CN201156858Y - Electronic component device with air duct - Google Patents
Electronic component device with air duct Download PDFInfo
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- CN201156858Y CN201156858Y CNU2007203116151U CN200720311615U CN201156858Y CN 201156858 Y CN201156858 Y CN 201156858Y CN U2007203116151 U CNU2007203116151 U CN U2007203116151U CN 200720311615 U CN200720311615 U CN 200720311615U CN 201156858 Y CN201156858 Y CN 201156858Y
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- air
- air outlet
- heat source
- air duct
- electronic component
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- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 239000002344 surface layer Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
Description
技术领域 technical field
本实用新型涉及一种电子元件装置。The utility model relates to an electronic component device.
背景技术 Background technique
目前,一般市面上的电子装置,如电脑内的中央处理单元(CPU)及其周围主机版的电子元件或零件等,其在运转或工作状态下皆会发出热量,为避免电脑内部的精密元件因温度过高而损坏,通常会加装一散热模组或风扇模组,来进行散热。由于科技日新月异,各种电子装置也日益精密,其所散发的热量也随之提高,因此可能就需要加装更大的风扇或增加数量,以免造成系统内散热不良而导致系统死机,或者是内部零件寿命的降低。At present, the general electronic devices on the market, such as the central processing unit (CPU) in the computer and the electronic components or parts of the host board around it, will emit heat when they are running or working. In order to prevent the precision components inside the computer from If it is damaged due to high temperature, a heat dissipation module or fan module is usually installed to dissipate heat. Due to the rapid development of science and technology, various electronic devices are becoming more and more sophisticated, and the heat emitted by them is also increasing. Therefore, it may be necessary to install larger fans or increase the number to avoid poor heat dissipation in the system and cause the system to crash. Reduced part life.
有时也需要考虑到商品整体的体积大小,而无法加装体积较大的风扇,而规格较小及散热功率较佳的风扇,其价格也随之提高,且较大的风扇也有噪音上的考虑,而增加风扇数量导致成本及体积的负担,也是业界所不愿乐见的,因此如何能降低成本且能增加散热的效率,是一个亟待解决的问题。Sometimes it is also necessary to consider the overall size of the product, and it is impossible to install a larger fan, and the price of a fan with a smaller specification and better heat dissipation power will also increase accordingly, and the larger fan also has noise considerations , and increasing the number of fans leads to cost and volume burdens, which the industry does not want to see. Therefore, how to reduce costs and increase heat dissipation efficiency is an urgent problem to be solved.
实用新型内容Utility model content
本实用新型的主要目的在于提供一种具有风道的电子元件装置,其利用电子元件装置的封闭结构,在此壳体内形成流向导通的风道,使气体能流经每一个热源体的表面以及底面层,将热源体所产生的热经由风道带离,以达到大幅提升散热效率的功效。The main purpose of this utility model is to provide an electronic component device with an air duct, which uses the closed structure of the electronic component device to form a flow-through air duct in the casing, so that the gas can flow through the surface of each heat source body As well as the bottom layer, the heat generated by the heat source body is taken away through the air duct, so as to achieve the effect of greatly improving the heat dissipation efficiency.
本实用新型的另一目的在于提供一种具有风道的电子元件装置,其利用风扇体与出风口相对位置垂直,形成一容置空间,以达到降低噪音的功效。Another object of the present invention is to provide an electronic component device with an air duct, which utilizes the relative position of the fan body and the air outlet to form an accommodating space to reduce noise.
为达到上述目的,本实用新型的具有风道的电子元件装置,其包含:一壳体、若干个热源体、复数个开口、一入风口及一出风部。In order to achieve the above purpose, the electronic component device with an air duct of the present invention includes: a housing, several heat source bodies, a plurality of openings, an air inlet and an air outlet.
该壳体其内排列有大致相互平行的复数个承载面体,将此壳体形成为若干个容置空间。而每一热源体是分别位于一承载面体上,且每一热源体的顶侧与另一承载面体是形成有一间隙。每一开口是位于此承载面体上,使此容置空间与另一容置空间相导通。该入风口提供气体通过进入此壳体中。该出风部具有一出风口以及与此出风口相对应的一风扇体,此出风口大致与此承载面体延伸方向相平行,且此风扇体的轴向方向大致与此承载面体延伸方向相垂直。A plurality of bearing surfaces roughly parallel to each other are arranged inside the housing, forming the housing into several accommodating spaces. Each heat source body is respectively located on a bearing surface body, and a gap is formed between the top side of each heat source body and the other bearing surface body. Each opening is located on the carrying surface body, so that the accommodating space communicates with another accommodating space. The air inlet provides air to pass into the housing. The air outlet part has an air outlet and a fan body corresponding to the air outlet, the air outlet is roughly parallel to the extending direction of the bearing surface body, and the axial direction of the fan body is roughly perpendicular to the extending direction of the bearing surface body .
本实用新型的较佳实施例中,此出风部更包含一风道遮罩,设置于对应于风扇体与出风口处,该风道遮罩是提供导引此风扇体流出的气体至通过出风口,并送离此壳体外。In a preferred embodiment of the present utility model, the air outlet part further includes an air duct cover, which is arranged corresponding to the fan body and the air outlet, and the air duct cover is provided to guide the air flowing out of the fan body to pass through Air outlet, and sent away from the shell.
本实用新型的具有风道的电子元件装置,由于其具有风道结构,可使电子元件装置的散热效果大幅提升,且仅需设置一风扇即可同时散去所有热源体的热量,可同时降低成本及噪音与大幅提升散热效率。The electronic component device with air duct of the utility model can greatly improve the heat dissipation effect of the electronic component device due to its air duct structure, and only need to install a fan to dissipate the heat of all heat source bodies at the same time, which can simultaneously reduce Cost and noise and greatly improved heat dissipation efficiency.
附图说明 Description of drawings
图1是本实用新型的具有风道的电子元件装置较佳实施例侧视剖面结构示意图;Fig. 1 is a side view sectional structure schematic diagram of a preferred embodiment of an electronic component device with an air duct of the present invention;
图2是本实用新型的具有风道的电子元件装置的出风部较佳实施例立体结构示意图;Fig. 2 is a three-dimensional structural schematic diagram of a preferred embodiment of the air outlet part of the electronic component device with air ducts of the present invention;
其中:in:
11:壳体;12:入风口;14、14a:热源体;16、16a、16b:承载面体;17、17a、17b:容置空间;18、18a:开口;2:出风部;2l:风扇体;22:出风口;23:风道遮罩;s:间隙。11: shell; 12: air inlet; 14, 14a: heat source body; 16, 16a, 16b: bearing surface; 17, 17a, 17b: accommodation space; 18, 18a: opening; 2: air outlet; 2l: Fan body; 22: air outlet; 23: air duct cover; s: gap.
具体实施方式 Detailed ways
以下将结合附图,对本实用新型的具有风道的电子元件装置的一个较佳实施例进行说明,为使便于理解,下述实施例中的相同元件以相同的符号标示来说明。A preferred embodiment of the electronic component device with an air duct of the present invention will be described below with reference to the accompanying drawings. For ease of understanding, the same components in the following embodiments are described with the same symbols.
请参阅图1所示,是本实用新型的具有风道的电子元件装置的较佳实施例的侧视剖面结构示意图。本实用新型的具有风道的电子元件装置其包括有:一壳体11、一入风口12、一出风部2、复数个热源体14以及复数个承载面体16。该壳体11其内排列有大致相互平行的复数个承载面体16,因此将该壳体内形成为若干个容置空间17,该承载面体16上设置有复数个热源体14,该热源体14可为电子元件或硬盘,且每一热源体14的顶侧与另一承载面体16是形成有一间隙s。每一该承载面体16上更具有至少一开口18,该开口18可以使该容置空间17与另一容置空间17a相导通。本实用新型的较佳实施例中,该承载面体16、16a、16b具有三个,第一个该承载面体16是为一主机板,因此其上布设有复数个电子元件,且该电子元件在电讯导通使用后,会产生热,而第二个及第三个该承载面体16a、16b是分别承载一硬盘,该硬盘在使用时,也会产生热,因此在此实施例中,该热源体14、14a分别为电子元件或硬盘。Please refer to FIG. 1 , which is a side view cross-sectional structure schematic diagram of a preferred embodiment of the electronic component device with air duct of the present invention. The electronic component device with air duct of the utility model includes: a housing 11 , an
且由于该入风口12的开口方向大致与该承载面体16相平行,因此外界的气体是由入风口12流入而进入该壳体11内,且气本的流动是如图中箭头所形成的通道方向,首先通过该热源体(电子元件)14的顶面侧,而至该壳体11的另一侧时,藉由该壳体11本身的阻挡,使气体会以该开口18而进入另一容置空间17a,且沿该间隙s流动,此气体会同时带离热源体(硬盘)14a上所产生的热,以及该承载面体16底面侧所产生的热。在本实用新型较佳实施例中,该气体在此间隙s流动至该壳体11的一侧时(此侧与该入风12为同侧),藉由该壳体11本身的阻挡,使气体会以该开口18a而进入另一容置空间17b。此气体同时会通过该承载面体16b的底面以及热源体(硬盘)14b的顶面而至该出风部2。因此藉由此风道的设计,可将该出风部2仅设计具有一风扇体21即可将气体抽离至壳体11外,以达到散热的目的,并由于气体流经过每一热源体14的顶面及底面侧,而大幅提升散热效率。And because the opening direction of the
请参阅图2所示,是本实用新型的具有风道的电子元件装置的出风部较佳实施例立体结构示意图。在本实用新型的较佳实施例中,该出风部2具有一出风口22以及与该出风口22相对应的一风扇体21,该出风22大致与该承载面体16延伸方向相平行,且该风扇体21的轴向方向大致与该承载面体16延伸方向相垂直。最好还具有一风道遮罩23,藉由在风扇体21与出风22间及风道遮罩23的结合,形成一密闭空间,由于风扇体21运转时,会抽离下方的空气往该密闭空间流动,因此会造成密闭空间内的局部高压,致使气流往出风口22流动,而增加出风22往外的气体流动速率。因流经风扇体21的气流具有一稳定的气体流速,致使空气造成的扰流减少,也就能有效降低因风切导致的噪音。Please refer to FIG. 2 , which is a three-dimensional structural diagram of a preferred embodiment of the air outlet part of the electronic component device with an air duct of the present invention. In a preferred embodiment of the present utility model, the air outlet part 2 has an
上述详细说明仅是针对本实用新型得一个可行实施例的具体说明,该实施例并非用以限定本实用新型的专利范围,任何未脱离本实用新型的精神与范畴,而对其进行的等效修改或变更,均应包含于本实用新型的专利范围中。The above detailed description is only a specific description of a feasible embodiment of the utility model, which is not intended to limit the patent scope of the utility model, and any equivalence to it without departing from the spirit and scope of the utility model Amendments or alterations should be included in the patent scope of the present utility model.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNU2007203116151U CN201156858Y (en) | 2007-12-13 | 2007-12-13 | Electronic component device with air duct |
Applications Claiming Priority (1)
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CNU2007203116151U CN201156858Y (en) | 2007-12-13 | 2007-12-13 | Electronic component device with air duct |
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CN201156858Y true CN201156858Y (en) | 2008-11-26 |
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CNU2007203116151U Expired - Fee Related CN201156858Y (en) | 2007-12-13 | 2007-12-13 | Electronic component device with air duct |
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- 2007-12-13 CN CNU2007203116151U patent/CN201156858Y/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhongyi (Suzhou) Technology Co., Ltd. Assignor: SerComm Corporation Contract record no.: 2011990000541 Denomination of utility model: Electronic element device having air duct Granted publication date: 20081126 License type: Exclusive License Record date: 20110704 |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081126 Termination date: 20161213 |
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CF01 | Termination of patent right due to non-payment of annual fee |