CN201093648Y - Thermoelectric semiconductor dual-system air conditioner - Google Patents
Thermoelectric semiconductor dual-system air conditioner Download PDFInfo
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- CN201093648Y CN201093648Y CNU200720055171XU CN200720055171U CN201093648Y CN 201093648 Y CN201093648 Y CN 201093648Y CN U200720055171X U CNU200720055171X U CN U200720055171XU CN 200720055171 U CN200720055171 U CN 200720055171U CN 201093648 Y CN201093648 Y CN 201093648Y
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims 2
- 238000005057 refrigeration Methods 0.000 abstract description 34
- 238000001816 cooling Methods 0.000 abstract description 23
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 239000003507 refrigerant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 230000002528 anti-freeze Effects 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 206010013786 Dry skin Diseases 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 206010034464 Periarthritis Diseases 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 206010003246 arthritis Diseases 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 230000037336 dry skin Effects 0.000 description 1
- 201000010603 frozen shoulder Diseases 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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- 230000005676 thermoelectric effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及一种空气温度调节器,具体涉及一种热电半导体双制式空调器。The utility model relates to an air temperature regulator, in particular to a thermoelectric semiconductor dual-system air conditioner.
背景技术Background technique
目前,传统的制冷技术空调器已在工业生产、生物工程、医疗卫生和人民日常生活中广泛的得到使用,它已成为现代社会必不可缺的一项重要技术和必需品。而现有的制冷与空调技术中,空气压缩机制冷方法应用最为普遍。通常使用以氟利昂等为制冷剂,一旦泄漏对大气臭氧层有一定的破坏作用;现有的各种的空调器以压缩机制冷为中心,空气压缩机工作时产生的噪音污染,危害人们的身体健康和生活质量,对人类的环境保护起到了破坏作用,同时消耗大量的电能,也极大的浪费能源。传统的制冷技术由于大量使用该类制冷剂而面临新的抉择,包括压缩机、冷凝器、蒸发器、膨胀阀、散热板等辅助设备,涉及零部件、元器件多,原材料消耗大,技术要求高,制造工艺复杂,检测手段严格,这些都对空调器的制造业造成了一定困难。为了彻底解决现有制冷剂造成的环保问题,在寻找替代介质的同时,人们也急切的可求一种新的制冷方法和全新的空调器面世。At present, the air conditioner, a traditional refrigeration technology, has been widely used in industrial production, bioengineering, medical care and people's daily life, and it has become an indispensable important technology and necessity in modern society. In the existing refrigeration and air-conditioning technologies, the air compressor refrigeration method is the most common. Freon is usually used as a refrigerant, and once it leaks, it will have a certain destructive effect on the atmospheric ozone layer; the existing various air conditioners are centered on compressor refrigeration, and the noise pollution generated when the air compressor is working is harmful to people's health. And the quality of life, it has played a destructive role in the environmental protection of human beings, and at the same time consumes a large amount of electric energy, and also greatly wastes energy. Traditional refrigeration technology faces new choices due to the extensive use of this type of refrigerant, including compressors, condensers, evaporators, expansion valves, cooling plates and other auxiliary equipment, involving many parts and components, large consumption of raw materials, technical requirements High, complex manufacturing process, strict testing methods, these have caused certain difficulties to the air conditioner manufacturing industry. In order to thoroughly solve the environmental protection problems caused by the existing refrigerants, while looking for alternative media, people are also eager to seek a new refrigeration method and a brand-new air conditioner to come out.
发明内容Contents of the invention
本实用新型是利用热电效应原理达到制冷或致热的功能,提供了一种热电半导体双制式空调器,它取代传统老式的采用氟利昂制冷剂等制冷的空调机,用电量是传统空调制冷机的耗能的1/3至1/4,体积小,重量轻,它取消了现有空调器的过滤网,同时取消了各种病菌滋生因素,解决了现有空调器污染空气,浪费能源,运行噪声大,制造难及耗材浪费和长时间散发大量水气使人患关节炎、肩周炎、空调病、致人皮肤感觉干噪等问题,本实用新型采用热电半导体制冷元件制冷,采用低电压,使用安全、寿命长、性能可靠、无噪声。它体积小、重量轻、构造简单、投资少、成本低,既节能且效能高,还会给人们补充一定的水气,是一种有利环保的冷热双制式空调器,可做为空调器升级换代的首选产品。The utility model uses the principle of thermoelectric effect to achieve the function of cooling or heating, and provides a thermoelectric semiconductor dual-system air conditioner, which replaces the traditional and old-fashioned air conditioner that uses freon refrigerants for refrigeration. 1/3 to 1/4 of the energy consumption, small size, light weight, it cancels the filter screen of the existing air conditioner, and cancels various germ breeding factors at the same time, solves the air pollution of the existing air conditioner, waste of energy, The operation noise is large, the manufacturing is difficult, the waste of consumables and the long-term emission of a large amount of water vapor cause people to suffer from arthritis, frozen shoulder, air-conditioning disease, and dry skin. Voltage, safe use, long life, reliable performance, no noise. It is small in size, light in weight, simple in structure, low in investment and low in cost. The product of choice for upgrading.
本实用新型所采用的技术方案是:一种热电半导体双制式空调器,包括机壳,直流稳压电源,与之并联连接的热电半导体制冷板,热电半导体制冷板的冷极面与热交换水箱连接,在热交换水箱中部的出水口连接高压泵,高压泵与毛细管连接,毛细管与蒸发器进水管连接,蒸发器的出水管与热交换水箱在下部的进水口连接,在蒸发器的后面装有排风机;在热电半导体制冷板的热极面设有散热装置,装有风机和排气管。The technical solution adopted in the utility model is: a thermoelectric semiconductor dual-system air conditioner, including a casing, a DC stabilized power supply, a thermoelectric semiconductor refrigeration plate connected in parallel with it, a cold pole surface of the thermoelectric semiconductor refrigeration plate and a heat exchange water tank Connect the water outlet in the middle of the heat exchange tank to the high-pressure pump, the high-pressure pump is connected to the capillary tube, the capillary tube is connected to the water inlet pipe of the evaporator, the water outlet pipe of the evaporator is connected to the water inlet in the lower part of the heat exchange water tank, and the There is an exhaust fan; a cooling device is provided on the hot pole surface of the thermoelectric semiconductor refrigeration plate, and a fan and an exhaust pipe are installed.
本实用新型的特征还在于:The utility model is also characterized in that:
所述的热电半导体制冷板的热极面可与热交换水箱连接。The thermal pole surface of the thermoelectric semiconductor refrigeration plate can be connected with the heat exchange water tank.
所述的直流稳压电源为可调稳压电源。The DC stabilized power supply is an adjustable stabilized voltage power supply.
所述的热电半导体制冷板为8-40个。There are 8-40 thermoelectric semiconductor refrigeration panels.
所述的半导体热电制热交换水箱中的液体为汽车用防冻液。The liquid in the semiconductor thermoelectric heat exchange water tank is antifreeze for automobiles.
所述的热交换水箱与热电半导体制冷板接触板面内侧连接有纵截面为U型的金属导热块。A metal heat conduction block with a U-shaped longitudinal section is connected to the inner side of the contact plate between the heat exchange water tank and the thermoelectric semiconductor refrigeration plate.
所述的金属导热块为铝合金材料,与热电半导体制冷板数量相同。The metal heat conduction block is made of aluminum alloy and has the same number as the thermoelectric semiconductor cooling plates.
本热电半导体制冷无需空气压缩机和制冷剂制冷,采用直流稳压电源连接热电半导体制冷板制冷,出风口温度为5-15℃,制热时出风口温度为30-90℃可达到老式空调机相同的制冷降温和制热保暧效果。具有无污染、节约能源等特点,解决了现有空调器必须通过空气压缩氟利昂制冷剂制冷,造成的空气和噪声污染、破坏环境及消耗能源的问题,实现了室内温度恒定,无噪音和废气污染,大大节约了能源。并可通过调整电压大小控制温升速度,在6V-12V正常电压下运作,水箱的水温在几分钟内可控制在5-15℃度。由于热电半导体双制式空调器具有抗振、耐压、无制冷剂泄漏和使用直流电等一系列优点,因此本实用新型也可在轮船、铁路机车、客车及地下工程等特殊场合得到广泛应用,因此具有显著的经济效益和非常好的发展前景。The thermoelectric semiconductor refrigeration does not require air compressors and refrigerant refrigeration. It uses a DC stabilized power supply to connect the thermoelectric semiconductor refrigeration plate for refrigeration. The temperature of the air outlet is 5-15°C, and the temperature of the air outlet during heating is 30-90°C, which can reach the old air conditioner. The same effect of cooling and cooling and heating and warming. It has the characteristics of no pollution and energy saving, and solves the problems of air and noise pollution, environmental damage and energy consumption caused by the existing air conditioners that must be refrigerated by air-compressed Freon refrigerants, and achieves constant indoor temperature, no noise and exhaust pollution. , greatly saving energy. And the speed of temperature rise can be controlled by adjusting the voltage. When operating at a normal voltage of 6V-12V, the water temperature of the water tank can be controlled at 5-15°C within a few minutes. Because the thermoelectric semiconductor dual-system air conditioner has a series of advantages such as anti-vibration, pressure resistance, no refrigerant leakage, and the use of direct current, the utility model can also be widely used in special occasions such as ships, railway locomotives, passenger cars, and underground engineering. Therefore, It has significant economic benefits and very good development prospects.
附图说明Description of drawings
图1是本实用新型热电半导体双制式空调器原理示意图;Fig. 1 is a schematic diagram of the principle of a thermoelectric semiconductor dual-system air conditioner of the present invention;
图2是本实用新型热电半导体双制式空调器结构制冷示意图;Fig. 2 is a structural refrigerating schematic diagram of a thermoelectric semiconductor dual-system air conditioner of the present invention;
图3是本实用新型热电半导体双制式空调器结构示意图;Fig. 3 is a structural schematic diagram of a thermoelectric semiconductor dual-mode air conditioner of the present invention;
图4是本实用新型热电半导体双制式空调器结构制热示意图;Fig. 4 is a structural heating diagram of a thermoelectric semiconductor dual-system air conditioner of the present invention;
图中,1.机壳,2.稳压电源,3.热电半导体制冷板,4.热交换水箱,5.高压泵,6.毛细管,7.蒸发器,8.排风机,9.散热装置,10.风机,11.排气管,12.导热块,13.液体。In the figure, 1. Case, 2. Stabilized power supply, 3. Thermoelectric semiconductor cooling plate, 4. Heat exchange water tank, 5. High pressure pump, 6. Capillary tube, 7. Evaporator, 8. Exhaust fan, 9. Radiator , 10. Fan, 11. Exhaust pipe, 12. Heat conduction block, 13. Liquid.
具体实施方式Detailed ways
下面结合附图和具体实施方式对本实用新型进行详细说明。The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
本实用新型热电半导体双制式空调器系统原理图如图1所示,热电半导体双制式空调器由热电半导体制冷装置、室内蒸发式散热装置及向室外排温装置三部分构成。它由热电半导体制冷装置制冷(或制热),由室内蒸发式散热装置向室内吹进冷气(或热风),由向室外排温装置将热气(或冷气)排出室外,形成一个温度调节过程,实现室内温度控制。The schematic diagram of the thermoelectric semiconductor dual system air conditioner system of the utility model is shown in Figure 1. The thermoelectric semiconductor dual system air conditioner is composed of three parts: a thermoelectric semiconductor refrigeration device, an indoor evaporative cooling device and an outdoor temperature exhaust device. It is refrigerated (or heated) by a thermoelectric semiconductor refrigeration device, blows cold air (or hot air) into the room by an indoor evaporative cooling device, and discharges hot air (or cold air) to the outside by an outdoor temperature exhausting device, forming a temperature regulation process. Realize indoor temperature control.
本实用新型热电半导体双制式空调器结构如图2、图3所示,包括机壳1,直流稳压电源2,与之并联连接着热电半导体制冷板3,热电半导体制冷板3的冷极面与热交换水箱4连接,热交换水箱4中部的出水口连接高压泵5,高压泵5与毛细管6连接,毛细管6与蒸发器7进水管连接,蒸发器7的出水管与热交换水箱4在下部的进水口连接,在蒸发器7的后面装有排风机8;在热电半导体制冷板3的热极面设有散热装置9,装有风机10和排气管11;在热交换水箱4与热电半导体制冷板3接触板面内侧连接有导热块12。The structure of the thermoelectric semiconductor dual-mode air conditioner of the utility model is shown in Figure 2 and Figure 3, comprising a
当空调器在这种状态下通电运行,热电半导体制冷板3的冷极面制冷,通过紧贴的热交换水箱4板面将温度直接传递到热交换水箱4内。由于热交换水箱4内与热电半导体制冷板3的对应位置安装有导热块12,它迅速地将产生得低温传递给热交换水箱4内的液体13。为了提高功效,液体13可采用汽车用防冻液作为介质。被降温的液体13经连接在热交换水箱4中部出水口的高压泵5以高压经毛细管6喷入蒸发器7进水管流经蒸发器7,然后再从蒸发器7的出水管流回热交换水箱4,实现液体循环。蒸发器7的后面安装排风机8将冷气吹入室,起到降温作用。在热电半导体制冷板3的热极面设有散热装置9,通过风机10将热极面产生的热气经排气管11排出室外。完成室内的降温制冷的作用。When the air conditioner is energized and operated in this state, the cold pole surface of the thermoelectric
如图4所示,当热电半导体制冷板3的热极面可与热交换水箱4连接。此时空调器热电半导体制冷板3热极面制热,通过紧贴的热交换水箱4板面将热度直接传递到热交换水箱4内。由于热交换水箱4内与热电半导体制冷板3的对应位置安装有导热块12,它迅速地将产生得热温传递给热交换水箱4内的液体13。被升温的液体13经连接在热交换水箱4中部出水口的高压泵5以高速经毛细管6喷入蒸发器7进水管流经蒸发器7,然后再从蒸发器7的出水管流回热交换水箱4,实现液体循环。蒸发器7的后面安装排风机8将冷气吹入室,起到升温作用。在热电半导体制冷板3的冷极面设有散热装置9,通过风机10将冷极面产生的冷气经排气管11排出室外。完成室内温保暖的作用。As shown in FIG. 4 , when the thermal pole surface of the thermoelectric
本实用新型热电半导体双制式空调器直流稳压电源2采用可调稳压电源,通过调整电压实现,热电半导体制冷板3的数量根据室内面积大小为8-40个。在6V-12V正常电压下运行,热交换水箱4的液体13在几分钟内可控制在零上5-15℃,通过调节电压的大小可实现快速升降温度或减缓温度的变化,起到了节电;热交换水箱4内与热电半导体制冷板3接触板面连接有导热块12采用铝合金材料,与热电半导体制冷板3数量相同,金属导热块12采用为U型的纵截面可增加受热面积,使传递温度速度加快。同时起到了节电和降低能耗的作用。当液体13不足则需补足液体时或出现故障时,打开散热装置9,添加液体13和更换热电半导体制冷板3也非常简便。The DC stabilized
热电半导体双制式空调器,采用低电压工作,即省电又安全,大大节约了能源,并可通过调整电压大小控制温升速度,操作方便,老少皆宜。不论是在夏季制冷降温,还是冬季制热取暖,都不产生噪音和废气污染,实现了室内温度恒定,由于本实用新型具有抗振、耐压、无制冷剂泄漏和使用直流电等一系列优点,将在各种不同场合得到广泛应用。The thermoelectric semiconductor dual-mode air conditioner adopts low-voltage operation, which saves electricity and is safe, greatly saving energy, and can control the temperature rise speed by adjusting the voltage. It is easy to operate and suitable for all ages. Whether it is cooling in summer or heating in winter, no noise and waste gas pollution are generated, and the indoor temperature is kept constant. Because the utility model has a series of advantages such as anti-vibration, pressure resistance, no refrigerant leakage and the use of direct current, It will be widely used in various occasions.
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CNU200720055171XU CN201093648Y (en) | 2007-08-03 | 2007-08-03 | Thermoelectric semiconductor dual-system air conditioner |
PCT/CN2008/071686 WO2009018741A1 (en) | 2007-08-03 | 2008-07-18 | A kind of thermoelectric semiconductor air conditioning for refrigerating and heating |
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CN (1) | CN201093648Y (en) |
WO (1) | WO2009018741A1 (en) |
Cited By (8)
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CN103743018A (en) * | 2013-12-25 | 2014-04-23 | 王春 | Novel energy-saving TE module air conditioner |
CN103776117A (en) * | 2014-02-17 | 2014-05-07 | 叶炉军 | Car air conditioner without compressor |
CN104390297A (en) * | 2014-11-13 | 2015-03-04 | 靖江市安信制冷设备有限公司 | Electronic air conditioner |
CN104534582A (en) * | 2014-04-08 | 2015-04-22 | 侴乔力 | Semiconductor thermoelectric air-conditioning and water-heating device |
CN104976719A (en) * | 2015-06-17 | 2015-10-14 | 杨湜 | Environment-friendly air conditioner fan |
CN105066306A (en) * | 2015-08-29 | 2015-11-18 | 秦冬妹 | Water circulation refrigeration device |
TWI599713B (en) * | 2016-07-19 | 2017-09-21 | Chuan Sheng Chen | To the semiconductor as the core of the cold and warm cycle machine |
WO2020096527A1 (en) * | 2018-11-08 | 2020-05-14 | Trends Home Electrical Pte. Ltd. | Air conditioner unit |
Families Citing this family (1)
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CN205440884U (en) * | 2015-12-25 | 2016-08-10 | 广州亿航智能技术有限公司 | Multiaxis manned vehicle |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1080711A (en) * | 1992-06-30 | 1994-01-12 | 宋乃尊 | Universal semiconductor high-effect cooling device |
CN2143744Y (en) * | 1992-12-11 | 1993-10-13 | 上海机械学院 | Pyroelectric semiconductor air conditioner |
TWM287927U (en) * | 2005-07-15 | 2006-02-21 | Chuan-Sheng Chen | Semi-conductor based electrical cooling/heating appliance |
US20080041066A1 (en) * | 2006-08-21 | 2008-02-21 | Chin-Kuang Luo | Air cooling/heating device |
-
2007
- 2007-08-03 CN CNU200720055171XU patent/CN201093648Y/en not_active Expired - Fee Related
-
2008
- 2008-07-18 WO PCT/CN2008/071686 patent/WO2009018741A1/en active Application Filing
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103743018A (en) * | 2013-12-25 | 2014-04-23 | 王春 | Novel energy-saving TE module air conditioner |
CN103776117A (en) * | 2014-02-17 | 2014-05-07 | 叶炉军 | Car air conditioner without compressor |
CN104534582A (en) * | 2014-04-08 | 2015-04-22 | 侴乔力 | Semiconductor thermoelectric air-conditioning and water-heating device |
CN104390297A (en) * | 2014-11-13 | 2015-03-04 | 靖江市安信制冷设备有限公司 | Electronic air conditioner |
CN104976719A (en) * | 2015-06-17 | 2015-10-14 | 杨湜 | Environment-friendly air conditioner fan |
CN105066306A (en) * | 2015-08-29 | 2015-11-18 | 秦冬妹 | Water circulation refrigeration device |
TWI599713B (en) * | 2016-07-19 | 2017-09-21 | Chuan Sheng Chen | To the semiconductor as the core of the cold and warm cycle machine |
WO2020096527A1 (en) * | 2018-11-08 | 2020-05-14 | Trends Home Electrical Pte. Ltd. | Air conditioner unit |
Also Published As
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WO2009018741A1 (en) | 2009-02-12 |
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