CN201336305Y - Diamond LED module group with lamp cups - Google Patents
Diamond LED module group with lamp cups Download PDFInfo
- Publication number
- CN201336305Y CN201336305Y CN200820203412.5U CN200820203412U CN201336305Y CN 201336305 Y CN201336305 Y CN 201336305Y CN 200820203412 U CN200820203412 U CN 200820203412U CN 201336305 Y CN201336305 Y CN 201336305Y
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- led module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
Description
技术领域 technical field
本实用新型属于半导体器件的技术领域,具体涉及一种使用发光二极管作为光源的LED模组。The utility model belongs to the technical field of semiconductor devices, in particular to an LED module using a light emitting diode as a light source.
背景技术 Background technique
与传统光源一样,半导体发光二极管(LED)在工作期间也会产生热量,其多少取决于整体的发光效率。在外加电能量作用下,电子和空穴的辐射复合发生电致发光,在P-N结附近辐射出来的光还需经过晶片(chip)本身的半导体介质和封装介质才能抵达外界(空气)。综合电流注入效率、辐射发光量子效率、晶片外部光取出效率等,最终大概只有30-40%的输入电能转化为光能,其余60-70%的能量主要以非辐射复合发生的点阵振动的形式转化热能。而晶片温度的升高,则会增强非辐射复合,进一步消弱发光效率。Like traditional light sources, semiconductor light-emitting diodes (LEDs) also generate heat during operation, the amount of which depends on the overall luminous efficiency. Under the action of external electric energy, the radiative recombination of electrons and holes produces electroluminescence, and the light radiated near the P-N junction needs to pass through the semiconductor medium and packaging medium of the chip (chip) itself to reach the outside world (air). Comprehensive current injection efficiency, radiative luminescence quantum efficiency, chip external light extraction efficiency, etc., in the end, only about 30-40% of the input electric energy is converted into light energy, and the remaining 60-70% of the energy is mainly generated by the lattice vibration of non-radiative recombination. Form into heat energy. The increase of the wafer temperature will enhance the non-radiative recombination and further weaken the luminous efficiency.
现在市面上的LED照明灯具是把多只LED进行串并联组合。如果用大功率LED进行串并联组合的话,灯具散热问题是现阶段难以解决的问题;如果用20mA小功率LED进行串并联组合的话,LED的使用数量会大量增加,在有限的空间内,对电路板上的元器件布局也是一个必须值得考虑的问题。此外,现有的LED灯的聚光结构还存在成本比较高的问题。The LED lighting fixtures currently on the market combine multiple LEDs in series and parallel. If high-power LEDs are used for series-parallel combination, the problem of heat dissipation of lamps and lanterns is difficult to solve at the present stage; if 20mA low-power LEDs are used for series-parallel combination, the number of LEDs used will increase greatly. The layout of components on the board is also a problem that must be considered. In addition, the existing light-gathering structure of the LED lamp still has the problem of relatively high cost.
实用新型内容 Utility model content
本实用新型的目的在于提供一种散热好、布局方便、聚光结构简单的带灯杯的菱形LED模组。The purpose of the utility model is to provide a diamond-shaped LED module with a lamp cup, which has good heat dissipation, convenient layout and simple light-gathering structure.
为解决上述技术问题,本实用新型采用的技术方案为:带灯杯的菱形LED模组,包括绝缘的壳体,壳体为菱形框状,壳体的内圈中间底部设有散热片,在散热片上面设有至少两个可构成聚光反射面的灯杯,所述的灯杯中设有LED,LED与灯杯之间填充有导热绝缘胶,LED的管脚从壳体的侧壁中引出来。In order to solve the above technical problems, the technical solution adopted by the utility model is: a diamond-shaped LED module with a lamp cup, including an insulating shell, the shell is a diamond-shaped frame, and the middle bottom of the inner ring of the shell is provided with a heat sink. There are at least two lamp cups on the heat sink that can form a light-concentrating reflective surface. LEDs are arranged in the lamp cups, and heat-conducting insulating glue is filled between the LEDs and the lamp cups. drawn out.
由于采用了上述的结构,本实用新型具有下述的有益效果:Owing to adopting above-mentioned structure, the utility model has following beneficial effect:
1)、把两个甚至更多个3V/20mALED芯片分散组合在同一圆形壳体内,在照度、光效等指标可与大功率LED相当,同时也节省PCB空间,方便电子元件的布局;1) Two or more 3V/20mA LED chips are scattered and combined in the same circular housing, which can be comparable to high-power LEDs in terms of illuminance and light efficiency, and also save PCB space and facilitate the layout of electronic components;
2)、LED产生的热量通过散热片传递到所安装的PCB的露铜区域,然后由PCB露铜区域散发出去,具有良好的散热效果;2) The heat generated by the LED is transferred to the exposed copper area of the installed PCB through the heat sink, and then dissipated by the exposed copper area of the PCB, which has a good heat dissipation effect;
3)、同一模组内分散式排列的LED可实现相互配光,可以节约大功率LED需用的透镜成本,在壳体内排放不同颜色的LED,再通过外部电路设计,不同时段可发出不同颜色的混合光;3) LEDs arranged in a distributed manner in the same module can achieve mutual light distribution, which can save the cost of lenses required for high-power LEDs. LEDs of different colors are discharged in the housing, and then through external circuit design, different colors can be emitted at different times. the mixed light;
4)、根据外部电路设计,对模组内LED能灵活的采取串并联连接方式;4) According to the external circuit design, the LEDs in the module can be flexibly connected in series and parallel;
5)、灯杯可对LED进行聚光,加强LED光源的方向性和集中性,其结构简单,成本低。5) The light cup can concentrate the LED light, enhance the directionality and concentration of the LED light source, and has a simple structure and low cost.
附图说明 Description of drawings
下面结合附图对本实用新型的具体实施方式作进一步详细的描述,但并不构成对本实用新型的任何限制。The specific implementation of the present utility model will be further described in detail below in conjunction with the accompanying drawings, but this does not constitute any limitation to the present utility model.
图1是带灯杯的菱形LED模组的立体图;Figure 1 is a perspective view of a diamond-shaped LED module with a lamp cup;
图2是图1的部分剖视图。FIG. 2 is a partial sectional view of FIG. 1 .
具体实施方式 Detailed ways
如图1和图2所示,本实用新型所述的带灯杯的菱形LED模组,包括壳体1,壳体1由绝缘材料制成,形状为菱形框状。壳体1的内圈中问底部设有散热片2,散热片2可由金属等导热良好的材料制成,在散热片2上面设有至少两个可构成聚光反射面的灯杯5,所述的灯杯5可以由设在散热片2上的凹孔形成,其较易制作,成本低。图中选用9个灯杯5,当然也可为其他个数。各个灯杯5中设有LED3,LED3与灯杯5之间填充有导热绝缘胶,导热绝缘胶和LED3的形状在图中没有明确绘出。9个LED3共有十八个管脚,管脚4从壳体1的侧壁中引出来,用于LED3的电源连接。As shown in FIG. 1 and FIG. 2 , the diamond-shaped LED module with lamp cup described in the present invention includes a housing 1 made of insulating material and shaped like a diamond frame. The bottom of the inner circle of the housing 1 is provided with a
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200820203412.5U CN201336305Y (en) | 2008-11-14 | 2008-11-14 | Diamond LED module group with lamp cups |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200820203412.5U CN201336305Y (en) | 2008-11-14 | 2008-11-14 | Diamond LED module group with lamp cups |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201336305Y true CN201336305Y (en) | 2009-10-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200820203412.5U Expired - Fee Related CN201336305Y (en) | 2008-11-14 | 2008-11-14 | Diamond LED module group with lamp cups |
Country Status (1)
| Country | Link |
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| CN (1) | CN201336305Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355625A (en) * | 2010-06-01 | 2016-02-24 | Lg伊诺特有限公司 | Light emitting device package |
| US9991241B2 (en) | 2010-06-01 | 2018-06-05 | Lg Innotek Co., Ltd. | Light emitting device package |
-
2008
- 2008-11-14 CN CN200820203412.5U patent/CN201336305Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355625A (en) * | 2010-06-01 | 2016-02-24 | Lg伊诺特有限公司 | Light emitting device package |
| US9991241B2 (en) | 2010-06-01 | 2018-06-05 | Lg Innotek Co., Ltd. | Light emitting device package |
| US10283491B2 (en) | 2010-06-01 | 2019-05-07 | Lg Innotek Co., Ltd | Light emitting device package |
| US10541235B2 (en) | 2010-06-01 | 2020-01-21 | Lg Innotek Co., Ltd. | Light emitting device package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091028 Termination date: 20121114 |