CN201115039Y - Opposite open kettle mouth of tin overflow mouth - Google Patents
Opposite open kettle mouth of tin overflow mouth Download PDFInfo
- Publication number
- CN201115039Y CN201115039Y CNU2007200755473U CN200720075547U CN201115039Y CN 201115039 Y CN201115039 Y CN 201115039Y CN U2007200755473 U CNU2007200755473 U CN U2007200755473U CN 200720075547 U CN200720075547 U CN 200720075547U CN 201115039 Y CN201115039 Y CN 201115039Y
- Authority
- CN
- China
- Prior art keywords
- kou
- tin
- mouth
- pcba plate
- excessive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 56
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 abstract description 28
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 21
- 238000009826 distribution Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Landscapes
- Molten Solder (AREA)
Abstract
The utility model relates to a tinning furnace component used for a PCBA plate soldering, in particular to a tinning furnace spout. The spout has a rectangular shape, at least a tin overflowing port is respectively arranged on the long sides of the rectangular-shaped spout; the tin overflowing ports are rectangular openings with depth of 2 to 8 mm. The tinning furnace spout of the utility model has the advantages of simple structure, can effectively improve the soldering efficiency, and applies to large-scaled automatic production; in addition, the tinning furnace spout effectively prevents the oxidation layer on the tin fluid surface from remaining on the surface of the PCBA plate, thus guaranteeing the quality of soldering spots.
Description
Technical field
The utility model relates to a kind of tin stove parts of the PCBA of being used for boards solder, especially a kind of tin furnace kettle mouth.
Background technology
Common wave-soldering adopts manual operations usually, and production efficiency is lower, for the comparatively intensive PCBA plate of need pad, this welding manner is more inadequate, in addition, because stannum export too small (generally long 2 millimeters), can bring the obstruction of scruff, thereby cause the large tracts of land of rosin joint to produce Hu Kou; At the comparatively intensive PCBA plate of pad, the kettle of employing mouth structure is also arranged, but common tin furnace kettle mouth is flat mouthful design, in order to realize scolding tin operation to the PCBA plate, generally need maintenance distance once between PCBA plate and kettle mouth, guarantee to make tin liquor can the electric elements on the PCBA plate of top be welded on the one hand from the Hu Kou ejection, guarantee simultaneously can in time discharge Hu Kou from the tin liquor of Hu Kou ejection subsequently, prevent that the kettle mouth pressure is excessive, influence welding quality, but also there is fault of construction in this structure: when tin liquor when Hu Kou sprays, because the tin liquor of upper space is owing to directly contact the formation oxide layer with air, this part oxide layer at first contacts with the PCBA plate of top along with tin liquor is gushed out from Hu Kou, in the wings under the frontal impact of tin liquor, make this part oxide layer oppressed on PCBA plate face, be difficult for it being taken away, make oxide layer remain between solder joint and the PCBA plate, have a strong impact on welding quality by the kettle mouth tin liquor of gushing out subsequently.
Summary of the invention
In order to overcome the deficiency that above-mentioned various scolding tin exists, when especially adopting the intensive PCBA plate of the point-to-point wave-soldering butt welding point of automatic selectivity to weld, inefficiency, be unsuitable for extensive batch machining, and contact easily forms the deficiency of rosin joint, it is a kind of simple in structure that the utility model provides, and can effectively improve welding efficiency, guarantees the tin furnace kettle mouth of the quality of welded contact.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of excessive tin mouth clamshell type Hu Kou, described Hu Kou is shaped as rectangle, is provided with an excessive Xi Kou on the long limit of rectangular edges respectively at least.This structure is mainly used in the welding of double or many row's lead-in wires.
For the ease of the processing of the Xi Kou that overflows, guarantee the tin liquor Xi Kou outflow of can overflowing equably simultaneously, further: described excessive Xi Kou is a rectangle gap.
For the degree of depth of the Xi Kou that overflows rationally is set, cross shallow may rising and come the Xi Kou that overflows excessive tin effect should be arranged, cross may cause deeply tin liquor before the kettle mouth of emerging just from the Xi Kou outflow of overflowing, make the emerge height of Hu Kou of tin ripple on the low side, influence welding quality, more further: the degree of depth of described excessive Xi Kou is 2～8mm.
The existence of excessive Xi Kou can effectively change the flow direction of tin liquor behind ejection Hu Kou.After tin liquor sprays from Hu Kou, tin liquor can preferentially flow out from the Xi Kou that overflows, so just form certain tin stream that flows to, making the oxide layer of the superiors can directly do not impacted is adsorbed onto on the PCBA plate, even there is the partial oxidation layer to be adsorbed onto on the PCBA plate, can be washed away by the tin liquor that sprays from Hu Kou subsequently, having guaranteed can residual oxide layer not influence the soldering quality between scolding tin and PCBA plate yet; On the other hand, because surface tension, tin liquor upper surface in the kettle mouth is spherical shape, make under the not high situation of furnace pressure, may appear at kettle mouth edge and form rosin joint, influence welding quality, the existence of excessive Xi Kou, change the flow direction of kettle mouth tin liquor, made tin liquor can maximum possible cover the PCBA plate of kettle mouth top, guaranteed the adequacy and the fastness of welding.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the utility model kettle mouth structure schematic diagram.
Fig. 2 is the placement location schematic diagram of the utility model on the PCBA plate.
1. excessive tin mouth 2.PCBA plate 3. electronic devices and components among the figure
Embodiment
A kind of excessive tin mouth clamshell type Hu Kou as shown in Figure 1, described Hu Kou is shaped as rectangle, is provided with an excessive tin mouth 1 on the long limit of rectangular edges respectively at least, and described excessive tin mouth 1 is a rectangle gap, and its degree of depth is 2～8mm.
As shown in Figure 2, Hu Kou described in the utility model is mainly used in the welding of the electronic devices and components 3 of double or many row's lead-in wires, and the heavy line among the figure is partly represented the Xi Kou that overflows.According to the distribution situation of the distribution of lead-in wire to be welded on the PCBA plate 2 and near the electronic devices and components 3 the kettle mouth excessive tin mouth 1 on the long limit of Hu Kou is set rationally: for the welding of continuous double or many rows' lead-in wires, an elongated excessive tin mouth 1 is set on the Hu Kou of relevant position, welding for the double or many rows lead-in wire of discontinuous layout is interrupted that on the Hu Kou of relevant position a plurality of excessive tin mouths 1 being set; When near the kettle mouth outside, having other electronic devices and components 3, trickle to these electronic devices and components 3 for fear of tin liquor, the tin mouth 1 that overflows is not set near the Hu Kou these electronic devices and components 3.
During use, the PCBA plate is placed on the precalculated position of kettle mouth top, and board plane and the excessive Xi Kou of Hu Kou are maintained a certain distance, generally be controlled at 2～6mm.The shape of Hu Kou can determine that Hu Kou is designed to rectangular shape usually according to the distribution situation of PCBA plate welding position, and its width is 8～10mm.For the welding position is irregular concentrated distribution, can adopt a plurality of rectangle Hu Kou to piece together required welding shape.Tin liquor keeps earlier certain liquid level to store in the kettle mouth 1～3 minute, the PCBA plate to be welded of top is carried out preheating, so that preceding operation is removed the oxide layer on the PCBA plate at the scaling powder generation chemical reaction of PCBA plate position to be welded spraying.Afterwards, the electronic startup of tin stove, push to Hu Kou by the tin liquor of exerting pressure the tin furnace interior, the continuous lifting of tin liquor face in the kettle mouth, and tin liquor ejects the excessive Xi Kou of Hu Kou the most at last, contacts with the PCBA plate of top and welds, and is guaranteeing that tin liquor and PCBA plate fully weld, unnecessary tin liquor can be discharged from the Xi Kou that overflows, and takes away the oxide layer and the impurity of tin liquor top layer.At last, take off the PCBA plate, finish the welding of ground PCBA plate from kettle mouth top.
Because adopted kettle mouth method for designing flexibly, enlarged effective solder side, thereby made speed of welding fast on year-on-year basis more than three times with international " automatic selectivity welding tin stove ".
Because Hu Kou has adopted excessive tin mouth design, this scheme has just been removed the main scruff of welding quality and the oxide skin on tin liquor surface of influencing before welding, make the qualification rate of welding reach 99.More than 9%.
Claims (3)
1. excessive tin mouth clamshell type Hu Kou, it is characterized in that: described Hu Kou is shaped as rectangle, is provided with an excessive Xi Kou (1) on the long limit of rectangular edges respectively at least.
2. excessive tin mouth clamshell type Hu Kou according to claim 1, it is characterized in that: described excessive Xi Kou (1) is a rectangle gap.
3. excessive tin mouth clamshell type Hu Kou according to claim 2, it is characterized in that: the degree of depth of described excessive Xi Kou (1) is 2～8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200755473U CN201115039Y (en) | 2007-10-18 | 2007-10-18 | Opposite open kettle mouth of tin overflow mouth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200755473U CN201115039Y (en) | 2007-10-18 | 2007-10-18 | Opposite open kettle mouth of tin overflow mouth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201115039Y true CN201115039Y (en) | 2008-09-10 |
Family
ID=39966790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200755473U Expired - Fee Related CN201115039Y (en) | 2007-10-18 | 2007-10-18 | Opposite open kettle mouth of tin overflow mouth |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201115039Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210060678A1 (en) * | 2019-08-27 | 2021-03-04 | Illinois Tool Works Inc. | Nozzle, system and method |
-
2007
- 2007-10-18 CN CNU2007200755473U patent/CN201115039Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210060678A1 (en) * | 2019-08-27 | 2021-03-04 | Illinois Tool Works Inc. | Nozzle, system and method |
| CN112439967A (en) * | 2019-08-27 | 2021-03-05 | 伊利诺斯工具制品有限公司 | Nozzle, system and method |
| EP3785837B1 (en) * | 2019-08-27 | 2024-10-02 | Illinois Tool Works, Inc. | Nozzle, system and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201115039Y (en) | Opposite open kettle mouth of tin overflow mouth | |
| CN201115040Y (en) | Double open kettle mouth on long side of tin overflow mouth | |
| CN201115036Y (en) | Single open kettle mouth on long side of tin overflow mouth | |
| CN201115037Y (en) | Single open kettle mouth on wide side of tin overflow mouth | |
| CN201115038Y (en) | Open kettle mouth at the corner of tin overflow mouth | |
| CN201115027Y (en) | Open L kettle mouth outside tin overflow hole | |
| CN201115030Y (en) | Concave kettle mouth inside tin overflow hole | |
| CN201115026Y (en) | Open L kettle mouth inside tin overflow hole | |
| CN201312421Y (en) | Combined in-row-plugged kettle opening | |
| CN201312420Y (en) | Single-row-plugged kettle opening | |
| CN201115029Y (en) | Protruding kettle mouth outside tin overflow hole | |
| CN201312414Y (en) | Plug-type kettle opening | |
| CN201115028Y (en) | Protruding kettle mouth inside tin overflow hole | |
| CN201312411Y (en) | Single-opened and semi-closed kettle opening | |
| CN201312424Y (en) | Combined part type kettle spout | |
| CN201115032Y (en) | Open loop kettle mouth inside tin overflow hole | |
| CN201312438Y (en) | Single-opening avoiding kettle mouth | |
| CN201115025Y (en) | Open loop bottle mouth outside tin overflow hole | |
| CN201312419Y (en) | Chip element avoiding single-opened kettle opening | |
| CN201312418Y (en) | Chip element avoiding closed type kettle opening | |
| CN201312417Y (en) | Single-opened and full-closed type kettle opening | |
| CN201312415Y (en) | Single-side straddle type part avoiding-type kettle opening | |
| CN201312441Y (en) | Inflow double-opening kettle spout | |
| CN201312416Y (en) | Outside block plug-type kettle opening | |
| CN201312410Y (en) | Inside-flow and full-opened type kettle opening |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |