CN200983294Y - An EMC filter inductor - Google Patents
An EMC filter inductor Download PDFInfo
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- CN200983294Y CN200983294Y CN 200620164728 CN200620164728U CN200983294Y CN 200983294 Y CN200983294 Y CN 200983294Y CN 200620164728 CN200620164728 CN 200620164728 CN 200620164728 U CN200620164728 U CN 200620164728U CN 200983294 Y CN200983294 Y CN 200983294Y
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Abstract
The utility model discloses an EMC filter inductance, including one or more windings, distribute in one deck or multilayer, be equipped with metal shielding ground between the winding and/or between the winding layer and/or outside the winding. Parasitic Y capacitance can be created by coupling the metal shield ground to the windings. The winding wire has a distance between turns, so that the winding wire is sparsely arranged and wound. Parasitic parallel capacitance can be reduced. Due to the existence of the parasitic Y capacitor, the parasitic Y capacitor between the two windings is equivalent to another type of parasitic X capacitor after being connected in series, and the capacity of the X capacitor is equivalent to increase. For the winding wires in each phase of winding with the framework type common mode filter inductor are staggered, the adjacent winding wires between two phases of windings are not staggered, so that the parallel parasitic capacitance of the inductor generated by the upper and lower interlayer wires in each phase of winding can be reduced; increasing the parasitic X capacitance capacity between the windings.
Description
Technical field
The utility model relates to a kind of EMC (Electro Magnetic Compatibility, Electro Magnetic Compatibility) filter inductance.
Technical background
In conduction high band and radiation frequency range, common mode disturbances usually is main interference source, thus in electronic product in order to solve the common mode disturbances problem, often need use the common mode filtering circuit, the core of common mode filtering circuit is exactly common mode filtering inductance and Y electric capacity.There is the occasion of shock hazard in Y electric capacity when generally being used in and losing efficacy, therefore electric and Mechanical Reliability has specific (special) requirements to it, has certain limitation to exist to prevent energy hazard again to its capacity simultaneously, and it is higher to safe requirement certainly; Can be divided into Y1, Y2, Y3 and Y4 four classes again according to its rated voltage and the peak voltage grade that can bear.In present patent application, each line of input that adds for the filtering common mode disturbances that our said Y electric capacity is meant that the common mode filtering circuit imports that each line links to each other with the earth or casing etc. and the cross-over connection electric capacity between the earth, or the electric capacity of function phase class therewith.
Having that the common mode filtering inductance is commonly used is single-phase, three-phase and type such as heterogeneous, divide from the coiling form, can be divided into two kinds on matrix type and magnet ring type, which kind of coiling form no matter, all exist various parasitic parameters, these parasitic parameters to EMC favourable also have disadvantageous, as the turn-to-turn coupling capacitance of parasitism, parasitic X electric capacity etc.X electric capacity refers generally to be used in the occasion that can not have shock hazard when losing efficacy, when cross-line uses electric capacity (being equivalent to differential mode capacitor) to carry out filtering, because of having thunderbolt, switching surge etc. between line, may cause electric capacity to be smoldered or on fire, so the security for all countries regulation has the specific safety requirement to this type of electric capacity, this class cross-line is referred to as X electric capacity with the electric capacity that certain safety requirements is arranged simultaneously, can be divided into X1, X2, X3 three classes again according to its rated voltage and the peak voltage grade that can bear.In present patent application, our said X electric capacity is meant the line that adds for the differential mode interference between filtering incoming line and line and the cross-over connection electric capacity between line, or other electric capacity of function phase class therewith.But existing quovis modo inductance all is difficult to produce parasitic Y electric capacity, disturbs for high band, and particularly the signal High-frequency Interference can only add Y electric capacity.Under electric capacity technological level and security regulations require, can only produce the sheet Y2 electric capacity of pottery at present, this ceramic sheet Y2 electric capacity cost is very expensive, and tens times that are common Y2 electric capacity to hundreds of times, and large-scale application is not arranged at present as yet; In addition because the complexity of processing technology does not still have the Y1 electric capacity appearance of sheet, so can't be used for actual EMC protection in enormous quantities, and with the Y electric capacity of plug-in unit usually because whole plank all is the device of paster and can't being accepted, perhaps to carry out repair welding after the veneer Reflow Soldering and additionally increase unnecessary cost.At present adopt high pressure paster metalized film capacitor to replace Y electric capacity usually, but because there is big security risk in the difference of deterioration characteristic for some signal circuit or power circuits that are in below the safe voltage.Disturb for high band EMC in addition, common mode inductance is because the parasitic shunt capacitance that turn-to-turn sand closes generation is quite negative to itself and inductance resonance frequency with the influence of super band, sometimes or even the heel of Achilles of the EMC of a product, so we wish that the parasitic shunt capacitance of inductance is the smaller the better.But because the characteristics of present annular inductance and the restriction of wire winding level, interior ring lead often can't sparsely arrange, and parasitic shunt capacitance just is difficult to reduce.
In sum, there is following shortcoming in existing filter inductance:
1. can't produce parasitic Y electric capacity, very unfavorable to common mode filtering; Though can add Y electric capacity, Y electric capacity is because security regulations and present production technology problem volume are bigger, and Y electric capacity does not still have the sheet Y electric capacity of producing in enormous quantities at present; For the interference signal of high frequency tens, adopt plug-in unit Y electric capacity to have the harmful effect of parasitic parameter equally to hundreds of million;
2. parasitic shunt capacitance Cp is bigger, to the noise inhibiting ability generation ten minutes adverse influence of inductance;
3. parasitic X capacitance is too little, and is unfavorable to the differential mode filter effect.
Summary of the invention
The utility model is exactly in order to solve the problems referred to above of existing EMC filter inductance, to propose a kind of new EMC filter inductance.
For this reason, EMC filter inductance of the present utility model comprises one or more windings, be distributed in one or more layers, between described winding and/or between winding layers and/or winding be provided with metallic shield ground outward.
Preferably,
Described winding wire turn-to-turn has distance, make the sparse row of winding conducting wire around.
Described metallic shield ground is the shielding copper sheet, and an end of described copper sheet links to each other with the earth, and the other end is unsettled.
Be meant between described winding between winding and be meant between described winding layers that in the winding interlayer insulating film, described winding is meant in the winding external insulation layer outward in the insulating barrier.
Described filter inductance is annular common mode filtering inductance or band matrix type common mode filtering inductance or I-shaped differential mode filter inductance or band matrix type differential mode filter inductance.
Winding wire mutual dislocation in every phase winding of described filter inductance, the adjacent winding wire between two phase windings of described filter inductance over against.
Compared with prior art, the beneficial effects of the utility model are as follows
EMC filter inductance of the present utility model is provided with metallic shield ground in winding and/or between winding and/or outside the winding, can produce parasitic Y electric capacity by coupling between ground level and winding.
The winding wire turn-to-turn has distance in addition, and the sparse row of winding conducting wire is around reducing parasitic shunt capacitance.
Especially,, be equivalent to the parasitic X electric capacity of another type after the parasitic Y capacitances in series between two windings, be equivalent to increase the X capacitance owing to the existence of parasitic Y electric capacity.
For the winding wire mutual dislocation in every phase winding of band matrix type common mode filtering inductance, the winding wire between two phase windings does not misplace and can reduce the inductance parasitic capacitance in parallel that lead produces between the interior levels of every phase winding; Increase the parasitic X capacitance between winding.
Description of drawings
Fig. 1 is a common annular common mode inductance profile;
Fig. 2 is the circuit model schematic diagram that the various parasitic parameters of annular common mode inductance shown in Figure 1 are formed;
Fig. 3 is the graph of a relation of single inductive impedance and inductance value, parasitic parameter;
Fig. 4 is the utility model embodiment one annular common mode inductance profile;
Fig. 5 is the utility model embodiment one band matrix type common mode inductance profile;
Fig. 6 is the utility model embodiment second ring common mode inductance profile;
Fig. 7 is 3 first kinds of bands of the utility model embodiment matrix type common mode inductance profile;
Fig. 8 is 3 second kinds of bands of the utility model embodiment matrix type common mode inductance profile;
Fig. 9 is the utility model embodiment four I-shaped differential mode inductance profiles;
Figure 10 is the utility model embodiment four-tape matrix type differential mode inductance profile;
Figure 11 is the equivalent circuit diagram that has the differential mode inductance of certain common mode filtering ability.
Embodiment
For the ease of following description, below earlier the operation principle of existing EMC filter inductance is described and its filter effect is analyzed.
As shown in Figure 1, 2, in a kind of parasitic parameter of common annular EMC common mode filtering inductance, the dead resistance Rs1 of ground level, Rs2 are useful to suppressing differential mode and common mode disturbances, certainly Rs1, Rs2 have attenuation too to normal input power supply or signal, can produce certain loss, be to wish that Rs1, Rs2 are the smaller the better in the integrated application.Parasitic shunt capacitance Cp1, Cp2 are very disadvantageous to suppressing common mode and differential mode interference, and they have formed transmission channel to the interference signal of various frequencies, and the inhibitory action of 1 pair of interference signal of inductance L is greatly weakened.On the other hand, parasitic X capacitor C s1 and Cs2 are favourable to suppressing differential mode interference, so we wish that they are the bigger the better.
Fig. 3 is the graph of a relation of single inductive impedance and inductance value, parasitic parameter.As can be seen from Figure 3, if under the constant situation of inductance value, when parasitic shunt capacitance Cp capacity is big more, the resonant frequency point of inductance is just more little, and the impedance maximum point just moves down, and the resistance value behind the resonant frequency point descends thereupon, and the inhibition ability of interference source is descended thereupon.Rs is big more, and the impedance starting point is just high more, and is just strong more to the inhibition ability of interference source.Below we analyze each key element that influences parasitic capacitance in the inductance, we are example with an annular inductance, the toroidal core cross section of supposing inductance is circular, we just can know according to the principle of electric capacity, and the capacity of parasitic capacitance is main relevant with following Several Parameters: the cylindrical diameter of toroidal core, line footpath, turn-to-turn distance, dielectric material characteristic etc. wind the line.Wherein the outer insulating material characteristic of dielectric material characteristic and air, lead coat of paint or other lead is relevant, generally fix, coiling line footpath with flow through the current related of inductance, also should fix; The cylindrical diameter of toroidal core also determines after core material, inductance value and coiling line are directly determined, thus we can change have only the turn-to-turn distance.Under other condition one stable condition, the relation of the size of parasitic capacitance and the cylindrical diameter of toroidal core is: the cylindrical diameter of toroidal core is big more, parasitic capacitance capacity also big more; Under other condition one stable condition, the size of parasitic capacitance with the relation in coiling line footpath is: coiling line footpath is big more, parasitic capacitance capacity also big more; Under other condition one stable condition, the relation of the size of parasitic capacitance and turn-to-turn distance is: turn-to-turn is apart from more little, parasitic capacitance capacity big more.Spacing is much larger than the turn-to-turn distance between two other winding, thus parasitic capacitance Cp too much larger than Cs, this is not that we are desirable.On the other hand, the parasitic Y electric capacity that does not also have us to wish in the top parasitic capacitance exists, and this common mode filtering effect to the common mode filtering inductance is disadvantageous.
Introduce the modified model EMC filter inductance of the utility model on existing EMC filter inductance basis with several embodiments below, its main improvement is: introduce ground level in the winding of EMC filter inductance and/or between winding and/or outside the winding, produce parasitic Y electric capacity by coupling between ground level and winding.Because the raising of the window utilance of magnet ring and the introduction of ground level, the average headway between two winding conducting wires reduces, and can increase the parasitic X electric capacity between two windings equally in addition.In addition, the sparse row of winding conducting wire is wound to reduce parasitic shunt capacitance.The introduction method of ground level is as follows: in the winding of filter inductance and/or between winding and/or winding set up the shielding copper sheet outward, the copper sheet head is with tail insulation overlap joint but do not link to each other; Copper sheet head and tail can not overlap yet, and only separate winding is two-layer with small pieces copper sheet outsourcing insulation ring in magnet ring, and under two kinds of situations, an end of copper sheet all will be received the earth (or casing ground level) with lead, and the other end is unsettled; Also can adopt many narrow copper sheets to shield, an end of many narrow copper sheets links to each other with a lead, and the other end is unsettled.Inductance for the magnetic core matrix type, we can adopt top several method to carry out the coiling inductance equally, between each inductance winding layers, add shielding copper layer, start and the head not of shielding copper layer can overlap, can not overlap yet, start or not head draw with a lead and to connect the earth (metal shell ground), the other end is unsettled.Obviously also can adopt other metals as metal screen layer.
Below we to improve the back inductance analyze:
Y electric capacity for parasitism, spacing between lead and copper sheet is the thickness to two-layer insulating tape, be about 0.05mm～0.1mm generally speaking, the parasitic Y electric capacity that produces is with not improve preceding inductance parasitic capacitance in parallel suitable, if adopt with the enamelled wire in line-transect footpath and make ground level, then more than the twice of the preceding inductance parasitic capacitance in parallel of the parasitic Y electric capacity of Chan Shenging and improvement.For parasitic X electric capacity, because the average headway between two winding conducting wires diminishes, X electric capacity is corresponding can be increased, in addition because the existence of parasitic Y electric capacity, be equivalent to the parasitic X electric capacity of another type after the parasitic Y capacitances in series between two windings, this equally also is equivalent to increase the X capacitance.Dead resistance Rsc, Rsd for ground level, because whether the ground level of practical application circuit unicity, its size also is dissimilar to the influence of EMC, so we will control their size, for the situation of copper sheet as ground level, these two dead resistances are very little, can ignore; As ground level, the parasitic shunt capacitance Cpc of ground wire, Cpd exist hardly, can ignore for copper sheet.In sum, improve back each parasitic parameter of inductance and all change towards favourable EMC direction, we wish just for this.
Embodiment one
As shown in Figure 4, to the annular common mode filtering inductance of single layer winding, adopt the winding layering, interlayer is set up insulated metal shielding ground in order to increase parasitic Y electric capacity.The sparse row of winding conducting wire is wound to reduce parasitic shunt capacitance simultaneously.The sparse row of described winding conducting wire is around being that the winding wire turn-to-turn has spacing.A kind of annular common mode filtering inductance comprises winding wire 1, shielding copper layer 2, and described shielding copper layer 2 is positioned between winding layers.
As shown in Figure 5, also can directly between winding layers, set up metallic shield ground in order to increase parasitic Y electric capacity for the common mode filtering inductance of multilayer winding itself.The sparse row of winding conducting wire is wound to reduce parasitic shunt capacitance simultaneously.A kind of band matrix type common mode filtering inductance, comprise skeleton 6, the L phase winding 1a and the N phase winding 1b that form on the skeleton 6 by winding wire 1, be positioned at the winding interlayer insulating film 4 of L phase winding 1a and N phase winding 1b, L is positioned at insulating barrier 3 between winding between phase winding 1a and N phase winding 1b, is positioned at the shielding copper layer 2 of winding interlayer insulating film 4 and is positioned at the outer line encrust insulating barrier 5 of whole winding wire bag.
Winding conducting wire in L phase winding 1a and the N phase winding 1b staggers mutually to reduce the inductance parasitic capacitance in parallel that lead produces between levels; Do not misplace between the upper and lower between two primary winding that face mutually between L phase winding 1a and N phase winding 1b, to increase the parasitic X electric capacity between winding.
Embodiment two
As shown in Figure 6, two windings adopt same insulated metal shielding ground in order to increase parasitic Y electric capacity, and promptly two winding intermediate insulation plate washers are metallic shield ground, can increase parasitic Y electric capacity like this; The sparse row of winding conducting wire is wound in order to reduce parasitic shunt capacitance simultaneously.
Embodiment three
As shown in Figure 7, add insulated metal shielding ground between two winding layers in order to increase parasitic Y electric capacity, the sparse row of winding conducting wire is wound in order to reduce parasitic shunt capacitance simultaneously.A kind of band matrix type common mode filtering inductance, comprise skeleton 6, the L phase winding 1a and the N phase winding 1b that form on the skeleton 6 by winding wire 1, be positioned at the winding interlayer insulating film 4 of L phase winding 1a and N phase winding 1b, L is positioned at insulating barrier 3 between winding between phase winding 1a and N phase winding 1b, is positioned at the shielding copper layer 2 of insulating barrier 3 between winding and is positioned at the outer line encrust insulating barrier 5 of whole winding wire bag.
Obviously, as shown in Figure 8, also can be simultaneously between winding insulating barrier 3 and winding interlayer insulating film 4 set up shielding copper layer 2 simultaneously.
Embodiment four
We can transfer to the method in the common mode inductance of being used in the differential mode inductance and go, and produce a kind of differential mode inductance that has certain common mode filtering ability.We add metallic shield ground between the differential mode inductance winding layers, make it to produce parasitic Y electric capacity; Also can produce parasitic Y electric capacity on differential mode inductance outsourcing one metallic shield ground; Or the like be used for the method for common mode, can be directly used in differential mode inductance, make differential mode inductance have certain common mode filtering ability.
As shown in Figure 9, a kind of I-shaped differential mode filter inductance comprises I shape magnetic core 7, the winding wire 1 on the I shape magnetic core 7, and described I-shaped differential mode inductance is surrounded by shielding copper layer 2 outward, and shielding copper layer 2 is positioned at winding external insulation layer 8.
As shown in figure 10, a kind of band matrix type differential mode filter inductance comprises skeleton 6, forms winding by winding wire 1 on skeleton 6, be positioned at the winding interlayer insulating film 4 of winding layers, be positioned at the shielding copper layer 2 of winding interlayer insulating film 4 and be positioned at the outer line encrust insulating barrier 5 of whole winding wire bag.
For the above-mentioned differential mode inductance that has certain common mode filtering ability, it has induction equivalent circuit figure such as Figure 11 of various parasitic parameters.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620164728 CN200983294Y (en) | 2006-12-13 | 2006-12-13 | An EMC filter inductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620164728 CN200983294Y (en) | 2006-12-13 | 2006-12-13 | An EMC filter inductor |
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| CN200983294Y true CN200983294Y (en) | 2007-11-28 |
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| CN 200620164728 Expired - Lifetime CN200983294Y (en) | 2006-12-13 | 2006-12-13 | An EMC filter inductor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106920628A (en) * | 2017-04-20 | 2017-07-04 | 马焰琳 | A manufacturing process of liquid metal filter RT coil |
| CN112863834A (en) * | 2019-11-28 | 2021-05-28 | 广东美的白色家电技术创新中心有限公司 | Power factor corrector |
-
2006
- 2006-12-13 CN CN 200620164728 patent/CN200983294Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106920628A (en) * | 2017-04-20 | 2017-07-04 | 马焰琳 | A manufacturing process of liquid metal filter RT coil |
| CN106920628B (en) * | 2017-04-20 | 2019-05-14 | 马焰琳 | A kind of manufacture craft of liquid metal filter coil |
| CN112863834A (en) * | 2019-11-28 | 2021-05-28 | 广东美的白色家电技术创新中心有限公司 | Power factor corrector |
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| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: SE-141 NO. 1, DIALOGGATAN STREET, STOCKHOLM CITY, SWEDEN TO: NO. 1122, AVENUE F, LORAIN CITY, OHIO, THE USA |
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| TR01 | Transfer of patent right |
Effective date of registration: 20110323 Address after: The United States of Ohio city F Lorain Street No. 1122 Patentee after: Emerson Network Power Co., Ltd. Address before: SE-141 Sweden Stockholm Taylor's grid Street No. 1 Patentee before: Emerson Network Power Co., Ltd. |
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| CX01 | Expiry of patent term |
Granted publication date: 20071128 |
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