CN1979826A - Heat sink and the high thermal conductivity composite material it uses - Google Patents
Heat sink and the high thermal conductivity composite material it uses Download PDFInfo
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- CN1979826A CN1979826A CN 200510125715 CN200510125715A CN1979826A CN 1979826 A CN1979826 A CN 1979826A CN 200510125715 CN200510125715 CN 200510125715 CN 200510125715 A CN200510125715 A CN 200510125715A CN 1979826 A CN1979826 A CN 1979826A
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Abstract
The invention provides a heat dissipation device and a high-thermal-conductivity composite material used by the same. The heat dissipation device provided by the invention is used for dissipating heat of an electronic element and comprises a first heat dissipation element, wherein the first heat dissipation element is directly contacted with the electronic element, and the material of the first heat dissipation element is a composite material containing carbon fiber or foamed graphite. The high heat-conducting composite material is used in a heat dissipation device and comprises a fiber structure and a matrix tissue. The heat sink of the invention has high thermal conductivity and thermal diffusivity, and at the same time, the specific gravity is light, which can further improve the heat dissipation efficiency of the heat sink, and in addition, the thermal expansion coefficient is quite close to that of the semiconductor element, which can reduce the deformation of the semiconductor element caused by thermal stress.
Description
Technical field
The present invention relates to a kind of heat abstractor and employed composite material thereof, particularly a kind of heat abstractor that has with the made heat dissipation element of high-heat-conductive composite material.
Background technology
Electronics, stability and the reliability of electronic product class in order to improve its use must reduce interference source, and in interference miscellaneous, the influence that thermal source disturbs is maximum, so these heat must be got rid of by other approach; As methods such as heat conduction, thermal convection or thermal radiations with heat escape to surrounding environment, just be unlikely making too high and stability and the reliability when influencing product and using of electronic component temperature.Radiator (Heat Sink) promptly is the most normal a kind of heat sink material element that is employed, and can be fixed on electronic component (as CPU, VGA, BGA, MCM, LED...) surface usually, around being used for the heat that electronic component produces conducted to.Known radiator, shown in Fig. 1 a, Fig. 1 b, normally the heat sink 120 that has a plurality of fins (Fins) 100 by a base plate (Base Plate) 104 and is formed, base plate 104 directly contacts with electronic component (not icon), be responsible for heat being conducted fast and diffusing out, to avoid hot concentrations; 100 area of dissipations that are used for increasing fin of fin, so that further transmit the heat that the base plate diffusion is come, and by of the thermal convection of fin 100 surfaces with environment, with heat escape to surrounding environment, the heat sink 120 of Fig. 1 b also comprises heat pipe (heat pipe) 102, and heat is conducted to fin 100 from base plate 104.Therefore more height and thermal diffusivity (Thermal Diffusivity) are faster for the thermal conductivity (Thermal Conductivity) of fin material, and area of dissipation is bigger, and then its radiating efficiency is better.
Early stage CPU is (as Pentum II ﹠amp; When caloric value III) also was not quite high (less than 80W), its heat abstractor mainly was the fin based on aluminium, the pressure cooling fan of arranging in pairs or groups again, promptly so-called air cooling radiator (air-cooled heat sink).Wherein the production method of aluminium radiator fin aluminium extrusion shaping, die casting, bending arranged, cohere, forging, welding, planer, punching press and mechanical Precision Machining etc.But along with operating frequency and the packaging density of CPU constantly promotes, caloric value is soaring (greater than 100W) thereupon, Aluminium Radiator can't satisfy radiating requirements gradually, thereby the birth of radiator at the bottom of copper radiator and the copper arranged, and become the main product in market gradually, mainly be two times that its thermal conductivity is almost aluminium, can promote heat dissipation.But copper radiating rib preponderance, limited (being difficult to directly liquid the shaping and plastic working) of processing technology and shock-sensitive moving are discontented with by the user always.Therefore have following electronic component in mind because of miniaturization and high packaging density, heat generation density still can continue to increase, need seek a kind of heat sink material that can replace fine copper, this kind material preferably can have characteristics such as high heat conductance, high thermal diffusivity, low thermal coefficient of expansion and low-density concurrently simultaneously, could satisfy following market demand.
The Taiwan patent discloses a kind of manufacture method of radiator for No. 573025, copper powders may, carbon dust and high molecular polymer with high thermal conductivity coefficient are mixed into plastic, through heat treatment operation repeatedly, and high molecular polymer is evaporated, this plastic crystallization forms the carbon/carbon-copper composite material of carbon containing, and thermal coefficient of expansion is low.But the carbon dust that the method can be added is no more than 30% usually, can't significantly improve thermal conductivity (less than 300W/ (mK)) and thermal diffusivity.Discontinuous fibre with high thermal conductivity coefficient in No. the 534374th, the Taiwan patent evenly mixes back injection moulding with plastics, apply the metal level of (Coating) high thermal conductivity coefficient again in spreader surface, the method is added many more discontinuous fibres, and it is mobile poor more with filling, and the finished product yield can reduce.And its surface metallization layer generally can be too not thick, and the very fast heat balance that promptly reaches is improved limited to radiating effect.
Use composite material to make the method for fin in the foreign patent, as U.S. Pat 5,981, No. 085 with carborundum (SiC), aluminium oxide (Al
2O
3) be made into the aluminium composite material or the carbon/carbon-copper composite material of low thermal coefficient of expansion and high heat conductance with aluminium nitride (AlN), be used as the equal backing (Heat Spreader) between semiconductor wafer and fin, but the metal-base composites of this ceramic reinforced, its thermal conductivity is about about 180～220W/ (mK), thermal diffusivity and aluminium are approaching, but the problem that has processing to be difficult for and to engage.U.S. Pat 20040175875A1 then earlier is made into preform with diamond, again molten aluminum or copper molten metal are poured in the infiltration mould to make composite material with pressure, with as equal backings, but the material of diamond powder metal-base composites and cost of manufacture costliness, and the same back processed that is difficult for still has its difficulty in practical application.In U.S. Pat 6,469, disclose for the first time among 381 B1 with carbon-to-carbon material and carbon fiber metal base and answer the equal backing of material, but but be not on the base plate (baseplate) that is applied in fin in addition as semiconductor element.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of with the made heat dissipation element of high-heat-conductive composite material, to replace copper heat dissipation element.
The invention provides a kind of heat abstractor that comprises high-heat-conductive composite material, one electronic component is dispelled the heat, this heat abstractor comprises one first heat dissipation element, and it directly is contacted with this electronic component, and wherein the material of first heat dissipation element is the composite material of a kind of carbon fiber-containing or expandable graphite.
In above-mentioned heat abstractor, above-mentioned composite material comprises a fibre structure and a matrix.That fibre structure can be is Powdered, short fiber shape or long fibre shape, and comprises polyacrylonitrile (PAN) carbon fiber, pitch (Pitch) carbon fiber, gas-phase growth of carbon fibre, CNT (carbon nano-tube) or expandable graphite.
In above-mentioned heat abstractor, the scope of the percentage by volume that fibre structure is shared is 10% to 90%.
In above-mentioned heat abstractor, matrix available metal material constitutes.Above-mentioned metal material can comprise aluminium and aluminium alloy, copper and copper alloy, silver, zinc, magnesium and alloy thereof.
In above-mentioned heat abstractor, matrix can constitute with material with carbon element, and the precursor of material with carbon element is pitch (Pitch), polyacrylonitrile (PAN) or phenolic resins (phenolic resin).
Above-mentioned heat abstractor also comprises one second heat dissipation element, thermo-contact is in first heat dissipation element, and having a plurality of radiating fins, second heat dissipation element is made by metal working process such as extrusion molding, die casting, punching press, forging, bending, planer, machining or metal powder injection moldings.
In above-mentioned heat abstractor, first heat dissipation element engages or engages with heat-conducting glue with the mode of second heat dissipation element with soldering.
The present invention also provides a kind of high-heat-conductive composite material, is used for a heat abstractor, and this high-heat-conductive composite material comprises a fibre structure and a matrix.
The main characteristic of the present invention is to adopt the base plate (base plate) of the carbon fibre composite of high-termal conductivity and high heat diffusivity as radiator, it not only has high thermal conductivity and thermal diffusivity, its light specific gravity of while, be a kind of heat abstractor that has lightweight and high-cooling property concurrently, can further improve the heat dissipation of radiator.Its thermal coefficient of expansion is more controlled in addition is made as with semiconductor element quite approachingly, can reduce the distortion that semiconductor element causes because of thermal stress.
Description of drawings
Fig. 1 a, Fig. 1 b are the schematic diagram of known heat abstractor.
Fig. 2 a, Fig. 2 b are the schematic diagram of heat abstractor of the present invention.
Fig. 3 is the photo of the cpu heat of known use copper soleplate.
Fig. 4 is for using the photo of high-heat-conductive composite material of the present invention as the cpu heat of base plate.
Fig. 5 is the photo of the CPU heat radiation module of known use copper soleplate.
Fig. 6 is the photo of the CPU heat radiation module of use carbon fiber aluminum-based compound material base plate of the present invention.
Fig. 7 is the photo that known portable computer uses the radiator of copper soleplate.
Fig. 8 is the photo of the radiator of the portable computer of use carbon fiber aluminum-based compound material base plate of the present invention.
Embodiment
For above and other objects of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Fig. 2 a and Fig. 2 b are the schematic diagram of a preferred embodiment of heat abstractor of the present invention.In Fig. 2 a, heat abstractor comprises one first heat dissipation element (base plate) 202 and one second heat dissipation element (containing radiating fin) 206, wherein first heat dissipation element 202 directly contacts with electronic component 200, second heat dissipation element 206 comprises a plurality of radiating fins 208, and is engaged in first heat dissipation element 202 in the mode that soldering or thermal paste are cohered.In Fig. 2 b, second heat dissipation element 206 also comprises heat pipe 204 except radiating fin 208, and its bottom is engaged in first heat dissipation element 202.
The main feature of the present invention is to make first heat dissipation element 202 with the Metal Substrate of carbon fiber or expandable graphite and carbon back composite wood.This material has high heat conductance, low-density reaches the thermal coefficient of expansion that is complementary with semiconductor element, is different from the bottom of a large amount of in the market aluminium that adopt and radiator at the bottom of the copper.The concrete technological means of this heat abstractor below is described respectively:
(1) carbon fiber knit is become the form of weaving cotton cloth of one dimension (X), two dimension (X-Y) or three-dimensional (X-Y-Z), and make preform with the resin impregnation or with adhesive, through slaking, stabilisation, carbonization and graphitization processing, make it have high thermal conductivity (formation fibre structure) again.Wherein carbon fiber can be Powdered, short fiber shape or long fibre shape.
(2) molten metal, pitch or resin are utilized modes such as hot pressing, liquid phase pressure permeation or vacuum infiltration be fed in the carbon fiber preform or form reguline metal base or C-base composte material (formation matrix) in the expandable graphite.Therefore matrix can be formed or be formed by material with carbon element by metal material.
(3) block carbon fibrous composite or expandable graphite composite material are processed into first heat dissipation element 202 of certain size, as the hot baseboard material that the electronic component 200 with heating contacts, some installs equal backing additional in wafer surface this type of electronic component.
(4) the carbon fibre composite backplate surface that machines is plated one deck nickel, copper or ag material, so that engage with the bottom or the heat pipe 204 of second heat dissipation element 206.
(5) coat scolder at the top surface of first heat dissipation element 202 of the carbon fibre composite of finishing plating, carry out solder joints with second heat dissipation element 206 again, be combined into the heat abstractor that contains the highly-conductive hot carbon fibrous composite.
Table 1 is the material behavior of the multiple material of various carbon fiber used in the present invention, comprise that one dimension arranges that the carbon fiber of (1-D) is aluminium base, the carbon fiber of copper base or C-base composte material, two-dimensional arrangements (2-D) is aluminium base, copper base or C-base composte material, three-dimensional arrangement (3-D) carbon fiber are aluminium base, copper base or C-base composte material and expandable graphite aluminum matrix composite etc., its thermal conductivity is not waited by 260～800W/ (mK), and thermal diffusivity is by 1.24～5.18cm
2/ s does not wait, and exceeds several times than fine copper, the high heat that moment produces in the time of electronic component can being operated fast evenly diffusion come, and conduct on the radiating fin, avoid focus (hot spot) to emerge and overheated, the lifting of radiating efficiency is had absolute help.And aspect thermal coefficient of expansion, generally can be controlled between 2～10ppm/K, close with 4～6ppm/K of semiconductor element.
Table 1
| The composite material type formula | Carbon material percentage by volume (%) | Thermal conductivity (W/ (mK)) (X/Y/Z) | Thermal diffusivity (cm 2/s) (X/Y/Z) | Density (kg/L) | Thermal coefficient of expansion (ppm/K) |
| The multiple material 1D carbon-to-carbon of 1D carbon-to-carbon/aluminium 1D carbon-to-carbon/aluminium 1D carbon-to-carbon/copper | 58％ 67％ 90％ 67％ | 517/70/22 646/80/70 802/50/37 717/100/86 | 4.68/0.67/0.23 3.743/0.45/0.42 5.187/0.261/0.243 3.012/0.142/0.126 | 1.82 2.24 2.15 4.2 | -1.0 7.74 1.52 4.162 |
| 2D carbon-to-carbon/aluminium | 80 | 320/310/150 | 1.63/1.57/0.78 | 2.27 | 4.02 |
| 3D carbon-to-carbon/aluminium | 85 | 330/320/190 | 1.84/1.80/1.16 | 2.28 | 3.4 |
| Expandable graphite/aluminium | 40～60 | 252/245/260 | 0.92/0.853/1.246 | 2.4 | 11～9 |
| Fine copper | 0 | 398 | 1.15 | 8.9 | 16 |
| Fine aluminium | 0 | 220 | 0.96 | 2.68 | 23 |
One of characteristic of heat abstractor of the present invention is the carbon fibre composite that the material of its first heat dissipation element 202 that contacts with semiconductor element uses high heat conduction and high heat diffusivity, the caloric value of semiconductor element promptly can be spread and conducts and come, and be passed to cold junction by heat pipe and radiating fin, relend and help fan forced convection or natural convection air that heat escape is gone out, temperature is unlikely too high when guaranteeing the semiconductor element running.Another characteristic then is its light specific gravity, and is low more than fine copper proportion, meets the light-weighted demand of electronics spare part.On the other hand by the control of carbon material or carbon fiber volume percentage (between 10% to 90%), the thermal coefficient of expansion of adjusting composite material is between 2～10ppm/K, (4～6ppm/K) can be complementary, and reduce the generation of thermal stress deformation to make the thermal coefficient of expansion of itself and semiconductor element.Therefore this heat abstractor can have more advantage than radiator at the bottom of radiator at the bottom of the conventional aluminum or the copper on thermal efficiency and weight.Below be the explanation of several application example:
Application examples one
At present a lot of desktop computer CPU caloric values surpass 100W, and its heat radiation module makes aluminium fin radiator at the bottom of copper radiator or the copper into by the Aluminium Radiator in past.Figure 3 shows that the radiator that uses known copper base plate, the fin of its top is the punching press fin of copper, and the below base plate is a copper material, and total weight is up to 580g, and its thermal resistance is 0.368 ℃/W.Should change with the base plate of highly-conductive hot carbon fiber aluminium based composite material by use-case as radiator, after Nickel Plating Treatment, do soldering with the aluminium fin of punching press, the heat abstractor that assembles as shown in Figure 4, its weight is 192g, 1/3 weight that is about Fig. 3 copper radiator, the result after after tested is as shown in table 2 for its heat dissipation, and thermal resistance value is about 0.333 ℃/W.This shows, be the heat abstractor of base plate with the multiple material of high thermal conductivity aluminum matrix carbon fiber, and its heat dissipation not only is better than heat abstractor at the bottom of the copper, and weight is also much lower more than the copper heat abstractor simultaneously.
Table 2 thermal resistance measurement result
| The base plate material | Thermal source (Q) | Thermal resistance (R) | Weight |
| Copper radiator | 89W | 0.368℃/W | 580g |
| The radiator of the aluminium base multiple material of carbon fiber-containing | 89.3W | 0.333℃/W | 192g |
Application examples two
Following Desktop CPU (desktop processor) caloric value will be up to more than the 120W, therefore has part heat radiation module to begin to adopt the matched combined of copper soleplate+heat pipe+radiating fin to solve the radiating requirements of golf calorific value, as shown in Figure 5.The present invention uses the highly-conductive hot carbon fiber aluminium based composite material to substitute the copper soleplate of heat radiation module, its practice is that carbon fiber aluminum-based compound material is processed into the size the same with the copper ground, plate layer of Ni or Cu at carbon fiber surface again, again with the soldering of heat radiation module, as shown in Figure 6.Measurement result that can table 3 after tested, the thermal resistance of the aluminium base multiple material base plate of carbon fiber is minimum as can be known by the result is 0.235 ℃/w, and the thermal resistance of copper soleplate is 0.269 ℃/w.This shows, use the aluminium base multiple material of carbon fiber to be better than copper soleplate as the heat dissipation of base plate.This mainly is because of the aluminium base multiple material of carbon fiber provides thermal diffusivity and thermal conductivity faster, the thermal source rapid diffusion of CPU can be come, and reaches heat pipe rapidly, relends the radiating fin that helps heat pipe to transfer heat to condensation end, and improves its heat dissipation.
Table 3 thermal resistance measurement result
| The base plate material | Thermal source (Q) | Interface temperature (Tc) | Ambient temperature (Ta) | Thermal resistance (R) |
| Copper | 126W | 70.1℃ | 36.2℃ | 0.269℃/W |
| The aluminium base multiple material of carbon fiber | 126W | 66.2℃ | 36.5℃ | 0.235℃/W |
Application examples three
The heat radiation module of portable computer is made up of fin, heat pipe and fan mostly, and for improving heat dispersion, a copper billet can be welded or be bumped in the place that known fin bottom contacts with CPU usually, as shown in Figure 7.Though this kind way can be dealt with present mobileCPU (mobile processor) radiating requirements (approximately 25W), under the trend to future more lightening design and golf calorific value (greater than 30W), this kind heat radiation module will face harsh challenge.The present invention uses carbon fiber aluminum-based compound material to substitute the copper soleplate of heat radiation module, thermal diffusivity and thermal conductivity faster are provided, the high heat that moment produces in the time of CPU can being operated quickly diffuses to heat pipe, radiating fin and the fan that is passed to condensation end fast by heat pipe dispels the heat away again, thereby avoid the generation of focus, as shown in Figure 8.Measurement result that can table 4 after tested, the heat radiation module thermal resistance that to adopt the aluminium base multiple material of carbon fiber as can be known be base plate is minimum to be 1.40 ℃/W, and the thermal resistance of copper soleplate is 1.59 ℃/W.This shows that carbon fiber aluminium base base plate heat dissipation is better than copper soleplate.
Table 4 thermal resistance measurement result
| The base plate material | Thermal source (Q) | Interface temperature (Tc) | Ambient temperature (Ta) | Thermal resistance (R) |
| Copper | 28.9W | 81.88℃ | 36℃ | 1.59℃/W |
| The aluminium base multiple material of carbon fiber | 29.35W | 78.45℃ | 37.3℃ | 1.40℃/W |
The effect of invention
The main characteristic of the present invention is to adopt the base plate of the carbon fibre composite of high-termal conductivity and high heat diffusivity as radiator, it not only has thermal conductivity and the thermal diffusivity higher than copper, its proportion has only 1/3～1/4 of copper simultaneously, be a kind of heat abstractor that has lightweight and high-cooling property concurrently, can further improve the heat dissipation of radiator, can replace heat abstractor at the bottom of present fine copper system heat abstractor and the copper.Its thermal coefficient of expansion more can be controlled between 2～10ppm/K in addition, and is quite approaching with semiconductor element, can reduce the distortion that semiconductor element causes because of thermal stress.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any personnel that have the knack of this technology; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when being as the criterion with the scope that claims were defined.
Being simply described as follows of symbol in the accompanying drawing:
100～fin
102～heat pipe
104～base plate
120～radiating piece
200～electronic component
202～the first heat dissipation elements (base plate)
204～heat pipe
206～the second heat dissipation elements
208～radiating fin
Claims (21)
1. heat abstractor, one electronic component is dispelled the heat, this heat abstractor comprises one first heat dissipation element, and this first heat dissipation element directly is contacted with this electronic component, and wherein the material of this first heat dissipation element is the high-heat-conductive composite material of a kind of carbon fiber-containing or expandable graphite.
2. heat abstractor according to claim 1, wherein, this high-heat-conductive composite material comprises a fibre structure and a matrix.
3. heat abstractor according to claim 2, wherein, the form of this fibre structure is Powdered, short fiber shape or long fibre shape.
4. heat abstractor according to claim 2, wherein, this fibre structure comprises polyacrylonitrile carbon fiber, asphalt-based carbon fiber, gas-phase growth of carbon fibre, CNT (carbon nano-tube) or expandable graphite.
5. heat abstractor according to claim 2, wherein, the shared percentage by volume of this fibre structure is more than or equal to 10% and is less than or equal to 90%.
6. heat abstractor according to claim 2, wherein, this matrix forms with metal material.
7. heat abstractor according to claim 6, wherein, this metal material comprises aluminium and aluminium alloy.
8. heat abstractor according to claim 6, wherein, this metal material comprises copper and copper alloy.
9. heat abstractor according to claim 6, wherein, this metal material comprises silver, zinc, magnesium and alloy thereof.
10. heat abstractor according to claim 2, wherein, this matrix constitutes with material with carbon element, and the precursor of this material with carbon element is pitch, polyacrylonitrile or phenolic resins.
11. heat abstractor according to claim 1, it also comprises one second heat dissipation element, thermo-contact is in this first heat dissipation element, and having a plurality of radiating fins, this second heat dissipation element is made by metal working process such as extrusion molding, die casting, punching press, forging, bending, planer, machining or metal powder injection moldings.
12. heat abstractor according to claim 11, wherein, this first heat dissipation element engages or engages with heat-conducting glue with the mode of this second heat dissipation element with soldering.
13. a high-heat-conductive composite material is used for a heat abstractor, this high-heat-conductive composite material comprises a fibre structure and a matrix.
14. high-heat-conductive composite material according to claim 13, wherein, the form of this fibre structure is Powdered, short fiber shape or long fibre shape.
15. high-heat-conductive composite material according to claim 13, wherein, this fibre structure comprises polyacrylonitrile carbon fiber, asphalt-based carbon fiber, gas-phase growth of carbon fibre, CNT (carbon nano-tube) or expandable graphite.
16. high-heat-conductive composite material according to claim 13, wherein, the shared percentage by volume of this fibre structure is more than or equal to 10% and is less than or equal to 90%.
17. high-heat-conductive composite material according to claim 13, wherein, this matrix forms with metal material.
18. high-heat-conductive composite material according to claim 17, wherein, this metal material comprises aluminium and aluminium alloy.
19. high-heat-conductive composite material according to claim 17, wherein, this metal material comprises copper and copper alloy.
20. high-heat-conductive composite material according to claim 17, wherein, this metal material comprises silver, zinc, magnesium and alloy thereof.
21. high-heat-conductive composite material according to claim 13, wherein, this matrix forms with material with carbon element, and the precursor of this material with carbon element is pitch, polyacrylonitrile or phenolic resins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510125715 CN1979826A (en) | 2005-12-01 | 2005-12-01 | Heat sink and the high thermal conductivity composite material it uses |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510125715 CN1979826A (en) | 2005-12-01 | 2005-12-01 | Heat sink and the high thermal conductivity composite material it uses |
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| CN1979826A true CN1979826A (en) | 2007-06-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200510125715 Pending CN1979826A (en) | 2005-12-01 | 2005-12-01 | Heat sink and the high thermal conductivity composite material it uses |
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| CN (1) | CN1979826A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012159533A1 (en) * | 2011-05-26 | 2012-11-29 | Huawei Technologies Co., Ltd. | Thermally enhanced stacked package and method |
| CN104932637A (en) * | 2015-05-20 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Heat conduction assembly for CPU (central processing unit) of desk computer |
| CN105283952A (en) * | 2013-06-27 | 2016-01-27 | 迪睿合株式会社 | Thermally conductive sheet, method for producing same, and semiconductor device |
-
2005
- 2005-12-01 CN CN 200510125715 patent/CN1979826A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012159533A1 (en) * | 2011-05-26 | 2012-11-29 | Huawei Technologies Co., Ltd. | Thermally enhanced stacked package and method |
| CN105283952A (en) * | 2013-06-27 | 2016-01-27 | 迪睿合株式会社 | Thermally conductive sheet, method for producing same, and semiconductor device |
| CN104932637A (en) * | 2015-05-20 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Heat conduction assembly for CPU (central processing unit) of desk computer |
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