CN201023172Y - Side-opening type splash-proof tin wire - Google Patents
Side-opening type splash-proof tin wire Download PDFInfo
- Publication number
- CN201023172Y CN201023172Y CNU2007200111245U CN200720011124U CN201023172Y CN 201023172 Y CN201023172 Y CN 201023172Y CN U2007200111245 U CNU2007200111245 U CN U2007200111245U CN 200720011124 U CN200720011124 U CN 200720011124U CN 201023172 Y CN201023172 Y CN 201023172Y
- Authority
- CN
- China
- Prior art keywords
- opening
- tin layer
- solder stick
- utility
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 239000000843 powder Substances 0.000 claims description 16
- 238000005476 soldering Methods 0.000 abstract 6
- 230000004907 flux Effects 0.000 abstract 4
- 238000003466 welding Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a solder wire, in particular to a side opening anti-spatter solder wire, which is primarily used for the soldering of elements in electronic industry such as the connection of electronic components on a circuit board, and for other soldering. The solder wire comprises an inner-lateral soldering flux (1), and a tin layer (2) is arranged at the outer side of the soldering flux (1). The utility model is characterized in that a longitudinal opening (3) is arranged on the tin layer (2), and the soldering flux (1) crops out from the opening (3). Due to the automatic release of internal pressure which is produced after the solder wire is heated, the spatter of the soldering flux and the tin layer is overcome, thereby the phenomena such as easy short circuit and joint solder of products being soldered and the like are avoided, and the operational efficiency and product quality are enhanced.
Description
Technical field:
The utility model relates to a kind of solder stick, and the anti-solder stick that splashes of particularly a kind of side opening formula is mainly used in the welding between each element in the electron trade, as the connection of electronic devices and components on the circuit board, also can be used for other.
Background technology:
At present, in electron trade, the various components and parts on the circuit board all adopt the scolding tin mode to connect, and employed solder stick structure is during welding: there is scaling powder the inboard, form the core of solder stick, in the outside of scaling powder the tin layer are arranged.Because higher temperature is arranged when using; solder stick is under the situation of being heated; be positioned at inner scaling powder fusing and vaporization rapidly; interior pressure increases thereupon; inner scaling powder and outside tin layer splash phenomena appear through regular meeting; splash formed tin club to being impacted by the weldering product, as short circuit, connect weldering etc.
The utility model content:
The technical problems to be solved in the utility model is that the scaling powder of existing solder stick inside seals, in use easily splashes and causes by problems such as the short circuit of weldering product, company's welderings, at the problems referred to above, the purpose of this utility model provides a kind of solder stick can discharge interior pressure when being heated automatically, do not have and splash, be difficult for producing by weldering product short circuit or connect that the side opening formula of weldering is anti-to fly to survey solder stick, overcomes the deficiencies in the prior art.
The anti-solder stick that splashes of side opening formula of the present utility model comprises being positioned at inboard scaling powder that be provided with the tin layer in the outside of scaling powder, described tin layer is provided with opening, and described scaling powder exposes from opening part.
The anti-solder stick that splashes of side opening formula of the present utility model, wherein said opening is along vertical setting of solder stick.
The anti-solder stick that splashes of side opening formula of the present utility model, the number of degrees of the two sides angle a of wherein said opening are 20 °～30 °.
The anti-solder stick that splashes of side opening formula of the present utility model, owing on the tin layer, be provided with opening, being positioned at inner scaling powder exposes from opening part, the interior pressure that the back is produced so solder stick is heated can discharge automatically, overcome splashing of scaling powder and tin layer, thereby avoided having been improved operating efficiency and product quality by phenomenons such as the easy short circuit of weldering product, company's welderings.
Description of drawings:
Fig. 1 is the structural representation of the anti-solder stick that splashes of the utility model side opening formula.
The specific embodiment:
As shown in the figure: 1 is inner scaling powder, be provided with tin layer 2 in the outside of scaling powder, be processed with opening 3 on tin layer 2, opening 3 vertically is provided with, scaling powder 1 can be exposed in its inside, and two sides angle a each other of opening 3 is defined as 20 ° or 22 ° or 24 ° or 26 ° or 28 ° or 30 °.Promptly between 20 °～30 °, all can.
Claims (3)
1. the anti-solder stick that splashes of side opening formula comprises being positioned at inboard scaling powder (1), and be provided with tin layer (2) in the outside of scaling powder (1), it is characterized in that: described tin layer (2) is provided with opening (3), and described scaling powder (1) is located to expose from opening (3).
2. the anti-solder stick that splashes of side opening formula according to claim 1, it is characterized in that: described opening (3) is along vertical setting of solder stick.
3. the anti-solder stick that splashes of side opening formula according to claim 2, it is characterized in that: the number of degrees of the two sides angle a of described opening (3) are 20 °～30 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200111245U CN201023172Y (en) | 2007-03-16 | 2007-03-16 | Side-opening type splash-proof tin wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200111245U CN201023172Y (en) | 2007-03-16 | 2007-03-16 | Side-opening type splash-proof tin wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201023172Y true CN201023172Y (en) | 2008-02-20 |
Family
ID=39097027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200111245U Expired - Fee Related CN201023172Y (en) | 2007-03-16 | 2007-03-16 | Side-opening type splash-proof tin wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201023172Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741814A (en) * | 2015-04-17 | 2015-07-01 | 郑州机械研究所 | Semi-closed medicine core silver solder and preparation method thereof |
| CN105397231A (en) * | 2015-11-26 | 2016-03-16 | 吴水鱼 | Soldering tin preheating principle and application |
-
2007
- 2007-03-16 CN CNU2007200111245U patent/CN201023172Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104741814A (en) * | 2015-04-17 | 2015-07-01 | 郑州机械研究所 | Semi-closed medicine core silver solder and preparation method thereof |
| CN105397231A (en) * | 2015-11-26 | 2016-03-16 | 吴水鱼 | Soldering tin preheating principle and application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080220 Termination date: 20100316 |