CN200976876Y - Multifunctional Chip Pad - Google Patents
Multifunctional Chip Pad Download PDFInfo
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- CN200976876Y CN200976876Y CN 200620166237 CN200620166237U CN200976876Y CN 200976876 Y CN200976876 Y CN 200976876Y CN 200620166237 CN200620166237 CN 200620166237 CN 200620166237 U CN200620166237 U CN 200620166237U CN 200976876 Y CN200976876 Y CN 200976876Y
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- pad
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- chip
- pad body
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Abstract
Description
技术领域technical field
本实用新型是与一种垫体有关,更详而言之,特别是指一种垫体表面有预定的结合部,且该等结合部内相对贴合一内部布设有芯片的弹性垫的多功能芯片垫体。The utility model is related to a pad body, more specifically, it refers to a multi-functional elastic pad with predetermined joints on the surface of the pad body, and the joints are relatively fitted with an elastic pad with a chip inside. Chip pad body.
背景技术Background technique
按,垫体是为鞋垫或座垫,已知的鞋垫,其主要是提供作为鞋子底衬使用,不同的鞋子各自搭配不同的鞋垫,以增加穿著时的舒适性,现行鞋垫的材质可因应脚底的舒适性,更改其鞋垫形成方式,例如按摩鞋垫、透气鞋垫、弹性鞋垫、吸震鞋垫等材质所构成,其后再因应不同鞋具,适当裁切成一体成型的鞋垫,另,已知的座垫,其主要是减轻使用者长时间坐在椅子上时,所产生的臀部不舒服感,现行座垫是为按摩垫、透气垫、弹性垫、吸震垫等材质所构成的一体成型的座垫,以增加坐椅子时臀部的舒适感,惟,已知垫体是为功能性材质所构成,其结构不论为鞋垫或座垫,其结构的设计上,均采用一体成型方式直接成型出其所需要的附加功能,此部份虽可提供较为节省的加工成本,但也相对的使其本身不具有可变化性,导致当垫体作为按摩垫时,垫体的整体材质较硬,无法达到只有按摩凸粒较硬而其它部份较柔软的效果,是以,整体而言已知的垫体结构除不具变换组合的功能,也因其为一体成型的结构,难以达到多样变化组装的目的。Press, the pad body is an insole or a seat pad. Known insoles are mainly used as shoe soles. Different shoes are equipped with different insoles to increase the comfort when wearing. The material of the current insoles can be adapted to the soles of the feet. To improve the comfort of the insole, change its insole forming method, such as massage insole, breathable insole, elastic insole, shock-absorbing insole and other materials, and then cut it into an integrally formed insole according to different shoes. In addition, the known seat Cushion, which is mainly to relieve the discomfort of the buttocks when the user sits on the chair for a long time. The current seat cushion is an integrally formed seat cushion made of materials such as massage cushions, air-permeable cushions, elastic cushions, and shock-absorbing cushions. , to increase the comfort of the buttocks when sitting on a chair. However, it is known that the cushion body is made of functional materials. Whether it is an insole or a seat cushion, its structure design is directly formed by integral molding. The required additional function, although this part can provide a relatively low processing cost, but it is relatively invariable, resulting in that when the pad body is used as a massage pad, the overall material of the pad body is relatively hard, which cannot achieve only The effect of the massage bumps being harder and other parts being softer is that overall, the known pad structure does not have the function of transforming and combining, and because of its integrated structure, it is difficult to achieve the purpose of various changes and assembling.
实用新型内容Utility model content
本实用新型的目的在于,提供一种多功能芯片垫体,该垫体中的弹性垫可对人体提供一吸震及缓冲功效,且该等弹性垫内的芯片可发射出对人体有益能量的功效,可对人体起到保健功能。The purpose of this utility model is to provide a multi-functional chip pad body, the elastic pad in the pad body can provide a shock absorption and cushioning effect on the human body, and the chips in the elastic pads can emit beneficial energy to the human body , can play a health care function for the human body.
本实用新型提供一种多功能芯片垫体,是包含有一垫体及预定数目的弹性垫所构成;其特征在于:The utility model provides a multifunctional chip pad body, which is composed of a pad body and a predetermined number of elastic pads; it is characterized in that:
该垫体表面设有预定形状及数目的结合部;The surface of the pad is provided with a predetermined shape and number of joints;
该弹性垫各成型为相对该结合部的形状,以相对容置固设于该结合部内,其中,该弹性垫包含一弹性胶体及其外缘封接包覆的薄膜壁组成,且该弹性胶体内包覆有预定的芯片。Each of the elastic pads is formed in a shape relative to the joint portion, and is fixed in the joint portion for relative accommodation, wherein the elastic pad is composed of an elastic gel and a film wall sealed and coated on the outer edge thereof, and the elastic gel The body is coated with a predetermined chip.
其中,该垫体表面设有一吸汗布,该吸汗布为透气布材质所制成,且该垫体底侧设有一透气部,该透气部由多数均匀布设于垫体纵向的贯穿透气孔所组成。Wherein, the surface of the pad body is provided with a sweat-absorbing cloth, the sweat-absorbing cloth is made of breathable cloth material, and the bottom side of the pad body is provided with a ventilating part, and the ventilating part is composed of a plurality of penetrating vent holes evenly arranged in the longitudinal direction of the pad body. .
其中,该垫体的结合部成型为凹槽,供该等弹性垫容设于其中,且该结合部和弹性垫相对应的底面预先涂布一粘剂,使其粘结贴合。Wherein, the joint part of the pad body is formed into a groove for the elastic pads to be accommodated therein, and an adhesive is pre-coated on the bottom surface corresponding to the joint part and the elastic pad to make them stick together.
其中,该结合部成型为透孔,供该弹性垫容置于其中,且于该弹性垫的薄膜壁周缘成型有一封接唇缘,以与该垫体透孔底侧周缘相对叠接,以一热压装置热压胶合成型。Wherein, the joint part is formed into a through hole for the elastic pad to be accommodated therein, and a sealing lip is formed on the periphery of the film wall of the elastic pad to overlap with the bottom peripheral edge of the through hole of the pad body, so as to A hot pressing device is used for thermocompression gluing and molding.
其中,该弹性垫是成型为透明状。Wherein, the elastic pad is formed into a transparent shape.
其中,该弹性胶体采用PU、硅胶或凝胶材质。Wherein, the elastic colloid is made of PU, silica gel or gel material.
其中,该等薄膜壁为TPU薄膜材质所构成。Wherein, the film walls are made of TPU film material.
其中,该芯片为能量芯片,其包含一金属片及其表面的一能量涂布层所构成,且该能量涂布层包含有预定比例的铜、碳、硅、锰、硫、镍、锗、铬、钼、钛、钒材质混合而成。Wherein, the chip is an energy chip, which consists of a metal sheet and an energy coating layer on its surface, and the energy coating layer contains a predetermined proportion of copper, carbon, silicon, manganese, sulfur, nickel, germanium, A mix of chrome, molybdenum, titanium, and vanadium.
其中,该垫体成型为鞋垫、护垫、护腕、护膝、枕头垫、座垫或床垫的形状。Wherein, the pad body is shaped into the shape of an insole, a pad, a wrist pad, a knee pad, a pillow pad, a seat pad or a mattress.
本实用新型的有益效果是:The beneficial effects of the utility model are:
本实用新型的多功能芯片垫体,该垫体中的弹性垫可对人体提供一吸震及缓冲功效,且该等弹性垫内的芯片可发射出对人体有益能量的功效,可对人体起到保健功能。In the multifunctional chip pad body of the present utility model, the elastic pads in the pad body can provide a shock absorption and cushioning effect to the human body, and the chips in the elastic pads can emit beneficial energy to the human body, which can play a role in the human body. Health function.
附图说明Description of drawings
为进一步说明本实用新型的具体技术内容,以下结合实施例及附图详细说明如后,其中:In order to further illustrate the concrete technical content of the present utility model, below in conjunction with embodiment and accompanying drawing, describe in detail as follows, wherein:
图1是本实用新型较佳实施例的外观图。Fig. 1 is the exterior view of the preferred embodiment of the utility model.
图2是本实用新型较佳实施例弹性垫的外观图。Fig. 2 is the external view of the elastic pad of the preferred embodiment of the utility model.
图3是本实用新型较佳实施例的垫体与弹性垫贴合动作示意图。Fig. 3 is a schematic diagram of the lamination action of the pad body and the elastic pad in a preferred embodiment of the present invention.
图4是本实用新型较佳实施例的底视图。Fig. 4 is a bottom view of a preferred embodiment of the utility model.
图5是本实用新型另一实施例的外观图。Fig. 5 is an appearance view of another embodiment of the utility model.
图6是本实用新型另一实施例的垫体与子垫贴合动作示意图。Fig. 6 is a schematic diagram of the lamination action of the pad body and the sub pad according to another embodiment of the present invention.
图7是本实用新型又一实施例的外观图。Fig. 7 is an appearance view of another embodiment of the utility model.
具体实施方式Detailed ways
请参阅图1至图4所示,本实用新型提供一种多功能芯片垫体的较佳实施例,该多功能芯片垫体是为一鞋垫,其是包含有一垫体10及预定数目的弹性垫20等构件所组成;其中:Please refer to Fig. 1 to Fig. 4, the utility model provides a preferred embodiment of a multi-functional chip pad, the multi-functional chip pad is an insole, which includes a
该垫体10的表面相对应于脚掌及脚跟穴道密集处,是设有预定形状及数目的结合部11,该结合部11是成型为透孔,而该垫体10是采用一种软质发泡体12及一贴合于上方的吸汗布13所构成,该吸汗布13是为透气布材质所制成,且该垫体10底侧是设有一透气部14,该透气部14是由多数均匀布设于垫体10纵向的贯穿透气孔141所组成;The surface of the
该等弹性垫20是成型为透明状,其是各成型为相对该结合部11的形状,且该弹性垫20是包含一薄膜壁21、一弹性胶体22及预定数目及形状的芯片23所组成,其中,该薄膜壁21是为TPU薄膜材质所构成,其是利用热压方式胶合封接包覆于该弹性胶体22外缘,且该薄膜壁21周缘成型有一封接唇缘211,另,该弹性胶体22是为PU、硅胶或凝胶材质所构成,且该弹性胶体22内预定位置是包覆有芯片23,该等芯片23是为能量芯片,其是由圆形的一金属片231及其表面涂布的一能量涂布层232所构成,该能量涂布层232是包含有预定比例的铜、碳、硅、锰、硫、镍、锗、铬、钼、钛、钒等材质混合而成。These
请参阅图1至图4所示,该垫体10的结合部11是成型为透孔,供该等弹性垫20容置于其中,且以一位于其下方的热压装置30,利用其相对提供的热源,往上压合于该薄膜壁21的封接唇缘211与该垫体10结合部11底侧周缘相对叠接处,使其两者热压胶合成型为一体构造,以使该等弹性垫20可固设于相对的结合部11内,同时,该等弹性垫20的表面并与该垫体10表面概位于同一平面,可提供一平整结构,其中,当该垫体10置于鞋中使用时,由于该等弹性垫20的弹性胶体22反弹力好,可对人体提供一吸震及缓冲功效,且其内的芯片23可发射出对人体有益的远红外线能量,是以,当其对应人体的脚掌位置时,可完全贴触,并不断提供相对的能量作用于脚部,如此,可改善人体机能及消除疲劳,且芯片23亦具有除臭及抗菌效果,进而提高对于人体的良好能量作用功效。Please refer to Fig. 1 to Fig. 4, the
请参阅图5至图6所示,本实用新型提供一种多功能芯片垫体的另一实施例,其主要组成构造是与前一实施例同,故不再赘述,其中,该垫体10的结合部11是成型为凹槽,且该等结合部11和弹性垫20相对应的底面是预先涂布一粘剂15,预先裁剪该等弹性垫20薄膜壁21的封接唇缘211,以符合相对结合部11的形状大小,再将该等弹性垫20置设于相对的结合部11内,使该等弹性垫20与结合部11粘附贴合,以使该等弹性垫20可固设于相对的结合部11内,另,该等弹性垫20的表面是可略凸出于垫体20表面,以增加弹性垫20与脚底接触的按摩效果。Please refer to Fig. 5 to Fig. 6, the utility model provides another embodiment of a multi-functional chip pad body, its main composition structure is the same as that of the previous embodiment, so it will not be repeated, wherein, the
请参阅图7所示,本实用新型一种多功能芯片垫体的又一实施例,该垫体40是为一座垫,该垫体40设有成型为透孔的结合部41,可供相对形状的弹性垫50容设贴合固定于其中,以增加坐椅子时臀部的舒适感,另,该垫体40亦是可成型为护垫、护腕、护膝、枕头垫或床垫等予人体可相接触的物品,以使该等弹性垫50可对人体提供一吸震及缓冲功效,且其内的芯片可发射出对人体有益的能量,以使对人体具有一保健功效。Please refer to Fig. 7, another embodiment of a multi-functional chip pad body of the present invention, the
最后,将本实用新型的特点与功效整理如下:Finally, the features and effects of the present utility model are sorted out as follows:
1.本实用新型的多功能芯片垫体,该等弹性垫的弹性胶体反弹力好,可对人体提供一吸震及缓冲功效,且当弹性垫表面略凸出于垫体表面时,可增加弹性垫与脚底接触的面积,以达到按摩的功效。1. The multi-functional chip pad body of the present utility model, the elastic colloid of these elastic pads has good rebound force, which can provide a shock absorption and cushioning effect for the human body, and when the surface of the elastic pad slightly protrudes from the surface of the pad body, the elasticity can be increased The area where the pad is in contact with the soles of the feet, in order to achieve the effect of massage.
2.本实用新型的多功能芯片垫体,该弹性垫内是置设有芯片,该芯片是可发射出对人体有益的能量,以改善人体机能及消除疲劳,其芯片亦具有除臭及抗菌效果。2. In the multifunctional chip pad body of the present invention, a chip is placed inside the elastic pad, and the chip can emit energy beneficial to the human body to improve human body functions and eliminate fatigue. The chip also has deodorizing and antibacterial properties. Effect.
3.本实用新型的多功能芯片垫体,该等弹性垫反弹是数高及可挠性高,当脚掌施力起步行走时,除了能给予更好的辅助弹性外,同时,亦能因应使用者走动时做出适当的调整变化。3. The multi-functional chip pad body of the present utility model has high bounce rate and high flexibility of these elastic pads. When the sole of the foot exerts force to start and walk, it can not only provide better auxiliary elasticity, but also can respond to the use Make appropriate adjustments while walking.
4.本实用新型的多功能芯片垫体,该垫体的结合部是容设于该垫体的不同位置上,其相对应的弹性垫亦可因应使用者的需求,调整该弹性垫的功能性,该垫体和弹性垫其两者的结合是为多样性,且结合力大,以使该垫体是同时具有对人体有益的单一功效或多样组合二种以上的功效。4. In the multi-functional chip pad of the present invention, the joints of the pad are accommodated at different positions of the pad, and the corresponding elastic pad can also adjust the function of the elastic pad according to the needs of users. The combination of the pad body and the elastic pad is diverse, and the combination force is large, so that the pad body can simultaneously have a single effect beneficial to the human body or combine two or more functions in various ways.
Claims (9)
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102551268A (en) * | 2011-11-10 | 2012-07-11 | 杨红光 | Silica gel health-care shoe and making method thereof as well as silica gel insole and making method thereof |
CN103330333A (en) * | 2013-07-04 | 2013-10-02 | 东莞华宝鞋业有限公司 | an insole |
CN103917120A (en) * | 2011-09-14 | 2014-07-09 | G形式有限责任公司 | Slideable and abrasion resistant flexible impact absorbing cushioning pads, clothing incorporating such pads, and method of making and using |
CN104352024A (en) * | 2014-11-06 | 2015-02-18 | 际华三五一五皮革皮鞋有限公司 | Odor-resistant shock-absorbing foot massage healthcare shoe pad |
CN104720436A (en) * | 2013-12-23 | 2015-06-24 | 王圣君 | Warm baby carriage |
CN106579653A (en) * | 2016-04-07 | 2017-04-26 | 明卫国 | Health-care massage insole made with TPU (thermoplastic polyurethane) elastomer and PU (polyurethane) mixture |
US9770642B2 (en) | 2010-08-11 | 2017-09-26 | G-Form, LLC | Flexible cushioning pads, items incorporating such pads, and methods of making and using |
CN110200351A (en) * | 2019-05-16 | 2019-09-06 | 佛山市南海起弘新材料科技有限公司 | A kind of cumulative insole |
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2006
- 2006-12-11 CN CN 200620166237 patent/CN200976876Y/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US9770642B2 (en) | 2010-08-11 | 2017-09-26 | G-Form, LLC | Flexible cushioning pads, items incorporating such pads, and methods of making and using |
US9782662B2 (en) | 2010-08-11 | 2017-10-10 | G-Form, LLC | Flexible cushioning pads, items incorporating such pads, and methods of making and using |
US9908028B2 (en) | 2010-08-11 | 2018-03-06 | G-Form, LLC | Flexible cushioning pads, items incorporating such pads, and methods of making and using |
CN103917120A (en) * | 2011-09-14 | 2014-07-09 | G形式有限责任公司 | Slideable and abrasion resistant flexible impact absorbing cushioning pads, clothing incorporating such pads, and method of making and using |
CN111134405A (en) * | 2011-09-14 | 2020-05-12 | G形式有限责任公司 | Slidable and abrasion resistant flexible impact absorbing cushioning pad, garment incorporating same, and methods of manufacture and use |
CN102551268A (en) * | 2011-11-10 | 2012-07-11 | 杨红光 | Silica gel health-care shoe and making method thereof as well as silica gel insole and making method thereof |
CN103330333A (en) * | 2013-07-04 | 2013-10-02 | 东莞华宝鞋业有限公司 | an insole |
CN103330333B (en) * | 2013-07-04 | 2015-04-08 | 东莞华宝鞋业有限公司 | Shoe-pad |
CN104720436A (en) * | 2013-12-23 | 2015-06-24 | 王圣君 | Warm baby carriage |
CN104352024A (en) * | 2014-11-06 | 2015-02-18 | 际华三五一五皮革皮鞋有限公司 | Odor-resistant shock-absorbing foot massage healthcare shoe pad |
CN106579653A (en) * | 2016-04-07 | 2017-04-26 | 明卫国 | Health-care massage insole made with TPU (thermoplastic polyurethane) elastomer and PU (polyurethane) mixture |
CN110200351A (en) * | 2019-05-16 | 2019-09-06 | 佛山市南海起弘新材料科技有限公司 | A kind of cumulative insole |
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