CN201171044Y - Apparatus for adsorbing base plate - Google Patents
Apparatus for adsorbing base plate Download PDFInfo
- Publication number
- CN201171044Y CN201171044Y CNU2008200104674U CN200820010467U CN201171044Y CN 201171044 Y CN201171044 Y CN 201171044Y CN U2008200104674 U CNU2008200104674 U CN U2008200104674U CN 200820010467 U CN200820010467 U CN 200820010467U CN 201171044 Y CN201171044 Y CN 201171044Y
- Authority
- CN
- China
- Prior art keywords
- wafer
- centrifuge
- base frame
- sealing ring
- adsorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 claims abstract description 21
- 238000010521 absorption reaction Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000001179 sorption measurement Methods 0.000 abstract 8
- 238000000034 method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 32
- 238000012986 modification Methods 0.000 description 15
- 230000004048 modification Effects 0.000 description 15
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to an adsorption base frame device used for ensuring a wafer to be rotated in high speed after the wafer is arranged on the semiconductor equipment, in particular to a rotating device which can securely deliver and carry the wafer with warping deformation. The device comprises an easy deforming sealing ring, an adsorption base plane, an adsorption base frame, a centrifuge vacuum channel and a centrifuge, wherein, a wafer and the adsorption base plane of the base frame are arranged on the upper surface of the adsorption base frame, the easy deforming sealing ring is installed in the position of the vacuum adsorption position of the base frame and the wafer, and the centrifuge vacuum channel communicated with a centrifuge is arranged on the adsorption base frame. The adsorption base frame device can solve the problem that the wafer is easy to be dropped off when the wafer is warped, the mechanism can not only absorb standard wafer, but also tightly absorb the wafer with warping deformation, to ensure the wafer to be not easy to be dropped off during the rotating process, or prevent the wafer from causing the equipment to be stopped.
Description
Technical field:
The utility model relates to the suction base device that is used for making after the loaded with wafers wafer high speed rotating on the semiconductor equipment, especially can transmit the whirligig that delivery has the wafer of warpage modification safely.
Background technology:
At present, the even glue of wafer and development are to rotate together by the wafer that centrifuge drive chuck (base) adsorbs to realize on the semiconductor equipment, but warpage takes place in the manufacturing process of preceding operation wafer sometimes, and warpage is last, downward sometimes sometimes, and is fixing.At this moment common suction base is because the warpage of wafer, and can not hold wafer fully, and wafer can cause equipment downtime because absorption affinity is little in rotary course, even can fall sheet, causes unnecessary loss.
The utility model content:
In order to overcome above-mentioned deficiency; the utility model provides a kind of novel suction base device; fall problems such as sheet when solving silicon wafer warpage easily; this mechanism not only can adsorb the wafer of standard; also can tightly adsorb the wafer that has the warpage modification; make it in rotary course, can not fall sheet, or cause equipment downtime.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of suction base device, this device is provided with flexible type sealing ring, absorption basal plane, suction base, centrifuge vacuum passage, centrifuge, the suction base upper surface is provided with the absorption basal plane of wafer and base, on base, the flexible type sealing ring is installed, is had the centrifuge vacuum passage that communicates with centrifuge in the suction base with wafer vacuum absorption place.
The utility model is installed soft slim flexible type sealing ring at base and wafer vacuum absorption place, the upper space of sealing ring will keep in one plane, and the basal plane keeping parallelism that contacts with wafer with base, when loading for the standard wafer that does not have distortion, because the soft flexible type of slim sealing ring, vacuum is opened wafer bottom surface, back sealing ring is flattened fully, and wafer and suction base are adsorbed fully, and is identical with common suction base; When the wafer that has the warpage modification loads, because the effect of gravity, sealing ring can be along with the direction generation modification of chip warpage modification, the circle wafer complete and modification of going up of sealing ring is overlapped, after vacuum is opened, because the sealing ring of modification and modification bottom of wafer complete closed form negative pressure and will be attached together firmly with base, even also can not be separated from the rotary course rapidly.
The beneficial effects of the utility model are, no matter whether the wafer of apparatus processing has the warpage modification, and the utility model suction base can be made safely, does not fall sheet, and is simple in structure.
Description of drawings:
Fig. 1 is the utility model structural front view.
Fig. 2 is the utility model structural upright schematic diagram.
Among the figure, 1 flexible type sealing ring; 2 basal planes; 3 bases; 4 centrifuge vacuum passages; 5 centrifuges.
Embodiment:
Below in conjunction with drawings and Examples the utility model is further specified.
Shown in Fig. 1-2, the utility model suction base device is provided with flexible type sealing ring 1, absorption basal plane 2, suction base 3, centrifuge vacuum passage 4, centrifuge 5 etc.Suction base 3 upper surfaces are provided with the absorption basal plane 2 of wafer and base, with wafer vacuum absorption place soft slim flexible type sealing ring 1 are installed on base 3, have the centrifuge vacuum passage 4 that communicates with centrifuge 5 in the suction base 3.
In the present embodiment, flexible type sealing ring 1 material can be silica gel.
After loading for the standard wafer that does not have distortion, the wafer bottom surface flattens flexible type sealing ring 1, after vacuum is opened, vacuum is passed to suction base 3 by centrifuge vacuum passage 4, wafer is contacted fully with base absorption basal plane 2, thereby wafer and suction base 3 are tightly adsorbed, identical with common suction base;
When the wafer that has the warpage modification loads, because the effect of gravity, flexible type sealing ring 1 can be along with the direction generation modification of chip warpage modification, the bottom surface of going up circle and modification wafer of flexible type sealing ring 1 is fitted like a glove, after vacuum is opened, because the flexible type sealing ring 1 of modification and modification wafer complete closed form negative pressure and will firmly be attached together with suction base 3, even also can not fall down in the rotary course rapidly at centrifuge 5.
Claims (1)
1, a kind of suction base device, it is characterized in that: this device is provided with flexible type sealing ring, absorption basal plane, suction base, centrifuge vacuum passage, centrifuge, the suction base upper surface is provided with the absorption basal plane of wafer and base, on base, the flexible type sealing ring is installed, is had the centrifuge vacuum passage that communicates with centrifuge in the suction base with wafer vacuum absorption place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200104674U CN201171044Y (en) | 2008-01-25 | 2008-01-25 | Apparatus for adsorbing base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200104674U CN201171044Y (en) | 2008-01-25 | 2008-01-25 | Apparatus for adsorbing base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201171044Y true CN201171044Y (en) | 2008-12-24 |
Family
ID=40210093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200104674U Expired - Lifetime CN201171044Y (en) | 2008-01-25 | 2008-01-25 | Apparatus for adsorbing base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201171044Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386051A (en) * | 2010-09-02 | 2012-03-21 | 北京中电科电子装备有限公司 | Slice absorbing platform device |
| WO2012068751A1 (en) * | 2010-11-22 | 2012-05-31 | 沈阳芯源微电子设备有限公司 | Absorption device for rotatable heating |
| CN103367217A (en) * | 2012-04-11 | 2013-10-23 | 上海微电子装备有限公司 | Silicon-chip absorption device and absorption method thereof |
| CN103901735A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Silicon slice ejection mechanism |
| CN105374733A (en) * | 2014-08-20 | 2016-03-02 | 沈阳芯源微电子设备有限公司 | Wafer adsorption apparatus |
-
2008
- 2008-01-25 CN CNU2008200104674U patent/CN201171044Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386051A (en) * | 2010-09-02 | 2012-03-21 | 北京中电科电子装备有限公司 | Slice absorbing platform device |
| WO2012068751A1 (en) * | 2010-11-22 | 2012-05-31 | 沈阳芯源微电子设备有限公司 | Absorption device for rotatable heating |
| US9666457B2 (en) | 2010-11-22 | 2017-05-30 | Shenyang Kingsemi Co., Ltd. | Adsorption device for rotatable heating |
| CN103367217A (en) * | 2012-04-11 | 2013-10-23 | 上海微电子装备有限公司 | Silicon-chip absorption device and absorption method thereof |
| CN103367217B (en) * | 2012-04-11 | 2016-08-24 | 上海微电子装备有限公司 | A kind of silicon-chip absorption device and absorption method thereof |
| CN103901735A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Silicon slice ejection mechanism |
| CN103901735B (en) * | 2012-12-28 | 2016-02-03 | 上海微电子装备有限公司 | Silicon chip penetrating mechanism |
| CN105374733A (en) * | 2014-08-20 | 2016-03-02 | 沈阳芯源微电子设备有限公司 | Wafer adsorption apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102584335B1 (en) | Bonding apparatus and bonding system | |
| CN201171044Y (en) | Apparatus for adsorbing base plate | |
| CN106455353B (en) | Automatic PCB high-temperature adhesive tearing device and adhesive tearing process thereof | |
| CN101728300A (en) | Novel non-vacuum adsorption wafer clamping mechanism | |
| WO2019095564A1 (en) | Substrate clamping device | |
| CN106098849B (en) | Flower basket clamping mechanism, flower basket handling robot and handling method thereof | |
| TW202143382A (en) | Automatic sticking and removing equipment | |
| CN101434069A (en) | Transmission arm | |
| CN104992921B (en) | A clamping device for large-sized ultra-thin wafers | |
| CN201102246Y (en) | Convection arm | |
| CN115440632A (en) | Stripping device for wafer and automatic equipment for stripping wafer | |
| CN215527694U (en) | Adsorption device for transferring thin wafers | |
| CN115424966A (en) | Top thorn formula crystalline grain transfer device | |
| CN216104863U (en) | Automatic silicon wafer feeding device | |
| CN106271341A (en) | An air-floating chuck fixture | |
| CN115440642B (en) | Carrier plate bearing device suitable for grain transfer | |
| CN207451087U (en) | A kind of double upper material box devices of cell piece | |
| CN211879332U (en) | Needle device is planted in upset | |
| CN215437115U (en) | Glass film sticking machine | |
| CN205253469U (en) | Liquid wax of wafer revolves wax device | |
| CN103381960A (en) | Sheet feeding and conveying device | |
| CN109720865B (en) | Material taking and feeding device and material taking and feeding method | |
| CN221939609U (en) | Flake separation device | |
| CN209382349U (en) | A turntable carrier for film laminating machine | |
| CN112660480A (en) | Glass film sticking machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081224 |
|
| CX01 | Expiry of patent term |