CN1979820A - Radiating apparatus - Google Patents
Radiating apparatus Download PDFInfo
- Publication number
- CN1979820A CN1979820A CNA2005101020287A CN200510102028A CN1979820A CN 1979820 A CN1979820 A CN 1979820A CN A2005101020287 A CNA2005101020287 A CN A2005101020287A CN 200510102028 A CN200510102028 A CN 200510102028A CN 1979820 A CN1979820 A CN 1979820A
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- conducting plate
- fan
- abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000004411 aluminium Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 abstract description 5
- 230000008030 elimination Effects 0.000 abstract 4
- 238000003379 elimination reaction Methods 0.000 abstract 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The heat sink includes a heat conducting plate contacted to electric component, a radiator setup on the heat conducting plate, a fan on the radiator, a heat elimination component, and a heat pipe. The heat pipe heat-connects the plate, radiator, and heat elimination component. The radiator includes a heat-conducting pole, and fin on the heat-conducting pole. Being located below the fan, the heat-conducting pole is corresponding to the heat conducting plate. Connecting to radiator, and heat elimination component, the heat pipe increases area of dissipation effectively and raises heat dispersion. The heat-conducting pole can carry out heat elimination for places, where airflow generated from fan cannot blow. The heat conducting plate does not block flow of air current so as to raise heat dispersion.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of heat abstractor that is applied to electronic component.
[background technology]
Produce a large amount of heats during electronic component (as central processing unit) operation, and itself and system temperature are raise, cause the decline of its runnability then.For guaranteeing that electronic component can normally move, heat abstractor is installed on electronic component usually, discharge the heat that it produces.
Traditional heat abstractor generally comprises the radiator that contacts with electronic component and is located at the fan at radiator top.Radiator comprises a pedestal and is located at some fin on this pedestal.Fan comprises a wheel hub and some blades of outside radial extension from the wheel hub.The air-flow that fan produces is blown over fin downwards and is carried out heat exchange with fin, and radiator is distributed from the heat that electronic component absorbs.Yet when the air-flow that produces when fan blew to pedestal, air-flow was stopped and produces rebound phenomena and cause the flow resistance of air-flow to increase the heat exchange action that influences between air-flow and the fin.In addition, the air-flow that fan produces a seldom part can blow to the part that radiator is positioned at the fan hub below, promptly fails to make full use of the part that is positioned at the fan hub below on the radiator and dispels the heat.
[summary of the invention]
In view of this, be necessary to provide a kind of improved heat abstractor.
A kind of heat abstractor, comprise the heat-conducting plate that contacts with electronic component, be located at a radiator on this heat-conducting plate, be located at a fan, a heat dissipation element and a heat pipe on the radiator, this heat pipe is heat-conducting plate, radiator and heat dissipation element hot link, and wherein this radiator comprises corresponding with heat-conducting plate and is positioned at a heating column of fan below and is located at some fins on the heating column.
Compared to prior art, described heat abstractor utilizes heat pipe with radiator and heat dissipation element hot link, can effectively increase area of dissipation, promotes heat dispersion; Heating column is located at fan below, can make full use of fan produces on the radiator air-flow blow less than part dispel the heat; Simultaneously, heating column is corresponding with heat-conducting plate, and heat-conducting plate can not hinder flowing of air-flow, so heat abstractor of the present invention has heat dispersion preferably.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
[description of drawings]
Fig. 1 be heat abstractor one embodiment of the present invention three-dimensional assembly diagram.
Fig. 2 is the exploded view of subelement among Fig. 1.
Fig. 3 is the ground plan of the radiator among Fig. 2.
Fig. 4 be another embodiment of heat abstractor of the present invention stereogram.
Fig. 5 is the exploded view of subelement among Fig. 4.
[embodiment]
See also Fig. 1 to 2, disclose the heat abstractor of one embodiment of the invention.This heat abstractor comprises a heat-conducting plate 100, be located at a radiator 200 on the heat-conducting plate 100, be fixed on a fan 300 at radiator 200 tops, a heat dissipation element 400 of being located at radiator 200 1 sides and a heat-conduction component as three heat pipes 500 by a plurality of fan Fixtures 310.This three heat pipe 500 is with heat-conducting plate 100, radiator 200 and heat dissipation element 400 hot links.Fan 300 comprises a wheel hub 320 and the some blades 330 that are provided with from wheel hub 320 outside radial extensions.
Heat-conducting plate 100 and electronic component such as central processing unit etc. contact and absorb the heat of its generation.Heat-conducting plate 100 is by the good material of heat conductivility, makes as metallic copper or aluminium etc., and heat-conducting plate 100 1 sides are provided with three mutual parallel grooves 102.
Please consult Fig. 3 simultaneously, radiator 200 is an aluminium extruded type, and it comprises and is positioned at wheel hub 320 belows and is vertically fixed on a heating column 210 on the heat-conducting plate 100.Heating column 210 is the square type, and its four jiaos stretch out respectively and form an adjutage 212.Heating column 210 comprises top 214 that contacts with fan 300 and the bottom 216 that joins with heat-conducting plate 100, and heating column 210 bottoms 216 areas are not less than the area of heat-conducting plate 100.Heating column 210 bottoms 216 be provided be parallel to each other and with heat-conducting plate 100 on three corresponding respectively grooves 218 of groove 102, these grooves 218 and groove 102 be corresponding be combined into can ccontaining heat pipe 500 three pipelines.Radiator 200 also comprises is located at heating column 210 and adjutage 212 some fins 220 on every side thereof, and these fins 220 are from these heating column 210 outside radial extension settings.Be provided with spacing between the adjacent fin 220, but form the gas channel 222 that air feed stream passes through.The air-flow that fan 300 produces flows downward along gas channel 222, carries out heat exchange with radiator 200, thereby cools off central processing unit and be located at central processing unit other electron component on every side.
Heat pipe 500 roughly is the L type, and each heat pipe 500 comprises an evaporation section 510 that is placed in the pipeline, and bends a condensation segment 520 that extends from evaporation section 510.The condensation segment 520 of heat pipe 500 is arranged in the through hole 430 on the heat dissipation element 400 respectively, and is parallel to heating column 210.
Heat abstractor of the present invention in use, heat-conducting plate 100 contacts with central processing unit and absorbs the heat that central processing unit produces, and the air-flow that fan 300 produces blows to central processing unit along the gas channel on the radiator 200 222 and also the part heat that central processing unit produces directly can be distributed.The heat part that heat-conducting plate 100 absorbs passes to the heating column 210 of radiator 200, by the fin on it 220 heat is distributed again; Another part heat is delivered to heat dissipation element 400 fast by heat pipe 500, and then is evenly distributed on the fin 420 and is dispersed in the surrounding environment.
Because the area of heat-conducting plate 100 is less than the area of heating column 210, the air-flow that fan 300 produces can directly blow the obstruction that can not be subjected to heat-conducting plate 100 to central processing unit, eliminates the obstruction of 100 pairs of air-flows of heat-conducting plate, promotes heat exchanger effectiveness thereby reduce flow resistance; Heating column 210 is located at wheel hub 320 belows of fan 300 and is absorbed heat from heat-conducting plate 100, can make full use of the part that is positioned at wheel hub 320 belows on the radiator 200 and dispel the heat, thereby promote whole heat dispersion.
In addition, the part heat that central processing unit produces is delivered to the heat dissipation element 400 that is positioned at radiator 200 1 sides by heat pipe 500 and distributes, and can make radiator 200 and heat dissipation element 400 common for central processing unit dispels the heat like this, can effectively increase area of dissipation; Especially be subjected to spatial limitation radiator 200 can not be too high the time, dispel the heat in the setting space that can make full use of around the radiator 200 like this.
Seeing also Fig. 4 to 5, is the stereogram of another embodiment of heat abstractor of the present invention.The main difference part of this embodiment and a last embodiment comprises: heat dissipation element 400 ' is arranged in order by some fin that are parallel to each other 440 to be formed, these heat dissipation element 400 ' relative both sides are respectively equipped with a raceway groove, the raceway groove buckle on a pair of fan Fixture 450 and the heat dissipation element 400 ' and another fan 600 is fixed on this heat dissipation element 400 '.Identical among other elements and the last embodiment.
In the above-described embodiments, between the element that need be connected and fixed, between heat-conducting plate 100, radiator 200 and heat pipe 500, can be connected by methods such as welding between heat pipe 500 and the heat dissipation element 400,400 '.
Claims (10)
1. heat abstractor, comprise the heat-conducting plate that contacts with electronic component, be located at a radiator on this heat-conducting plate, be located at a fan, a heat dissipation element and a heat pipe on the radiator, this heat pipe is characterized in that heat-conducting plate, radiator and heat dissipation element hot link: this radiator comprises corresponding with heat-conducting plate and is positioned at a heating column of fan below and is located at some fins on the heating column.
2. heat abstractor as claimed in claim 1 is characterized in that: this heat dissipation element comprises a heat-conducting block parallel with heating column and is located at some fin on the heat-conducting block.
3. heat abstractor as claimed in claim 2 is characterized in that: these fin be located at the relative both sides of heat-conducting block and with the heat-conducting plate almost parallel.
4. heat abstractor as claimed in claim 2 is characterized in that: heat-conducting block is provided with through hole in order to ccontaining heat pipe.
5. heat abstractor as claimed in claim 4 is characterized in that: this heat abstractor also comprises another heat pipe, and this another heat pipe is with heat-conducting plate, radiator and heat dissipation element hot link, and fin is provided with through hole in order to ccontaining this another heat pipe.
6. heat abstractor as claimed in claim 2 is characterized in that: radiator and heat dissipation element are aluminium extruded type.
7. heat abstractor as claimed in claim 1 is characterized in that: these fins are from the outside radial extension setting of heating column.
8. heat abstractor as claimed in claim 1 is characterized in that: heat dissipation element is superposeed successively by some fin and forms.
9. heat abstractor as claimed in claim 8 is characterized in that: this heat abstractor also comprises another fan, and this another fan is located on the heat dissipation element.
10. heat abstractor as claimed in claim 1 is characterized in that: this heat-conducting plate one side is provided with groove, and heating column and the heat-conducting plate side of joining is provided with groove, this groove is corresponding with groove be combined into can ccontaining heat pipe pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101020287A CN100555610C (en) | 2005-12-02 | 2005-12-02 | heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101020287A CN100555610C (en) | 2005-12-02 | 2005-12-02 | heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1979820A true CN1979820A (en) | 2007-06-13 |
| CN100555610C CN100555610C (en) | 2009-10-28 |
Family
ID=38130920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101020287A Expired - Fee Related CN100555610C (en) | 2005-12-02 | 2005-12-02 | heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100555610C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110785701A (en) * | 2018-05-31 | 2020-02-11 | 深圳市大疆创新科技有限公司 | Heat dissipation system and photographic equipment |
| CN114284221A (en) * | 2022-01-28 | 2022-04-05 | 奇鋐科技股份有限公司 | Heat dissipation module structure |
-
2005
- 2005-12-02 CN CNB2005101020287A patent/CN100555610C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110785701A (en) * | 2018-05-31 | 2020-02-11 | 深圳市大疆创新科技有限公司 | Heat dissipation system and photographic equipment |
| CN114284221A (en) * | 2022-01-28 | 2022-04-05 | 奇鋐科技股份有限公司 | Heat dissipation module structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100555610C (en) | 2009-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091028 Termination date: 20141202 |
|
| EXPY | Termination of patent right or utility model |