CN201278348Y - Plug-in type light emitting diode packaging structure special for fuse - Google Patents
Plug-in type light emitting diode packaging structure special for fuse Download PDFInfo
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- CN201278348Y CN201278348Y CNU2008201232044U CN200820123204U CN201278348Y CN 201278348 Y CN201278348 Y CN 201278348Y CN U2008201232044 U CNU2008201232044 U CN U2008201232044U CN 200820123204 U CN200820123204 U CN 200820123204U CN 201278348 Y CN201278348 Y CN 201278348Y
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- 238000004806 packaging method and process Methods 0.000 title abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000005538 encapsulation Methods 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000004020 luminiscence type Methods 0.000 claims 5
- 239000007787 solid Substances 0.000 claims 2
- 241000218202 Coptis Species 0.000 claims 1
- 235000002991 Coptis groenlandica Nutrition 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Fuses (AREA)
Abstract
Description
技术领域 technical field
本实用新型有关一种发光二极管,尤指一种保险丝专用的插件式发光二极管封装结构。The utility model relates to a light-emitting diode, in particular to a plug-in type light-emitting diode packaging structure dedicated to fuses.
背景技术 Background technique
目前汽车所使的保险丝都以电性连接于该汽车设备的控制回路上,以确保该回路所电性连接的设备不会因为汽车瞬间启动,或开关瞬间按下所产生的逆向大电流(浪涌信号)给烧毁。At present, the fuses used in automobiles are electrically connected to the control circuit of the automobile equipment to ensure that the equipment electrically connected to the circuit will not be reversed due to the instantaneous start of the automobile or the instantaneous pressing of the switch. Surge signal) to burn out.
由于较早被制造出来的汽车保险丝在连接于两个导电插片之间的熔丝烧断后,从保险丝的壳体外观是无法直接观测出来。因此在检修时,维修者必须逐一的将每个保险丝拔起检查,将导致维修上费时、费工。为了使检修或维修便利,将汽车保险丝的两个导电插片之间电性连接有低电阻值的发光二极管,当两个导电插片之间电性连接的熔丝烧断时,该电流就流过该发光二极管,使发光二极管被点亮。在维修者打开保险丝盒后,可以直接看到是哪一个保险丝的发光二极管被点亮,即表示该保险丝的熔丝已烧断,以便于维修者维修或更换保险丝。Since the fuse of the automobile fuse that was manufactured earlier is blown after the fuse connected between the two conductive inserts, it cannot be directly observed from the appearance of the fuse housing. Therefore, when overhauling, the maintainer must pull out each fuse one by one to check, which will result in time-consuming and labor-intensive maintenance. In order to facilitate overhaul or maintenance, a low-resistance light-emitting diode is electrically connected between the two conductive inserts of the car fuse. When the fuse electrically connected between the two conductive inserts is blown, the current will be Flow through the light emitting diode, so that the light emitting diode is lit. After the maintainer opens the fuse box, he can directly see which fuse's light-emitting diode is lit, which means that the fuse of the fuse has been blown, so that the maintainer can repair or replace the fuse.
但是,连接在两个导电插片之间的发光二极管为低电阻值特性的组件,所以瞬间流过发光二极管的电流过大时,将会烧毁发光二极管。因此为了避免发光二极管被烧毁,在该发光二极管的其中一个接脚上电性连接高电阻值的电阻组件。虽然,在发光二极管的其中一个上串联一个高电阻值的电阻组件,可以确保发光二极管不被烧毁,但是以此种连接方式易造成制作上的麻烦。However, the light-emitting diode connected between the two conductive inserts is a low-resistance component, so when the current flowing through the light-emitting diode is too large, it will burn the light-emitting diode. Therefore, in order to prevent the light-emitting diode from being burned, a high-resistance resistor component is electrically connected to one of the pins of the light-emitting diode. Although connecting a high-resistance resistor component in series with one of the light-emitting diodes can ensure that the light-emitting diodes will not be burned, such a connection method is likely to cause troubles in production.
实用新型内容 Utility model content
有鉴于此,本实用新型的主要目的在于提供一种易于操作、制作简单的保险丝专用的插件式发光二极管封装结构。In view of this, the main purpose of the present utility model is to provide an easy-to-operate and simple-to-manufacture plug-in LED packaging structure dedicated to fuses.
为达到上述目的,本实用新型提供一种保险丝专用的插件式发光二极管封装结构,其包括:基板、电极层、芯片组、导线组、两个电极接脚及外壳体。该基板上具有正面及背面。该电极层设于该基板正面上,且由两个相对称的第一及第二凸字形电极与第一及第二直线形电极组成。该芯片组由第一及第二电阻芯片与第一及第二发光芯片组成,该第一电阻芯片及第二发光芯片固晶于该第一凸字形电极上,该第二电阻芯片及第一发光芯片固晶于该第二凸字形电极上。该导线组电性连接于该第一电阻芯片、第一发光芯片与该第一直线形电极之间,与该第二电阻芯片、第二发光芯片与该第二直线形电极之间。该两个电极接脚固接于该基板的两端上,并与该第一及第二凸字形电极电性连接。该外壳体将该电极层、芯片组、导线组及两个电极接脚一端封装,以避免该芯片组受到外部破坏,同时该外壳体也形成该发光二极管封装结构的透镜。In order to achieve the above purpose, the utility model provides a plug-in LED packaging structure dedicated to fuses, which includes: a substrate, an electrode layer, a chipset, a wire set, two electrode pins and an outer shell. The substrate has a front side and a back side. The electrode layer is arranged on the front surface of the substrate and is composed of two symmetrical first and second convex-shaped electrodes and first and second linear electrodes. The chipset is composed of first and second resistor chips and first and second light-emitting chips. The first resistor chip and the second light-emitting chip are crystal-bonded on the first convex electrode. The light-emitting chip is crystal-bonded on the second convex-shaped electrode. The wire group is electrically connected between the first resistance chip, the first light-emitting chip and the first linear electrode, and between the second resistance chip, the second light-emitting chip and the second linear electrode. The two electrode pins are fixedly connected to both ends of the substrate, and are electrically connected with the first and second protruding electrodes. The outer casing encapsulates the electrode layer, the chip group, the wire group and one end of the two electrode pins, so as to prevent the chip group from being damaged by the outside, and at the same time, the outer casing also forms the lens of the light emitting diode packaging structure.
本实用新型的保险丝专用的插件式发光二极管封装结构,将电阻芯片与发光二极管的发光芯片结合在一个封装结构里,以形成具有电阻特性的发光二极管封装结构,只要将该发光二极管封装结构电性连接于汽车保险丝的两个导电插片之间,在该汽车保险丝的两个导电插片之间的熔丝烧断后,该发光二极管封装结构可以承受大电流流过而被点亮,使用者或维修者能够比较容易地判断保险丝的熔丝的烧断情况,同时该封装结构制作简单。The plug-in type light-emitting diode package structure dedicated to the fuse of the utility model combines the resistance chip and the light-emitting chip of the light-emitting diode in one package structure to form a light-emitting diode package structure with resistance characteristics, as long as the light-emitting diode package structure is electrically Connected between the two conductive blades of the car fuse, after the fuse between the two conductive blades of the car fuse is blown, the LED package structure can withstand a large current flow and be lit, the user or The maintainer can relatively easily judge the blown condition of the fuse of the fuse, and at the same time, the packaging structure is simple to manufacture.
附图说明 Description of drawings
图1为本实用新型的插件式发光二极管未封装前的立体示意图;Fig. 1 is a three-dimensional schematic view of the plug-in light-emitting diode of the present invention before being packaged;
图2为本实用新型的插件式发光二极管封装结构的外观立体示意图;Fig. 2 is a three-dimensional schematic diagram of the appearance of the package structure of the plug-in light emitting diode of the present invention;
图3为本实用新型的插件式发光二极管封装结构的俯视示意图;Fig. 3 is a schematic top view of the package structure of the plug-in light emitting diode of the present invention;
图4为本实用新型的插件式发光二极管封装结构的侧视示意图;Fig. 4 is a schematic side view of the package structure of the plug-in light emitting diode of the present invention;
图5为本实用新型的插件式发光二极管封装结构的等效电路示意图;Fig. 5 is a schematic diagram of an equivalent circuit of the plug-in light-emitting diode packaging structure of the present invention;
图6为本实用新型的插件式发光二极管封装结构使用状态示意图。Fig. 6 is a schematic diagram of the use state of the plug-in LED packaging structure of the present invention.
附图标记说明Explanation of reference signs
发光二极管封装结构 10Light-emitting
基板 1
正面 11
背面 12Back 12
电极层 2
第一凸字形电极 21aThe
第二凸字形电极 21bThe
第一直线形电极 22aFirst
第二直线形电极 22bSecond
芯片组 3
第一电阻芯片 31aThe
第二电阻芯片 31bThe
第一发光芯片 32aThe first light-emitting
第二发光芯片 32bThe second light-emitting
导线组 4Wire set 4
电极接脚 5Electrode
外壳体 6
保险丝壳体 20
右侧导电插片 201Right
左侧导电插片 202Left
熔丝 203
具体实施方式 Detailed ways
有关本实用新型的技术内容及详细说明,现配合附图说明如下:Relevant technical content and detailed description of the present utility model, cooperate accompanying drawing to illustrate as follows now:
请参阅图1,为本实用新型的插件式发光二极管未封装前的立体示意图。如图1所示:本实用新型的保险丝专用的插件式发光二极管封装结构,该插件式发光二极管封装结构10,包括:基板1、电极层2、芯片组3、导线组4及两个电极接脚5。Please refer to FIG. 1 , which is a three-dimensional schematic view of the plug-in LED of the present invention before being packaged. As shown in Figure 1: the plug-in type light-emitting diode packaging structure dedicated to the fuse of the present invention, the plug-in type light-emitting
该基板1,其设有正面11及背面12。在图1中,该基板为绝缘材质。The
该电极层2,设于该基板1的正面11上,该电极层2由两个相对称的第一及第二凸字形电极21a、21b与第一及第二直线形电极22a、22b组成。在图1中,该电极层2为铜箔。The
该芯片组3,由第一及第二电阻芯片31a、31b及第一及第二发光芯片32a、32b组成,该第一电阻芯片31a及第二发光芯片32b固晶于该第一凸字形电极21a,该第二电阻芯片31b及第一发光芯片32a固晶于该第二凸字形电极21b上。在图1中,该第一及第二电阻芯片31a、31b以作为限流电阻,以保护第一及第二发光芯片32a、32b。The
该导线组4,以电性连接于该第一电阻芯片31a、第一发光芯片32a及第一直线形电极22a之间,与第二电阻芯片31b、第二发光芯片32b及第二直线形电极22b之间,在该导线组4电性连接两组第一及第二电阻芯片31a、31b与第一及第二发光芯片32a、32b后,使该发光二极管电路形成无极性状态。在图1中,该导线组4以金线为材料。The
该两个电极接脚5,为长条状,固接于该基板1的两端上,并与该第一及第二凸字形电极21a、21b电性连接,以该两个电极接脚5作为发光二极管电路的电源输入端及输出端。The two
请参阅图2,为本实用新型的插件式发光二极管封装结构的立体示意图。如图2所示:在插件式发光二极管的基板1的正面11完成固晶及打线的制作过程后,将该基板1外表封装由透明树脂形成的封装结构体,该封装结构体成为透明外壳体6,并将该电极层2、芯片组3、导线组4及两个电极接脚5一端封包住,以成为插件式发光二极管封装结构10,以避免芯片组3受到外部破坏。同时,该外壳体6也形成该发光二极管封装结构10的透镜。Please refer to FIG. 2 , which is a three-dimensional schematic view of the plug-in LED packaging structure of the present invention. As shown in Figure 2: After the
请参阅图3、图4,为本实用新型的插件式发光二极管封装结构的俯视及侧视示意图。如图3、图4所示:在完成一个无极性的插件式发光二极管封装结构10后,当施加电压的正电压于该左侧的电极接脚5时,而负电压施加于该右侧的电极接脚5时,电流流经第一电阻芯片31a及第一发光芯片32a,使该第一发光芯片32a被点亮。Please refer to FIG. 3 and FIG. 4 , which are schematic top and side views of the plug-in LED packaging structure of the present invention. As shown in Figure 3 and Figure 4: After completing a non-polar plug-in
同样地,当施加电压的负电压于该左侧的电极接脚5时,而正电压施加于该右侧的电极接脚5时,电流流经第二电阻芯片31b及第二发光芯片32b,使该第二发光芯片32b被点亮。Similarly, when a negative voltage is applied to the
请参阅图5,为本实用新型的插件式发光二极管封装结构的等效电路示意图。如图5所示:此图所揭露的等效电路,由两组线路组成。第一组线路由第一电阻芯片31a与第一发光芯片32a串联连接而成,而第二组线路由第二电阻芯片31b与第二发光芯片32b串联连接而成。再将第一电阻芯片31a的输入端与该第二发光芯片32b输出端电性连接,而该第二电阻芯片31b的输入端与该第一发光芯片32a输出端电性连接,以形成无极性发光二极管线路。Please refer to FIG. 5 , which is a schematic diagram of an equivalent circuit of the plug-in LED packaging structure of the present invention. As shown in Figure 5: the equivalent circuit disclosed in this figure consists of two sets of circuits. The first group of circuits is formed by serially connecting the
在A点施加正电压及B点施加负电压时,由第一组线路的第一电阻芯片31a及第一发光芯片32a通电,使该第一发光芯片32a被点亮。在A点施加负电压及B点施加正电压时,由第二组线路的第二电阻芯片31b及第二发光芯片32b通电,使该第二发光芯片32b被点亮。When a positive voltage is applied to point A and a negative voltage is applied to point B, the
请参阅图6,为本实用新型的插件式发光二极管封装结构使用状态示意图。如图6所示:当发光二极管封装结构安装于汽车保险丝壳体20内部,以两个电极接脚5与该汽车保险丝壳体20内部的右侧及左侧导电插片201、202电性连接,当流入过大电流由右侧导电插片201或由左侧导电插片202流入,使连接在左、右侧导电插片202、201之间的熔丝203烧断后,即使第一发光芯片32a或第二发光芯片32b被点亮,使用者或维修者得知保险丝的熔丝203已被烧断,需更换汽车保险丝。Please refer to FIG. 6 , which is a schematic view of the use state of the plug-in LED packaging structure of the present invention. As shown in Figure 6: when the light-emitting diode package structure is installed inside the
上述仅为本实用新型的较佳实施例而已,并非用来限定本实用新型实施的范围。即凡依本实用新型申请专利范围所做的均等变化与修饰,均为本实用新型专利范围所涵盖。The above are only preferred embodiments of the present utility model, and are not intended to limit the implementation scope of the present utility model. That is, all equal changes and modifications made according to the patent scope of the utility model are covered by the patent scope of the utility model.
Claims (6)
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CNU2008201232044U CN201278348Y (en) | 2008-10-21 | 2008-10-21 | Plug-in type light emitting diode packaging structure special for fuse |
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CNU2008201232044U CN201278348Y (en) | 2008-10-21 | 2008-10-21 | Plug-in type light emitting diode packaging structure special for fuse |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102403306A (en) * | 2010-09-10 | 2012-04-04 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102403306A (en) * | 2010-09-10 | 2012-04-04 | 展晶科技(深圳)有限公司 | Light-emitting diode packaging structure |
CN102403306B (en) * | 2010-09-10 | 2015-09-02 | 展晶科技(深圳)有限公司 | Package structure for LED |
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