CN201327612Y - Elastic fixing structure of case panel and heat radiating device with same - Google Patents
Elastic fixing structure of case panel and heat radiating device with same Download PDFInfo
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- CN201327612Y CN201327612Y CNU2008201764188U CN200820176418U CN201327612Y CN 201327612 Y CN201327612 Y CN 201327612Y CN U2008201764188 U CNU2008201764188 U CN U2008201764188U CN 200820176418 U CN200820176418 U CN 200820176418U CN 201327612 Y CN201327612 Y CN 201327612Y
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Abstract
Description
技术领域 technical field
本实用新型是有关于一种机箱结构,尤指一种电脑机箱板面的弹性固定结构及具有该结构的散热装置。The utility model relates to a case structure, in particular to an elastic fixing structure for a board surface of a computer case and a heat dissipation device with the structure.
背景技术 Background technique
一般的电脑机箱通常由多个板面组合而成,其组装方式是先分别制作完成各个板面,再于组装时依序将各板面结合固定于一机箱架上;但是,由于各板面皆有制作上的公差,当各板面组装于机箱架上时,某一板面的结合位置与最初设计的位置常有出入,造成机箱板面与板面间存有间隙。A general computer case is usually composed of a plurality of boards. The assembly method is to make each board separately, and then sequentially combine and fix each board on a chassis frame during assembly; however, due to the There are manufacturing tolerances. When each board is assembled on the chassis frame, the joint position of a certain board is often different from the original design position, resulting in a gap between the chassis boards.
另一方面,将金属制成的电脑机箱的板面用于散热,则为现今一种机箱内部常见的散热方式,通过具大散热面积的机箱板面,以排除电子元件所产生的可观热量。如图1所示,是为习知一种电脑机箱内部的散热方式;是将一导热模块10a(如散热鳍片、热管、均温板等)的一端连接一导热块20a,该导热块20a上装设有一弹性机构30a,使该导热块20a可调整位置以接触一发热元件40a,该导热块20a是吸取该发热元件40a所产生的热量而传导至该导热模块10a,再者,该导热模块10a的另一端是贴附至一机箱板面50a上,令该发热元件40a所产生的热经由导热模块10a而传递至机箱上,从而利用该机箱板面50a以将热逸散至外界。On the other hand, using metal computer case boards for heat dissipation is a common heat dissipation method in the case today. The large heat dissipation area of the case boards is used to remove considerable heat generated by electronic components. As shown in Fig. 1 , it is a known heat dissipation method inside a computer case; one end of a
然而,上述结构中,由于各机箱板面50a的结合存有较大的公差,组装完成后,机箱板面50a的最终固定位置无法正确地对应到最初设计的预定位置,造成该导热模块10a常无法确实地接触到该机箱板面50a;倘若以精密地控制各机箱板面50a及机箱架的制造公差,使机箱板面可精确地结合于机箱架上,则会大幅提高机箱的制造成本而不符所需。However, in the above-mentioned structure, due to the large tolerance in the combination of the
有鉴于此,本实用新型发明人是为改善并解决上述的缺失,乃特潜心研究并配合学理的运用,终于提出一种设计合理且有效改善上述缺失的本实用新型。In view of this, in order to improve and solve the above-mentioned shortcomings, the inventor of the present utility model devoted himself to research and combined with the application of theories, and finally proposed a utility model with reasonable design and effective improvement of the above-mentioned shortcomings.
发明内容 Contents of the invention
本实用新型的一主要目的,在于提供一种机箱板面的弹性固定结构,是于第一板面置设具有弹性部的金属板条,令该第二板面与该金属板条结合时,该金属板条则产生拉伸或压缩的弹性变形,并通过金属板条的弹性回复力以常态施力于该第二板面上,令该第二板面可弹性地结合于第一板面上。A main purpose of the present utility model is to provide an elastic fixing structure for the board surface of the chassis, which is to arrange a metal lath with an elastic part on the first board surface, so that when the second board surface is combined with the metal lath, The metal strip produces elastic deformation of stretching or compression, and exerts force on the second plate surface in a normal state through the elastic recovery force of the metal strip, so that the second plate surface can be elastically combined with the first plate surface superior.
本实用新型的另一目的,在于提供一种机箱板面的弹性固定结构,使第二板面可弹性地结合于第一板面上,因其组装上可容许较大的公差,故不需精密地控制机箱板面制造上的公差,可节省制造上的成本。Another object of the present utility model is to provide an elastic fixing structure for the panel of the chassis, so that the second panel can be elastically combined with the first panel, and because the assembly can allow a large tolerance, it does not need to Precisely controlling the manufacturing tolerances of the chassis panels can save manufacturing costs.
本实用新型的再一目的,在于提供一种具机箱板面的弹性固定结构的散热装置,通过机箱内设有一发热元件及导热模块,且该导热模块具有一传导面,该第二板面可弹性贴接该传导面,使发热元件所产生的热,经由导热模块及其传导面而传导至第二板面,通过第二板面以将热逸散。Another object of the present utility model is to provide a cooling device with an elastic fixed structure of the chassis plate. A heating element and a heat conduction module are arranged in the chassis, and the heat conduction module has a conduction surface. The second plate surface can The conduction surface is elastically attached, so that the heat generated by the heating element is conducted to the second plate surface through the heat conduction module and the conduction surface, and the heat is dissipated through the second plate surface.
为了达成上述的目的,本实用新型是为一种机箱板面的弹性固定结构及具该结构的散热装置,弹性固定结构是用以固定机箱内相互垂直的第一板面及第二板面,第一板面上是设有具弹性的一金属板条,金属板条上设有一第一结合部,另于第二板面设有第二结合部,其中,该第二结合部与该第一结合部相互结合时,金属板条是产生弹性变形,通过金属板条的弯曲段的弹性回复力,令第二板面可弹性地结合于该第一板面上;再者,机箱内设有一发热元件及一导热模块,且第二板面可弹性贴接导热模块的一传导面,因此,发热元件所产生的热是经导热模块及其传导面而传导至第二板面,通过第二板面以将热逸散。In order to achieve the above-mentioned purpose, the utility model is an elastic fixing structure of a chassis panel and a heat dissipation device with the structure. The elastic fixing structure is used to fix the first panel and the second panel perpendicular to each other in the chassis. The first plate surface is provided with a flexible metal lath, the metal lath is provided with a first joint part, and the second plate surface is provided with a second joint part, wherein, the second joint part and the first joint part When the first joint part is combined with each other, the metal lath is elastically deformed, and the second board surface can be elastically combined with the first board surface through the elastic recovery force of the bending section of the metal lath; There is a heating element and a heat conduction module, and the second plate surface can be elastically attached to a conduction surface of the heat conduction module, so the heat generated by the heating element is conducted to the second plate surface through the heat conduction module and its conduction surface, and passes through the second plate surface. Two boards to dissipate heat.
本实用新型的有益效果在于通过第一板面上金属板条弹性拉伸或压缩的回复力,以令该第二板面弹性地结合于该第一板面上,进而确实地固定于机箱的预定位置;另,由于该第二板面与第一板面的组合,其组装可容许较大的公差,因不需精密地控制各机箱板面的制造公差,故可节省制造成本;再者,机箱内发热元件所产生的热是经一导热模块而传导至第二板面,第二板面可弹性贴接于导热模块的传导面,使发热元件所产生的热是经导热模块及其传导面而传导至第二板面,通过第二板面以将热逸散。The beneficial effect of the utility model is that the second plate is elastically combined with the first plate through the elastic stretching or compressing restoring force of the metal lath on the first plate, and then firmly fixed on the chassis. Predetermined position; In addition, due to the combination of the second board and the first board, its assembly can allow a larger tolerance, because it is not necessary to precisely control the manufacturing tolerances of each chassis board, so the manufacturing cost can be saved; moreover , the heat generated by the heating element in the chassis is conducted to the second board through a heat conduction module, and the second board can be elastically attached to the conduction surface of the heat conduction module, so that the heat generated by the heating element is passed through the heat conduction module and its The conductive surface is conducted to the second plate surface, and the heat is dissipated through the second plate surface.
附图说明 Description of drawings
图1是习知导热模块与机箱配设的散热方式;Figure 1 shows the heat dissipation method of the conventional heat conduction module and chassis configuration;
图2是本实用新型的机箱的立体分解图;Fig. 2 is the three-dimensional exploded view of the cabinet of the present utility model;
图3是本实用新型的金属板条的立体外观图;Fig. 3 is the three-dimensional appearance diagram of the metal lath of the present utility model;
图4是本实用新型的金属板条结合于第一板面的立体外观图;Fig. 4 is a three-dimensional appearance view of the metal lath of the present invention combined with the first plate surface;
图5是本实用新型的第二板面的立体外观图;Fig. 5 is a three-dimensional appearance view of the second panel of the present invention;
图6是本实用新型的第二板面组装于第一板面的动作示意图;Fig. 6 is a schematic diagram of the action of assembling the second panel on the first panel of the present invention;
图7是本实用新型的使用示意图;以及Figure 7 is a schematic view of the utility model; and
图8是本实用新型的机箱组装完成后的示意图。Fig. 8 is a schematic diagram of the assembled chassis of the present invention.
附图标记说明:Explanation of reference signs:
现有技术:10a-导热模块;20a-导热块;30a-弹性结构;40a-发热元件;50a-机箱板面;Existing technology: 10a-heat conduction module; 20a-heat conduction block; 30a-elastic structure; 40a-heating element; 50a-chassis panel;
本实用新型:1-机箱;2-发热元件;3-导热模块;10-第一板面;11-侧板;110-结合孔;12-螺件;20-金属板条;21-平直段;211-第一结合部;22-弯曲段;221-螺孔;23-凸耳;231-缺槽;232-锁合件;24-盖板;30-第二板面;300-内壁面;301-第二结合部;31-定位肋;A-传导面;B-贴接面。The utility model: 1-chassis; 2-heating element; 3-heat conduction module; 10-first plate surface; 11-side plate; 110-combining hole; 12-screw; Section; 211-the first junction; 22-curved section; 221-screw hole; 23-lug; 231-notch; 232-locking piece; Wall surface; 301-second joint; 31-positioning rib; A-conducting surface; B-bonding surface.
具体实施方式 Detailed ways
有关本实用新型的详细说明及技术内容,配合图式说明如下,然而所附图式仅提供参考与说明用,并非用来对本实用新型加以限制。The detailed description and technical content of the present utility model are described below with drawings, but the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.
请参照图2,是为本实用新型的机箱的立体分解图;本实用新型是提供一种机箱板面的弹性固定结构及具该结构的散热装置,一机箱1置设有呈相互垂直的一第一板面10及一第二板面30,该第一板面10的一面设有一金属板条20,该第二板面30是垂直立于该第一板面10的一侧,该第二板面30之外侧具有一定位肋31;于本实施例中,该机箱1上是具有一贴接面B,该贴接面B是为该第二板面30结合于该机箱1时的预定固定处,另,该机箱1内设有一发热元件2及一导热模块3,该导热模块3是供传导该发热元件2所产生的热,其是包含一导热块3a及多个热管3b,该导热块3a的一侧是贴接于所述发热元件2的表面,其另一侧则穿接该等热管3b,其中,该等热管3b是成型有一传导面A。Please refer to Fig. 2, which is a three-dimensional exploded view of the cabinet of the present invention; the utility model provides an elastic fixing structure for the panel surface of the cabinet and a heat dissipation device with the structure, and a
请另参图3,是为本实用新型的金属板条的立体外观示意图;该金属板条20具有平行于该第一板面10的一平直段21及自该平直段21的两端处分别延伸的一弯曲段22,该平直段21上设有一第一结合部211,该弯曲段22的末端设有一螺孔221,该弯曲段22是向内弯曲而呈一U型,该金属板条20因设有该弯曲段22而具弹性变形的能力。Please also refer to FIG. 3 , which is a schematic diagram of the three-dimensional appearance of the metal lath of the present invention; the
请再参图4,是为本实用新型的金属板条结合于第一板面的立体外观图;该金属板条20是自该第一板面10的一端延伸至该第一板面10的另一端,而该金属板条20的二端分别结合于该第一板面10的二侧板11上,该第一板面10于该侧板11上是设有一结合孔110,将该金属板条20的弯曲段22末端的螺孔221对准该第一板面10的侧板11的结合孔110,并于该结合孔110及螺孔221中螺合一螺件12,以将该金属板条20的弯曲段22锁合于该第一板面10上;于本实施例中,该金属板条20的平直段21是延伸出有一凸耳23,并在该凸耳23上开设有一缺槽231,而该第一板面10上更设有一盖板24,该凸耳23则穿设在该第一板面10及该盖板24之间,并通过一锁合件232穿设该盖板24及凸耳23的该缺槽231而锁固于该第一板面10上,以将该金属板条20固定于该第一板面10上。Please refer to FIG. 4 again, which is a three-dimensional appearance view of the metal lath combined with the first plate surface of the present invention; the
请续参图5,是为本实用新型的第二板面的立体外观图;该第二板面30是垂直于该第一板面10的一侧,该第二板面30设有一第二结合部301,当该第二结合部301与该第一结合部211(参图4)相互结合时,该金属板条20是产生压缩或拉伸的弹性变形,此时,该金属板条20即通过弯曲段22的弹性回复力以常态施力于该第二板面30上,令该第二板面30可弹性地结合于该第一板面10上,进而确实地固定于该机箱1的贴接面B;于本实施例中,该第一结合部211是设为多个勾槽,而该第二结合部301是设为多个卡勾,该等卡勾是对应扣设于该金属板条20的各勾槽中;另,该第二板面30的内壁面300亦设有多个热管3b,可将传导至该第二板面30局部区域的热均匀地扩散至整个该第二板面30上,以加速散热。Please continue to refer to Figure 5, which is a perspective view of the second panel of the present utility model; the
请参照图6,是为本实用新型的第二板面组装于第一板面的动作示意图;该第二板面30的第二结合部301是穿设于该第一板面10的第一结合部211中,当各卡勾对应扣设于各勾槽中后,推送该第二板面30,利用该第二板面30的定位肋31以将该第二板面30定位,使该第二板面30之内壁面300定位于该机箱1上的贴接面B。Please refer to FIG. 6 , which is a schematic diagram of the assembly of the second panel of the present invention on the first panel; In the
请参照图7,是为本实用新型的使用示意图;该金属板条20因设有弯曲段22而具弹性,因此,当该第二板面30的第二结合部301与该金属板条20的第一结合部211相互结合时,该第二结合部301会拉伸或压缩该金属板条20,该金属板条20即通过弯曲段22的弹性回复力而常态施力于该第二结合部301上,使该第二板面30弹性地结合于该第一板面10上。Please refer to FIG. 7 , which is a schematic view of the utility model; the
请参照图8,是为本实用新型的机箱组装完成后的示意图;当该第二板面30弹性地固定于该机箱1上后,该等热管3b或该第二板面30可弹性贴接于该导热模块3的传导面A上,因此,该发热元件2所产生的热,经由该导热模块3,再通过该传导面A而传导至该第二板面30,并以该第二板面30将热逸散。Please refer to FIG. 8 , which is a schematic diagram of the assembled chassis of the present invention; when the
以上所述仅为本实用新型的较佳实施例,非用以限定本实用新型的专利范围,其他运用本实用新型的专利精神的等效变化,均应俱属本实用新型的专利范围。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. Other equivalent changes using the patent spirit of the present utility model all belong to the patent scope of the present utility model.
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CN106020400A (en) * | 2016-07-01 | 2016-10-12 | 山东超越数控电子有限公司 | CPCI module cooling method |
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CN106020400A (en) * | 2016-07-01 | 2016-10-12 | 山东超越数控电子有限公司 | CPCI module cooling method |
CN106020400B (en) * | 2016-07-01 | 2018-12-14 | 山东超越数控电子有限公司 | A kind of CPCI module heat dissipating method |
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