CN201153120Y - Wireless communication module packaging structure - Google Patents

Abstract

The utility model relates to a wireless communication module packaging structure includes: a substrate, one side edge part of which is provided with a concave part, and the surface of the concave part is provided with a grounding welding pad; a conductive cover body, one side edge part of which is provided with a connecting part which is arranged in the concave part and is electrically connected with the grounding welding pad; the cover body covers the top of the substrate, and the inner side wall surface of the cover body is attached to the side edge part of the substrate. The utility model can increase the joint area of a single contact through the connecting part and the grounding welding pad, thereby improving the bonding strength of the single contact between the contact surfaces; the outer edge of the cover body is attached to the side edge of the substrate, so that external force can be dispersed to avoid stress concentration at the joint, and the joint of the connecting part and the grounding welding pad is prevented from being broken; has the advantages of improving the mechanical strength of the whole structure and bearing larger external force. The utility model discloses need not reserve the space of climbing tin in the top surface of the peripheral part of this base plate, have the advantage in the whole space of reduction.

Description

Package structure of wireless communication module

technical field

The utility model relates to a wireless communication module, in particular to a packaging structure of a wireless communication module.

Background technique

The known wireless communication module packaging structure includes: a communication module and a cover; the communication module has a substrate and a plurality of chips arranged on the top surface of the substrate, and the top surface of the substrate is provided with a plurality of grounding pads for The power supply is connected to the bottom edge of the cover. These grounding pads are electrically connected to a grounding mechanism to provide the effect of grounding the cover, so as to achieve the purpose of blocking electromagnetic interference (EMI).

However, due to the limited bonding area between the cover and the ground pad of the substrate, the bonding strength it can provide is limited; when the conventional wireless communication module packaging structure is impacted by external force, the cover and the ground pad of the substrate The joint parts are often easier to be damaged first, and have the disadvantage of poor mechanical strength of the overall structure. Furthermore, this kind of structure needs to reserve a space for tin climbing on the top surface of the peripheral part of the substrate, so as to facilitate the fixing of the cover on the substrate; Including the part where these ground pads are laid out, the practitioner has the disadvantage of having to make the substrate larger and increase the overall space.

To sum up, the conventional wireless communication module packaging structure has the above-mentioned shortcomings and needs to be improved.

Utility model content

The main purpose is to provide a wireless communication module packaging structure, which improves the mechanical strength of the overall structure and has the advantage of being able to withstand relatively large external force impacts.

Another object is to provide a wireless communication module packaging structure, which does not need to reserve a solder creeping space on the top surface of the peripheral part of the substrate, and has the advantage of reducing the overall space.

In order to achieve the above object, a wireless communication module packaging structure is provided, which includes: a substrate, a side edge portion has a concave portion, and a ground pad is provided on the surface of the concave portion; a conductive cover body, a side edge portion There is a connection part, the connection part is arranged in the concave part and is electrically connected to the grounding pad; the cover body covers the top of the substrate, and its inner wall surface is attached to the side edge part of the substrate.

According to an embodiment of the present invention, the surface of the grounding pad is pre-coated with solder paste for electrical connection of the connecting portion of the cover. Each connecting portion has a curved section protruding toward the inner side of the center of the cover, and the curved section of the connecting portion is electrically connected to the ground pad. One side edge of the cover has a curved section protruding toward the inner side of the center of the cover, the connecting portion and the curved section are respectively located at different side edges of the cover, the curved section of the cover is on the side edge of the substrate.

The positive effect of the present utility model: the package structure of the wireless communication module provided by the present utility model exceeds the above-mentioned structure, which can increase the bonding area of a single contact through the connecting part and the grounding pad, thereby improving the bonding between the single contact and the contact surface Intensity; moreover, the outer edge of the cover is attached to the side edge of the substrate, which can disperse the external force and avoid the stress concentration at the joint, so as to prevent the connection between the connection part and the ground pad from breaking; compared with the conventional , which has the advantages of improving the mechanical strength of the overall structure and being able to withstand large external forces. In addition, there is no need to reserve a space for solder crawling on the top surface of the peripheral portion of the substrate; compared with conventional ones, it has the advantage of reducing the overall space.

Description of drawings

Fig. 1 is a perspective view of the first preferred embodiment of the utility model.

Fig. 2 is an exploded view of the components of the first preferred embodiment of the present invention.

3 is a cross-sectional view along the direction 3 - 3 of FIG. 1 , mainly revealing the structure between the ground pad of the substrate and the connecting portion of the cover.

FIG. 4 is a cross-sectional view along the direction 4 - 4 of FIG. 1 , mainly revealing the structure between the ground pad of the substrate and the connecting portion of the cover.

5 is a top view of the second preferred embodiment of the present invention after removing the top of the cover, mainly revealing the structure between the ground pad of the substrate and the connecting portion of the cover.

FIG. 6 is a schematic structural diagram of a second preferred embodiment of the present invention, which mainly discloses the structure between the ground pad of the substrate and the connecting portion of the cover.

Fig. 7 is a perspective view of a third preferred embodiment of the present invention.

FIG. 8 is a cross-sectional view along the direction 8-8 of FIG. 7, mainly revealing the structure of the curved section of the cover.

Description of main component symbols

Package structure of wireless communication module 10

Substrate 20 Recess 22

Ground Pad 24 Chip 26

Passive components 28 Solder paste 30

Cover 40 Connecting part 42

Package structure of wireless communication module 12

Substrate 50 Recess 52

Ground pad 54 Solder paste 60

Cover 70 Connecting part 72

Bend section 721

Package structure of wireless communication module 14

Substrate 80 Cover 90

Connecting part 92 Bend section 94

The representative figure of the designated summary of this case is: Figure 4.

Detailed ways

In order to describe in detail the structure, features and effects of the present utility model, the following preferred embodiments are given below and are described in conjunction with the drawings, wherein:

Please refer to FIG. 1 to FIG. 4 , the wireless communication module packaging structure 10 provided by the first preferred embodiment of the present invention includes: a substrate 20 and a conductive cover 40 .

The substrate 20 has a concave portion 22 on the side edge portions of two opposite sides, each of the concave portions 22 is provided with a grounding pad 24, and the top surface of the substrate 20 is provided with two chips 26 and a plurality of passive components 28; each of the grounding pads The surface of the cover 24 is pre-coated with a solder paste 30 for the electrical connection of the cover 40 . Wherein, the chips 26 and the passive components 28 in this embodiment are only for illustration, not as limiting requirements.

The cover body 40 has a connecting portion 42 at the side edge portions on two opposite sides respectively, the cover body 40 covers the top of the substrate 20 and completely covers the chips 26 , and the inner wall surface of the cover body 40 is attached to the substrate 20 The side edge portion; these connection portions 42 are respectively disposed in the concave portion 22 of the substrate 20 and are respectively electrically connected to the ground pads 24 of the substrate 20 .

Through the above-mentioned structure, when the grounding pads 24 indirectly ground the cover 40 through an electrical connection to an external grounding mechanism, the cover 40 can block electromagnetic interference (electromagnetic interference; EMI) to protect the chips 26 reliably. Purpose. In terms of the overall structure, the wireless communication module packaging structure 10 can increase the joint area of a single contact through the corresponding connecting portion 42 and the ground pad 24, thereby improving the bonding strength of a single contact between the joints; Or, the utility model is attached to the side edge of the substrate 20 through the outer edge of the cover 40, the purpose of which is to disperse the external force and avoid stress concentration at the joint, thereby preventing the connection between the connecting portion 42 and the grounding pad 24 from occurring. Fracture: Compared with the conventional ones, the utility model has the advantages of improving the mechanical strength of the overall structure and being able to withstand relatively large external force impacts. In addition, as far as the assembly operation is concerned, the top surface of the substrate 20 in this embodiment only provides the required area for laying out these chips 26, and there is no need to reserve a space for tin crawling on the top surface of the peripheral portion of the substrate 20; It has the advantage of reducing the overall space compared with the habitual user.

Please refer to Fig. 5 and Fig. 6, the wireless communication module packaging structure 12 provided by the second preferred embodiment of the present invention is roughly the same as the first preferred embodiment, including: a substrate 50 and a cover 70; However, the difference is that the cover body 70 has two connecting portions 72, each of the connecting portions 72 has a curved section 721 protruding toward the inner side of the center of the cover body 70, each of the curved sections 721 is embedded in the The concave portion 52 of the substrate 50 is electrically connected to the ground pad 54 of the substrate 50 through a solder paste 60 . Wherein, because the hardness of the solder paste 60 is low, the joints between the grounding pads 54 and the curved sections 721 of the connecting parts 72 are parts with weak stress tolerance. If the proportion of the solder paste 60 is increased, it will Relatively reduce the structural strength of the aforementioned connection.

The purpose of this embodiment is to further shorten the distance between the ground pads 54 and the connection portions 72 via the curved sections 721 of the connection portions 72 , so that the usage amount of the solder paste 60 for each of the ground pads 54 is reduced. Thereby, this embodiment can achieve the same effect as the first preferred embodiment, has the advantage of improving the mechanical strength of the overall structure, and provides another implementation mode.

Please refer to Fig. 7 and Fig. 8, the wireless communication module packaging structure 14 provided by the third preferred embodiment of the present invention is roughly the same as the first preferred embodiment, including: a substrate 80 and a cover 90; However, the difference is that the side edge of the cover body 90 has two connecting portions 92 and two curved sections 94 protruding toward the inner side of the center of the cover body 90. These connecting portions 92 are the same as those in the first preferred embodiment. This does not need to be described in detail; these connecting portions 92 and these curved sections 94 are respectively located at different side edge portions of the cover body 90, that is, these curved sections 94 are located at the side edge portions of the cover body 90 without these connecting portions 92; each of the curved sections 94 is formed to protrude toward the inner side of the center of the cover body 90 for engaging with the side edge of the base plate 80 .

The purpose of this embodiment is to further fix the substrate 80 and the cover 90 through the curved sections 94 to avoid loosening of the substrate 80 and the cover 90 . Thereby, this embodiment can achieve the same effect as the first preferred embodiment, has the advantage of improving the mechanical strength of the overall structure, and provides another implementation mode.

The constituent elements disclosed in the foregoing embodiments of the present invention are for illustration only, and are not intended to limit the scope of the present case. Substitution or changes of other equivalent elements should also be covered by the scope of the patent application of the present invention.

Claims (4)

1. A wireless communication module encapsulation structure, characterized in that it comprises: A substrate having a recess at one side edge portion, and a ground pad is provided on the surface of the recess; and A conductive cover body, one side edge portion has a connection portion, the connection portion is arranged in the concave portion and electrically connected to the ground pad; the cover body covers the top of the substrate, and its inner wall surface is attached to the substrate side edge part. 2 . The packaging structure of the wireless communication module according to claim 1 , wherein a solder paste is pre-coated on the surface of the ground pad for electrical connection with the connecting portion of the cover. 3 . 3. The packaging structure of the wireless communication module according to claim 1, wherein each connecting portion has a curved section protruding toward the inner side of the center of the cover, and the curved section of the connecting portion is electrically connected to the ground solder pads. 4. The packaging structure of the wireless communication module according to claim 1, wherein one side edge of the cover has a curved section protruding toward the inner side of the center of the cover, and the connecting portion and the curved section They are respectively located at different side edge portions of the cover body, and the curved section of the cover body is engaged with the side edge of the substrate.

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