imported described probe via described I/O connection pad.
Spring needle contact mat of the present utility model can also be further achieved by the following technical measures.
Aforesaid spring needle contact mat, wherein said conductive layer, described screen layer and described I/O connection pad have same potential.
Aforesaid spring needle contact mat comprises more that wherein a base plate is located under the described conductive layer.
Aforesaid spring needle contact mat comprises more that wherein a socket is located on the described screen layer.
Aforesaid spring needle contact mat, wherein said socket electrically connect described I/O connection pad.
Aforesaid spring needle contact mat comprises more that wherein an over cap is located on described I/O connection pad and the described screen layer.
Aforesaid spring needle contact mat comprises more that wherein a load bearing seat is located on the described over cap.
A kind of probe is used for test signal is injected tested crystal grain, and described probe comprises a substrate, a spring needle contact mat, and a probe and a connecting line is characterized in that:
Described substrate is provided with mounting groove;
Described spring needle contact mat is installed in the described mounting groove, for receiving described test signal;
Described probe is for the described tested crystal grain of contact;
Described connecting line electrically connects described spring needle contact mat and described probe, to transmit described test signal.
Probe of the present utility model can also be further achieved by the following technical measures.
Aforesaid probe, wherein said spring needle contact mat comprises:
One conductive layer;
One insulation course is located on the described conductive layer;
One screen layer is located on the described insulation course;
One I/O connection pad is located on the described insulation course;
Wherein, described screen layer is around described I/O connection pad, and described test signal is imported described probe via described I/O connection pad.
Aforesaid probe, wherein said conductive layer, described screen layer and described I/O connection pad have same potential.
Aforesaid probe comprises more that wherein a socket is located on the described screen layer, and described socket electrically connects described I/O connection pad.
A kind of probe is used for test signal is injected tested crystal grain, and described probe comprises a substrate, a spring needle contact mat group, and a probe and a connecting line is characterized in that:
Described substrate is provided with mounting groove;
Described spring needle contact mat group is made up of a plurality of spring needle contact mats, is installed in the described mounting groove;
Described probe is for the described tested crystal grain of contact;
Described connecting line electrically connects described spring needle contact mat and described probe, to transmit described test signal.
Aforesaid probe, wherein said spring needle contact mat comprises:
One conductive layer;
One insulation course is located on the described conductive layer;
One screen layer is located on the described insulation course;
One I/O connection pad is located on the described insulation course;
Wherein, described screen layer is around described I/O connection pad, and described test signal is imported described probe via described I/O connection pad.
Aforesaid probe, wherein said conductive layer, described screen layer and described I/O connection pad have same potential.
Aforesaid probe comprises more that wherein a base plate is located under the described conductive layer, and described each spring needle contact mat group is shared described base plate.
Aforesaid probe comprises more that wherein a socket is located on the described screen layer, and described socket electrically connects described I/O connection pad.
After adopting technique scheme, the probe of spring needle contact mat of the present utility model and the described spring needle contact mat of application has following advantage:
1. exempt known adhesion glue problem.
2. reduce probe manufacturing and maintenance cost.
3. further reduce leakage current, for test signal provides better screening ability.
Description of drawings
Fig. 1 is the top view of known probe card;
Fig. 2 is the structural map of known spring needle contact mat;
Fig. 3 is the structural map of spring needle contact mat one embodiment of the present utility model;
Fig. 4 is the structural map of another embodiment of spring needle contact mat of the present utility model;
Fig. 5 is the synoptic diagram of probe first embodiment of the present utility model;
Fig. 6 is the synoptic diagram of chimeric another embodiment of spring needle contact mat;
Fig. 7 is the synoptic diagram of probe second embodiment of the present utility model;
Fig. 8 is the synoptic diagram of probe the 3rd embodiment of the present utility model;
Fig. 9 is another embodiment synoptic diagram of spring needle contact mat of the present utility model;
Figure 10 is applied to the synoptic diagram of plug-in type spring needle contact mat for the utility model;
Figure 11 is applied to another embodiment synoptic diagram of plug-in type spring needle contact mat for the utility model;
Figure 12 is the sectional view of cantalever type probe card of the present utility model;
Figure 13 is the sectional view of vertical probe carb of the present utility model;
Figure 14 is the sectional view of microcomputer electric detecting probe fasten of the present utility model.
Wherein
10 spring needle contact mats
The 102I/O connection pad
104 screen layers
12 substrates
20 spring needle contact mats
The 200I/O connection pad
202 screen layers
204 insulation courses
206 conductive layers
208 base plates
22 substrates
220 mounting grooves
222 mounting grooves
224 mounting grooves
226 mounting grooves
25 spring needle contact mats
26 spring needle contact mats
30 films
32 films
34 spring needle contact mats
36 base materials
362 connection straps
38 spring needle contact mats
40 sockets
42 load bearing seats
44 load bearing seats
46 over caps
50 probes
52 glue posts
54 connecting lines
56 spring needle contact mats
The 560I/O connection pad
562 screen layers
564 insulation courses
566 conductive layers
568 base plates
60 substrates
62 elastic
64 probes
66 space convertors
68 probes.
Embodiment
Below in conjunction with embodiment and accompanying drawing thereof the utility model is illustrated further.
In order to ensure the fiduciary level of test, the leakage current on the probe must force down as far as possible.Because electric current
I=Δ V/R, formula 1
Therefore, the method for improving leakage current is except eliminating between the adjacent springs pin contact mat and the drain current path between I/O connection pad and the screen layer, makes outside resistance R increases as far as possible, can also reach by reducing Δ V.
Now see also Fig. 3, Fig. 3 is the structural map of spring needle contact mat one embodiment of the present utility model. as shown in the figure, I/O connection pad 200 and screen layer 202 are on insulation course 204, wherein screen layer 202 provides the noise shielding ability of horizontal direction around I/O connection pad 200, conductive layer 206 is below insulation course 204, the function of shielding of vertical direction is provided for I/O connection pad 200. in the present embodiment, each spring needle contact mat 20 is independent manufacturings, for being arranged on the substrate of a probe, therefore no longer include the residual drain current path that causes of adhesion glue between each spring needle contact mat. in addition, present embodiment also provides the current potential identical with I/O connection pad 200 to screen layer 202 and conductive layer 206, make Δ V level off to zero, with further reduction leakage current, make that simultaneously screen layer 202 and conductive layer 206 are able to provide better noise shielding function in level and vertical direction.
Fig. 4 shows another embodiment of spring needle contact mat of the present utility model, and base plate 208 is set below conductive layer 206, as with the surface of contact of probe card substrate.
Fig. 5 shows first embodiment according to probe of the present utility model, and substrate 22 is provided with a plurality of mounting grooves 220 for mounting spring pin contact mat 25.Because spring needle contact mat 20 time only need bear the downforce that is applied by measuring head in work, as long as so mounting groove 220 can closely cooperate with spring needle contact mat 25, spring needle contact mat 20 can not slided gets final product.In other embodiments, also chimeric mechanism can be set, or cooperate viscose glue that spring needle contact mat 25 is adhered on the substrate 22.Because spring needle contact mat 20 is indivedual manufacturings and installs, and can change individually when bad characteristic or decay, does not need to make again whole probe.
Fig. 6 is fixed on synoptic diagram on the substrate 22 for another kind of with spring needle contact mat 25, contracts in the upper limb of mounting groove 222 and forms slide rail, so that spring needle contact mat 25 is installed or removed to slide the embedding mode.
Fig. 7 is the synoptic diagram according to probe second embodiment of the present utility model, the substrate 22 of probe is provided with four mounting grooves 224, with reference to Fig. 3, the spring needle contact mat 26 of a plurality of tool vertical direction screening abilities is arranged on the film 30, every film 30 forms the spring needle contact mat group of one group of four/same form, when the situation of bad characteristic appears in the spring needle contact mat, just change the whole group of spring needle contact mat at place, described spring needle contact mat place.Though this design can sacrifice some still spendable spring needle contact mats, can make the replacing of spring needle contact mat more easy fast.
Fig. 8 is the synoptic diagram of probe the 3rd embodiment of the present utility model, four mounting grooves 226 are set on the substrate 22, but change on the every film 32 six spring needle contact mats 34 are set, form the spring needle contact mat group of eight/same form, keep the advantage of changing the spring needle contact mat fast, reduce the spring needle contact mat number of being sacrificed simultaneously.
Fig. 9 is another embodiment of spring needle contact mat of the present utility model, the spring needle contact mat 38 of tool vertical direction noise shielding function is arranged on the base material 36 of ring-type, do when changing when taking spring needle contact mat 38, cut off connection strap 362 and one or more spring needle contact mats 38 can be taken off.
With reference to Fig. 4, Fig. 7, Fig. 8 and Fig. 9, described film 30,32 and base material 36 can make the spring needle contact mat in each spring needle contact mat group have shared base plate as the base plate 208 of spring needle contact mat.
Figure 10 is the synoptic diagram that the utility model is applied to plug-in type spring needle contact mat, and socket 40 is arranged on the screen layer 202 and is electrically connected to I/O connection pad 200, and socket 40 is for socket connection line (not shown), so that measured signal is passed to probe.The prior art of relevant plug-in type spring needle contact mat can be consulted the Jap.P. spy and open 2004-125548 number.
Figure 11 is another embodiment that the utility model is applied to plug-in type spring needle contact mat; over cap 46 hides above spring needle contact mat 20; which is provided with load bearing seat 42 and 44, load bearing seat 42 and 44 electrically connects the screen layer of spring needle contact mat 25, for the spring needle of accepting measuring head.
Figure 12 is the sectional view of the utility model cantalever type probe card (cantilever probe card), the cantalever type probe 50 of substrate 60 belows is fixing with glue post 52, and be electrically connected to I/O connection pad 560 in the spring needle contact mat 56 with connecting line 54, the base plate 568 and the substrate 60 of spring needle contact mat 56 join, be conductive layer 566 and insulation course 564 in regular turn on it, screen layer 562 is on insulation course 564, around I/O connection pad 560.
Figure 13 is the sectional view of vertical probe carb of the present utility model (vertical probe card), and elastic 62 provides probe 64 to press down the required elasticity of tested crystal grain, and each probe 64 electrically connects spring needle contact mat 56. by connecting line 54
Figure 14 is the sectional view of microcomputer electric detecting probe fasten of the present utility model (MEMS probe card), and micro electronmechanical processing procedure probe 68 is transferred to connecting line 54 by space convertor (Space transformer) 66, to electrically connect with spring needle contact mat 56.
Above embodiment is only for the usefulness that the utility model is described, but not to restriction of the present utility model, person skilled in the relevant technique under the situation that does not break away from spirit and scope of the present utility model, can also be made various conversion or variation.Therefore, all technical schemes that are equal to also should belong to category of the present utility model, should be limited by each claim.
Claims (7)
1. a spring needle contact mat is arranged on the substrate of a probe, and for the acceptance test signal, described spring needle contact mat comprises a conductive layer, an insulation course, and a screen layer and an I/O connection pad is characterized in that:
Described conductive layer is located under the described insulation course;
Described insulation course is located on the described conductive layer;
Described screen layer is located on the described insulation course;
Described I/O connection pad is located on the described insulation course;
Wherein, described screen layer is around described I/O connection pad, and described test signal is imported described probe via described I/O connection pad.
2. spring needle contact mat as claimed in claim 1 is characterized in that, described conductive layer, described screen layer and described I/O connection pad have same potential.
3. spring needle contact mat as claimed in claim 1 is characterized in that, comprises that more a base plate is located under the described conductive layer.
4. spring needle contact mat as claimed in claim 1 is characterized in that, comprises that more a socket is located on the described screen layer.
5. spring needle contact mat as claimed in claim 4 is characterized in that, described socket electrically connects described I/O connection pad.
6. spring needle contact mat as claimed in claim 1 is characterized in that, comprises that more an over cap is located on described I/O connection pad and the described screen layer.
7. spring needle contact mat as claimed in claim 6 is characterized in that, comprises that more a load bearing seat is located on the described over cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920005231 CN201464508U (en) | 2009-03-18 | 2009-03-18 | Pogo pin contact pad and probe card using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920005231 CN201464508U (en) | 2009-03-18 | 2009-03-18 | Pogo pin contact pad and probe card using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201464508U true CN201464508U (en) | 2010-05-12 |
Family
ID=42391858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920005231 Expired - Lifetime CN201464508U (en) | 2009-03-18 | 2009-03-18 | Pogo pin contact pad and probe card using the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201464508U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103930982A (en) * | 2011-07-06 | 2014-07-16 | 塞莱敦体系股份有限公司 | Test apparatus having a probe card and connector mechanism |
| CN105277754A (en) * | 2014-07-18 | 2016-01-27 | 旺矽科技股份有限公司 | Probe card and its switching circuit board and signal feed-in structure |
| US9726694B2 (en) | 2011-07-06 | 2017-08-08 | Celadon Systems, Inc. | Test systems with a probe apparatus and index mechanism |
| CN111149003A (en) * | 2017-09-29 | 2020-05-12 | 新韩精密电子有限公司 | Conductive contact and anisotropic conductive sheet having the same |
| CN111896782A (en) * | 2020-08-04 | 2020-11-06 | 河南大学 | A probe and measuring instrument for nondestructively measuring thin films |
-
2009
- 2009-03-18 CN CN 200920005231 patent/CN201464508U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103930982A (en) * | 2011-07-06 | 2014-07-16 | 塞莱敦体系股份有限公司 | Test apparatus having a probe card and connector mechanism |
| CN103930982B (en) * | 2011-07-06 | 2016-07-06 | 塞莱敦体系股份有限公司 | There is test equipment and the connector mechanism of probe card |
| US9726694B2 (en) | 2011-07-06 | 2017-08-08 | Celadon Systems, Inc. | Test systems with a probe apparatus and index mechanism |
| US10145863B2 (en) | 2011-07-06 | 2018-12-04 | Celadon Systems, Inc. | Test systems with a probe apparatus and index mechanism |
| CN105277754A (en) * | 2014-07-18 | 2016-01-27 | 旺矽科技股份有限公司 | Probe card and its switching circuit board and signal feed-in structure |
| CN105277754B (en) * | 2014-07-18 | 2018-05-08 | 旺矽科技股份有限公司 | Probe card and its switching circuit board and signal feed-in structure |
| CN111149003A (en) * | 2017-09-29 | 2020-05-12 | 新韩精密电子有限公司 | Conductive contact and anisotropic conductive sheet having the same |
| CN111896782A (en) * | 2020-08-04 | 2020-11-06 | 河南大学 | A probe and measuring instrument for nondestructively measuring thin films |
| CN111896782B (en) * | 2020-08-04 | 2021-10-26 | 河南大学 | Probe and measuring instrument for nondestructive measurement of thin film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100512 |
|
| CX01 | Expiry of patent term |