CN200984700Y - Wafer Grinding Ring Construction - Google Patents

Abstract

The utility model discloses a wafer grinding ring structure. The grinding ring is designed to solve the problems that the grinding surface of the plastic ring of the existing wafer grinding ring has overlarge leveling precision error, long-time workpiece-free front grinding operation needs to be carried out, the grinding working hour is delayed, and the cost is increased. Comprises a metal ring and a plastic ring which is attached and fixed on the first side surface of the metal ring; the second side of the metal ring is in a surface form which is smooth and has no turning marks after being ground. The wafer grinding ring structure can enable the grinding surface of the plastic ring to achieve better flattening precision, further greatly reduce the error value of the flattening precision of the grinding surface when the wafer grinding ring is used on a machine for the first time, greatly shorten the pre-grinding operation time without workpieces, and achieve better industrial utilization benefit and improvement on reducing the loss of grinding machinery, electric energy and personnel cost and prolonging the service life of the plastic ring of the wafer grinding ring.

Description

Wafer Grinding Ring Construction

technical field

The utility model relates to a wafer grinding ring structure, in particular to an innovative design in which the surface of the metal ring is subjected to grinding processing so as to present a smooth surface without car marks.

Background technique

In the manufacture of existing wafer grinding rings, a metal ring and a plastic ring are made separately first, and then the plastic ring is fitted and fixed on one side of the metal ring, wherein the metal ring is only formed by precision lathing, which is to increase For the firmness of the bonding of the adhesive on the bonding surface, the industry usually applies sandblasting to the bonding surface of the metal ring to obtain a rough surface effect, so as to increase the adhesion area of the bonding agent; the above-mentioned existing wafer grinding ring The manufacturing method has the following problems in practical application:

After the bonding surface of the metal ring is sandblasted, the bonding surface is microscopically uneven, and the adhesive layer is also in an unstable structure before hardening, so the resulting error , so that after the plastic ring completes the bonding and fixing state, there will be a considerable deflection error value in the predetermined flatness of the grinding surface. According to the actual situation of manufacturing in the industry, the error value of the grinding surface of the plastic ring is usually As high as 0.1-0.2mm; after the finished wafer grinding ring is put on the machine, the grinding surface of the plastic ring must have the best flatness when rotating to meet the expected grinding accuracy and effect, but the existing finished wafer grinding ring is not As mentioned above, there is an excessive error value. In order to correct this error value, the current practice is to perform pre-grinding operations without workpieces when the wafer grinding ring is first used on the machine, that is, to make the wafer The grinding surface of the grinding ring is directly in contact with the working platform until the grinding surface is worn to a flat state before the actual workpiece grinding operation can be carried out; and if the pre-grinding operation is based on the error state of the aforementioned grinding surface, generally It must take 3-4 hours to complete, so it is conceivable that it will obviously cause a waste of working hours in the grinding operation, and the pre-grinding operation of the grinding machine will increase the huge electric energy, mechanical consumption and personnel cost burden (must have operator care), does not meet the best industrial utilization benefits.

Furthermore, the wafer lapping ring will also wear out about 0.2mm of the thickness of the plastic ring before the actual workpiece lapping operation due to the long-term pre-grinding operation due to the aforementioned factors. As far as the grinding thickness is quite shallow plastic ring (note: the plastic ring can use the grinding thickness is generally only 3-5mm), this will obviously cause the problems and disadvantages of accelerated wear and shortened service life of the plastic ring.

Therefore, in view of the problems and disadvantages of the above-mentioned existing wafer grinding rings, how to develop an innovative structural design that can greatly improve the precision of the finished wafer grinding ring and reduce the cost of grinding processing remains to be solved by relevant technical personnel in the industry. Then think about the breakthrough.

Utility model content

In order to overcome the above-mentioned defects, the main purpose of this utility model is to provide a wafer grinding ring structure. For the existing wafer grinding ring, there is a large error in the flatness and precision of the grinding surface of the plastic ring, and it is necessary to carry out long-term pre-grinding without workpieces. The problem of delay in grinding time and increase in cost caused by the operation is to be solved.

In order to achieve the above object, the structure of the wafer grinding ring of the present utility model includes a metal ring and a plastic ring attached and fixed on the first side of the metal ring; the second side of the metal ring is smooth and car-free after grinding. surface pattern of scars.

The above-mentioned structure of the wafer grinding ring can make the grinding surface of the plastic ring achieve better flatness and precision, thereby greatly reducing the error value of the flatness precision of the grinding surface when the wafer grinding ring is first used on the machine, and greatly shortening the time without workpieces. The grinding operation time is set to reduce the consumption of grinding machinery, electric energy and personnel costs, and to prolong the service life of the plastic ring of the wafer grinding ring, which is the best industrial utilization benefit and progress.

Description of drawings

Fig. 1 is a front perspective perspective view of the finished wafer grinding ring of the present invention.

Fig. 2 is a perspective view of the back side of the finished wafer grinding ring of the present invention.

Fig. 3 is a schematic plan view of an embodiment of the manufacturing method of the wafer grinding ring of the present invention.

Detailed ways

Please refer to Fig. 1 and shown in Fig. 2, the preferred embodiment of the structure of the wafer grinding ring of the present invention, these embodiments are for illustration purposes only, and are not limited by this structure on the patent application; The structure of the wafer grinding ring A described above is shown in Figure 1 and Figure 2, wherein Figure 1 shows a perspective view of the front angle of the wafer grinding ring A, and Figure 2 shows a perspective view of the rear angle of the wafer grinding ring A; The wafer grinding ring A includes a metal ring 10 and a plastic ring 20 that is attached and fixed on the first side 11 of the metal ring 10; and it is different from the existing structure mainly in the metal ring 10 of the present utility model. The second side 12 is a smooth surface without car marks after grinding.

As for the part of the described wafer grinding ring manufacturing method, although it is not intended to be protected and defined in this case, in order to make the effect of the present utility model manifest, the steps for its specific implementation are described as follows below, including: (please refer to Fig. 1, As shown in Figure 2 and Figure 3)

a. Make a metal ring 10 and a plastic ring 20 respectively; wherein the metal ring 10 is in the shape of a torus with a predetermined thickness and inner and outer diameters, and can be turned to shape the appearance; the plastic ring 20 is Generally, polymer plastic materials are used for injection molding to have sufficient wear-resistant hardness as an interface for grinding wafers;

b. Attach and fix the plastic ring 20 to the first side 11 of the metal ring 10;

c. After the plastic ring 20 is pasted and fixed on the first side 11 of the metal ring 10, the second side of the metal ring 10 is then treated with the grinding surface 21 of the plastic ring 20 as a reference plane (as shown by line L in FIG. 3 ). 12 is subjected to a grinding process, so that the second side 12 constituting the metal ring 10 is a surface pattern that is ground, smooth and free of car marks (referring to the tool marks formed by the turning tool of the lathe); thus That is, a finished wafer grinding ring A is produced.

Wherein, the mating surfaces of the metal ring 10 and the plastic ring 20 can be sandblasted and glued to achieve a fitting and fixing effect.

Wherein, this plastic ring 20 can be before or after the grinding step of the second side 12 of the metal ring 10, several waste grooves 22 can be set on its grinding surface 21, and the waste grooves 22 run through the inner and outer circumferences of the plastic ring 20 Edge, between each waste tank 22 can be arranged at equidistant intervals, its effect is to throw out the waste produced when the plastic ring 20 is grinded outwards.

The beneficial effects of the utility model are as follows:

The wafer grinding ring A of the present utility model mainly uses the innovative and unique design of the second side 12 of the metal ring 10 as a smooth surface without car marks after grinding, so that the finished grinding surface 21 The flat precision error value can be reduced to 1-2 μm, therefore, when the wafer grinding ring A is used on the machine for the first time, the thickness of the plastic ring 20 worn away by the non-workpiece pre-grinding operation can be reduced to the minimum. The unnecessary wear of the plastic ring 20 that can utilize the grinding thickness to a minimum, and then indeed achieve the practical progress of prolonging the service life of the wafer grinding ring.

The description of above-mentioned embodiment is in order to illustrate the present utility model in detail, although the text is described through specific terminology, but can not limit the patent scope of the present utility model with this; The spirit and principles are then changed and modified to achieve equivalent purposes, and such changes and modifications should be included in the scope defined by the scope of the claims.

Claims (2)

1, a kind of cyrstal sphere grinding ring structure, it comprises that a becket and applying be fixed in a plastic hoop of this becket first side; It is characterized in that: second side of this becket is the surface morphology through the smooth no car trace of milled processed.

2, cyrstal sphere grinding ring structure according to claim 1, it is characterized in that: this plastic hoop is equipped with an above waste tank in its this side away from becket.

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