CN201146195Y - Packaging structure of light emitting diode - Google Patents

Abstract

The packaging structure of the light emitting diode comprises a base, a pair of first pins and a pair of second pins. The base body is provided with a groove for accommodating the light emitting diode chip, and an opening of the groove is positioned on the top surface of the base body. The first pins are separately arranged in the grooves, extend through the base body from the grooves, penetrate out of the first side surface of the base body, and are bent and attached to the first side surface and the bottom surface of the base body. The second pins are separately arranged in the grooves, extend through the base body from the grooves and penetrate out of the second side face of the base body, and are bent and attached to the second side face and the bottom face of the base body, wherein the second side face is different from the first side face. The utility model discloses first side of pedestal, second side and bottom surface have the pin respectively to laminate on it, so can be used for the electric connection to be connected to in the backlight unit on the printed circuit board. When the package structure is electrically connected to the printed circuit board by different planes, the opening direction is changed accordingly, thereby generating various light source directions.

Description

Packaging Structure of Light Emitting Diodes

technical field

The utility model relates to a light emitting diode, in particular to a light emitting diode packaging structure.

Background technique

The main purpose of LED packaging is to install the LED chip in the packaging structure, and the packaging structure protects the chip from mechanical, heat, humidity and other external impacts. After the packaging is completed, the light-emitting diodes are installed on the circuit board in the backlight module together with the packaging structure.

In the prior art, as the direction of the light source in the backlight module is different, the packaging structure is also different. Therefore, the manufacturer must tailor its exclusive packaging structure according to the backlight module. From a mass production point of view, it is not economical.

Contents of the invention

The technical problem to be solved by the utility model is to provide a new packaging structure, which can be applied to backlight modules with different light source directions.

One aspect of the present invention is to provide a packaging structure of a light emitting diode, which includes a base, a pair of first pins and a pair of second pins. There is a groove in the base to accommodate the light-emitting diode chip, and the opening of the groove is located on the top surface of the base. The first pins are separately arranged in the groove, and extend from the groove through the base body, pass through the first side surface of the base body, and are bent and attached to the first side surface and the bottom surface of the base body. The second pins are also separately arranged in the groove, extend from the groove through the seat body, and pass through the second side surface of the seat body, and are bent and attached to the second side surface and the bottom surface of the seat body, wherein the first pin The second side is different from the first side.

The groove is a space for accommodating the light emitting diode, and the light emitted by the light emitting diode passes out from the opening, so the direction of the top surface of the base body represents the direction of the light source. The first side surface, the second side surface and the bottom surface of the base body respectively have pins affixed thereon, so they can be electrically connected to the printed circuit board in the backlight module. When the packaging structure is electrically connected to the printed circuit board on different planes, the direction of the opening will change accordingly, thereby producing various directions of light sources.

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.

Description of drawings

Fig. 1 is a perspective view of a packaging structure of a light emitting diode according to an embodiment of the present invention;

FIG. 2A is a usage state of the package structure in FIG. 1;

2B to 2D are a front view, a rear view and a side view according to FIG. 2A, respectively.

FIG. 3A is another usage state of the package structure in FIG. 1;

Figure 3B is a front view of Figure 3A.

Among them, reference signs

100: Encapsulation structure 110: Seat body

112: top surface 114: bottom surface

116: side 118: side

119: Side 120: Groove

122: Opening 130: The first pin

132: The first pin 140: The second pin

142: Second pin 150: First bump

152: Second bump 200: Printed circuit board

Detailed ways

Please refer to FIG. 1 , which is a perspective view of a packaging structure 100 of a light emitting diode according to an embodiment of the present invention. The LED packaging structure 100 includes a base body 110 for carrying the LED, and a first pin 130 and a first pin 132 connected to the base body 110 , and a second pin 140 and a second pin 142 .

There is a hollow groove 120 inside the base body 110 for accommodating and placing LED chips, so that the LEDs are embedded in the base body 110 . The opening 122 of the groove 120 is located on the top surface 112 of the base body 110 , and the light-emitting diode emits light and is exposed through the opening 122 . That is to say, the direction of the top surface 112 of the seat represents the direction of the light source. Generally speaking, there is a layer of transparent film on the opening 122 to close the opening 122 . The material of the seat body 110 includes non-conductive insulating materials, such as polyphthalamide, polybutylene terephthalate or other plastic resins.

The first pin 130 and the first pin 132 are separately disposed in the groove 120 , and extend from the groove 120 through the base body 110 , and pass out of the base body 110 . After passing through the side 116 of the base body 110 , the first pin 130 and the first pin 132 are bent and attached to the side surface 116 , and then bent and attached to the bottom surface 114 of the base body 110 . In this embodiment, the side surfaces 116 are respectively connected to the top surface 112 and the bottom surface 114 and are perpendicular to the top surface 112 .

It can be seen that the bottom and side surfaces of the packaging structure 100 of this embodiment have the first pins 130 and the first pins 132 located thereon, so the packaging structure 100 can contact the printed circuit board with the side or bottom surface, and then make the opening 122 direction Horizontal or vertical to the PCB. Please refer to the following content for a detailed description of the package structure 100 and the printed circuit board.

The material of the first pin 130 and the first pin 132 includes metal, such as gold, silver, copper and other conductive metals. When the light emitting diode is installed in the groove 120, the first pin 130 and the first pin 132 are respectively connected to the anode and the cathode of the light emitting diode. For example, in this embodiment, the first pin 130 is electrically connected to the anode of the LED, and the first pin 132 is electrically connected to the cathode of the LED.

The second pin 140 and the second pin 142 are separately disposed in the groove 120 , and extend from the groove 120 through the base body 110 , and pass out of the base body 110 . After the second pin 140 and the second pin 142 pass through the side surface 118 of the base body 110 , they are bent and attached to the side surface 118 and the bottom surface 114 of the base body 110 .

Side 118 is distinct from side 116 . In this embodiment, the side 116 and the side 118 are a pair of opposite planes of the base body 110 . Moreover, the side surfaces 118 are also respectively connected to the top surface 112 and the bottom surface 114 and are perpendicular to the top surface 112 . In another embodiment, the second leg 140 and the second leg 142 are bent and attached to the side surface 119 and the bottom surface 114 , wherein the side surface 119 is an adjoining surface of the side surface 116 .

It can be seen that the second pin 140 and the second pin 142 are also located on the bottom surface and the other side of the package structure 100, so that the package structure 100 can contact the printed circuit board on different planes. Please refer to the following content for detailed description .

In addition, the material of the second pin 140 and the second pin 142 includes metal, such as gold, silver, copper and other conductive metals. When the light emitting diode is installed in the groove 120, the second pin 140 and the second pin 142 are respectively connected to the anode and the cathode of the light emitting diode. Specifically, in this embodiment, the second pin 140 is electrically connected to the anode of the LED, and the second pin 142 is electrically connected to the cathode of the LED. That is, the first pin 130 and the second pin 140 are electrically connected to the anode of the LED, and the first pin 132 and the second pin 142 are electrically connected to the cathode of the LED.

In another embodiment, the first pin 130 and the first pin 132 are electrically connected to the anode of the LED, and the second pin 140 and the second pin 142 are both electrically connected to the cathode of the LED.

Please refer to Figure 1. Since the first pin 130 and the first pin 132 are electrically connected with different polarities, in order to prevent the two pins from contacting each other and causing a short circuit, the package structure 100 also includes a first bump 150 located on the side surface 116 , And between the first pin 130 and the first pin 132 , used to separate the first pin 130 and the first pin 132 , so as to distinguish the polarity of the first pin 130 and the first pin 132 .

Similarly, in order to prevent the second pin 140 from contacting with the second pin 142 and thus short circuit, there is a second bump 152 on the side 118 between the second pin 140 and the second pin 142, It is used to separate the second pin 140 and the second pin 142 to distinguish their polarities.

FIG. 2A to FIG. 3B respectively illustrate different usage states of the package structure 100 , which are sequentially explained as follows.

Please refer to FIG. 2A , which shows a usage state of the package structure 100 in FIG. 1 . The packaging structure 100 is installed on the printed circuit board 200 , and the bottom surface 114 of the base body 110 is in contact with the printed circuit board 200 , so that the direction of the opening 122 on the top surface 112 is horizontal to the printed circuit board 200 . That is, the direction of the light source is perpendicular to the printed circuit board 200 .

FIG. 2B is a front view of FIG. 2A , facing side 116 . Both the first pin 130 and the first pin 132 are connected to the printed circuit board 200, so for the light-emitting diode installed in the packaging structure 100, its anode and cathode can be electrically connected through the first pin 130 and the first pin 132, respectively. to PCB 200.

FIG. 2C is a rear view of FIG. 2A , facing side 118 . Both the second pin 140 and the second pin 142 are connected to the printed circuit board 200, so for the LED installed in the packaging structure 100, its anode and cathode can also be electrically connected through the second pin 140 and the second pin 142, respectively. Connect to printed circuit board 200 .

Figure 2D is a side view of Figure 2A. Both the first pin 130 and the second pin 140 are connected to the printed circuit board 200 . Therefore, it can be seen that the anode and cathode of the LED can also be electrically connected to the printed circuit board 200 through the first pin 130 and the second pin 140 respectively.

Please refer to FIG. 3A , which is another use state of the package structure 100 in FIG. 1 . The packaging structure 100 is installed on the printed circuit board 200 , and the side surface 116 of the base body 110 is in contact with the printed circuit board 200 , so that the opening 122 on the top surface 112 is perpendicular to the printed circuit board 200 . That is, the direction of the light source and the direction of the printed circuit board 200 are horizontal.

FIG. 3B is a front view of FIG. 3A , ie facing the top surface 112 . Both the first pin 130 and the first pin 132 are connected to the printed circuit board 200, so for the light-emitting diode installed in the packaging structure 100, its anode and cathode can be electrically connected through the first pin 130 and the first pin 132, respectively. to PCB 200.

It can be known from the above embodiments that the packaging structure 100 can be electrically connected to the plane of the base 110 of the printed circuit board 200 , such as the bottom surface 114 , the side surface 116 or the side surface 118 according to the direction of the light source of the backlight module. Therefore, the packaging structure 100 can be applied to backlight modules with different light source directions.

Of course, the utility model can also have other various embodiments, without departing from the spirit and essence of the utility model, those skilled in the art can make various corresponding changes and deformations according to the utility model, but these corresponding changes All changes and deformations should belong to the scope of protection of the appended claims of the utility model.

Claims (10)

1. A packaging structure for a light emitting diode, characterized in that it comprises: A base body, including a groove for accommodating a light emitting diode chip, wherein the opening of the groove is located on a top surface of the base body; A pair of first pins are separately arranged in the groove, extend from the groove through the base to the outside of the base, and are bent and attached to a first side surface and a bottom surface of the base; and A pair of second pins are separately arranged in the groove, extend from the groove through the base to the outside of the base, and are bent and attached to a second side surface and the bottom surface of the base, wherein the The second side is different from the first side. 2. The package structure according to claim 1, wherein the base body is made of insulating material. 3. The package structure according to claim 1, wherein the first side is vertically connected to the top surface. 4. The package structure according to claim 1, wherein the first side and the second side are a pair of opposite planes of the base. 5. The package structure according to claim 1, wherein the first side is an adjoining surface of the second side. 6. The package structure according to claim 1, wherein the material of the first pins and the second pins comprises metal. 7. The package structure according to claim 1, wherein one of the first pins is electrically connected to the anode of a light emitting diode, and the other first pins are electrically connected to the cathode of the light emitting diode . 8. The package structure according to claim 1, wherein one of the second pins is electrically connected to the anode of a light emitting diode, and the other second pins are electrically connected to the cathode of the light emitting diode . 9. The package structure according to claim 1, wherein the first pins are electrically connected to the anode of a light emitting diode, and the second pins are electrically connected to the cathode of the light emitting diode. 10. The packaging structure according to claim 1, further comprising: a plurality of first bumps, located on the first side, between the first pins, to separate the polarities of the first pins; and A plurality of second bumps are located on the second side and interposed between the second pins to separate polarities of the second pins.

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