CN201149609Y - Wafer detection device - Google Patents
Wafer detection device Download PDFInfo
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- CN201149609Y CN201149609Y CNU2008200012795U CN200820001279U CN201149609Y CN 201149609 Y CN201149609 Y CN 201149609Y CN U2008200012795 U CNU2008200012795 U CN U2008200012795U CN 200820001279 U CN200820001279 U CN 200820001279U CN 201149609 Y CN201149609 Y CN 201149609Y
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Abstract
Description
技术领域 technical field
本实用新型有关一种用以检测晶片接脚良率的晶片检测装置,使能够达到提升准确度、方便更换检测接口,以及尤适合搭配自动取放料设备达到完全自动化运作等功效。The utility model relates to a chip detection device for detecting the yield rate of chip pins, which can improve the accuracy, facilitate the replacement of the detection interface, and is especially suitable for matching with automatic pick-and-place equipment to achieve fully automatic operation.
背景技术 Background technique
如图1所示,为一种习有用以检测晶片接脚良率的检测装置,此习用的检测装置乃在一机台上固设有一检测接口10,以及在相对应于检测接口10的下方设有一供放置晶片20的升降平台30,在气压缸40的驱动下,使升降平台30相对应与检测接口10上下位移,使升降平台30上的晶片20能够与检测接口10接触以执行晶片接脚良率的检测动作。As shown in Figure 1, it is a kind of inspection device that is conventionally used to detect the yield rate of wafer pins. This conventional detection device is fixed with a
以及,当升降平台30下降之后,可将完成检测的晶片取出,再将另一待测晶片放置在升降平台30上,重复气压缸40驱动升降平台30上升执行晶片晶片接脚良率的检测动作;然而,上述习用检测装置,不但不容易更换检测接口10,而且当晶片完成检测动作下降之后,其升降平台30仍位于检测接口10的正下方,相对的较不方便进行晶片的取放料,更无法搭配自动进放料设备使用,以致于无法提升晶片的检测速度。And, after the
实用新型内容Utility model content
有鉴于此,本实用新型所解决的技术问题即针对习有用以检测晶片接脚良率的检测装置加以改良,旨在提供一种能够有效提升准确度、方便更换检测接口,以及尤适合搭配自动取放料设备达到完全自动化运作的晶片检测装置。In view of this, the technical problem solved by the utility model is to improve the conventional detection device for detecting the yield rate of the chip pins, aiming to provide a method that can effectively improve the accuracy, facilitate the replacement of the detection interface, and is especially suitable for matching with automatic The pick-and-place equipment achieves a fully automated wafer inspection device.
为达上揭目的,本实用新型的检测装置在一机台上设有一架体供插入检测接口,在相对应于架体的下方设有一可受第一驱动组件带动而与架体相对水平横向位移的滑台,于滑台上设有一可受第二驱动组件带动而与架体相对上下位移的载台供放置晶片。In order to achieve the purpose of exposing, the detection device of the present invention is provided with a frame on a machine for insertion into the detection interface, and a frame corresponding to the bottom of the frame is provided which can be driven by the first drive assembly and is relatively horizontal and transverse to the frame. The sliding platform for displacement is provided with a platform on the sliding platform that can be driven by the second driving component and move up and down relative to the frame body for placing wafers.
本实用新型的有益效果,利用检测接口插入架体的组装设计,使更换检测接口的动作更为方便;而且当晶片完成检测下降之后,由第一驱动组件带动载台横向位移,使空出载台上方的空间,不但方便取放晶片,更适合搭配自动取放料设备达到完全自动化运作的晶片检测装置;尤其,架体的下方与载台的上方分别设有相对应配置的锥孔与锥块,藉以提升整体晶片检测以及读取晶片中讯息与内容的准确度。The beneficial effect of the utility model is that the assembly design of inserting the detection interface into the frame body makes the action of replacing the detection interface more convenient; and when the wafer completes the detection and descends, the first driving component drives the lateral displacement of the stage to make the empty load The space above the table is not only convenient for picking and placing wafers, but also suitable for a fully automated wafer inspection device that is equipped with automatic pick-and-place equipment; especially, the bottom of the frame and the top of the carrier are equipped with corresponding taper holes and cones. block, so as to improve the accuracy of the overall chip inspection and read the information and content in the chip.
附图说明 Description of drawings
图1为一种习用晶片检测装置的结构示意图;Fig. 1 is a structural schematic diagram of a conventional wafer detection device;
图2为本实用新型的晶片检测装置外观立体图;Fig. 2 is a perspective view of the appearance of the wafer detection device of the present invention;
图3为本实用新型的晶片插入方式示意图;Fig. 3 is the schematic diagram of the chip insertion mode of the present utility model;
图4为本实用新型的晶片放置方式示意图;Fig. 4 is the schematic diagram of the chip placement mode of the present utility model;
图5为本实用新型的夹具调整动作示意图;Fig. 5 is a schematic diagram of the clamp adjustment action of the present invention;
图6为本实用新型的载台进入架体下方的动作示意图;Figure 6 is a schematic diagram of the action of the carrier of the present invention entering under the frame;
图7为本实用新型的载台上升动作示意图;Fig. 7 is a schematic diagram of the lifting action of the carrier of the present invention;
图8为本实用新型中锥孔与锥块的结构示意图。Fig. 8 is a schematic diagram of the structure of the taper hole and the taper block in the utility model.
【图号说明】【Description of figure number】
10检测接口 20晶片10
30升降平台 40气压缸30
50机台 60架体50
61滑槽 62固定螺丝61
63锥孔 70滑台63
80载台 81夹具80
82装配孔 83锥块82
91第一驱动组件 92第二驱动组件91 The
93微调机构93 fine-tuning mechanism
具体实施方式 Detailed ways
本实用新型的特点,可参阅本案图式及实施例的详细说明而获得清楚地了解。The features of the utility model can be clearly understood by referring to the detailed description of the drawings and the embodiments.
如图2至图5所示,本实用新型的晶片检测装置包括有:一机台50、一架体60、一滑台70及一载台80;其中:As shown in Figures 2 to 5, the wafer detection device of the present invention includes: a
架体60固设在机台50的上方,其底部设有一对滑槽61供插入检测接口10,并且在设有滑槽61的部位设有固定螺丝62将检测接口10固定,因此具有方便更换检测接口10的功效。The
上述滑台70装设在机台50相对应于架体60的下方,可受一由气压缸构成的第一驱动组件91带动而与架体50相对水平横向位移;至于,载台80装设在滑台70的上方供放置晶片20,其载台80上设有一对夹具81供晶片20定位,以及设有若干供夹具81锁固的装配孔82,使能够配合受测晶片20的规格更换夹具81或是如图5所示改变夹具8的装配位置。Above-mentioned
而且,该载台80可受由一气压缸所构成的第二驱动组件92带动而与架体60相对上下位移;据以,整体晶片检测装置于实际运作实,如图6所示,由第一驱动组件91带动滑台70连同载台80进入架体60的下方,再由滑台70上的第二驱动组件92带动载台80上升,如图7所示使载台80上的晶片20与架体60上的检测接口10接触以完成晶片10接脚良率的检测动作以及读取晶片10中的讯息与内容。Moreover, the
而且当晶片20完成检测下降之后,如图4所示由第一驱动组件91带动载台80横向位移,使空出载台80上方的空间,不但方便取放晶片20,更适合搭配自动取放料设备达到完全自动化运作。Moreover, after the
值得一提的是,本实用新型进一步在架体60的下方与载台80的上方分别相对应设有如图8所示的锥孔63与锥块83,使载台上升至定位时,能够经由锥孔63与锥块83的引导使晶片与检测接口确实对合;再者,如图2所示,可以利用微调机构93构成载台80与第二驱动组件92以及滑台70与第一驱动组件91的联结,使具有载台80及滑台70具有可以与架体50相对微调的功能。It is worth mentioning that the utility model is further provided with a
综上所述,本实用新型提供一较佳可行的晶片检测装置,爰依法提呈新型专利的申请;本实用新型的技术内容及技术特点巳揭示如上,然而熟悉本项技术的人士仍可能基于本实用新型的揭示而作各种不背离本案实用新型精神的替换及修饰。因此,本实用新型的保护范围应不限于实施例所揭示者,而应包括各种不背离本实用新型的替换及修饰,并为以下的申请专利范围所涵盖。In summary, the utility model provides a better and feasible wafer detection device, and the application for a new patent is submitted according to law; the technical content and technical characteristics of the utility model have been disclosed as above, but those who are familiar with this technology may still be based on The disclosure of the utility model makes various replacements and modifications without departing from the spirit of the utility model. Therefore, the protection scope of the present utility model should not be limited to those disclosed in the embodiments, but should include various replacements and modifications that do not deviate from the present utility model, and are covered by the scope of the following patent applications.
Claims (7)
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CNU2008200012795U CN201149609Y (en) | 2008-02-01 | 2008-02-01 | Wafer detection device |
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CNU2008200012795U CN201149609Y (en) | 2008-02-01 | 2008-02-01 | Wafer detection device |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101865972B (en) * | 2009-04-15 | 2012-05-23 | 旺矽科技股份有限公司 | detection device |
CN101661077B (en) * | 2008-08-25 | 2012-07-18 | 京元电子股份有限公司 | Wafer testing machine and wafer testing method |
CN107422170A (en) * | 2017-08-22 | 2017-12-01 | 机科发展科技股份有限公司 | Compressor drum counter electromotive force detection device |
-
2008
- 2008-02-01 CN CNU2008200012795U patent/CN201149609Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101661077B (en) * | 2008-08-25 | 2012-07-18 | 京元电子股份有限公司 | Wafer testing machine and wafer testing method |
CN101865972B (en) * | 2009-04-15 | 2012-05-23 | 旺矽科技股份有限公司 | detection device |
CN107422170A (en) * | 2017-08-22 | 2017-12-01 | 机科发展科技股份有限公司 | Compressor drum counter electromotive force detection device |
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C14 | Grant of patent or utility model | ||
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Granted publication date: 20081112 Termination date: 20100201 |