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CN201149609Y - Wafer detection device - Google Patents

Wafer detection device Download PDF

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Publication number
CN201149609Y
CN201149609Y CNU2008200012795U CN200820001279U CN201149609Y CN 201149609 Y CN201149609 Y CN 201149609Y CN U2008200012795 U CNU2008200012795 U CN U2008200012795U CN 200820001279 U CN200820001279 U CN 200820001279U CN 201149609 Y CN201149609 Y CN 201149609Y
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CN
China
Prior art keywords
wafer
detection device
frame body
driven
wafer detection
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Expired - Fee Related
Application number
CNU2008200012795U
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Chinese (zh)
Inventor
许宗寅
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Yuancheng Technology Co ltd
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Yuancheng Technology Co ltd
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Priority to CNU2008200012795U priority Critical patent/CN201149609Y/en
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Publication of CN201149609Y publication Critical patent/CN201149609Y/en
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Abstract

The wafer detection device of the utility model is provided with a frame body for inserting the detection interface on a machine table, a sliding table which can be driven by a first driving component and can horizontally and transversely displace relative to the frame body is arranged below the corresponding frame body, and a carrying table which can be driven by a second driving component and can vertically displace relative to the frame body is arranged on the sliding table for placing wafers; so as to form a chip detection device which is convenient for replacing the detection interface and is especially suitable for matching with automatic material taking and placing equipment to achieve full automatic operation; in particular, the lower part of the frame body and the upper part of the carrier are respectively provided with a taper hole and a taper block which are correspondingly configured, so that the accuracy of detecting the whole wafer and reading the information and the content in the wafer is improved.

Description

晶片检测装置 Wafer inspection device

技术领域 technical field

本实用新型有关一种用以检测晶片接脚良率的晶片检测装置,使能够达到提升准确度、方便更换检测接口,以及尤适合搭配自动取放料设备达到完全自动化运作等功效。The utility model relates to a chip detection device for detecting the yield rate of chip pins, which can improve the accuracy, facilitate the replacement of the detection interface, and is especially suitable for matching with automatic pick-and-place equipment to achieve fully automatic operation.

背景技术 Background technique

如图1所示,为一种习有用以检测晶片接脚良率的检测装置,此习用的检测装置乃在一机台上固设有一检测接口10,以及在相对应于检测接口10的下方设有一供放置晶片20的升降平台30,在气压缸40的驱动下,使升降平台30相对应与检测接口10上下位移,使升降平台30上的晶片20能够与检测接口10接触以执行晶片接脚良率的检测动作。As shown in Figure 1, it is a kind of inspection device that is conventionally used to detect the yield rate of wafer pins. This conventional detection device is fixed with a detection interface 10 on a machine table, and corresponding to the bottom of the detection interface 10. An elevating platform 30 for placing the wafer 20 is provided. Driven by the pneumatic cylinder 40, the elevating platform 30 is displaced up and down corresponding to the detection interface 10, so that the wafer 20 on the elevating platform 30 can be in contact with the detection interface 10 to perform the wafer connection. Foot yield detection action.

以及,当升降平台30下降之后,可将完成检测的晶片取出,再将另一待测晶片放置在升降平台30上,重复气压缸40驱动升降平台30上升执行晶片晶片接脚良率的检测动作;然而,上述习用检测装置,不但不容易更换检测接口10,而且当晶片完成检测动作下降之后,其升降平台30仍位于检测接口10的正下方,相对的较不方便进行晶片的取放料,更无法搭配自动进放料设备使用,以致于无法提升晶片的检测速度。And, after the lifting platform 30 is lowered, the wafer that has been tested can be taken out, and another wafer to be tested is placed on the lifting platform 30, and the pneumatic cylinder 40 is repeated to drive the lifting platform 30 to rise to perform the detection action of the wafer pin yield rate However, the above-mentioned conventional detection device is not only not easy to replace the detection interface 10, but also when the wafer completes the detection action and descends, its lifting platform 30 is still located directly below the detection interface 10, which is relatively inconvenient for picking and unloading the wafer. It cannot be used with automatic loading and unloading equipment, so that the detection speed of the wafer cannot be improved.

实用新型内容Utility model content

有鉴于此,本实用新型所解决的技术问题即针对习有用以检测晶片接脚良率的检测装置加以改良,旨在提供一种能够有效提升准确度、方便更换检测接口,以及尤适合搭配自动取放料设备达到完全自动化运作的晶片检测装置。In view of this, the technical problem solved by the utility model is to improve the conventional detection device for detecting the yield rate of the chip pins, aiming to provide a method that can effectively improve the accuracy, facilitate the replacement of the detection interface, and is especially suitable for matching with automatic The pick-and-place equipment achieves a fully automated wafer inspection device.

为达上揭目的,本实用新型的检测装置在一机台上设有一架体供插入检测接口,在相对应于架体的下方设有一可受第一驱动组件带动而与架体相对水平横向位移的滑台,于滑台上设有一可受第二驱动组件带动而与架体相对上下位移的载台供放置晶片。In order to achieve the purpose of exposing, the detection device of the present invention is provided with a frame on a machine for insertion into the detection interface, and a frame corresponding to the bottom of the frame is provided which can be driven by the first drive assembly and is relatively horizontal and transverse to the frame. The sliding platform for displacement is provided with a platform on the sliding platform that can be driven by the second driving component and move up and down relative to the frame body for placing wafers.

本实用新型的有益效果,利用检测接口插入架体的组装设计,使更换检测接口的动作更为方便;而且当晶片完成检测下降之后,由第一驱动组件带动载台横向位移,使空出载台上方的空间,不但方便取放晶片,更适合搭配自动取放料设备达到完全自动化运作的晶片检测装置;尤其,架体的下方与载台的上方分别设有相对应配置的锥孔与锥块,藉以提升整体晶片检测以及读取晶片中讯息与内容的准确度。The beneficial effect of the utility model is that the assembly design of inserting the detection interface into the frame body makes the action of replacing the detection interface more convenient; and when the wafer completes the detection and descends, the first driving component drives the lateral displacement of the stage to make the empty load The space above the table is not only convenient for picking and placing wafers, but also suitable for a fully automated wafer inspection device that is equipped with automatic pick-and-place equipment; especially, the bottom of the frame and the top of the carrier are equipped with corresponding taper holes and cones. block, so as to improve the accuracy of the overall chip inspection and read the information and content in the chip.

附图说明 Description of drawings

图1为一种习用晶片检测装置的结构示意图;Fig. 1 is a structural schematic diagram of a conventional wafer detection device;

图2为本实用新型的晶片检测装置外观立体图;Fig. 2 is a perspective view of the appearance of the wafer detection device of the present invention;

图3为本实用新型的晶片插入方式示意图;Fig. 3 is the schematic diagram of the chip insertion mode of the present utility model;

图4为本实用新型的晶片放置方式示意图;Fig. 4 is the schematic diagram of the chip placement mode of the present utility model;

图5为本实用新型的夹具调整动作示意图;Fig. 5 is a schematic diagram of the clamp adjustment action of the present invention;

图6为本实用新型的载台进入架体下方的动作示意图;Figure 6 is a schematic diagram of the action of the carrier of the present invention entering under the frame;

图7为本实用新型的载台上升动作示意图;Fig. 7 is a schematic diagram of the lifting action of the carrier of the present invention;

图8为本实用新型中锥孔与锥块的结构示意图。Fig. 8 is a schematic diagram of the structure of the taper hole and the taper block in the utility model.

【图号说明】【Description of figure number】

10检测接口              20晶片10 detection interface 20 chips

30升降平台              40气压缸30 lifting platform 40 air cylinder

50机台                  60架体50 machines 60 frames

61滑槽                  62固定螺丝61 chute 62 fixing screw

63锥孔                  70滑台63 taper hole 70 sliding table

80载台                  81夹具80 stages 81 fixtures

82装配孔                83锥块82 assembly holes 83 taper block

91第一驱动组件          92第二驱动组件91 The first drive assembly 92 The second drive assembly

93微调机构93 fine-tuning mechanism

具体实施方式 Detailed ways

本实用新型的特点,可参阅本案图式及实施例的详细说明而获得清楚地了解。The features of the utility model can be clearly understood by referring to the detailed description of the drawings and the embodiments.

如图2至图5所示,本实用新型的晶片检测装置包括有:一机台50、一架体60、一滑台70及一载台80;其中:As shown in Figures 2 to 5, the wafer detection device of the present invention includes: a machine platform 50, a frame body 60, a sliding platform 70 and a carrier platform 80; wherein:

架体60固设在机台50的上方,其底部设有一对滑槽61供插入检测接口10,并且在设有滑槽61的部位设有固定螺丝62将检测接口10固定,因此具有方便更换检测接口10的功效。The frame body 60 is fixed on the top of the machine table 50, and a pair of chute 61 is provided at the bottom for inserting the detection interface 10, and a fixing screw 62 is provided at the position provided with the chute 61 to fix the detection interface 10, so it is convenient for replacement. The efficacy of the interface 10 is tested.

上述滑台70装设在机台50相对应于架体60的下方,可受一由气压缸构成的第一驱动组件91带动而与架体50相对水平横向位移;至于,载台80装设在滑台70的上方供放置晶片20,其载台80上设有一对夹具81供晶片20定位,以及设有若干供夹具81锁固的装配孔82,使能够配合受测晶片20的规格更换夹具81或是如图5所示改变夹具8的装配位置。Above-mentioned sliding platform 70 is installed on the bottom of machine platform 50 corresponding to frame body 60, and can be driven by a first driving assembly 91 formed by a pneumatic cylinder to move horizontally and laterally relative to frame body 50; Wafer 20 is placed on the top of slide table 70, a pair of clamps 81 are provided on the carrier 80 for wafer 20 positioning, and a plurality of assembly holes 82 are provided for clamps 81 locking, so that the specifications of wafer 20 to be tested can be matched for replacement The jig 81 may change the assembly position of the jig 8 as shown in FIG. 5 .

而且,该载台80可受由一气压缸所构成的第二驱动组件92带动而与架体60相对上下位移;据以,整体晶片检测装置于实际运作实,如图6所示,由第一驱动组件91带动滑台70连同载台80进入架体60的下方,再由滑台70上的第二驱动组件92带动载台80上升,如图7所示使载台80上的晶片20与架体60上的检测接口10接触以完成晶片10接脚良率的检测动作以及读取晶片10中的讯息与内容。Moreover, the stage 80 can be driven by the second drive assembly 92 formed by a pneumatic cylinder to move up and down relative to the frame body 60; accordingly, the overall wafer detection device is actually operated, as shown in FIG. 6 , by the first A driving assembly 91 drives the sliding table 70 and the carrier 80 to enter the bottom of the frame body 60, and then the second driving assembly 92 on the sliding table 70 drives the carrier 80 to rise, as shown in Figure 7, the wafer 20 on the carrier 80 Contact with the detection interface 10 on the frame body 60 to complete the detection action of the pin yield of the chip 10 and read the information and content in the chip 10 .

而且当晶片20完成检测下降之后,如图4所示由第一驱动组件91带动载台80横向位移,使空出载台80上方的空间,不但方便取放晶片20,更适合搭配自动取放料设备达到完全自动化运作。Moreover, after the wafer 20 has finished testing and descending, as shown in FIG. 4 , the first drive assembly 91 drives the stage 80 to move laterally, so that the space above the stage 80 is vacated, which is not only convenient for picking and placing the wafer 20, but also suitable for automatic picking and placing. The material equipment is fully automated.

值得一提的是,本实用新型进一步在架体60的下方与载台80的上方分别相对应设有如图8所示的锥孔63与锥块83,使载台上升至定位时,能够经由锥孔63与锥块83的引导使晶片与检测接口确实对合;再者,如图2所示,可以利用微调机构93构成载台80与第二驱动组件92以及滑台70与第一驱动组件91的联结,使具有载台80及滑台70具有可以与架体50相对微调的功能。It is worth mentioning that the utility model is further provided with a taper hole 63 and a taper block 83 as shown in FIG. The guidance of the taper hole 63 and the taper block 83 makes the wafer and the detection interface fit together; moreover, as shown in FIG. The connection of the assembly 91 enables the carrying platform 80 and the sliding platform 70 to have the function of fine adjustment relative to the frame body 50 .

综上所述,本实用新型提供一较佳可行的晶片检测装置,爰依法提呈新型专利的申请;本实用新型的技术内容及技术特点巳揭示如上,然而熟悉本项技术的人士仍可能基于本实用新型的揭示而作各种不背离本案实用新型精神的替换及修饰。因此,本实用新型的保护范围应不限于实施例所揭示者,而应包括各种不背离本实用新型的替换及修饰,并为以下的申请专利范围所涵盖。In summary, the utility model provides a better and feasible wafer detection device, and the application for a new patent is submitted according to law; the technical content and technical characteristics of the utility model have been disclosed as above, but those who are familiar with this technology may still be based on The disclosure of the utility model makes various replacements and modifications without departing from the spirit of the utility model. Therefore, the protection scope of the present utility model should not be limited to those disclosed in the embodiments, but should include various replacements and modifications that do not deviate from the present utility model, and are covered by the scope of the following patent applications.

Claims (7)

1, a kind of wafer detection device is characterized in that, includes:
One board;
One support body is located at the board top and is detected interface for inserting;
One driven by one first driven unit and the slide unit of relative horizontal cross displacement with support body is located at the below of board corresponding to support body;
One driven by one second driven unit and with the microscope carrier of the relative upper and lower displacement of support body, be located on the slide unit for placing wafer.
2, wafer detection device as claimed in claim 1 is characterized in that, the bottom of this microscope carrier is provided with a pair of chute and detects interface for inserting, and is provided with in order to will detect the fixing fixed screw of interface at the position that is provided with chute.
3, wafer detection device as claimed in claim 1 is characterized in that, this microscope carrier is provided with a pair of anchor clamps for wafer orientation, and is provided with some pilot holes for the anchor clamps locking.
4, wafer detection device as claimed in claim 1 is characterized in that, this first, second driven unit is made of pneumatic cylinder.
5, wafer detection device as claimed in claim 1 is characterized in that, the below of this support body is respectively equipped with the taper hole of corresponding configuration and bores piece with the top of microscope carrier.
6, wafer detection device as claimed in claim 1 is characterized in that, this microscope carrier sees through micro-adjusting mechanism and second driven unit connects.
As claim 1 or 6 described wafer detection devices, it is characterized in that 7, this slide unit sees through micro-adjusting mechanism and first driven unit connects.
CNU2008200012795U 2008-02-01 2008-02-01 Wafer detection device Expired - Fee Related CN201149609Y (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Publications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101865972B (en) * 2009-04-15 2012-05-23 旺矽科技股份有限公司 detection device
CN101661077B (en) * 2008-08-25 2012-07-18 京元电子股份有限公司 Wafer testing machine and wafer testing method
CN107422170A (en) * 2017-08-22 2017-12-01 机科发展科技股份有限公司 Compressor drum counter electromotive force detection device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101661077B (en) * 2008-08-25 2012-07-18 京元电子股份有限公司 Wafer testing machine and wafer testing method
CN101865972B (en) * 2009-04-15 2012-05-23 旺矽科技股份有限公司 detection device
CN107422170A (en) * 2017-08-22 2017-12-01 机科发展科技股份有限公司 Compressor drum counter electromotive force detection device

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20081112

Termination date: 20100201