CN201045735Y - Wafer bearing and fixing device - Google Patents
Wafer bearing and fixing device Download PDFInfo
- Publication number
- CN201045735Y CN201045735Y CNU2007200027048U CN200720002704U CN201045735Y CN 201045735 Y CN201045735 Y CN 201045735Y CN U2007200027048 U CNU2007200027048 U CN U2007200027048U CN 200720002704 U CN200720002704 U CN 200720002704U CN 201045735 Y CN201045735 Y CN 201045735Y
- Authority
- CN
- China
- Prior art keywords
- wafer
- fixing
- fixing device
- fastening piece
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 abstract 1
- 239000013078 crystal Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000274 adsorptive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a wafer bears fixing device for the wafer sets up fixedly, and it includes annular frame body and a pair of fixed establishment, wherein the frame body is equipped with the interior flange face that supplies the wafer to paste to connect and forms the terminal surface above the interior flange face, fixed establishment contains the fixed subassembly of fixed connection to the frame body, pin joint on the fixed subassembly detains the piece and corresponds to the position of detaining the piece and fix the magnetic component on the frame body, the magnetic component is used for carrying out magnetic adsorption to detaining the piece, and makes detaining the piece and press and fix on the wafer; therefore, when the wafer is loaded into the frame body, the fixing mechanism can quickly press and fix the wafer, and when the wafer is taken down, the rapid detaching operation can be completed.
Description
Technical field
The utility model relates to a kind of carrying fixture, particularly a kind ofly is used to provide wafer to install fixing carrying fixture.
Background technology
Because semiconductor industry is flourish, constantly increase in the demand of each side such as mobile phone or communication to chip, therefore industry has been developed semiconductor transistor miscellaneous successively in a large number, this development trend has not only been accelerated information flow speed and efficient, and brings great convenience for people's life and work.In addition, because the making flow process of wafer (Wafer) is quite complicated, and after in manufacturing process, must coming wafer fixed with the crystal chip bearing fixture, again it is immersed in the acetone and other organic solvent, again through cleaning and drying and other steps, the set quality of wafer will badly influence the product yield and put the convenience of getting, and therefore, the design people promptly improves as research topic with this.
Known crystal chip bearing fixture, as shown in Figure 1, it mainly comprises annular framework 10a, a plurality of fastening piece 20a and a plurality of screw 30a, wherein framework 10a puts for wafer 5, screw 30a then is arranged in the end of fastening piece 20a, and equidistantly be fixed on the top circumferential surface of framework 10a, and can make rotary oscillation with respect to screw 30a by fastening piece 20a, thus press fixing to wafer 5.
Yet, known crystal chip bearing fixture is still having following problem in the practical application: because it is when imposing fixing or unloading to wafer 5, be by seriatim each fastening piece 20a being done to screw in or screw out, and press fixing or the removal separation to wafer 5, therefore, quite time-consuming and inconvenient in operating process, and derive operating personnel's problems such as human cost are arranged, thereby demand urgently being improved.
The utility model content
Main purpose of the present utility model is, provide a kind of being used for to install fixing crystal chip bearing fixture for wafer, it comprises annular framework and a pair of fixed mechanism, and wherein said framework is provided with the inward flange face that amplexiforms for wafer and is formed at the end face of inward flange face top; Described fixed mechanism comprises the fixation kit that is fixedly attached to framework, the fastening piece that is articulated in fixation kit and corresponding to the position of fastening piece and be fixed to the magnet assembly of framework, described magnet assembly is in order to carrying out magnetic absorption to fastening piece, and fastening piece pressed be fixed on the wafer.
Compared with prior art, the beneficial effects of the utility model are, by the magnetic suction-operated between fastening piece and the magnet assembly, in the time of in wafer is loaded into framework, can utilize fixed mechanism to press fixing fast to it, and when taking off wafer, also can finish unloading operation rapidly.
Description of drawings
Fig. 1 is the combination schematic diagram of known carrying fixture;
Fig. 2 is a combination schematic diagram of the present utility model;
Fig. 3 is a sectional perspective enlargement decomposition of the present utility model;
Fig. 4 is the combination schematic diagram of Fig. 3;
Fig. 5 is a local assembled sectional view of the present utility model;
Fig. 6 is that the utility model is used for the cutaway view for wafer placement; And
Fig. 7 is the combination appearance figure of the utility model and wafer.
In the accompanying drawing, the list of parts of each label representative is as follows:
Fastening piece 30a
Inclined plane 12 end faces 13
Screw 14 shrinkage pools 15
Fixed mechanism 20
Fastening piece 22 grooves 221
Wafer 5
Embodiment
Relevant detailed description of the present utility model and technology contents, conjunction with figs. is carried out following explanation, however accompanying drawing only provides reference and explanation usefulness, is not to be used for the utility model is limited.
Fig. 2 is a combination schematic diagram of the present utility model, and Fig. 3 is a sectional perspective enlargement decomposition of the present utility model, and Fig. 4 is the combination schematic diagram of Fig. 3, and Fig. 5 is a local assembled sectional view of the present utility model.The utility model provides a kind of crystal chip bearing fixture, and it mainly comprises annular framework 10 and a pair of fixed mechanism 20, wherein:
Fixed mechanism 20 can be a pair or more of configuration, is three groups in the present embodiment, and it comprises fixation kit 21, fastening piece 22 and magnet assembly 23, and fixation kit 21 can be screw, and in like manner it also can be various kenels such as circular shaft, rivet.The below of described screw is provided with open slot 211, and its spiral shell is connected in the screw 14 that is connected to framework 10.Fastening piece 22 can be magnetic or is made by metal sheet, offers groove 221 and is formed with pivot 222 at an end of plate, and the other end then roughly is formed with down the button portion 223 of " U " shape.Pivot 222 can embed in the open slot 211 of fixation kit 21, and can swing up and down with respect to fixation kit 21.Magnet assembly 23 can be permanent magnet or is made by other material with magnetic adsorptive power, and the magnet assembly 23 of present embodiment is cylinder, and corresponds respectively to the position of each fastening piece 22 and be installed with in the shrinkage pool 15 that is fixed on framework 10.
During combination, earlier each magnet assembly 23 is forced into respectively in the shrinkage pool 15 of framework 10, the open slot 211 with fixation kit 21 is sheathed on the pivot 222 of fastening piece 22 then, the screw 14 of fixation kit 21 corresponding to framework 10 is spirally connected again; So, just, one-tenth capable of being combined crystal chip bearing fixture of the present utility model.
Fig. 6 is that the utility model is used for the cutaway view for wafer placement, and Fig. 7 is the combination appearance figure of the utility model and wafer.The utility model is fixing in order to provide wafer 5 to install.During use, each fastening piece 22 is started with respect to fixation kit 21, again wafer 5 is inserted on the inward flange face 11 of framework 10, just each fastening piece 22 can be pulled down, by the magnetic suction-operated between fastening piece 22 and the magnet assembly 23, can press fixing fast to wafer 5; Otherwise, when taking off wafer 5,, just can push each fastening piece 22 open and upwards start by wafer 5 as long as directly promotion wafer 5 is to a side shifting, unload operation rapidly to finish.
In sum, crystal chip bearing fixture of the present utility model has practicality, novelty and creativeness, and structure of the present utility model also never sees like product and public use, meets the requirement of utility application fully, files an application according to Patent Law.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007200027048U CN201045735Y (en) | 2007-01-30 | 2007-01-30 | Wafer bearing and fixing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007200027048U CN201045735Y (en) | 2007-01-30 | 2007-01-30 | Wafer bearing and fixing device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201045735Y true CN201045735Y (en) | 2008-04-09 |
Family
ID=39309204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007200027048U Expired - Fee Related CN201045735Y (en) | 2007-01-30 | 2007-01-30 | Wafer bearing and fixing device |
Country Status (1)
Country | Link |
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CN (1) | CN201045735Y (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102263051A (en) * | 2010-05-28 | 2011-11-30 | 桦塑企业股份有限公司 | Wafer bearing device |
CN103386566A (en) * | 2013-07-10 | 2013-11-13 | 中国电子科技集团公司第四十一研究所 | Laser processing clamp of medium substrate and application method thereof |
CN104733366A (en) * | 2015-03-27 | 2015-06-24 | 北京七星华创电子股份有限公司 | Supporting leg device |
CN104851832A (en) * | 2014-02-18 | 2015-08-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Fixing device, reaction cavity and plasma processing device |
US20220108910A1 (en) * | 2020-10-01 | 2022-04-07 | Disco Corporation | Holding mechanism |
-
2007
- 2007-01-30 CN CNU2007200027048U patent/CN201045735Y/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102263051A (en) * | 2010-05-28 | 2011-11-30 | 桦塑企业股份有限公司 | Wafer bearing device |
CN103386566A (en) * | 2013-07-10 | 2013-11-13 | 中国电子科技集团公司第四十一研究所 | Laser processing clamp of medium substrate and application method thereof |
CN103386566B (en) * | 2013-07-10 | 2015-04-01 | 中国电子科技集团公司第四十一研究所 | Laser processing clamp of medium substrate and application method thereof |
CN104851832A (en) * | 2014-02-18 | 2015-08-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Fixing device, reaction cavity and plasma processing device |
CN104851832B (en) * | 2014-02-18 | 2018-01-19 | 北京北方华创微电子装备有限公司 | A kind of fixing device, reaction chamber and plasma processing device |
CN104733366A (en) * | 2015-03-27 | 2015-06-24 | 北京七星华创电子股份有限公司 | Supporting leg device |
CN104733366B (en) * | 2015-03-27 | 2017-07-25 | 北京七星华创电子股份有限公司 | A kind of support feet |
US20220108910A1 (en) * | 2020-10-01 | 2022-04-07 | Disco Corporation | Holding mechanism |
US11715664B2 (en) * | 2020-10-01 | 2023-08-01 | Disco Corporation | Holding mechanism |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080409 Termination date: 20140130 |