[go: up one dir, main page]

CN200976876Y - Multifunctional Chip Pad - Google Patents

Multifunctional Chip Pad Download PDF

Info

Publication number
CN200976876Y
CN200976876Y CN 200620166237 CN200620166237U CN200976876Y CN 200976876 Y CN200976876 Y CN 200976876Y CN 200620166237 CN200620166237 CN 200620166237 CN 200620166237 U CN200620166237 U CN 200620166237U CN 200976876 Y CN200976876 Y CN 200976876Y
Authority
CN
China
Prior art keywords
pad
elastic
chip
pad body
joint portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200620166237
Other languages
Chinese (zh)
Inventor
林豊棋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 200620166237 priority Critical patent/CN200976876Y/en
Application granted granted Critical
Publication of CN200976876Y publication Critical patent/CN200976876Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Mattresses And Other Support Structures For Chairs And Beds (AREA)

Abstract

A multifunctional chip pad body is composed of a pad body and a predefined number of elastic pads, the surface of said pad body has a predefined number of combined parts, and said elastic pads are made up by an elastic colloid and its film wall whose external edge is sealed and coated, and said elastic colloid contains predefined chips for providing a shock-absorbing and buffering function to human body.

Description

多功能芯片垫体Multifunctional Chip Pad

技术领域technical field

本实用新型是与一种垫体有关,更详而言之,特别是指一种垫体表面有预定的结合部,且该等结合部内相对贴合一内部布设有芯片的弹性垫的多功能芯片垫体。The utility model is related to a pad body, more specifically, it refers to a multi-functional elastic pad with predetermined joints on the surface of the pad body, and the joints are relatively fitted with an elastic pad with a chip inside. Chip pad body.

背景技术Background technique

按,垫体是为鞋垫或座垫,已知的鞋垫,其主要是提供作为鞋子底衬使用,不同的鞋子各自搭配不同的鞋垫,以增加穿著时的舒适性,现行鞋垫的材质可因应脚底的舒适性,更改其鞋垫形成方式,例如按摩鞋垫、透气鞋垫、弹性鞋垫、吸震鞋垫等材质所构成,其后再因应不同鞋具,适当裁切成一体成型的鞋垫,另,已知的座垫,其主要是减轻使用者长时间坐在椅子上时,所产生的臀部不舒服感,现行座垫是为按摩垫、透气垫、弹性垫、吸震垫等材质所构成的一体成型的座垫,以增加坐椅子时臀部的舒适感,惟,已知垫体是为功能性材质所构成,其结构不论为鞋垫或座垫,其结构的设计上,均采用一体成型方式直接成型出其所需要的附加功能,此部份虽可提供较为节省的加工成本,但也相对的使其本身不具有可变化性,导致当垫体作为按摩垫时,垫体的整体材质较硬,无法达到只有按摩凸粒较硬而其它部份较柔软的效果,是以,整体而言已知的垫体结构除不具变换组合的功能,也因其为一体成型的结构,难以达到多样变化组装的目的。Press, the pad body is an insole or a seat pad. Known insoles are mainly used as shoe soles. Different shoes are equipped with different insoles to increase the comfort when wearing. The material of the current insoles can be adapted to the soles of the feet. To improve the comfort of the insole, change its insole forming method, such as massage insole, breathable insole, elastic insole, shock-absorbing insole and other materials, and then cut it into an integrally formed insole according to different shoes. In addition, the known seat Cushion, which is mainly to relieve the discomfort of the buttocks when the user sits on the chair for a long time. The current seat cushion is an integrally formed seat cushion made of materials such as massage cushions, air-permeable cushions, elastic cushions, and shock-absorbing cushions. , to increase the comfort of the buttocks when sitting on a chair. However, it is known that the cushion body is made of functional materials. Whether it is an insole or a seat cushion, its structure design is directly formed by integral molding. The required additional function, although this part can provide a relatively low processing cost, but it is relatively invariable, resulting in that when the pad body is used as a massage pad, the overall material of the pad body is relatively hard, which cannot achieve only The effect of the massage bumps being harder and other parts being softer is that overall, the known pad structure does not have the function of transforming and combining, and because of its integrated structure, it is difficult to achieve the purpose of various changes and assembling.

实用新型内容Utility model content

本实用新型的目的在于,提供一种多功能芯片垫体,该垫体中的弹性垫可对人体提供一吸震及缓冲功效,且该等弹性垫内的芯片可发射出对人体有益能量的功效,可对人体起到保健功能。The purpose of this utility model is to provide a multi-functional chip pad body, the elastic pad in the pad body can provide a shock absorption and cushioning effect on the human body, and the chips in the elastic pads can emit beneficial energy to the human body , can play a health care function for the human body.

本实用新型提供一种多功能芯片垫体,是包含有一垫体及预定数目的弹性垫所构成;其特征在于:The utility model provides a multifunctional chip pad body, which is composed of a pad body and a predetermined number of elastic pads; it is characterized in that:

该垫体表面设有预定形状及数目的结合部;The surface of the pad is provided with a predetermined shape and number of joints;

该弹性垫各成型为相对该结合部的形状,以相对容置固设于该结合部内,其中,该弹性垫包含一弹性胶体及其外缘封接包覆的薄膜壁组成,且该弹性胶体内包覆有预定的芯片。Each of the elastic pads is formed in a shape relative to the joint portion, and is fixed in the joint portion for relative accommodation, wherein the elastic pad is composed of an elastic gel and a film wall sealed and coated on the outer edge thereof, and the elastic gel The body is coated with a predetermined chip.

其中,该垫体表面设有一吸汗布,该吸汗布为透气布材质所制成,且该垫体底侧设有一透气部,该透气部由多数均匀布设于垫体纵向的贯穿透气孔所组成。Wherein, the surface of the pad body is provided with a sweat-absorbing cloth, the sweat-absorbing cloth is made of breathable cloth material, and the bottom side of the pad body is provided with a ventilating part, and the ventilating part is composed of a plurality of penetrating vent holes evenly arranged in the longitudinal direction of the pad body. .

其中,该垫体的结合部成型为凹槽,供该等弹性垫容设于其中,且该结合部和弹性垫相对应的底面预先涂布一粘剂,使其粘结贴合。Wherein, the joint part of the pad body is formed into a groove for the elastic pads to be accommodated therein, and an adhesive is pre-coated on the bottom surface corresponding to the joint part and the elastic pad to make them stick together.

其中,该结合部成型为透孔,供该弹性垫容置于其中,且于该弹性垫的薄膜壁周缘成型有一封接唇缘,以与该垫体透孔底侧周缘相对叠接,以一热压装置热压胶合成型。Wherein, the joint part is formed into a through hole for the elastic pad to be accommodated therein, and a sealing lip is formed on the periphery of the film wall of the elastic pad to overlap with the bottom peripheral edge of the through hole of the pad body, so as to A hot pressing device is used for thermocompression gluing and molding.

其中,该弹性垫是成型为透明状。Wherein, the elastic pad is formed into a transparent shape.

其中,该弹性胶体采用PU、硅胶或凝胶材质。Wherein, the elastic colloid is made of PU, silica gel or gel material.

其中,该等薄膜壁为TPU薄膜材质所构成。Wherein, the film walls are made of TPU film material.

其中,该芯片为能量芯片,其包含一金属片及其表面的一能量涂布层所构成,且该能量涂布层包含有预定比例的铜、碳、硅、锰、硫、镍、锗、铬、钼、钛、钒材质混合而成。Wherein, the chip is an energy chip, which consists of a metal sheet and an energy coating layer on its surface, and the energy coating layer contains a predetermined proportion of copper, carbon, silicon, manganese, sulfur, nickel, germanium, A mix of chrome, molybdenum, titanium, and vanadium.

其中,该垫体成型为鞋垫、护垫、护腕、护膝、枕头垫、座垫或床垫的形状。Wherein, the pad body is shaped into the shape of an insole, a pad, a wrist pad, a knee pad, a pillow pad, a seat pad or a mattress.

本实用新型的有益效果是:The beneficial effects of the utility model are:

本实用新型的多功能芯片垫体,该垫体中的弹性垫可对人体提供一吸震及缓冲功效,且该等弹性垫内的芯片可发射出对人体有益能量的功效,可对人体起到保健功能。In the multifunctional chip pad body of the present utility model, the elastic pads in the pad body can provide a shock absorption and cushioning effect to the human body, and the chips in the elastic pads can emit beneficial energy to the human body, which can play a role in the human body. Health function.

附图说明Description of drawings

为进一步说明本实用新型的具体技术内容,以下结合实施例及附图详细说明如后,其中:In order to further illustrate the concrete technical content of the present utility model, below in conjunction with embodiment and accompanying drawing, describe in detail as follows, wherein:

图1是本实用新型较佳实施例的外观图。Fig. 1 is the exterior view of the preferred embodiment of the utility model.

图2是本实用新型较佳实施例弹性垫的外观图。Fig. 2 is the external view of the elastic pad of the preferred embodiment of the utility model.

图3是本实用新型较佳实施例的垫体与弹性垫贴合动作示意图。Fig. 3 is a schematic diagram of the lamination action of the pad body and the elastic pad in a preferred embodiment of the present invention.

图4是本实用新型较佳实施例的底视图。Fig. 4 is a bottom view of a preferred embodiment of the utility model.

图5是本实用新型另一实施例的外观图。Fig. 5 is an appearance view of another embodiment of the utility model.

图6是本实用新型另一实施例的垫体与子垫贴合动作示意图。Fig. 6 is a schematic diagram of the lamination action of the pad body and the sub pad according to another embodiment of the present invention.

图7是本实用新型又一实施例的外观图。Fig. 7 is an appearance view of another embodiment of the utility model.

具体实施方式Detailed ways

请参阅图1至图4所示,本实用新型提供一种多功能芯片垫体的较佳实施例,该多功能芯片垫体是为一鞋垫,其是包含有一垫体10及预定数目的弹性垫20等构件所组成;其中:Please refer to Fig. 1 to Fig. 4, the utility model provides a preferred embodiment of a multi-functional chip pad, the multi-functional chip pad is an insole, which includes a pad 10 and a predetermined number of elastic Composed of components such as pad 20; where:

该垫体10的表面相对应于脚掌及脚跟穴道密集处,是设有预定形状及数目的结合部11,该结合部11是成型为透孔,而该垫体10是采用一种软质发泡体12及一贴合于上方的吸汗布13所构成,该吸汗布13是为透气布材质所制成,且该垫体10底侧是设有一透气部14,该透气部14是由多数均匀布设于垫体10纵向的贯穿透气孔141所组成;The surface of the pad body 10 is corresponding to the densely packed parts of the soles of the feet and the heel acupuncture points, and is provided with a combination portion 11 of a predetermined shape and number. The foam body 12 and a sweat-absorbing cloth 13 attached to the top are formed. The sweat-absorbing cloth 13 is made of air-permeable cloth material, and the bottom side of the pad body 10 is provided with a ventilating portion 14, which is composed of a plurality of It is composed of penetrating air holes 141 uniformly arranged in the longitudinal direction of the pad body 10;

该等弹性垫20是成型为透明状,其是各成型为相对该结合部11的形状,且该弹性垫20是包含一薄膜壁21、一弹性胶体22及预定数目及形状的芯片23所组成,其中,该薄膜壁21是为TPU薄膜材质所构成,其是利用热压方式胶合封接包覆于该弹性胶体22外缘,且该薄膜壁21周缘成型有一封接唇缘211,另,该弹性胶体22是为PU、硅胶或凝胶材质所构成,且该弹性胶体22内预定位置是包覆有芯片23,该等芯片23是为能量芯片,其是由圆形的一金属片231及其表面涂布的一能量涂布层232所构成,该能量涂布层232是包含有预定比例的铜、碳、硅、锰、硫、镍、锗、铬、钼、钛、钒等材质混合而成。These elastic pads 20 are shaped to be transparent, which are each formed into a shape corresponding to the joint portion 11, and the elastic pads 20 are composed of a film wall 21, an elastic colloid 22 and chips 23 of predetermined number and shape. , wherein, the film wall 21 is made of TPU film material, which is glued and sealed on the outer edge of the elastic colloid 22 by hot pressing, and a sealing lip 211 is formed on the periphery of the film wall 21. In addition, The elastic colloid 22 is made of PU, silica gel or gel material, and the predetermined position in the elastic colloid 22 is coated with chips 23, and the chips 23 are energy chips, which are made of a circular metal sheet 231 and an energy coating layer 232 coated on its surface, the energy coating layer 232 contains a predetermined proportion of copper, carbon, silicon, manganese, sulfur, nickel, germanium, chromium, molybdenum, titanium, vanadium and other materials mixed.

请参阅图1至图4所示,该垫体10的结合部11是成型为透孔,供该等弹性垫20容置于其中,且以一位于其下方的热压装置30,利用其相对提供的热源,往上压合于该薄膜壁21的封接唇缘211与该垫体10结合部11底侧周缘相对叠接处,使其两者热压胶合成型为一体构造,以使该等弹性垫20可固设于相对的结合部11内,同时,该等弹性垫20的表面并与该垫体10表面概位于同一平面,可提供一平整结构,其中,当该垫体10置于鞋中使用时,由于该等弹性垫20的弹性胶体22反弹力好,可对人体提供一吸震及缓冲功效,且其内的芯片23可发射出对人体有益的远红外线能量,是以,当其对应人体的脚掌位置时,可完全贴触,并不断提供相对的能量作用于脚部,如此,可改善人体机能及消除疲劳,且芯片23亦具有除臭及抗菌效果,进而提高对于人体的良好能量作用功效。Please refer to Fig. 1 to Fig. 4, the joint portion 11 of the pad body 10 is formed into a through hole for the elastic pads 20 to be accommodated therein, and a heat pressing device 30 located below it is used to relatively The provided heat source is pressed upwards on the sealing lip 211 of the film wall 21 and the bottom peripheral edge of the pad body 10 joint 11, so that the two are thermocompressed and glued into an integral structure, so that the The elastic pads 20 can be fixed in the opposite joints 11. At the same time, the surfaces of the elastic pads 20 and the surface of the pad body 10 are approximately on the same plane, so that a flat structure can be provided. Wherein, when the pad body 10 is placed When used in shoes, because the elastic colloid 22 of these elastic pads 20 has good rebound force, it can provide a shock absorption and cushioning effect to the human body, and the chip 23 in it can emit far-infrared energy that is beneficial to the human body. Therefore, When it corresponds to the position of the sole of the human body, it can be completely attached and touched, and continuously provide relative energy to act on the foot, so that the function of the human body can be improved and fatigue can be eliminated, and the chip 23 also has deodorizing and antibacterial effects, thereby improving the effect on the human body. good energy effect.

请参阅图5至图6所示,本实用新型提供一种多功能芯片垫体的另一实施例,其主要组成构造是与前一实施例同,故不再赘述,其中,该垫体10的结合部11是成型为凹槽,且该等结合部11和弹性垫20相对应的底面是预先涂布一粘剂15,预先裁剪该等弹性垫20薄膜壁21的封接唇缘211,以符合相对结合部11的形状大小,再将该等弹性垫20置设于相对的结合部11内,使该等弹性垫20与结合部11粘附贴合,以使该等弹性垫20可固设于相对的结合部11内,另,该等弹性垫20的表面是可略凸出于垫体20表面,以增加弹性垫20与脚底接触的按摩效果。Please refer to Fig. 5 to Fig. 6, the utility model provides another embodiment of a multi-functional chip pad body, its main composition structure is the same as that of the previous embodiment, so it will not be repeated, wherein, the pad body 10 The joints 11 are formed into grooves, and the corresponding bottom surfaces of the joints 11 and the elastic pads 20 are pre-coated with an adhesive 15, and the sealing lips 211 of the film walls 21 of the elastic pads 20 are pre-cut, To conform to the shape and size of the relative joint portion 11, the elastic pads 20 are placed in the relative joint portion 11, so that the elastic pads 20 and the joint portion 11 are adhered so that the elastic pads 20 can be The elastic pads 20 are fixed in the opposite joint portion 11. In addition, the surfaces of the elastic pads 20 can slightly protrude from the surface of the pad body 20, so as to increase the massage effect of the elastic pads 20 in contact with the soles of the feet.

请参阅图7所示,本实用新型一种多功能芯片垫体的又一实施例,该垫体40是为一座垫,该垫体40设有成型为透孔的结合部41,可供相对形状的弹性垫50容设贴合固定于其中,以增加坐椅子时臀部的舒适感,另,该垫体40亦是可成型为护垫、护腕、护膝、枕头垫或床垫等予人体可相接触的物品,以使该等弹性垫50可对人体提供一吸震及缓冲功效,且其内的芯片可发射出对人体有益的能量,以使对人体具有一保健功效。Please refer to Fig. 7, another embodiment of a multi-functional chip pad body of the present invention, the pad body 40 is a seat pad, and the pad body 40 is provided with a joint portion 41 formed into a through hole, which can be used for The relative shape of the elastic pad 50 can fit and be fixed therein to increase the comfort of the buttocks when sitting on a chair. In addition, the pad body 40 can also be shaped into a pad, wrist guard, knee pad, pillow pad or mattress, etc. Articles that can be in contact with the human body, so that the elastic pads 50 can provide a shock absorption and cushioning effect to the human body, and the chips inside can emit energy beneficial to the human body, so that the human body has a health care effect.

最后,将本实用新型的特点与功效整理如下:Finally, the features and effects of the present utility model are sorted out as follows:

1.本实用新型的多功能芯片垫体,该等弹性垫的弹性胶体反弹力好,可对人体提供一吸震及缓冲功效,且当弹性垫表面略凸出于垫体表面时,可增加弹性垫与脚底接触的面积,以达到按摩的功效。1. The multi-functional chip pad body of the present utility model, the elastic colloid of these elastic pads has good rebound force, which can provide a shock absorption and cushioning effect for the human body, and when the surface of the elastic pad slightly protrudes from the surface of the pad body, the elasticity can be increased The area where the pad is in contact with the soles of the feet, in order to achieve the effect of massage.

2.本实用新型的多功能芯片垫体,该弹性垫内是置设有芯片,该芯片是可发射出对人体有益的能量,以改善人体机能及消除疲劳,其芯片亦具有除臭及抗菌效果。2. In the multifunctional chip pad body of the present invention, a chip is placed inside the elastic pad, and the chip can emit energy beneficial to the human body to improve human body functions and eliminate fatigue. The chip also has deodorizing and antibacterial properties. Effect.

3.本实用新型的多功能芯片垫体,该等弹性垫反弹是数高及可挠性高,当脚掌施力起步行走时,除了能给予更好的辅助弹性外,同时,亦能因应使用者走动时做出适当的调整变化。3. The multi-functional chip pad body of the present utility model has high bounce rate and high flexibility of these elastic pads. When the sole of the foot exerts force to start and walk, it can not only provide better auxiliary elasticity, but also can respond to the use Make appropriate adjustments while walking.

4.本实用新型的多功能芯片垫体,该垫体的结合部是容设于该垫体的不同位置上,其相对应的弹性垫亦可因应使用者的需求,调整该弹性垫的功能性,该垫体和弹性垫其两者的结合是为多样性,且结合力大,以使该垫体是同时具有对人体有益的单一功效或多样组合二种以上的功效。4. In the multi-functional chip pad of the present invention, the joints of the pad are accommodated at different positions of the pad, and the corresponding elastic pad can also adjust the function of the elastic pad according to the needs of users. The combination of the pad body and the elastic pad is diverse, and the combination force is large, so that the pad body can simultaneously have a single effect beneficial to the human body or combine two or more functions in various ways.

Claims (9)

1、一种多功能芯片垫体,是包含有一垫体及预定数目的弹性垫所构成;其特征在于:1. A multifunctional chip pad body, which is composed of a pad body and a predetermined number of elastic pads; it is characterized in that: 该垫体表面设有预定形状及数目的结合部;The surface of the pad is provided with a predetermined shape and number of joints; 该弹性垫各成型为相对该结合部的形状,以相对容置固设于该结合部内,其中,该弹性垫包含一弹性胶体及其外缘封接包覆的薄膜壁组成,且该弹性胶体内包覆有预定的芯片。Each of the elastic pads is formed in a shape relative to the joint portion, and is fixed in the joint portion for relative accommodation, wherein the elastic pad is composed of an elastic gel and a film wall sealed and coated on the outer edge thereof, and the elastic gel The body is coated with a predetermined chip. 2、如权利要求1项所述的多功能芯片垫体,其特征在于,其中,该垫体表面设有一吸汗布,该吸汗布为透气布材质所制成,且该垫体底侧设有一透气部,该透气部由多数均匀布设于垫体纵向的贯穿透气孔所组成。2. The multi-functional chip pad as claimed in claim 1, wherein, a sweat-absorbing cloth is provided on the surface of the pad, the sweat-absorbing cloth is made of air-permeable cloth, and a bottom of the pad is provided with a The ventilation part is composed of a plurality of penetrating ventilation holes evenly arranged in the longitudinal direction of the pad body. 3、如权利要求1项所述的多功能芯片垫体,其特征在于,其中,该垫体的结合部成型为凹槽,供该等弹性垫容设于其中,且该结合部和弹性垫相对应的底面预先涂布一粘剂,使其粘结贴合。3. The multifunctional chip pad as claimed in claim 1, wherein, the joint portion of the pad body is formed into a groove for the elastic pads to be accommodated therein, and the joint portion and the elastic pad The corresponding bottom surface is pre-coated with an adhesive to make it bonded. 4、如权利要求1项所述的多功能芯片垫体,其特征在于,其中,该结合部成型为透孔,供该弹性垫容置于其中,且于该弹性垫的薄膜壁周缘成型有一封接唇缘,以与该垫体透孔底侧周缘相对叠接,以一热压装置热压胶合成型。4. The multi-functional chip pad as claimed in claim 1, wherein, the joint part is formed as a through hole for the elastic pad to be accommodated therein, and a film wall periphery of the elastic pad is formed with a The sealing lip is overlapped with the peripheral edge of the bottom side of the through-hole of the pad body, and is formed by hot-pressing and gluing with a hot-pressing device. 5、如权利要求1项所述的多功能芯片垫体,其特征在于,其中,该弹性垫是成型为透明状。5. The multi-functional chip pad as claimed in claim 1, wherein the elastic pad is shaped transparent. 6、如权利要求1项所述的多功能芯片垫体,其特征在于,其中,该弹性胶体采用PU、硅胶或凝胶材质。6. The multifunctional chip pad as claimed in claim 1, wherein the elastic colloid is made of PU, silica gel or gel material. 7、如权利要求1项所述的多功能芯片垫体,其特征在于,其中,该等薄膜壁为TPU薄膜材质所构成。7. The multifunctional chip pad as claimed in claim 1, wherein the film walls are made of TPU film material. 8、如权利要求1项所述的多功能芯片垫体,其特征在于,其中,该芯片为能量芯片,其包含一金属片及其表面的一能量涂布层所构成,且该能量涂布层包含有预定比例的铜、碳、硅、锰、硫、镍、锗、铬、钼、钛、钒材质混合而成。8. The multifunctional chip pad as claimed in claim 1, wherein the chip is an energy chip, which comprises a metal sheet and an energy coating layer on its surface, and the energy coating The layer contains copper, carbon, silicon, manganese, sulfur, nickel, germanium, chromium, molybdenum, titanium and vanadium in a predetermined proportion. 9、如权利要求1项所述的多功能芯片垫体,其特征在于,其中,该垫体成型为鞋垫、护垫、护腕、护膝、枕头垫、座垫或床垫的形状。9. The multi-functional chip pad as claimed in claim 1, wherein the pad is shaped into a shape of a shoe pad, a pad, a wrist pad, a knee pad, a pillow pad, a seat pad or a mattress.
CN 200620166237 2006-12-11 2006-12-11 Multifunctional Chip Pad Expired - Fee Related CN200976876Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200620166237 CN200976876Y (en) 2006-12-11 2006-12-11 Multifunctional Chip Pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200620166237 CN200976876Y (en) 2006-12-11 2006-12-11 Multifunctional Chip Pad

Publications (1)

Publication Number Publication Date
CN200976876Y true CN200976876Y (en) 2007-11-21

Family

ID=38977255

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200620166237 Expired - Fee Related CN200976876Y (en) 2006-12-11 2006-12-11 Multifunctional Chip Pad

Country Status (1)

Country Link
CN (1) CN200976876Y (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102551268A (en) * 2011-11-10 2012-07-11 杨红光 Silica gel health-care shoe and making method thereof as well as silica gel insole and making method thereof
CN103330333A (en) * 2013-07-04 2013-10-02 东莞华宝鞋业有限公司 an insole
CN103917120A (en) * 2011-09-14 2014-07-09 G形式有限责任公司 Slideable and abrasion resistant flexible impact absorbing cushioning pads, clothing incorporating such pads, and method of making and using
CN104352024A (en) * 2014-11-06 2015-02-18 际华三五一五皮革皮鞋有限公司 Odor-resistant shock-absorbing foot massage healthcare shoe pad
CN104720436A (en) * 2013-12-23 2015-06-24 王圣君 Warm baby carriage
CN106579653A (en) * 2016-04-07 2017-04-26 明卫国 Health-care massage insole made with TPU (thermoplastic polyurethane) elastomer and PU (polyurethane) mixture
US9770642B2 (en) 2010-08-11 2017-09-26 G-Form, LLC Flexible cushioning pads, items incorporating such pads, and methods of making and using
CN110200351A (en) * 2019-05-16 2019-09-06 佛山市南海起弘新材料科技有限公司 A kind of cumulative insole

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9770642B2 (en) 2010-08-11 2017-09-26 G-Form, LLC Flexible cushioning pads, items incorporating such pads, and methods of making and using
US9782662B2 (en) 2010-08-11 2017-10-10 G-Form, LLC Flexible cushioning pads, items incorporating such pads, and methods of making and using
US9908028B2 (en) 2010-08-11 2018-03-06 G-Form, LLC Flexible cushioning pads, items incorporating such pads, and methods of making and using
CN103917120A (en) * 2011-09-14 2014-07-09 G形式有限责任公司 Slideable and abrasion resistant flexible impact absorbing cushioning pads, clothing incorporating such pads, and method of making and using
CN111134405A (en) * 2011-09-14 2020-05-12 G形式有限责任公司 Slidable and abrasion resistant flexible impact absorbing cushioning pad, garment incorporating same, and methods of manufacture and use
CN102551268A (en) * 2011-11-10 2012-07-11 杨红光 Silica gel health-care shoe and making method thereof as well as silica gel insole and making method thereof
CN103330333A (en) * 2013-07-04 2013-10-02 东莞华宝鞋业有限公司 an insole
CN103330333B (en) * 2013-07-04 2015-04-08 东莞华宝鞋业有限公司 Shoe-pad
CN104720436A (en) * 2013-12-23 2015-06-24 王圣君 Warm baby carriage
CN104352024A (en) * 2014-11-06 2015-02-18 际华三五一五皮革皮鞋有限公司 Odor-resistant shock-absorbing foot massage healthcare shoe pad
CN106579653A (en) * 2016-04-07 2017-04-26 明卫国 Health-care massage insole made with TPU (thermoplastic polyurethane) elastomer and PU (polyurethane) mixture
CN110200351A (en) * 2019-05-16 2019-09-06 佛山市南海起弘新材料科技有限公司 A kind of cumulative insole

Similar Documents

Publication Publication Date Title
CN200976876Y (en) Multifunctional Chip Pad
JP3113647U (en) Composite insole
CN109549282B (en) A kind of business formal shoes sole specially used for driving and its elastic shock absorption method
CN219288884U (en) Sole of high-heeled shoe
CN2707063Y (en) Movable adjustable orthopedic device for plantar height
KR200401231Y1 (en) Structure of middle layer of shore sole
CN202233334U (en) Heightening insole structure
CN204363092U (en) A kind of functional insole
CN209660569U (en) A kind of motor function insole
CN2879726Y (en) Silicone health care insole
CN201064232Y (en) Massage insole
CN2792252Y (en) A shock-absorbing health-care shoe sole
CN206744703U (en) A sports insole for reducing exercise fatigue
KR200314880Y1 (en) Structure of middle layer of shore sole
CN2754403Y (en) Shoes with different elastomers
CN202999510U (en) A kind of health massage insole
TWM592667U (en) Multifunctional arch support insole
CN221864847U (en) Shock-absorbing insole with acupoint massage function
CN219249331U (en) Multilayer thermoplastic shoe pad
CN201260428Y (en) Pressure-reducing shoe pad
CN201911412U (en) Crossed sole structure
CN103330333B (en) Shoe-pad
CN2724459Y (en) Shoes
CN210248632U (en) Aerogel health-care insole
TWM309889U (en) Multifunctional chip mat

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20071121

Termination date: 20141211

EXPY Termination of patent right or utility model