CN201066982Y - Heat dissipation module with low wind resistance and high heat dissipation efficiency - Google Patents

Abstract

The utility model discloses a heat radiation module with low wind resistance and high heat radiation efficiency, which comprises a heat radiation fin and a fixing device, wherein the heat radiation fin is provided with a base, and the top surface of the base is provided with a plurality of fins; the fixing device comprises a frame, a fixing device and a fixing device, wherein the frame is provided with a top end and a hole penetrating through the top end, the top end is connected with an elastic column extending towards the inside of the hole, and the elastic column is provided with a tail end part protruding downwards; the side of the frame has several fixing boards extending downwards, and each fixing board has one hook for installing heat sink onto the heat source to raise the top surface of the base from the hole to the same height as the top of the frame and to be pressed by the end of the elastic column for heat dissipation. The utility model discloses have the effect of reducing the windage to and promote the efficiency of radiating efficiency.

Description

Cooling module with low wind resistance and high cooling efficiency

technical field

The utility model relates to a heat dissipation device for removing heat, in particular to a heat dissipation module which has the effect of reducing wind resistance and improving heat dissipation efficiency when the heat is taken away by air.

Background technique

Nowadays, many electronic devices, such as: chipsets and random access memory, etc., will generate a lot of heat during their operation, and these heat must be effectively removed; otherwise, it may cause failure or damage; due to the heat dissipation As the demand for electronic devices continues to increase, many different types of heat sinks have been proposed in order to more effectively remove the large amount of heat generated by these electronic devices.

Please refer to FIG. 1 , which is a three-dimensional exploded view of a conventional heat sink assembly 1 and a chipset assembly 2 (a heat source) in the prior art. Wherein, the traditional heat sink assembly 1 has a heat sink 11 and a fixing device 12, and the fixing device 12 is used to install the heat sink 11 on the first top 210 of the chipset assembly 2, so as to eliminate The heat generated by the heat source. The chipset assembly 2 further includes: a chipset 21 having a first top 210 , a chip substrate 22 and a printed circuit board 23 . The heat sink 11 further includes a plurality of fins 111 and a base 112 , wherein a plurality of gaps 1111 are formed between the plurality of fins 111 , and the base 112 has a first surface 1121 and a heat dissipation bottom plate 1122 . The fixing device 12 further includes a frame 121 with a second top 1210, four edge green parts 1211 and a hole 1212, the inner diameter of the hole 1212 is smaller than the outer diameter of the base 112; The fixing plate 122 having a hook 1221 is used for fastening the edge of the chipset assembly 2 with the hook 1221 when the heat sink 11 is installed on the first top 210 of the chipset assembly 2 . The inner diameter of the hole 1212 of the frame 121 also has four elastic pillars 123 extending toward the inside of the hole. These elastic pillars 123 respectively have an end portion 1231 extending downwards, so as to compress the heat sink 11 and keep the heat sink 11 combined with the chipset. The pieces are in a tightly pasted state.

As shown in FIG. 2 , it is a schematic diagram of the aforementioned conventional heat sink assembly 1 installed on the first top 210 of the chipset assembly 2 . 3A and 3B respectively show a transverse cross-sectional view and a longitudinal cross-sectional view of the conventional heat sink assembly 1 and the chipset assembly 2 after assembly. 3A and 3B, since the traditional frame frame 121 will cover the peripheral portion of the base 112, so that no fins can be formed on the peripheral portion of the base 112, that is, the heat sink 11 has relatively few fins, resulting in the The heat dissipation efficiency of the conventional heat sink assembly 1 is relatively low. Furthermore, when the airflow blown by the fan (not shown) installed on the top of the heat sink passes through the gaps 1111 formed between the multi-fins 111, it will be blocked by the frame 121 and generate a large wind resistance, so it will be greatly hindered. The heat dissipation efficiency of the heat fin assembly 1 is delayed; especially when the height of the fins 111 is relatively low (as shown in FIG. 2 ).

Utility model content

The main purpose of the present invention is to provide a heat dissipation module including a fixing device, which can reduce wind resistance and have relatively better heat dissipation efficiency.

The heat dissipation module described in the utility model is used to eliminate the heat of the heat source from the top, and it includes a heat sink with a base and a fixing device. The top surface of the base of the heat sink is provided with a plurality of fins, and on these A plurality of slits are formed between the fins; the fixing device includes a frame with a second top and a hole, the inner diameter of the hole is larger than the outer diameter of the base, and the frame is connected with multiple holes extending toward the inside of the hole. An elastic column, and the free end of the elastic column has a terminal portion extending downward; a plurality of fixing plates extend downward under the frame, and the lower edge of the fixing plate has a clasp.

When the frame is used to install the heat sink, the first top end of the heat sink is raised from the hole of the frame to the same height as the second top end, the end portion of the elastic post is pressed against the base of the heat sink, and the clasp Fastened to the edge of the chip substrate.

According to the heat dissipation module of the present invention, the elastic column extends along one of the plurality of slits, turns from the end portion and faces the hole.

In the heat dissipation module described in the present invention, the fixing device further includes two positioning baffles, the frame further includes a first pair of corresponding sides and a second pair of corresponding sides, two of the plurality of fixing plates are formed from the second A pair of corresponding sides extends downwards, and the two positioning baffles extend downwards from the second corresponding sides to position the cooling fin.

In the heat dissipation module described in the utility model, the elastic column, the plurality of fixing plates and the two positioning baffles are integrally formed with the frame.

In the heat dissipation module of the present invention, the base further includes a heat dissipation bottom plate.

In the heat dissipation module of the present invention, the distance from the second top end to the clasp is greater than or equal to the sum of the thickness of the heat dissipation bottom plate and the thickness of the first top end.

In the heat dissipation module of the present invention, the distance from the second top to the hook is greater than or equal to the sum of the thickness of the base and the thickness of the first top.

In the heat dissipation module of the present invention, when the heat dissipation fin is installed on the first top, the frame and the plurality of gaps are at the same height, so the wind resistance can be reduced and it is beneficial to the heat generated by the heat source to dissipate .

Description of drawings

FIG. 1 shows an exploded perspective view of a conventional heat sink assembly and a chipset assembly in the prior art.

FIG. 2 shows a schematic view of the assembled conventional heat sink assembly and chipset assembly shown in FIG. 1 .

FIG. 3A shows a cross-sectional view of the conventional heat sink assembly and chipset assembly shown in FIG. 2 .

FIG. 3B shows a longitudinal cross-sectional view of the conventional heat sink assembly and chipset assembly shown in FIG. 2 .

FIG. 4 is an exploded perspective view showing the three-dimensional structure of a preferred embodiment of a heat sink assembly and a chipset assembly according to the concept of the present invention.

FIG. 5 is a schematic diagram of the combined embodiment of the heat sink assembly and the chipset assembly shown in FIG. 4 .

FIG. 6A shows a cross-sectional view of a preferred embodiment of the heat sink assembly and chipset assembly shown in FIG. 5 .

FIG. 6B shows a longitudinal cross-sectional view of a preferred embodiment of the heat sink assembly and chipset assembly shown in FIG. 5 .

Detailed ways

Please refer to FIG. 4 , which shows a three-dimensional exploded view of a heat sink assembly 3 and a chipset assembly 2 conceived according to the present invention. The heat sink assembly 3 includes a heat sink 31 and a fixing device 32 , wherein the fixing device 32 is used to install the heat sink 31 on a first top 210 of the chipset assembly 2 .

The chipset assembly 2 (which is a heat source) includes a chipset 21 with a first top 210 , a chip substrate 22 and a printed circuit board 23 .

The heat sink 31 includes a base 312 and multiple fins 311 disposed on the top surface of the base 312 , and a heat dissipation bottom plate 3122 is disposed on the bottom surface of the base 312 .

The fixing device 32 includes a frame 321 with a second top 3210 , four edge portions 3211 and a hole 3212 , the inner diameter of the hole 3212 is larger than the outer diameter of the base 312 . The four edge portions 3211 include first two opposite sides 32111 and second two opposite sides 32112 surrounding the hole 3212 . The fixing device 32 further includes two fixing plates 322 with a clasp 3221 for installing the heat sink 31 on the first top end 210 of the chipset assembly 2; two elastic columns 323 are connected to the frame 321 to The interior of the hole 3212 extends, and the free end of each elastic post 323 has an end portion 3231 ; The two fixing plates 322 extend downward from the first two opposite sides 32111 (or the second two opposite sides 32112 ), and the two clasps 3221 are used to install the heat sink 31 on the chipset assembly 2 On the first top 210, and make the top surface 3121 rise from the hole 3212 to the same height as the second top 3210, so that the end portion 3231 of the elastic column 323 presses the base 312, and the clasp 3221 is fastened to the chip. The substrate 22 facilitates the elimination of the heat generated by the chipset assembly 2 (ie, the heat source) (see FIG. 5 ).

It should be noted that the utility model still retains the fins 311 on the peripheral portion of the top surface 3121 of the base 312, and the frame 321 with the second top 3210 is located at the same height as the top surface 3121 of the base 312, so it will not The airflow is prevented from flowing through the gaps 3111 formed between the plurality of fins 311 , that is, the air resistance is relatively low. Therefore, the heat sink assembly 3 proposed according to the present invention will have relatively more fins and more airflow for cooling, so that the heat generated by the chipset assembly 2 can be dissipated more efficiently.

In FIG. 5 , it shows a schematic diagram of a heat sink assembly 3 with a heat sink 31 and a fixing device 32 installed on the first top 210 of the chipset assembly 2 according to the present invention.

Figure 6A is a transverse cross-sectional view of the heat sink assembly 3 and the chipset assembly 2 shown in Figure 5 according to the creative concept; Figure 6B shows the heat dissipation shown in Figure 5 according to the creative concept A longitudinal cross-sectional view of the chip assembly 3 and the chipset assembly 2.

The heat sink assembly 3 conceived according to the utility model can improve the deficiencies of the prior art and strengthen the conduction of the heat generated by the heat source. Firstly, each of the two fixing plates 322 has a clasp 3221 for installing the heat sink 31 on the first top end 210 . Secondly, because the inner diameter of the hole 3212 is larger than the outer diameter of the base 312 , the top surface 3121 of the base 312 can rise from the hole 3212 to the same height as the second top. Therefore, the plurality of fins 311 can also be formed on the peripheral portion of the base 312, and because the peripheral portion is no longer covered by the frame 321, the airflow flowing through the gaps formed between the plurality of fins will No longer blocked by the frame 321; that is, the heat sink assembly 3 with the heat sink 31 and the fixing device 32 will have relatively more fins and relatively low wind resistance, so it has a relatively good cooling benefits.

The above are only used to explain the preferred embodiments of the present utility model, and are not intended to limit the present utility model in any form. Therefore, any relevant modifications or changes made under the same spirit, All should still be included in the category that the utility model intends to protect.

Claims (8)

1. the radiating module of low windage and high cooling efficiency is characterized in that, comprising:

One fin has a substrate, and the top end surface of this substrate is provided with many fins, forms many slits between those fins;

One fixture, comprise framework with one second top and hole, the internal diameter size in this hole is greater than the outside dimension of described substrate, this framework is connected with the inner elasticity post that extends toward this hole, the free end of this elasticity post is provided with the end portion toward the below projection, this framework below is extended with fixed head, and the end of described fixed head is provided with clasp.

2. the radiating module of low windage as claimed in claim 1 and high cooling efficiency, it is characterized in that, this framework further comprises one first pair of corresponding limit and one second pair of corresponding limit, the corresponding limit of this first couple is provided with the fixed head that extends toward the below, and described second pair of corresponding limit is provided with the positioning baffle that extends toward the below.

3. the radiating module of low windage as claimed in claim 1 and high cooling efficiency is characterized in that described substrate more comprises a radiating bottom plate.

4. the radiating module of low windage as claimed in claim 3 and high cooling efficiency is characterized in that, from described second top to the distance of described clasp more than or equal to the thickness of described radiating bottom plate and described first tip thickness with.

5. the radiating module of low windage as claimed in claim 1 and high cooling efficiency is characterized in that, from described second top to the distance of described clasp more than or equal to described substrate thickness and described first tip thickness with.

6. the radiating module of low windage as claimed in claim 1 and high cooling efficiency, it is characterized in that, described framework is installed on described fin on first top of one chipset sub-assembly, and when described clasp was fixed in the chip substrate of chipset sub-assembly, the top end surface of described substrate was raised up to a height that is relatively higher than second top of described framework from described hole.

7. the radiating module of low windage as claimed in claim 1 and high cooling efficiency, it is characterized in that, described framework is installed on described fin on first top of one chipset sub-assembly, and when described clasp was fixed in the chip substrate of chipset sub-assembly, the top end surface of described substrate was raised up to a height that is lower than second top of described framework relatively from described hole.

8. the radiating module of low windage as claimed in claim 1 and high cooling efficiency is characterized in that, described elasticity post is along one of them extension of described a plurality of slits, and this end portion turnover reaches towards this hole certainly.

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