CN201115249Y - Casing (CN) - Google Patents
Casing (CN) Download PDFInfo
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- CN201115249Y CN201115249Y CNU2007201764520U CN200720176452U CN201115249Y CN 201115249 Y CN201115249 Y CN 201115249Y CN U2007201764520 U CNU2007201764520 U CN U2007201764520U CN 200720176452 U CN200720176452 U CN 200720176452U CN 201115249 Y CN201115249 Y CN 201115249Y
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- casing
- cooling fan
- accommodating
- heat dissipation
- fan
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Abstract
Description
技术领域 technical field
本实用新型涉及一种机壳,更详而言之,涉及一种配合散热风扇对容置的电子元件加以散热的机壳。The utility model relates to a casing, in more detail, relates to a casing that cooperates with a cooling fan to dissipate heat from accommodated electronic components.
背景技术 Background technique
随着电子科技的高速发展,现有电子产品的功能日益强大,更新换代的速度亦愈加迅猛,对应的,电子产品的散热问题又再度成为厂商们需重点解决问题之一,尤其是对于服务器这一网络运转的中枢电子设备而言,散热问题是否能良好解决直接关系到其稳定工作,即关系到整个网络的正常运行。With the rapid development of electronic technology, the functions of existing electronic products are becoming more and more powerful, and the speed of replacement is also increasing rapidly. Correspondingly, the heat dissipation problem of electronic products has once again become one of the key problems that manufacturers need to solve, especially for servers. As far as the central electronic equipment for network operation is concerned, whether the heat dissipation problem can be well solved is directly related to its stable operation, that is, it is related to the normal operation of the entire network.
请参阅图1,传统的服务器1是于机箱10的璧面上装设散热风扇11以抽吸方式将该机箱10内发热元件13所散发的热量排出,如图所示,该散热风扇11通常是于其四个角落位置分别以螺丝12锁附固定于该机箱10,限定了该风扇11的位置,而主机板的位置一般是位于该风扇的下方。Please refer to Fig. 1, traditional server 1 is to install cooling fan 11 on the wall surface of cabinet 10 to discharge the heat that heating element 13 in this cabinet 10 distributes by suction, as shown in the figure, this cooling fan 11 is usually Screws 12 are fastened and fixed to the case 10 at four corners thereof to define the position of the fan 11 , and the position of the motherboard is generally located below the fan.
因此,如此的结构使得该散热风扇11仅面对该主机板上发热元件13的上方空间,因此仅直接对该发热元件13上方较远的热空气加以抽吸,如图中箭头所示,而无法对离该发热元件较近的热空气加以排散,需通过空气对流的方式传导热量,因此导致无法迅速散热,散热效率极其低下,而由于该发热元件13一般为内存、显示卡等较重要部件,该类部件的散热不良亦有可能引起服务器当机的后果。Therefore, such a structure makes the cooling fan 11 only face the upper space of the heating element 13 on the motherboard, so only the far hot air directly above the heating element 13 is sucked, as shown by the arrow in the figure, and It is impossible to dissipate the hot air close to the heating element, and the heat needs to be conducted by air convection, so that the heat cannot be dissipated quickly, and the heat dissipation efficiency is extremely low, and because the heating element 13 is generally a memory, a display card, etc. Components, poor heat dissipation of such components may also cause the server to crash.
再者,由于机箱内空间较小,亦不太可能另外加设散热风扇来改善散热状况,难以突破此一瓶颈。Furthermore, due to the small space inside the chassis, it is impossible to add additional cooling fans to improve the heat dissipation, and it is difficult to break through this bottleneck.
综上所述,如何能找到一种应用于服务器的散热结构,以配合散热风扇达到更好的散热效果,进而避免上述的种种弊端,乃目前亟待解决的问题。To sum up, how to find a heat dissipation structure applied to the server to cooperate with the heat dissipation fan to achieve a better heat dissipation effect and avoid the above-mentioned disadvantages is an urgent problem to be solved at present.
实用新型内容Utility model content
鉴于上述现有技术的缺点,本实用新型的一目的在于提供一种配合散热风扇有效提升散热效率的机壳。In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a case that cooperates with a heat dissipation fan to effectively improve heat dissipation efficiency.
本实用新型的再一目的是提供一种一体成型的散热风扇固定结构的机壳,可容置并配合锁附件方便固定散热风扇,省去了另外加设诸如风扇固定架等装置,进而降低制造成本,提升产业效益。Another purpose of the present utility model is to provide an integrally formed cooling fan fixing structure housing, which can accommodate and cooperate with lock accessories to facilitate fixing the cooling fan, eliminating the need for additional devices such as fan fixing brackets, thereby reducing manufacturing costs. cost and improve industrial efficiency.
为达到上述目的,本实用新型提供一种机壳,供容置电子元件与散热风扇,该机壳包括机壳本体,内部具有供容置该电子元件的第一容置空间、及邻近该电子元件的开口;以及容置框,位于该机壳本体内侧对应该开口边缘且朝向该电子元件倾斜,内部并具有供容置该散热风扇的第二容置空间,使该散热风扇的入风口面对该电子元件。In order to achieve the above object, the utility model provides a casing for accommodating electronic components and a cooling fan. The opening of the component; and the accommodating frame, which is located on the inner side of the casing body corresponding to the edge of the opening and inclined towards the electronic component, and has a second accommodating space for accommodating the cooling fan inside, so that the air inlet surface of the cooling fan for the electronic components.
于一实施例中,该散热风扇复具有入风口、对应该入风口的出风口、以及设置于该散热风扇的多个固定孔,该容置框复设有挡止部,供挡止该散热风扇并露出该散热风扇的入风口,该挡止部设有对应于该散热风扇的固定孔的穿孔以及穿过该穿孔与该散热风扇结合的固定元件。该固定元件为螺丝或插销,该机壳本体与容置框为一体成形,该开口的尺寸大于该散热风扇。In one embodiment, the heat dissipation fan has an air inlet, an air outlet corresponding to the air inlet, and a plurality of fixing holes arranged on the heat dissipation fan, and the accommodating frame is further provided with a stopper for blocking the heat dissipation. The fan exposes the air inlet of the cooling fan, and the blocking part is provided with a through hole corresponding to the fixing hole of the cooling fan and a fixing element combined with the cooling fan through the through hole. The fixing element is a screw or a bolt, the casing body and the accommodating frame are integrally formed, and the size of the opening is larger than that of the cooling fan.
相比于现有技术,本实用新型的机壳,为配合倾斜设置的散热风扇直接面对该电子元件加以散热,通过于该机壳壁面的开孔边缘形成的容置框对应容置散热风扇,且该容置框为倾斜设置于开口处的壁面,以使该散热风扇面对该电子元件,进而提升散热效率,避免现有技术中操作不便及其它种种缺陷。Compared with the prior art, the casing of the present utility model directly faces the electronic component for heat dissipation in order to cooperate with the inclined cooling fan, and the accommodating frame formed on the edge of the opening on the wall of the casing corresponds to accommodate the cooling fan , and the accommodating frame is obliquely arranged on the wall surface of the opening, so that the heat dissipation fan faces the electronic component, thereby improving heat dissipation efficiency and avoiding inconvenient operation and other defects in the prior art.
附图说明 Description of drawings
图1为现有具有散热风扇的机箱的立体图;Fig. 1 is the perspective view of existing chassis with cooling fan;
图2为本实用新型的机壳的立体图;Fig. 2 is the perspective view of the casing of the present utility model;
图3A为本实用新型的机壳容置框的侧视图;以及Fig. 3A is a side view of the casing housing frame of the present invention; and
图3B为本实用新型的机壳的挡止部的前视图。Fig. 3B is a front view of the stop part of the casing of the present invention.
主要元件符号说明Description of main component symbols
1 服务器1 server
10 机箱10 Chassis
11 散热风扇11 cooling fan
12 螺丝12 screws
13 发热元件13 heating element
2 机壳2 chassis
20 机壳本体20 Chassis body
22 第一容置空间22 The first storage space
200 开口200 openings
21 容置框21 Accommodating frame
210 挡止部210 stopper
211 第二容置空间211 Second Storage Space
2100穿孔2100 perforations
2101固定元件2101 fixed element
30 散热风扇30 cooling fans
31 入风口31 air inlet
32 出风口32 air outlet
33 固定孔33 Fixing hole
40 电子元件40 electronic components
具体实施方式 Detailed ways
以下通过特定的具体实例说明本实用新型的实施方式,本领域技术人员可由本说明书所揭示的内容轻易地了解本实用新型的其它优点与功效。本实用新型亦可通过其它不同的具体实例加以施行或应用,本说明书中的各项细节亦可基于不同观点与应用,在不背离本实用新型的精神下进行各种修饰与变更。The implementation of the present utility model is described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The utility model can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the utility model.
请参阅图2,为本实用新型的机壳2的结构示意图,如图所示,本实用新型的机壳2于本实施例中是供应用于服务器,包括机壳本体20以及容置框21。该容置框21供容置具有入风口31、对应该入风口31的出风口32、以及多个固定孔33的散热风扇30。Please refer to FIG. 2 , which is a schematic structural diagram of a
该机壳本体20内部具有供容置电子元件40的第一容置空间22,且于邻近该电子元件40的机壳本体20壁面上设有开口200,其中,该开口200为现有机壳用于装设散热风扇30并露出出风口31的开口,并且于本实施例中,其尺寸大小应足够将散热风扇30自该机壳本体20外穿过该开口200而设置于该容置框21内。The
该容置框21位于对应该开口200边缘且朝向电子元件40倾斜,呈现为一空心的柱体结构,其内部具有供容置该散热风扇30的第二容置空间211,当前述的散热风扇30自该开口200滑入,并置入于该容置框21内,形成自该通风口至该散热风扇30的入风口31的风道,并且,该容置框21相对该开口200处的壁面倾斜,进而使该散热风扇30的入风口31面对该电子元件40。The
如此,该散热风扇30即可直接抽取该电子元件40例如内存等邻近上方的热气流,即如图中箭头所示,不同于现有技术中所抽取的气流离该发热元件较远,大大提升了散热效率。In this way, the
请一并参阅图3A及图3B,该容置框21复具有多个挡止部210,用以挡止该散热风扇30,于本实施例中,挡止部210为包覆该散热风扇30四个角落位置的挡片,并且该多个挡止部210上具有穿孔2100以及穿过该穿孔2100与该散热风扇30结合的固定元件2101,该穿孔2100对应与该散热风扇30的固定孔33相互重叠,通过该固定元件2101如螺丝或插销锁附可固定该散热风扇30,因此,仅需达到可使该穿孔2100与该固定孔33对应即可,而无需将该容置框21设计得较小来限位该散热风扇30,降低了设计要求,并且,还可通过例如于该容置框21内壁加设弹片等方式来固定该散热风扇30,并非以本实施例为限,但该固定方式并非本实用新型的技术特征,因此不另作赘述。Please refer to FIG. 3A and FIG. 3B together. The
须说明的是,该容置框21与该本体为一体成型的结构,可通过例如冲压方式直接形成,因此该容置框21与该本体所形成的风道仅露出该散热风扇30的入风口31,所形成的该散热风扇30出风口31至该通风口的风道为密封,基本不会出现如漏风等情形而影响散热效率。It should be noted that the
相比于现有技术,本实用新型的机壳,主要是配合散热风扇对电子元件加以散热,通过开孔内缘形成有容置框而对应容置散热风扇,且该容置框是相对该开口处的壁面倾斜,以使该散热风扇面对该电子元件,以提升散热效率,避免现有技术中操作不便及其它种种缺陷。Compared with the prior art, the housing of the present utility model mainly cooperates with the cooling fan to dissipate heat from the electronic components, and a housing frame is formed on the inner edge of the opening to accommodate the cooling fan correspondingly, and the housing frame is opposite to the cooling fan. The wall at the opening is inclined so that the heat dissipation fan faces the electronic component, so as to improve heat dissipation efficiency and avoid inconvenient operation and other defects in the prior art.
此外,本实用新型为一体成型的结构,可容置并配合固定元件方便固定散热风扇,且省去了另外加设诸如风扇固定架等装置,减少了成本,提升产业效益。In addition, the integrally formed structure of the utility model can accommodate and cooperate with the fixing element to facilitate fixing the cooling fan, and eliminates additional devices such as fan fixing brackets, which reduces costs and improves industrial efficiency.
上述实施例仅例示性说明本实用新型的原理及其功效,而非用于限制本实用新型。任何本领域技术人员均可在不违背本实用新型的精神及范畴下,对上述实施例进行修饰与改变。因此,本实用新型的权利保护范围,应以权利要求书的范围为依据。The above-mentioned embodiments only illustrate the principles and effects of the present utility model, but are not intended to limit the present utility model. Any person skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the rights of the utility model should be based on the scope of the claims.
Claims (7)
Priority Applications (1)
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CNU2007201764520U CN201115249Y (en) | 2007-09-13 | 2007-09-13 | Casing (CN) |
Applications Claiming Priority (1)
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CNU2007201764520U CN201115249Y (en) | 2007-09-13 | 2007-09-13 | Casing (CN) |
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CN201115249Y true CN201115249Y (en) | 2008-09-10 |
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CNU2007201764520U Expired - Fee Related CN201115249Y (en) | 2007-09-13 | 2007-09-13 | Casing (CN) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103687431A (en) * | 2012-09-20 | 2014-03-26 | 施耐德东芝换流器欧洲公司 | Installation device for equipment having cooling demand |
-
2007
- 2007-09-13 CN CNU2007201764520U patent/CN201115249Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103687431A (en) * | 2012-09-20 | 2014-03-26 | 施耐德东芝换流器欧洲公司 | Installation device for equipment having cooling demand |
CN103687431B (en) * | 2012-09-20 | 2016-12-21 | 施耐德东芝换流器欧洲公司 | For having the erecting device of the equipment of radiating requirements |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080910 Termination date: 20120913 |