CN201115237Y - Liquid cooling type heat dissipation device - Google Patents

Abstract

The utility model relates to a liquid cooling type heat dissipation device used for heat dissipation of electronic components, comprising a liquid pump, a heat absorbing module, and an annular sealing strip; the liquid pump has a plurality of liquid inlet holes and a liquid outlet pipe; the heat absorbing module contacts the electronic component on one side and contacts the pump on the other side, the heat absorbing module forms a closed flow channel connected to the liquid inlet hole of the pump, and an annular groove arranged on a contact surface contacting the pump and surrounding the flow channel; the annular sealing strip is embedded in the groove and the diameter of the sealing strip is greater than the depth of the groove. By arranging the annular groove on the contact surface of the heat absorbing module contacting the pump and embedding the sealing strip therein, the working liquid in the pump or the heat absorbing module can be prevented from leaking to the outside.

Description

Liquid-cooled heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a liquid-cooled heat dissipation device for removing heat generated by electronic components.

Background technique

As the calculation speed of electronic components such as the central processing unit continues to increase, the calorific value of electronic components also continues to increase. The previous air-cooled heat sink has gradually been unable to meet the heat dissipation requirements. Therefore, a liquid pump (pump) is used to drive the liquid flow and contact with the A liquid-cooled heat sink, in which the heat-absorbing module of the heat source performs heat exchange, is gradually applied to the heat dissipation of the above-mentioned electronic components.

Generally speaking, the liquid pump of the liquid-cooled heat sink is connected to the heat-absorbing module through a communication pipe, so that the liquid pump drives the working liquid to circulate in the heat-absorbing module to remove the heat generated by the electronic components. heat. In order to reduce the volume of the overall cooling device and reduce the head loss caused by the pipeline, the liquid pump and the heat-absorbing module are integrated without connecting pipelines, so that the liquid inlet hole of the liquid pump is directly connected to the heat-absorbing module. The liquid outlet hole of the module is connected, and it is integrally placed on the design of the electronic component.

Although the above-mentioned integrated design effectively reduces the volume of the overall cooling device and the head loss caused by the connecting pipeline, how to make the connection between the liquid inlet hole of the liquid pump and the liquid outlet hole of the heat-absorbing module tightly connected without leakage? , has become another important subject of this kind of liquid-cooled heat dissipation device with an integrated design.

It can be seen that the above-mentioned existing liquid-cooled heat dissipation device obviously still has inconveniences and defects in structure and use, and needs to be further improved urgently. In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general products have no suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve. Therefore, how to create a liquid-cooled heat sink with a new structure is one of the current important research and development topics, and it has also become a goal that the industry needs to improve.

In view of the defects of the above-mentioned existing liquid-cooled heat dissipation devices, the designer actively researches and innovates based on his rich practical experience and professional knowledge in the design and manufacture of such products for many years, and cooperates with the application of academic theories, in order to create a new type The liquid-cooled heat dissipation device with the structure can improve the general existing liquid-cooled heat dissipation device and make it more practical. Through continuous research, design, and after repeated trial samples and improvements, the utility model with practical value is finally created.

Contents of the invention

The purpose of the utility model is to overcome the defects of the existing liquid-cooled heat sink, and provide a liquid-cooled heat sink with a new structure that prevents the leakage of working liquid, which is very suitable for practical use.

The purpose of this utility model and the solution to its technical problems are achieved by adopting the following technical solutions. A liquid-cooled heat dissipation device proposed according to the utility model is applied to the heat dissipation of electronic components, including: a liquid pump and a heat-absorbing module; the liquid pump has a plurality of liquid inlet holes and a liquid outlet pipe; One side of the heat-absorbing module is in contact with the electronic component and the other side is in contact with the pump, and forms a closed flow channel that communicates with the liquid inlet hole of the pump; it is characterized in that: the heat-absorbing module also forms a An annular groove is provided on the contact surface with the pump and surrounds the flow passage, and the liquid-cooled heat sink also includes a groove whose thickness is greater than the depth of the groove and is compressed by the pump. An annular sealing strip embedded in the groove.

The purpose of this utility model and the solution to its technical problems can also be further realized by adopting the following technical measures.

The aforementioned liquid-cooled heat dissipation device, wherein the pump includes a casing and an impeller set; the casing is formed with a chamber communicating with the liquid inlet hole and the liquid outlet pipe; the impeller set is arranged on the In the chamber, there is a rotating shaft fixed on the housing and an impeller body that can rotate along the rotating shaft.

The aforementioned liquid-cooled heat dissipation device, wherein the housing has a body and a bottom plate, the body and the bottom plate cooperate to close the chamber, the body has a shaft seat for fixing one end of the rotating shaft, The bottom plate is provided with a positioning hole for fixing the other end of the rotating shaft.

In the aforementioned liquid-cooled heat dissipation device, the liquid inlet holes are arranged at intervals around the positioning holes of the bottom plate.

The aforementioned liquid-cooled heat sink, wherein the body has a bottom wall and a surrounding wall extending upward from the periphery of the bottom wall, and the center of the bottom wall protrudes upward to form a cylindrical bulge with an opening facing downward, The cavity is formed in the raised portion.

The aforementioned liquid-cooled heat dissipation device, wherein the heat-absorbing module includes a lower plate and an upper plate that cooperates with the lower plate to close the flow channel, and the heat-absorbing module faces the pump with its upper plate is embedded in the bottom wall of the pump, and the upper plate forms a liquid outlet hole communicating with the liquid inlet hole of the pump and the flow channel.

The aforementioned liquid-cooled heat dissipation device, wherein the flow channel is formed by a downward depression on the upper surface of the lower plate, and the flow channel is in a vortex shape and has a central end and a peripheral end, and the upper plate The liquid outlet hole is connected to the central end of the flow channel, and the upper plate has a liquid inlet hole connected to the peripheral end of the flow channel.

The aforementioned liquid-cooled heat sink, wherein the upper plate is smaller than the lower plate, and the groove is formed on the exposed upper surface of the lower plate surrounding the vortex-shaped flow channel, and is located between the upper and lower plates Generate gaps.

The aforementioned liquid-cooled heat sink, wherein a plurality of spaced riveting holes are formed around the bottom wall of the pump near the surrounding wall, and the exposed upper surface of the lower plate protrudes to form a plurality of Cooperate with the riveting part inserted into the riveting hole.

In the aforementioned liquid-cooled heat sink, the sealing strip is made of rubber or silica gel.

Compared with the prior art, the utility model has obvious advantages and beneficial effects. It can be seen from the above technical content that in order to achieve the above purpose, the utility model provides a liquid-cooled heat dissipation device, which includes: a liquid pump, a heat-absorbing module, and a ring-shaped sealing strip; the liquid pump has a plurality of inlet A liquid hole and a liquid outlet pipe; one side of the heat-absorbing module is in contact with the electronic components and the other side is in contact with the pump. An annular groove on the surface and surrounding the flow channel; the ring-shaped sealing strip is embedded in the groove and the diameter of the sealing strip is greater than the depth of the groove.

With the above technical solution, the utility model liquid-cooled heat sink has at least the following advantages and beneficial effects: the utility model is provided with an annular groove on the contact surface between the heat-absorbing module and the pump, and is embedded with a seal There is a strip therein, which can be used to prevent the working fluid in the pump or the heat-absorbing module from leaking to the outside.

To sum up, the utility model provides a liquid-cooled heat dissipation device that can effectively prevent leakage of working fluid. It has great improvement in both product structure and function, and has made significant progress in technology, and has produced easy-to-use and practical effects, and has enhanced outstanding efficacy compared with existing liquid-cooled heat sinks, so that it is more Suitable for practical use, it is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present utility model. In order to better understand the technical means of the present utility model, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present utility model better It is obvious and easy to understand. The preferred embodiments are specifically cited below, together with the accompanying drawings, and detailed descriptions are as follows.

Description of drawings

Fig. 1 is an exploded perspective view of a preferred embodiment of the liquid-cooled heat sink of the present invention;

Fig. 2 is a three-dimensional exploded view of the liquid pump of the preferred embodiment;

Fig. 3 is a three-dimensional combined view of the liquid pump of the preferred embodiment;

Fig. 4 is a side sectional view of the liquid pump of the present preferred embodiment; and

FIG. 5 is a side sectional view of the liquid-cooled heat sink of the preferred embodiment.

Detailed ways

In order to further explain the technical means and effects of the utility model to achieve the intended purpose of the invention, the specific implementation, structure and characteristics of the liquid-cooled heat dissipation device proposed according to the utility model will be described below in conjunction with the accompanying drawings and preferred embodiments. And its effect, detailed description is as follows.

The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. For convenience of description, in the following embodiments, the same elements are denoted by the same numbers.

Please refer to FIG. 1 , the preferred embodiment of the liquid-cooled heat dissipation device of the present invention mainly includes a liquid pump and a heat-absorbing module. The liquid pump part will be described below first. Please refer to FIG. 2 and FIG. 3 , the liquid pump 1 of the present invention includes a casing 10 , an impeller set 20 , and a driving unit 30 . The impeller set 20 is driven to rotate by the driving unit 30 .

The above-mentioned housing 10 has a body 11 integrally formed, and a disc-shaped bottom plate 12 located below the body 11 . The main body 11 has a bottom wall 111 and a surrounding wall 112 extending upward from the periphery of the bottom wall 111. The center of the bottom wall 111 protrudes upwards to form a cylindrical bulge 113 with an opening facing downward. An inner chamber 114 is formed inside the bulge 113. An outer chamber 115 is formed between the area around the protruding portion 113 and the surrounding wall 112 . The bottom plate 12 fits upward to cover the opening at the bottom edge of the protruding portion 113 to seal the inner chamber 114 . A plurality of spaced riveting holes 119 are formed around the bottom wall 111 near the surrounding wall 112 .

Please refer to FIG. 4 , the body 11 also forms a shaft seat 116 located at the center of the bottom surface of the protruding portion 113 , and a liquid outlet pipe 117 disposed on the protruding portion 113 to communicate with the inner chamber 114 . A positioning hole 121 is formed in the center of the bottom plate 12 , and a plurality of arc-shaped liquid inlet holes 122 are formed around the positioning hole 121 at intervals.

The above-mentioned impeller set 20 is sealed in the inner chamber 114, and has a rotating shaft 21, a bearing 22 rotatably sleeved on the rotating shaft 21, an impeller body 23 rotatably sleeved on the bearing 22, and a The flat annular permanent magnet group 24 fixed on the impeller body 23 . The lower end of the rotating shaft 21 is fixed in the positioning hole 121 supported by the bottom plate 12 , and the upper end is inserted in the shaft seat 116 on the bottom surface of the protruding portion 113 . A plurality of curved blades 231 extending radially are formed on the bottom surface of the impeller body 23 . The permanent magnet set 24 has a plurality of N poles and S poles arranged alternately along the circumferential direction.

The above-mentioned drive unit 30 is arranged in the outer chamber 115 of the main body 11, and has a pair of electromagnets 31 respectively arranged on both sides of the protruding portion 113. Each electromagnet 31 includes an iron core 311 and a coil wound on the iron core 311. 312. The core 311 has a winding section 313 for winding the coil 312 , and two active sections 314 respectively bent and extended from opposite ends of the winding section 313 . The magnetic force generated by the electromagnet 31 through the end surface of the action section 314 drives the permanent magnet group 24 to rotate the impeller body 23 through the bulge 113 of the main body 11, so that the working liquid flows into the inner chamber 114 from the liquid inlet hole 122, and flows in the impeller. The working fluid flows out from the outlet pipe 117 penetrating through the protruding portion 113 under the centrifugal action generated by the rotation of the main body 23 .

The impeller set 20 and the driving unit 30 are respectively isolated in the inner chamber 114 and the outer chamber 115 by means of the integrally formed body 11, and there is no seam between the inner and outer chambers 114, 115, which can definitely avoid The working fluid flowing in the inner chamber 114 leaks into the outer chamber 115 during operation, causing damage to the driving unit 30 and other related electronic components disposed in the outer chamber 115 .

Hereinafter, please refer to FIG. 1 and FIG. 5 , the above-mentioned liquid pump 1 of the present invention is combined with a heat absorbing module 40 to form a liquid-cooled heat dissipation device of the present invention.

The above-mentioned heat absorbing module 40 includes a lower plate 41 , an upper plate 42 , and an annular sealing strip 43 .

The upper surface of the lower plate 41 is recessed downward to form a vortex flow channel 411 for the flow of working fluid, an annular groove 414 around the flow channel 411, and protrudes upward to form a plurality of spaced riveting parts 415, wherein the vortex flow The lane 411 may define a central end 412 and a peripheral end 413 . The upper plate 42 is smaller than the lower plate 41 and cooperates with the lower plate 41 to close the flow channel 411, but exposes the upper surface of the lower plate 41 to form an annular groove 414 and a riveting portion 415, and the upper plate 42 is also formed with corresponding A liquid outlet hole 421 and a liquid inlet hole 422 are connected to the central end 412 and the peripheral end 413 of the flow channel 411 . The sealing strip 43 is made of elastic material with sealing effect such as rubber or silica gel, and is embedded in the groove 414 , and the thickness of the sealing strip 43 in a natural state is greater than the depth of the groove 414 .

The heat absorbing module 40 is embedded upwardly on the bottom of the bottom plate 12 of the pump 1 with its upper plate 42 facing the pump 1 , and the riveting portion 415 of the lower plate 41 is correspondingly inserted into the riveting hole 119 of the bottom wall 111 of the pump body 11 . The sealing strip 43 is tightly embedded in the groove 414 of the heat-absorbing module 40 under the pressure of the pump body 11 by the riveting part 415 being inserted into the riveting hole 119 for riveting, so as to achieve the effect of sealing and preventing leakage. It should be noted that although riveting is used as the connection method between the pump 1 and the heat-absorbing module 40 here, in actual implementation, the connection method is not limited to riveting.

Wherein, the liquid outlet hole 421 of the heat absorbing module 40 is communicated with the liquid inlet hole 122 on the bottom plate 12, and the liquid inlet hole 422 of the heat absorbing module 40 is communicated with a liquid inlet pipe 116 provided on the liquid pump 1. In this implementation In an example, the liquid inlet pipe 116 is bent downwardly through the main body 11 to communicate with the liquid inlet hole 422 of the heat absorption module 40 .

In addition, as far as the location of the groove 414 is concerned, in this embodiment, the groove 414 is arranged on the upper surface of the lower plate 41 where the step difference between the upper and lower plates 42, 41 occurs, so that the sealing strip 43 is embedded therein. In this way, the position of the sealing strip 43 is just at the intersection of the joints between the main body 11 of the pump 1 and the heat-absorbing module 40 and the joints of the upper and lower plates 42, 41, so as to prevent further leakage of the liquid leaked from the joints. to the outside world and affect electronic components. In actual implementation, the groove 414 can also be arranged on the bottom surface of the body 11 of the liquid pump 1 near the level difference between the upper and lower plates 42 , 41 .

In actual work, the liquid-cooled heat sink of the present invention is brought into contact with the heat-generating electronic components such as the central processing unit with the bottom surface of the lower plate 41 of the heat-absorbing module 40, and the working liquid is driven by the liquid pump 1. The liquid pipe 116 flows into the liquid inlet hole 422 of the heat-absorbing module 40, and flows into the liquid inlet hole 122 of the liquid pump 1 from the liquid outlet hole 421 along the vortex flow channel 411, and is discharged from the liquid outlet pipe by the action of the liquid pump 1. 115 outflow, so as to use the flow of the working fluid to take away the heat generated by the heating electronic components.

To sum up the above, the utility model is provided with an annular groove 414 on the surface of the heat-absorbing module 40 between the liquid pump 1 and the heat-absorbing module 40, and a sealing strip 43 is embedded therein to prevent the liquid pump 1 or The working fluid in the heat-absorbing module 40 leaks to the outside, which indeed achieves the effect of the present utility model.

The above are only preferred embodiments of the present utility model, and do not limit the utility model in any form. Although the utility model has been disclosed as above with preferred embodiments, it is not intended to limit the utility model. Any Those skilled in the art can use the technical content disclosed above to make some changes or modify them into equivalent embodiments without departing from the technical solution of the present utility model. Content, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the utility model still belong to the scope of the technical solution of the utility model.

Claims (10)

1. A liquid-cooled heat dissipation device, applied to the heat dissipation of electronic components, comprising: a liquid pump, and a heat-absorbing module; the liquid pump has a plurality of liquid inlet holes and a liquid outlet pipe; the heat-absorbing One side of the module is in contact with the electronic components and the other side is in contact with the pump, and forms a closed flow channel that communicates with the liquid inlet hole of the pump; it is characterized in that: the heat-absorbing module is also formed with a An annular groove on the contact surface that the pump contacts and surrounds the flow channel, and the liquid-cooled heat sink also includes a thickness greater than the depth of the groove and is pressed by the pump and embedded in the Ring seals in the grooves described above. 2. The liquid-cooled heat dissipation device according to claim 1, wherein said pump comprises a casing and an impeller set; The chamber; the impeller is set in the chamber, and has a rotating shaft fixed on the housing and an impeller body that can rotate along the rotating shaft. 3. The liquid-cooled heat dissipation device according to claim 2, wherein the housing has a body and a bottom plate, the body and the bottom plate cooperate to close the chamber, and the body has a A shaft seat at one end of the rotating shaft is fixed, and a positioning hole for fixing the other end of the rotating shaft is provided on the bottom plate. 4. The liquid-cooled heat sink as claimed in claim 3, wherein the liquid inlet holes are spaced apart around the positioning holes of the bottom plate. 5. The liquid-cooled heat dissipation device according to claim 3, wherein the body has a bottom wall and a surrounding wall extending upward from the periphery of the bottom wall, and the center of the bottom wall protrudes upward to form a A cylindrical bulge with an opening facing downward, the cavity is formed inside the bulge. 6. The liquid-cooled heat dissipation device according to claim 5, wherein the heat-absorbing module includes a lower plate and an upper plate that cooperates with the lower plate to close the flow channel, and the heat-absorbing module The group is embedded in the bottom wall of the pump with its upper plate facing the pump, and the upper plate forms a liquid outlet hole communicating with the liquid inlet hole of the pump and the flow channel. 7. The liquid-cooled heat dissipation device according to claim 6, wherein the flow channel is formed by a downward depression on the upper surface of the lower plate, and the flow channel is vortex-shaped and has a central end and a peripheral end, the liquid outlet hole of the upper plate communicates with the central end of the flow channel, and the upper plate also has a liquid inlet hole connected with the peripheral end of the flow channel. 8. The liquid-cooled heat dissipation device according to claim 7, wherein the upper plate is smaller than the lower plate, and the groove is formed on the exposed upper plate of the lower plate surrounding the vortex-shaped flow channel. surface, and is located at the level difference between the upper and lower plates. 9. The liquid-cooled heat dissipation device according to claim 8, wherein a plurality of spaced riveting holes are formed around the bottom wall of the pump near the surrounding wall, and the lower plate is exposed The upper surface of the upper surface is also protrudingly formed with a plurality of riveting parts that fit into the riveting holes. 10. The liquid-cooled heat sink as claimed in claim 1, wherein the sealing strip is made of rubber or silica gel.

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