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CN201386989Y - LED illuminating lamp adopting two-stage heat dissipation - Google Patents

LED illuminating lamp adopting two-stage heat dissipation Download PDF

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Publication number
CN201386989Y
CN201386989Y CN200920009597U CN200920009597U CN201386989Y CN 201386989 Y CN201386989 Y CN 201386989Y CN 200920009597 U CN200920009597 U CN 200920009597U CN 200920009597 U CN200920009597 U CN 200920009597U CN 201386989 Y CN201386989 Y CN 201386989Y
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led lamp
led
radiator
led chip
plane
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郑榕彬
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Priority to CN200920009597U priority Critical patent/CN201386989Y/en
Priority to EP09842042.5A priority patent/EP2411727A4/en
Priority to KR1020117025361A priority patent/KR20120023619A/en
Priority to CA2759812A priority patent/CA2759812A1/en
Priority to PCT/CN2009/000927 priority patent/WO2010108305A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

本实用新型提供一种LED灯,其包括具有多个斜面的一级散热体和与该一级散热体相连接的二级散热体,在所述斜面上安装有多个LED芯片。该LED灯所采用二级散热技术可极大地提高散热效率;同时所述斜面包括具有一定高度的LED芯片支座,所述LED芯片坐落于所述支座上,从而使芯片向空间发射光线的角度最大可达270°,不但增大了照射角度,而且更好地保障了光照的平均强度和均匀性。

Figure 200920009597

The utility model provides an LED lamp, which comprises a primary heat sink with multiple inclined surfaces and a secondary heat sink connected to the primary heat sink, wherein multiple LED chips are mounted on the inclined surfaces. The secondary heat dissipation technology adopted by the LED lamp can greatly improve the heat dissipation efficiency; at the same time, the inclined surface comprises an LED chip support with a certain height, and the LED chip is seated on the support, so that the angle of the chip emitting light into space can reach up to 270° at most, which not only increases the irradiation angle, but also better guarantees the average intensity and uniformity of the light.

Figure 200920009597

Description

采用二级散热的LED照明灯 LED lighting with secondary heat dissipation

技术领域 technical field

本实用新型一般地涉及LED照明灯具,更具体地,本实用新型涉及一种具有高散热效率、大照射角度和均匀光照强度的LED照明灯。The utility model generally relates to LED lighting fixtures, and more specifically, the utility model relates to an LED lighting lamp with high heat dissipation efficiency, large irradiation angle and uniform light intensity.

背景技术 Background technique

随着发光二极管(LED)技术的发展,越来越多的大功率LED灯被设计用于照明,例如居家照明。相对于现有的白炽灯等照明光源,LED灯具有亮度充足、节能、可靠性高、寿命长等诸多优点,这使其在照明领域具有更广阔的应用前景。With the development of light-emitting diode (LED) technology, more and more high-power LED lamps are designed for lighting, such as home lighting. Compared with existing lighting sources such as incandescent lamps, LED lamps have many advantages such as sufficient brightness, energy saving, high reliability, and long life, which make them have broader application prospects in the lighting field.

对于大功率LED,散热效果的好坏成为决定其性能的重要因素。现有技术的LED灯是将至少一个封装好的LED芯片设置在基体上以形成单独的或阵列式的光源,同时紧贴着基体连接散热体以促进热量的散发。如中国专利号为“200720141005.1”的LED灯泡改良结构专利中,在灯外部设有一灯头,内部设有光源的发光二极管,在基座底部贴合有一面积大于基座面积的加大散热片。中国发明专利申请CN101349415A则公开了一种大功率LED灯对流散热装置,其采用的技术方案是在散热板体的一侧设置有一组LED灯,在散热板体的另一侧设置一组散热凸起,并在散热板体安装槽的两侧设置带有辅助散热凸起及空气对流孔的辅助散热板。这些直接接触式的散热结构虽然减少了基座与散热片之间的热阻,但在短时间内产生较多热量的情况下,仍然存在热量聚集的问题。For high-power LEDs, the quality of heat dissipation becomes an important factor in determining their performance. In the prior art LED lamps, at least one packaged LED chip is arranged on a substrate to form a single or array light source, and at the same time, a radiator is connected to the substrate to promote heat dissipation. For example, in the Chinese Patent No. "200720141005.1" LED light bulb improved structure patent, a lamp cap is arranged outside the lamp, a light-emitting diode with a light source is arranged inside, and an enlarged heat sink with an area larger than the area of the base is attached to the bottom of the base. Chinese invention patent application CN101349415A discloses a high-power LED lamp convection heat dissipation device. and an auxiliary heat dissipation plate with auxiliary heat dissipation protrusions and air convection holes is arranged on both sides of the installation groove of the heat dissipation plate body. Although these direct-contact heat dissipation structures reduce the thermal resistance between the base and the heat sink, there is still the problem of heat accumulation when a large amount of heat is generated in a short period of time.

另外,这些LED灯虽然可以满足普通的照明需求,但由于其LED发光体均位于同一平面内,因此所发射的光指向性强而照射范围较小。针对照射角度较小的问题,中国发明专利申请CN101182916A公开了一种LED灯具,其包括若干LED和LED承载体,所述LED承载体具有呈平面状的第一LED承载面和等角度分布在一圆周上的倾斜的第二LED承载面。这种结构能够扩大出光范围,但由于其倾斜面不连续且倾斜面上的LED仅位于一个球面上,因此其光照强度的分布并不均匀。In addition, although these LED lamps can meet the general lighting requirements, since the LED illuminants are all located in the same plane, the emitted light has strong directivity and the irradiation range is small. Aiming at the problem of a small irradiation angle, Chinese invention patent application CN101182916A discloses an LED lamp, which includes several LEDs and an LED carrier. An inclined second LED-carrying surface on the circumference. This structure can expand the range of light emission, but since the inclined surface is discontinuous and the LEDs on the inclined surface are only located on one spherical surface, the distribution of the light intensity is not uniform.

承上所述,需要提供一种散热效率高、照射角度大且光照强度均匀的LED照明灯,以解决现有技术所存在的问题。Based on the above, it is necessary to provide an LED lighting lamp with high heat dissipation efficiency, large irradiation angle and uniform light intensity, so as to solve the problems existing in the prior art.

实用新型内容Utility model content

为了克服现有技术的不足,本实用新型提供一种新型LED照明灯,此种LED灯能够提高散热效率,增大照射角度,同时很好地保障光照的平均强度,达到良好的照明效果。In order to overcome the deficiencies of the prior art, the utility model provides a new type of LED lighting lamp, which can improve the heat dissipation efficiency, increase the irradiation angle, and at the same time ensure the average intensity of the illumination to achieve a good lighting effect.

根据本实用新型的一个方面,提供一种LED灯,其包括一级散热体和二级散热体,该一级散热体具有多个斜面,每个所述斜面上设置有至少一个LED芯片。According to one aspect of the present invention, an LED lamp is provided, which includes a primary radiator and a secondary radiator, the primary radiator has a plurality of slopes, and at least one LED chip is disposed on each slope.

优选地,所述一级散热体和二级散热体至少部分连接或接触。Preferably, the primary radiator and the secondary radiator are at least partially connected or in contact.

优选地,所述斜面围绕LED灯的中心轴呈放射状周期性分布,且相邻斜面具有不同的倾斜角。Preferably, the inclined planes are distributed radially and periodically around the central axis of the LED lamp, and adjacent inclined planes have different inclination angles.

优选地,所述斜面沿放射径向形成倾斜角不同的多个层级,且同一层级中的相邻斜面具有不同的倾斜角。Preferably, the inclined surfaces form multiple levels with different inclination angles along the radial direction, and adjacent inclined surfaces in the same level have different inclination angles.

优选地,所述斜面包括具有一定高度的LED芯片支座,所述LED芯片坐落于所述支座上。Preferably, the slope includes an LED chip support with a certain height, and the LED chip is seated on the support.

更优选地,LED芯片支座的高度在1.2-3mm之间,从而使LED芯片四周的光线发射角度最大可达270°。More preferably, the height of the LED chip support is between 1.2-3mm, so that the light emitting angle around the LED chip can reach up to 270°.

优选地,斜面的倾斜角范围为10°至80°。Preferably, the slope angle of the slope ranges from 10° to 80°.

更优选地,斜面的倾斜角为15°或75°。More preferably, the inclination angle of the slope is 15° or 75°.

更优选地,斜面的倾斜角为20°或70°。More preferably, the inclination angle of the slope is 20° or 70°.

优选地,所述一级散热体为由金属材料加工而成的支架。Preferably, the primary radiator is a bracket processed from metal materials.

优选地,二级散热体为浇铸成形的金属材料块。Preferably, the secondary radiator is a cast metal material block.

优选地,二级散热体的外部具有翅状的散热片。Preferably, the exterior of the secondary radiator has fin-shaped fins.

优选地,通过两级散热结构,使一级散热体的温度保持在80℃-120℃,二级散热体的温度保持在90℃以下。Preferably, through the two-stage heat dissipation structure, the temperature of the primary radiator is kept at 80°C-120°C, and the temperature of the secondary radiator is kept below 90°C.

优选地,LED芯片外部设置有由诸如PC材料制作成的透明的塑料灯罩。Preferably, a transparent plastic lampshade made of materials such as PC is arranged outside the LED chip.

为实现上述及相关目标,本实用新型包含在下文充分描述并在权利要求书中特别指出的特征。以下说明及附图详细描述了本实用新型的某些示例性实施例。然而,这些实施例是示例性的,本实用新型的原理可以具有一些与这里公开的等同的实施方式。To the accomplishment of the above and related ends, the invention comprises the features hereinafter fully described and particularly pointed out in the claims. The following description and accompanying drawings describe in detail certain exemplary embodiments of the invention. However, these examples are exemplary and the principles of the invention may have some equivalents to those disclosed herein.

附图说明 Description of drawings

通过下面对本实用新型的详细说明并结合以下附图,本实用新型的其它目标、优点和新特征将变得明显,附图中相同的附图标记指代相同的部分,其中:Through the following detailed description of the utility model and in conjunction with the following drawings, other objects, advantages and new features of the utility model will become apparent. In the accompanying drawings, the same reference numerals refer to the same parts, wherein:

图1是根据本实用新型优选实施例的LED灯的三维示意图;Fig. 1 is a three-dimensional schematic diagram of an LED lamp according to a preferred embodiment of the present invention;

图2是根据本实用新型优选实施例的LED灯的侧视图;Fig. 2 is a side view of an LED lamp according to a preferred embodiment of the present invention;

图3是根据本实用新型优选实施例的LED芯片与芯片支座的局部放大示意图;Fig. 3 is a partially enlarged schematic diagram of an LED chip and a chip holder according to a preferred embodiment of the present invention;

图4是根据本实用新型优选实施例的LED灯的俯视图;Fig. 4 is a top view of an LED lamp according to a preferred embodiment of the present invention;

图5是根据本实用新型优选实施例的LED芯片与接线柱的局部放大示意图;Fig. 5 is a partially enlarged schematic diagram of an LED chip and a terminal according to a preferred embodiment of the present invention;

图6是根据本实用新型优选实施例的电路连接示意图。Fig. 6 is a schematic diagram of circuit connection according to a preferred embodiment of the present invention.

具体实施方式 Detailed ways

本实用新型提供一种新型的LED照明灯,其包括具有多个斜面的基体,所述多个斜面形成为至少一个层级,同一层级中的相邻斜面具有不同的倾斜角,每个斜面上设置有至少一个LED芯片。该LED灯采用二级散热技术,使一级散热体的温度保持在80℃-120℃,二级散热体的温度保持在90℃以下,从而可极大地提高散热效率。The utility model provides a novel LED lighting lamp, which comprises a base body with a plurality of inclined planes, the plurality of inclined planes are formed into at least one level, adjacent inclined planes in the same level have different inclination angles, and each inclined plane is provided with There is at least one LED chip. The LED lamp adopts two-stage heat dissipation technology to keep the temperature of the primary radiator at 80°C-120°C, and the temperature of the secondary radiator below 90°C, which can greatly improve the heat dissipation efficiency.

下面将参考附图对本发明的LED照明灯进行详细描述。The LED lighting lamp of the present invention will be described in detail below with reference to the accompanying drawings.

现在参考图1和图2,其分别是根据本实用新型优选实施例的LED灯的三维示意图和侧视图。该实施例的LED灯主要包括LED芯片1、灯罩3、灯头12、一级散热体7和二级散热体8以及虚线部分所示的内部直流供电电子板13,其中灯头或灯座12用于连接220V交流电源以便为LED灯供电,其与普通照明灯泡的相应灯头具有相同的规格,从而该LED灯可以方便地替换当前所用的日光灯。Referring now to FIG. 1 and FIG. 2 , they are respectively a three-dimensional schematic diagram and a side view of an LED lamp according to a preferred embodiment of the present invention. The LED lamp of this embodiment mainly includes an LED chip 1, a lampshade 3, a lamp cap 12, a primary radiator 7, a secondary radiator 8, and an internal DC power supply electronic board 13 shown in a dotted line, wherein the lamp cap or lamp holder 12 is used for A 220V AC power supply is connected to power the LED lamp, which has the same specifications as the corresponding lamp base of the general lighting bulb, so that the LED lamp can conveniently replace the fluorescent lamp currently used.

一级散热体7是由导热性能良好且具有一定机械强度的金属制成的,其用作支撑LED芯片或发光体的支架,该支架可通过常用机械加工工艺(如切割)制成,例如利用切削、切割工艺等工艺形成如图1所示的多个斜面15和15’,这些斜面围绕LED灯的中心轴呈大致放射状周期性分布或大致对称分布,并相对于中心平面向下倾斜。可以通过例如电镀等镀膜工艺使这些斜面具有非常好的光源反射性,从而提高光利用率。这些斜面相对于中心平面可以具有相同的或不同的倾斜角,例如可以对这些斜面进行设置,以使相邻斜面具有不同的倾斜角。例如从图1可以看出,斜面15’的倾斜角大于斜面15的倾斜角。作为替代,当斜面数量足够多时,可以使间隔一个或一个以上斜面的两斜面具有相同的倾斜角,也就是斜面的倾斜角可以周期性地变化,从而使LED发光体在整个圆周方向上的照射也周期性变化,以提高各个方向上光照的均匀度。为了实现最佳的照明效果,优选将一级散热体7上的所有斜面的倾斜角限定在10°至80°的范围内,如10°、15°、20°、30°、45°、60°、70°、75°或80°等。The primary radiator 7 is made of metal with good thermal conductivity and certain mechanical strength, and it is used as a support for supporting LED chips or luminous bodies. Cutting, cutting and other processes form a plurality of inclined planes 15 and 15' as shown in FIG. 1 , and these inclined planes are distributed periodically or substantially radially around the central axis of the LED lamp, and are inclined downward relative to the central plane. These slopes can be made to have very good light source reflectivity through a coating process such as electroplating, thereby improving light utilization. These inclined surfaces may have the same or different inclination angles relative to the central plane, for example, these inclined surfaces may be set so that adjacent inclined surfaces have different inclination angles. For example, it can be seen from Fig. 1 that the inclination angle of the inclined plane 15' is greater than the inclination angle of the inclined plane 15. As an alternative, when the number of slopes is large enough, the two slopes separated by one or more slopes can have the same slope angle, that is, the slope angle of the slope can be changed periodically, so that the illumination of the LED illuminant in the entire circumferential direction It also changes periodically to improve the uniformity of lighting in all directions. In order to achieve the best lighting effect, it is preferable to limit the inclination angles of all inclined surfaces on the primary radiator 7 within the range of 10° to 80°, such as 10°, 15°, 20°, 30°, 45°, 60° °, 70°, 75° or 80° etc.

在每个斜面上设置至少一个被灯罩3覆盖的LED芯片作为发光源。灯罩3可以采用透明的塑料例如PC材料(即聚碳酸酯)、玻璃或聚合物制成。根据光效的需要,也可以采用磨砂玻璃或半透明的其他塑料材料制作各种不同形状的灯罩3,以增加光线的柔和度及LED灯的美观度。从图2可以看出,在斜面下方还设置有绝缘体5,其内部含有导电物质形成的连接线。该绝缘体例如管状通道5的一端穿过一级散热体7的斜面并固定于其中,另一端连接到用于给各个LED芯片1供电的PCB板6上,从而形成供电导线通过的供电通道。该绝缘体可以是柔性绝缘材料,也可以是具有一定硬度的绝缘材料,以起到固定支撑斜面的附加作用。图3通过局部放大示意图详细显示了LED芯片的设置方式,其中LED芯片1被设置在凸出于斜面一定高度h的LED芯片支座2上,所述高度h可以设计成在大约1.2-3mm之间,从而使芯片向空间发射光线的角度α由大约180°增大至最大达约270°,这不但增大了照射角度,而且更好地保障了光照的平均强度。At least one LED chip covered by the lampshade 3 is arranged on each inclined surface as a light emitting source. The lampshade 3 can be made of transparent plastic such as PC material (ie polycarbonate), glass or polymer. According to the needs of light effect, frosted glass or other translucent plastic materials can also be used to make lampshades 3 of various shapes, so as to increase the softness of light and the aesthetics of the LED lamp. It can be seen from FIG. 2 that an insulator 5 is provided below the slope, and the inside thereof contains connecting wires formed of conductive substances. One end of the insulator such as a tubular channel 5 passes through the slope of the primary radiator 7 and is fixed therein, and the other end is connected to the PCB board 6 for supplying power to each LED chip 1 to form a power supply channel through which the power supply wire passes. The insulator can be a flexible insulating material, or an insulating material with a certain hardness, so as to play an additional role of fixing the supporting slope. Figure 3 shows the arrangement of LED chips in detail through a partially enlarged schematic diagram, wherein the LED chip 1 is arranged on the LED chip support 2 protruding from the slope by a certain height h, and the height h can be designed to be between about 1.2-3mm Therefore, the angle α at which the chip emits light into the space increases from approximately 180° to a maximum of approximately 270°, which not only increases the illumination angle, but also better ensures the average intensity of illumination.

二级散热体8与一级散热体7可以分别形成并组装在一起,以便于导电线的连接,其中一级散热体7的中心具有通孔,该通孔与二级散热体8的中心轴相配合形成稳定连接。一级散热体7可以由金属或合金材料加工制成,二级散热体8可以是浇铸成形的金属或合金块,且其外部优选具有相当数量的、可最大限度增加与空气接触面积的高效散热翅状结构9。通过这种二级散热结构,LED芯片在通电时所散发的热量首先被LED芯片支座2(也由金属材料制成)和一级散热体7快速带走并传递给二级散热体8,然后经由二级散热体8外部的翅状结构9与空气的热交换实现较好的散热效果。通过这种两级散热机构,可以使一级散热体7的温度一般保持在80℃-120℃,二级散热体8的温度则一般保持在90℃以下。与现有技术中LED芯片的支撑体与散热体紧密结合的结构相比,这种二级散热结构不仅增大了散热面积,而且通过两个散热体的不同温度实现从一级散热体7到二级散热体8的快速热传递,避免热量在一级散热体7中积累而影响LED芯片的性能,同时两个散热体周围的空气也会由于被加热到不同温度而经水平散热孔10和垂直散热孔11形成空气流动,从而更进一步提高散热效率。The secondary radiator 8 and the primary radiator 7 can be respectively formed and assembled together so as to facilitate the connection of conductive wires, wherein the center of the primary radiator 7 has a through hole, and the through hole is connected to the central axis of the secondary radiator 8. Cooperate to form a stable connection. The primary radiator 7 can be processed by metal or alloy material, and the secondary radiator 8 can be a metal or alloy block formed by casting, and its exterior preferably has a considerable amount of efficient heat dissipation that can maximize the contact area with the air. winged structure 9. Through this secondary heat dissipation structure, the heat emitted by the LED chip when it is energized is first quickly taken away by the LED chip support 2 (also made of metal material) and the primary heat sink 7 and transferred to the secondary heat sink 8, Then, a better heat dissipation effect is achieved through the heat exchange between the fin-shaped structure 9 outside the secondary radiator 8 and the air. Through this two-stage heat dissipation mechanism, the temperature of the primary radiator 7 can generally be kept at 80°C-120°C, and the temperature of the secondary radiator 8 can generally be kept below 90°C. Compared with the structure in which the support body of the LED chip and the heat sink are closely combined in the prior art, this secondary heat dissipation structure not only increases the heat dissipation area, but also realizes the transformation from the primary heat sink 7 to the heat sink through the different temperatures of the two heat sinks. The rapid heat transfer of the secondary heat sink 8 avoids heat accumulation in the primary heat sink 7 and affects the performance of the LED chip. At the same time, the air around the two heat sinks will also be heated to different temperatures through the horizontal heat dissipation holes 10 and The vertical cooling holes 11 form air flow, thereby further improving the cooling efficiency.

现在参考图4和图5,其分别为根据本实用新型优选实施例的LED灯的俯视图和LED芯片与接线柱的局部放大示意图。如图所示,LED芯片沿圆周方向呈大致周期性分布,且相邻LED芯片的主照射方向(即垂直于斜面的方向)不同,从而增大LED灯的光照角度并提高平均光照强度。根据需要,在同一径向上可以设置更多个具有不同倾斜角的斜面层级以实现更好的照明效果。每个LED芯片通过两条键合线20连接到两个LED电源线接口4,该键合线20优选为本领域常用的金线。LED电源线接口4为小块的金属管柱,其嵌入在绝缘体5中而与一级散热体7形成电绝缘,并通过绝缘体5中的导电线与下面的PCB板6形成电连接,从而为LED芯片1供电。该LED灯的内部电路连接如图6所示。在该LED灯的内部空腔中安置有直流供电电子板13。该直流供电电子板13也是PCB板,其包含将交流电转换为直流电的转换器,这种转换器可以使用本领域公知的器件,在此不详细描述。同时该直流供电电子板还包括控制每个LED发光体的电流的控制部分(未示出)。转换器的输入端通过导线19连接到灯头12上,以便从灯头获得220V的交流电压,同时转换器的输出端通过直流电源线18连接到PCB板6的输入端上,并进一步经由PCB板6的输出端、LED电源线接口4和键合线20向LED芯片1提供转换得到的直流电源。Referring now to FIG. 4 and FIG. 5 , they are respectively a top view of an LED lamp according to a preferred embodiment of the present invention and a partially enlarged schematic diagram of an LED chip and a terminal. As shown in the figure, the LED chips are roughly periodically distributed along the circumferential direction, and the main illumination direction (ie, the direction perpendicular to the slope) of adjacent LED chips is different, thereby increasing the illumination angle of the LED lamp and increasing the average illumination intensity. According to needs, more slope levels with different inclination angles can be set on the same radial direction to achieve better lighting effects. Each LED chip is connected to two LED power line interfaces 4 through two bonding wires 20, and the bonding wires 20 are preferably gold wires commonly used in the field. The LED power line interface 4 is a small piece of metal pipe column, which is embedded in the insulator 5 to form electrical insulation with the primary radiator 7, and is electrically connected to the PCB board 6 below through the conductive wire in the insulator 5, thereby providing LED chip 1 supplies power. The internal circuit connection of the LED lamp is shown in FIG. 6 . A DC power supply electronic board 13 is arranged in the inner cavity of the LED lamp. The DC power supply electronic board 13 is also a PCB board, which includes a converter for converting AC power into DC power. This converter can use devices known in the art and will not be described in detail here. At the same time, the DC power supply electronic board also includes a control part (not shown) for controlling the current of each LED illuminant. The input end of converter is connected on the lamp cap 12 by lead 19, so that obtain the alternating current voltage of 220V from lamp cap, simultaneously the output end of converter is connected on the input end of PCB board 6 by DC power line 18, and further through PCB board 6 The output end of the LED power line interface 4 and the bonding wire 20 provide the converted DC power to the LED chip 1 .

综上所述,在所设计的新型LED灯的结构中,两级散热机构的使用可以很好地实现LED芯片的快速散热,避免热量在一级散热体上积累而导致LED芯片性能退化。同时,一级散热体上设置LED芯片的斜面可以实现较大的光照角度,而同一层级上斜面的大致周期性变化或大致对称分布则保证了圆周光照的均匀性,因此整体上更显著地提高LED灯的光照角度和平均光照强度。To sum up, in the structure of the new LED lamp designed, the use of the two-stage heat dissipation mechanism can well realize the rapid heat dissipation of the LED chip, and avoid the heat accumulation on the primary heat sink to cause the performance degradation of the LED chip. At the same time, the inclined surface of the LED chip on the first-level heat sink can achieve a larger illumination angle, while the roughly periodic change or approximately symmetrical distribution of the inclined surface on the same level ensures the uniformity of the circumferential illumination, so the overall improvement is more significant. The illumination angle and average illumination intensity of LED lights.

对于本领域技术人员来说,通过阅读前述说明,可以想到许多修改和改进。本实用新型希望覆盖权利要求书的内容及任何等价物。这里所用的具体实施例是为了帮助理解本实用新型,并不将其用于以比权利要求书及其等价物更窄的方式限制本实用新型的范围。另外,虽然在上面已通过优选实施例描述了本实用新型的具体特征,但某些具体特征可以变化而不偏离本实用新型的范围,例如每个斜面上可以根据需要设置多于一个LED芯片,或者同一径向上的斜面可以是倾斜角不同的多个斜面,从而进一步提高LED灯的光照角度和平均光照强度。From the foregoing description, many modifications and improvements will occur to those skilled in the art. The utility model intends to cover the content of the claims and any equivalents. The specific examples used here are to help the understanding of the present invention, and they are not used to limit the scope of the present invention in a narrower manner than the claims and their equivalents. In addition, although the specific features of the present utility model have been described above through preferred embodiments, some specific features can be changed without departing from the scope of the present utility model, for example, more than one LED chip can be arranged on each slope as required, Or the slopes on the same radial direction may be multiple slopes with different inclination angles, so as to further increase the illumination angle and average illumination intensity of the LED lamp.

Claims (16)

1, a kind of LED lamp is characterized in that: comprise one-level radiator and secondary radiator, this one-level radiator has a plurality of inclined-planes, and each described inclined-plane is provided with at least one led chip.
2. LED lamp according to claim 1 is characterized in that: described one-level radiator is connected with secondary radiator to small part.
3, LED lamp according to claim 1 is characterized in that: described a plurality of inclined-planes are radial periodic distribution around the central shaft of described LED lamp, and adjacent inclined-plane has different inclinations angle.
4, LED lamp according to claim 3 is characterized in that: described a plurality of inclined-planes radially form the different a plurality of levels in inclination angle along radiation, and the adjacent inclined-plane in the same level has different inclinations angle.
5, according to each described LED lamp among the claim 1-4, it is characterized in that: described inclined-plane comprises the led chip bearing with certain altitude, and described led chip is seated on the described bearing.
6, LED lamp according to claim 5 is characterized in that: the height of described led chip bearing is between 1.2-3mm, so that described led chip can reach 270 ° to the angle maximum of spatial emission light.
7, according to each described LED lamp among the claim 1-4, it is characterized in that: the tilt angle ranges on described inclined-plane is 10 ° to 80 °.
8, LED lamp according to claim 7 is characterized in that: the inclination angle on described inclined-plane is 15 ° or 75 °.
9, LED lamp according to claim 7 is characterized in that: the inclination angle on described inclined-plane is 20 ° or 70 °.
10, according to each described LED lamp among the claim 1-4, it is characterized in that: described one-level radiator is made by metal material.
11, LED lamp according to claim 10 is characterized in that: the support of described one-level radiator for being formed by metal material processing.
12, according to each described LED lamp among the claim 1-4, it is characterized in that: described secondary radiator is the block of metallic material of casting forming.
13, according to each described LED lamp among the claim 1-4, it is characterized in that: the outside of described secondary radiator has the fin of aliform.
14, according to each described LED lamp among the claim 1-4, it is characterized in that: the temperature of described one-level radiator remains on 80 ℃-120 ℃, and the temperature of described secondary radiator remains on below 90 ℃.
15, according to each described LED lamp among the claim 1-4, it is characterized in that: also comprise the Transparent lamp shade that is arranged on described led chip outside.
16, LED lamp according to claim 15, it is characterized in that: described lampshade is made by the PC material.
CN200920009597U 2009-03-26 2009-03-26 LED illuminating lamp adopting two-stage heat dissipation Expired - Lifetime CN201386989Y (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN200920009597U CN201386989Y (en) 2009-03-26 2009-03-26 LED illuminating lamp adopting two-stage heat dissipation
EP09842042.5A EP2411727A4 (en) 2009-03-26 2009-08-13 Led lighting lamp
KR1020117025361A KR20120023619A (en) 2009-03-26 2009-08-13 Led lighting lamp
CA2759812A CA2759812A1 (en) 2009-03-26 2009-08-13 Led lighting lamp
PCT/CN2009/000927 WO2010108305A1 (en) 2009-03-26 2009-08-13 Led lighting lamp

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011120862A1 (en) * 2010-03-31 2011-10-06 Ledo Led Technologie Gmbh Led luminaire as a replacement for incandescent light bulbs
CN103492789A (en) * 2011-04-29 2014-01-01 皇家飞利浦有限公司 LED lighting device with upper heat dissipating structure
CN103547849A (en) * 2011-04-29 2014-01-29 皇家飞利浦有限公司 Led lighting device with lower heat dissipating structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011120862A1 (en) * 2010-03-31 2011-10-06 Ledo Led Technologie Gmbh Led luminaire as a replacement for incandescent light bulbs
CN103003630A (en) * 2010-03-31 2013-03-27 莱多Led技术有限公司 LED luminaire as a replacement for incandescent light bulbs
CN103492789A (en) * 2011-04-29 2014-01-01 皇家飞利浦有限公司 LED lighting device with upper heat dissipating structure
CN103547849A (en) * 2011-04-29 2014-01-29 皇家飞利浦有限公司 Led lighting device with lower heat dissipating structure
CN103492789B (en) * 2011-04-29 2016-09-07 皇家飞利浦有限公司 There is the LED illumination device of top heat dissipation structure
CN103547849B (en) * 2011-04-29 2018-04-17 亮锐控股有限公司 LED light device with lower part heat dissipation structure
US9995438B2 (en) 2011-04-29 2018-06-12 Lumileds Llc LED lighting device with lower heat dissipating structure

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