CN201122597Y - Light emitting diode chip packaging structure with thick guide pins - Google Patents

Abstract

A light emitting diode chip package structure with thick leads, comprising: the LED package comprises a plurality of mutually separated conductive pins, an insulating shell, a plurality of LED chips and a packaging colloid. The insulating shell covers the lower surfaces of the conductive pins to form an ejection groove for exposing the upper surface of each conductive pin, and two sides of the conductive pins extend out of the insulating shell; the plurality of light emitting diode chips are respectively arranged in the ejection groove, and the positive electrode end and the negative electrode end of each light emitting diode chip are respectively and electrically connected with different conductive pins; the packaging colloid is filled in the ejection groove so as to cover the plurality of light emitting diode chips.

Description

Light emitting diode chip packaging structure with thick leads

technical field

The utility model relates to a packaging structure of a light-emitting diode chip, in particular to a packaging structure of a light-emitting diode chip which has thick guide pins and does not need to bend the guide pins.

Background technique

Please refer to FIG. 1 , which is a schematic cross-sectional view of a conventional vertical LED chip packaging structure. It can be seen from the figure that the known vertical LED chip packaging structure includes: an insulating substrate 1a, a conductive frame 2a, a LED chip 3a and a fluorescent colloid 4a.

Wherein, the conductive frame 2a has two conductive pins 20a, 21a respectively bent twice along two opposite sides of the insulating base 1a, so that the lower end surfaces of the plurality of conductive pins 20a, 21a can be connected with a The circuit board 5a is electrically contacted, and the conductive pins 20a, 21a respectively have a positive electrode area 200a and a negative electrode area 210a.

Furthermore, the LED chip 3a has a positive electrode terminal 300a and a negative electrode terminal 310a, and the LED chip 3a is directly disposed on the conductive pin 20a, so that the positive electrode terminal 300a is directly connected to the conductive pin 20a The positive electrode region 200a of the light-emitting diode chip 3a is electrically connected to the positive electrode region 200a, and the negative electrode terminal 310a of the LED chip 3a is electrically connected to the negative electrode region 210a of the conductive pin 21a through a wire 6a.

Finally, the fluorescent colloid 4a covers the LED chip 3a to protect the LED chip 3a. In this way, the known vertical LED chip packaging structure can produce a luminous effect of projecting light upward (as indicated by the arrow).

However, the above vertical light emitting diode chip packaging structure still has the following disadvantages:

1. The plurality of conductive pins 20a, 21a must be bent to make contact with the circuit board 5a, thus increasing the complexity of the manufacturing process.

2. Since the plurality of conductive pins 20a, 21a are too thin, the heat dissipation area is too small to achieve the advantage of high heat dissipation.

3. Since the plurality of conductive pins 20a, 21a are too thin, the supply of power cannot be increased, so that the LED chip 3a cannot produce high luminous efficacy.

Therefore, it can be seen from the above that the currently known LED chip packaging structures, whether vertical or side, obviously have inconvenience and disadvantages, and need to be improved.

Utility model content

The technical problem to be solved by the utility model is to provide a light-emitting diode chip packaging structure with thick leads, which is easy to manufacture, and has better heat dissipation and higher luminous efficiency.

In order to solve the above technical problems, according to one solution of the present utility model, a light-emitting diode chip packaging structure with thick leads is provided, which includes: a metal substrate; The base material is extended; an insulating shell, which covers the lower surface of the plurality of conductive feet, to form an injection groove for exposing the upper surface of each conductive foot; a plurality of light-emitting diode chips, which are respectively electrically Sexually connected to the plurality of conductive pins; and an encapsulant, which is filled in the emitting groove to cover the plurality of LED chips.

Therefore the utility model has the following advantages:

1. The thick guide pin of the present invention does not need to be bent, but can directly contact the circuit board, so the present invention can simplify the complexity of the manufacturing process.

2. Due to the use of thick guide feet, the utility model can increase the heat dissipation area and achieve the advantage of high heat dissipation.

3. Due to the use of thick guide pins, the utility model can increase the supply of power supply, so that the LED chip can produce higher luminous efficiency.

In order to further understand the technology, means and effects that the utility model adopts to achieve the predetermined purpose, please refer to the following detailed description and accompanying drawings of the utility model, and believe that the purpose, characteristics and characteristics of the utility model should be obtained from this In-depth and specific understanding, however, the accompanying drawings are only for reference and illustration, and are not intended to limit the utility model.

Description of drawings

1 is a schematic cross-sectional view of a known vertical light-emitting diode chip packaging structure;

Fig. 2 is the flow chart of the first embodiment of the manufacturing method of the light emitting diode chip packaging structure with thick guide pins of the present invention;

Fig. 3 is a three-dimensional schematic diagram of the metal substrate of the first embodiment of the present invention;

Fig. 4 is a top view of the metal base material of the first embodiment of the present invention;

Fig. 5 is a 5-5 sectional view of Fig. 3;

Fig. 6 is a three-dimensional schematic diagram of the combination of the metal base material and the insulating casing according to the first embodiment of the present invention;

FIG. 7 is a three-dimensional schematic diagram of the light-emitting diode chip electrically connected to the conductive pin according to the first embodiment of the present invention;

Fig. 8 is a schematic side view of the first arrangement mode of the light-emitting diode chip in the first embodiment of the present invention;

FIG. 9 is a schematic perspective view of the encapsulant filling the injection groove according to the first embodiment of the present invention;

Fig. 10 is a schematic perspective view of the plurality of conductive feet cut off according to the first embodiment of the present invention;

Fig. 11 is a schematic perspective view of another angle after the plurality of conductive feet are cut off according to the first embodiment of the present invention;

Fig. 12 is a schematic side view of a second arrangement of light emitting diode chips in the first embodiment of the present invention;

Fig. 13 is a schematic side view of a third arrangement of light-emitting diode chips according to the first embodiment of the present invention;

Fig. 14 is a schematic side view of the fourth arrangement mode of the light emitting diode chip of the present invention;

Fig. 15 is a flow chart of the second embodiment of the manufacturing method of the light-emitting diode chip packaging structure with thick guide pins of the present invention;

Fig. 16 is a three-dimensional schematic diagram of the combination of the metal base material and the insulating casing according to the second embodiment of the present invention;

17 is a flow chart of the third embodiment of the manufacturing method of the light-emitting diode chip package structure with thick guide pins of the present invention;

Fig. 18 is a three-dimensional schematic diagram of the combination of the metal base material and the insulating casing according to the third embodiment of the present invention;

Fig. 19 is a three-dimensional schematic diagram of the combination of the metal base material and the insulating casing according to the first embodiment of the present invention;

Fig. 20 is a schematic perspective view of the combination of the metal base material and the insulating casing according to the second embodiment of the present invention; and

FIG. 21 is a schematic perspective view of the combination of the metal substrate and the insulating casing according to the third embodiment of the present invention.

Wherein, the reference signs are explained as follows:

Insulation base 1a Conductive frame 2a

Conductive pins 20a, 21a Electrode area 200a

Negative electrode area 210a Light-emitting diode chip 3a

Positive terminal 300a Negative terminal 310a

Fluorescent colloid 4a circuit board 5a

Conductor 6a Metal Base 1

Conductive foot 11 groove 111

Positive conductive part 1100 Negative conductive part 1101

Electroplating protection layer 110 insulation shell 2

Exit groove 20 Non-conductive area 21

Light-emitting diode chip 3 Positive and negative electrode terminals 30, 31

Wire 4 4 Encapsulant 5

Metal Base 1′ Conductive Feet 11′

Groove 111′ insulation shell 2′

Exit Groove 20′ Non-conductive Area 21′

Light-emitting diode chip 3' Positive and negative electrode terminals 30', 31'

Lead wire 4′ metal substrate 1″

Conductive foot 11″ groove 111″

Positive conductive part 1100″ Negative conductive part 1101″

Reinforcement 12″ Insulation shell 2″

Exit groove 20″ Non-conductive area 21″

Light-emitting diode chip 3″ Positive and negative electrode terminals 30″, 31″

Solder ball 4″

Detailed ways

Please refer to Fig. 2 to Fig. 5, which are the flow chart of the first embodiment of the manufacturing method of the LED chip packaging structure with thick guide pins of the present invention and the metal base material of the first embodiment of the present invention respectively. A three-dimensional schematic diagram, a top view of the metal base material of the first embodiment of the present invention, and a 5-5 sectional view of FIG. 3 .

It can be seen from the flow chart in FIG. 2 that the manufacturing method of the light-emitting diode chip packaging structure with thick leads provided by the first embodiment of the present invention includes: first, as shown in FIG. 3 , a metal substrate 1 is provided. , which has a plurality of extended and suspended conductive pins 11, and the lower surface of each conductive pin 11 has a groove 111 (step S100), wherein the groove 111 is a halfetching concave groove. Wherein, the metal substrate 1 and the plurality of conductive pins 11 are formed by etching, stamping or any other forming method. Furthermore, by means of electroplating, an electroplating protective layer 110 is formed on the surface of the metal substrate 1 and the plurality of conductive pins 11 . In addition, the thickness of each conductive pin 11 is between 0.4-3 mm, so each conductive pin 11 has a thickness between 0.4-3 mm. Of course, the thickness of each conductive pin 11 can also be designed to exceed 3mm according to the needs of users.

Then, please refer to FIG. 6 , which is a three-dimensional schematic view of the combination of the metal base material and the insulating casing according to the first embodiment of the present invention. It can be seen from FIG. 6 that after the step S100, the lower surface of the plurality of conductive pins 11 is covered by an insulating shell 2 to form an injection groove 20 for exposing the upper surface of each conductive pin 11 ( Step S102). Wherein, the insulating shell 2 is filled in the non-conductive area 21 between the plurality of conductive pins 11 . In addition, in the step S102 , the insulating shell 2 can cover the lower surface of the plurality of conductive pins 11 by injection molding or any other molding method.

Please refer to FIG. 7 and FIG. 8, which are respectively a three-dimensional schematic diagram of the LED chip electrically connected to the conductive pin in the first embodiment of the utility model, and the first type of LED chip in the first embodiment of the utility model. Schematic side view of the setup. It can be seen from FIG. 7 and FIG. 8 that after the step S102, a plurality of light emitting diode chips 3 are placed in the emitting groove 20, and the positive and negative electrode terminals 30, 31 of each light emitting diode chip 3 are respectively electrically connected to different The conductive pin 11 (step S104).

That is, the positive and negative electrode terminals 30, 31 of the light emitting diode chip 3 are respectively arranged on the lower surface and the upper surface of each light emitting diode chip 3, and each light emitting diode chip 3 is selectively arranged on the corresponding positive electrode conductive part 1100, so that the positive electrode terminal 30 of each light emitting diode chip 3 is directly electrically connected to the corresponding positive electrode conductive portion 1100, and the negative electrode terminal 31 of each light emitting diode chip 3 is electrically connected to the The corresponding negative electrode conductive part 1101 .

Next, please refer to FIG. 9 , which is a three-dimensional schematic view of the encapsulant filling the injection groove according to the first embodiment of the present invention. As can be seen from FIG. 9 , after the step S104 , an encapsulant 5 is filled in the injection groove 20 to cover the plurality of LED chips 3 (step S106 ). Wherein, the material of the packaging colloid 5 can be epoxy resin or silicone material.

Finally, please refer to FIG. 10 to FIG. 11 , which are the three-dimensional schematic diagrams of the plurality of conductive legs cut off in the first embodiment of the utility model, and the plurality of conductive pins in the first embodiment of the utility model. A three-dimensional schematic diagram of another angle after the foot is cut off. It can be seen from FIG. 10 and FIG. 11 that after the step S106, the plurality of conductive pins 11 are cut to complete the fabrication of the LED chip packaging structure with thick conductive pins (step S108). Wherein, the two ends of each conductive pin 11 are exposed on both sides of the insulating casing 2, so as to facilitate the subsequent soldering process.

Please refer to FIG. 12 , which is a schematic side view of the second arrangement of the LED chips in the first embodiment of the present invention. It can be seen from the figure that the positive and negative electrode terminals 30, 31 of the light emitting diode chip 3 are respectively arranged on the lower surface and the upper surface of each light emitting diode chip 3, and each light emitting diode chip 3 is sequentially arranged on the corresponding anode conductive part 1100', so that the positive electrode terminal 30 of each light emitting diode chip 3 is directly electrically connected to the corresponding positive electrode conductive part 1100', and the negative electrode terminal 31 of each light emitting diode chip 3 is connected through a wire 4. It is electrically connected to the corresponding negative electrode conductive part 1101'.

Please refer to FIG. 13 , which is a schematic side view of a third arrangement of LED chips in the first embodiment of the present invention. It can be seen from the figure that the insulating casing 2 further includes: a plurality of non-conductive regions 21 ′ respectively formed between every two conductive pins 11 . Furthermore, the positive and negative electrode terminals 30', 31' of the light emitting diode chip 3' are respectively arranged on the upper surface of each light emitting diode chip 3', and each light emitting diode chip 3' is arranged at intervals in each non-conductive area 21'; thereby, through wire-bounding, the positive and negative electrode terminals 30' and 31' of each light-emitting diode chip 3' are electrically connected to the adjacent LED chip 3' through two wires 4' respectively. The positive conductive part 1100' and the negative conductive part 1101'.

Please refer to FIG. 14 , which is a schematic side view of the fourth arrangement of the light emitting diode chips of the present invention. It can be seen from the figure that the positive and negative electrode terminals 30 ″ and 31 ″ of the light emitting diode chip 3 ″ are respectively arranged on the lower surface of each light emitting diode chip 3 ″, and each light emitting diode chip 3 ′ straddles the corresponding non-conductive region 21"; thereby, through flip-chip, the positive and negative electrode terminals 30", 31" of each light-emitting diode chip 3" are electrically connected to the adjacent The positive electrode conductive part 1100" and the negative electrode conductive part 1101".

Please refer to Fig. 15 and Fig. 16, which are respectively the flow chart of the second embodiment of the manufacturing method of the light-emitting diode chip packaging structure with thick leads of the present invention, and the metal substrate and the insulating case of the second embodiment A three-dimensional schematic diagram of the combination of bodies. It can be seen from the flow chart in FIG. 15 that the manufacturing method of the light-emitting diode chip packaging structure with thick leads provided by the second embodiment of the present invention includes: first, as shown in FIG. 16 , a metal substrate 1 is provided. ', which has a plurality of extended conductive pins 11' fixed at both ends, and the lower surface of each conductive pin 11' has a groove 111' (step S200), wherein the groove 111' is a half-etched groove. Next, the lower surfaces of the plurality of conductive pins 11' are covered by an insulating casing 2' to form an injection groove 20' for exposing the upper surface of each conductive pin 11' (step S202). Moreover, the insulating shell 2' fills the non-conductive area 21' between the plurality of conductive pins 11'.

Next, same as steps S104 and S108 of the first embodiment, load a plurality of light emitting diode chips (not shown) in the emitting groove, and the positive and negative electrodes of each light emitting diode chip are respectively electrically connected to different The conductive pin 11' (step S204). Then, an encapsulant (not shown) is filled into the emitting groove 20 ′ to cover the plurality of LED chips (step S206 ). Finally, the plurality of conductive pins 11' are cut to complete the fabrication of the LED chip packaging structure with thick conductive pins (step S208).

Please refer to Fig. 17 and Fig. 18, which are respectively the flow chart of the third embodiment of the manufacturing method of the light-emitting diode chip packaging structure with thick leads of the present invention, and the metal base material and the insulating shell of the third embodiment A three-dimensional schematic diagram of the combination of bodies. It can be known from the flow chart in FIG. 17 that the manufacturing method of the light-emitting diode chip packaging structure with thick leads provided by the third embodiment of the present invention includes: first, as shown in FIG. 18 , a metal substrate 1 is provided. ", which has a plurality of extended and suspended conductive feet 11" and a plurality of reinforcing ribs 12" extended and connected between every two conductive feet 11", and the lower surface of each conductive foot 11" has a concave Groove 111" (step S300), wherein the groove 111" is a half-etched groove. Then, an insulating shell 2" is used to cover the lower surface of the plurality of conductive pins 11", so as to form a hole for exposing The ejection groove 20" on the upper surface of each conductive pin 11" (step S302). Moreover, the insulating shell 2" fills the non-conductive area 21" between the plurality of conductive pins 11".

Next, same as steps S204 and S206 of the second embodiment, load a plurality of light emitting diode chips (not shown) in the injection groove 20″, and the positive and negative terminals of each light emitting diode chip are electrically connected respectively different conductive pins 11" (step S304); then, fill an encapsulant (not shown) in the injection groove to cover the plurality of LED chips (step S306). Finally, cutting the plurality of conductive pins 11 ″ and the plurality of reinforcing ribs 12 ″ to complete the fabrication of the LED chip packaging structure with thick conductive pins (step S308 ).

Please refer to FIG. 19 to FIG. 21 , which are three-dimensional schematic diagrams of the combination of the metal substrate and the insulating housing in the first, second, and third embodiments of the present invention, respectively. It can be seen from FIG. 19 that multiple structures of the first embodiment having the metal base material 1 and the conductive pin 11 and combining the metal base material 1 and the insulating housing 2 are connected in series in three rows; in addition, it can be seen from FIG. 20 that multiple In the second embodiment, the metal substrate 1' and the conductive pin 11', and the metal substrate 1' and the insulating shell 2' are connected in series in three rows; and, as can be seen from FIG. 21, multiple third implementations In the example, the metal substrate 1" and the conductive pin 11" are combined with the structure of the metal substrate 1" and the insulating shell 2" to form three rows in series. Thereby, the combination of the conductive feet 11 , 11 ′, 11 ″ and the insulating casing 2 , 2 ′, 2 ″ in the above three different embodiments can be manufactured in an all-in-one manner.

To sum up, the light-emitting diode chip packaging structure with thick leads provided by the utility model has the following advantages:

1. The thick guide pin of the present invention does not need to be bent, but can directly contact the circuit board, so the present invention can simplify the complexity of the manufacturing process.

2. Due to the use of thick guide feet, the utility model can increase the heat dissipation area and achieve the advantage of high heat dissipation.

3. Due to the use of thick guide pins, the utility model can increase the supply of power supply, so that the LED chip can produce higher luminous efficiency.

Note that the above description is only a detailed description and drawings of one of the best specific embodiments of the utility model, but the features of the utility model are not limited thereto, and are not intended to limit the utility model. All scopes should be based on the following claims, and all embodiments that conform to the spirit of the patent scope of the utility model and its similar changes should be included in the scope of the utility model. In the field of novelty, easily conceivable changes or modifications can all be covered within the scope of the following patents of this application.

Claims (7)

1. A light-emitting diode chip packaging structure with thick guide pins, characterized in that it comprises: a metal substrate; a plurality of separate conductive feet extending from the metal base; An insulating shell, which covers the lower surface of the plurality of conductive feet, to form an injection groove for exposing the upper surface of each conductive foot; a plurality of light emitting diode chips, which are respectively electrically connected to the plurality of conductive pins; and An encapsulant is filled in the emitting groove to cover the plurality of LED chips. 2. The light-emitting diode chip packaging structure with thick leads as claimed in claim 1, characterized in that: the surface of the metal substrate and the plurality of conductive leads is electroplated with an electroplating protection layer. 3. The light-emitting diode chip packaging structure with thick leads as claimed in claim 1, wherein the thickness of each conductive lead is between 0.4-3mm. 4. The light-emitting diode chip packaging structure with thick leads as claimed in claim 1, characterized in that: the insulating case is filled in the non-conductive area between the plurality of conductive leads, and two of each conductive lead The ends are exposed on both sides of the insulating shell. 5. The light-emitting diode chip packaging structure with thick leads as claimed in claim 1, wherein the packaging colloid is a packaging colloid made of epoxy resin or a packaging colloid made of silica gel. 6. The light-emitting diode chip packaging structure with thick leads as claimed in claim 1, wherein each light-emitting diode chip has a positive terminal and a negative electrode terminal respectively electrically connected to different conductive leads. 7. The LED chip packaging structure with thick leads as claimed in claim 1, wherein the plurality of LED chips are respectively disposed in the emitting groove.

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