CN1976785B

CN1976785B - Boring method of printed wiring board

Info

Publication number: CN1976785B
Application number: CN2005800068361A
Authority: CN
Inventors: 河东和彦
Original assignee: Beac Co Ltd
Current assignee: Beac Co Ltd
Priority date: 2005-06-27
Filing date: 2005-06-27
Publication date: 2010-06-09
Anticipated expiration: 2025-06-27
Also published as: CN1976785A; JP4646982B2; TWI331886B; JPWO2007000804A1; WO2007000804A1; TW200701844A

Abstract

The boring method of a printed wiring board comprising a first step for forming a through hole in a board for BOC by lowering a punc while holding the board for BOC between a stripper plate and a dieplate, a second step for feeding compressed air to the through hole from the punching die side through a punch hole after the punc is elevated while holding the board for BOC between the stripper plate and the die plate, and a third step for lowering the punch again while holding the board for BOC between the stripper plate and the die plate. In this boring method, boring chips generated on the inner surface of the through hole can be removed completely, adhesion of boring chips to the upper surface of the board for BOC can be suppressed, and the mechanism and method for forming the throughhole can be simplified easily.

Description

The method for punching of printed wiring circuit board

Technical field

The present invention relates to method for punching, printed wiring circuit board and the BOC circuit board of printed wiring circuit board.

Background technology

In recent years, in memory area, the CSP (wafer-level package) that can tackle miniaturization, high capacity, the requirement of transmission data high-speed is noticeable, and (Board on Chip: plate level chip) semiconductor device of structure is noticeable especially wherein to have the BOC that can use the wire-bonded technology when assembling.As the printed wiring circuit board that in such semiconductor device, uses (below; also can abbreviate " circuit board " as) representational wired circuit board; exist and to have and to make BT (Bismaleimide Triazine: the base material layer on the glass cloth matrix material that infiltrates such as resin or epoxy resin, imide resin Bismaleimide Triazine), the circuit board of the structure that clips with protective layer from the two sides.

As having the boring method of opening difform hole etc. on the circuit board of this spline structure, the perforate processing method of utilizing the perforate processing method of drill bit and utilizing punching press etc. to carry out perforate is used.Utilize the processing method of drill bit perforate, the inside surface roughness in the hole that processing obtains and the shape excellence in hole, but on the other hand owing to be to be rotated processing, exist production efficiency low, the shortcoming that processing cost is high with drill bit.

On the other hand, perforate processing methods such as punching press can be carried out perforate with the short time owing to be to utilize drift (punch) and punch die (die) to carry out punching processing to form through hole on circuit board, and therefore the also low advantage of production efficiency height and processing cost is arranged.And, can open complicated advantages (for example, with reference to patent documentation 1 and 2) such as perforate processing such as difform hole in addition simply.

Patent documentation 1: Japan opens flat 1-128915 communique in fact

Patent documentation 2: Japanese kokai publication sho 62-241700 communique

Summary of the invention

Patent documentation 1 described method for punching, be to use the 1st cutting edge of the internal diameter same diameter that possesses the through hole that has and on circuit board, form, and be positioned at than the more forward end of the 1st cutting edge and have than the internal diameter of through hole slightly the drift of the 2nd cutting edge of minor diameter carry out the perforate method for processing.Thus, can utilize the 1st cutting edge stamping-out to cut in the perforation bits that produce at the through hole inner face by the 2nd cutting edge stamping-out, can remove the perforation bits that produce on the through hole inner face.But, because the 1st cutting edge produces new perforation bits when cutting out the hole on the through hole inner face, so there is the problem that can't remove the perforation bits that produce on the through hole inner face fully.

On the other hand, patent documentation 2 described method for punching are not the disposable circuit boards of stamping-out quickly, but each time all with the small distance slowly stamping-out circuit board that repeatedly punches repeatedly, the final method that on circuit board, forms through hole.The surface roughness of the inner face of through hole is diminished.But fine perforation bits that produced in the process of punching repeatedly repeatedly can not be discharged to Anywhere during before stamping-out is through hole, therefore exist the perforation bits of having nowhere to go to be attached to the problem of circuit board upper surface.

Again, owing to the slowly stamping-out circuit board that repeatedly punches repeatedly with small distance, so be necessary suitably to set number of times and the punching amount of change, therefore exist to be not easy to make to form the mechanism that through hole uses and the problem of methods simplification with the drift stamping-out according to the material of circuit board and thickness.

Therefore, the present invention makes for addressing the above problem, its purpose is to provide a kind of can remove the perforation bits that the through hole inner face produces more up hill and dale, can be attached on the circuit board by the rejection iris bits simultaneously, and then make the method for punching of the printed wiring circuit board that forms mechanism that through hole uses and methods simplification easily.The present invention also aims to provide the method for punching of the good like this printed wiring circuit board of use to carry out printed wiring circuit board and BOC circuit board that perforation is processed again.

(1) method for punching of printed wiring circuit board of the present invention, be to use and possess drift with metal die and have the punching machine of the punch die of decking with metal die with drift and stripper plate, on the printed wiring circuit board, implement the method for punching of the printed wiring circuit board of perforation processing usefulness, this method for punching contains following steps successively: descend by make above-mentioned drift under the state that clips above-mentioned printed wiring circuit board between above-mentioned stripper plate and the above-mentioned decking, on above-mentioned printed wiring circuit board, form the 1st step of through hole, after making above-mentioned drift rising under the constant situation of the state that keeps clipping between above-mentioned stripper plate and the above-mentioned decking above-mentioned printed wiring circuit board, punching hole by above-mentioned stripper plate is sent into above-mentioned through hole from above-mentioned drift with the metal die side with compressed air, remove the 2nd step of the perforation bits that exist on the above-mentioned through hole inboard with this punch die hole by above-mentioned decking, and under the constant situation of the state that keeps clipping between above-mentioned stripper plate and the above-mentioned decking above-mentioned printed wiring circuit board, above-mentioned drift is descended once more, consider the perforation that above-mentioned through hole inboard exists to be worth doing remove the 3rd step with this by above-mentioned punch die hole, it is characterized in that, form structure as described below, that is: on the inner face of described punching hole, formation by the interior shape corresponding to the outer shape of above-mentioned drift constitute the 1st in perimembranous, and the upper end of being located at perimembranous in the 1st, the 2nd interior perimembranous with shape of cross section also bigger than the shape of cross section of the above-mentioned the 1st interior perimembranous, the leading section of above-mentioned drift from above-mentioned punching hole the above-mentioned the 1st in perimembranous when rising in the above-mentioned the 2nd perimembranous, compressed air is admitted to above-mentioned through hole by above-mentioned punching hole.

Therefore, if adopt the method for punching of printed wiring circuit board of the present invention, drift is descended, on circuit board, form through hole, after drift is risen compressed air is sent into through hole, remove the perforation bits that the through hole inboard exists with this by the punch die hole,, the inboard perforation bits that exist of through hole are removed by the punch die hole by in the 3rd step, drift being descended once more; Therefore, even when the 2nd step finishes also under the situation of the remaining perforation of through hole inner face bits, also can remove perforation bits remaining on the through hole inner face up hill and dale by in the 3rd step, drift being descended once more.Consequently, can remove the perforation bits that produce on the through hole inner face more up hill and dale.

Again, if adopt the method for punching of printed wiring circuit board of the present invention, then be to clip between stripper plate and the decking under the state of foregoing circuit plate always, carry out from a succession of action of above-mentioned the 1st step to the 3 steps, therefore the upper surface of circuit board is covered by stripper plate always, thus can the rejection iris bits attached to the upper surface of circuit board.

Again, the unnecessary situation of the method for punching of printed wiring circuit board of the present invention as patent documentation 2 described method for punching, material and thickness according to circuit board are suitably set number of times and the punching amount of change with the drift stamping-out, owing to be to form straight through hole, therefore oversimplify forming mechanism and the method that through hole is used easily by amounting to 2 simple stamping-out actions in the 1st step and the 3rd step.

Therefore, the method for punching of printed wiring circuit board of the present invention, be to remove the perforation bits that produce on the through hole inner face more up hill and dale, simultaneously can be attached to the upper surface of circuit board by the rejection iris bits, and then make easily and form the become method for punching of simple printed wiring circuit board of mechanism that through hole uses and method.

Here, what is called among the present invention " perforation bits " is meant the bits that produce when forming through hole on the printed wiring circuit board, the matrix material bits that produce when not merely meaning stamping-out printed wiring circuit board, the metal material (for example gold etc.) that also comprises the wiring part that through hole nearby forms adds in perforate falls into through hole inside man-hour, the fine metal bits that the metal material of falling into like this produces as main cause.Be formed at and adhere to such metal fillings on the wiring part on the circuit board, can exist to cause risk of short-circuits, still,, just can suppress such metal fillings adhering at the circuit board upper surface if adopt the method for punching of printed wiring circuit board of the present invention.

In addition, by using such method, it is such that drift plays a part so-called air valve, when the leading section of drift is positioned at from punch die (die) hole the position to the 1st perimembranous of punching hole, compressed air is not admitted to through hole, when leading section perimembranous in the 1st of drift rises in the 2nd perimembranous compressed air is sent into through hole.Therefore, needn't move up and down according to the high speed of drift and at high speed compressed air be carried out the control of ON/OFF break-make, so control becomes easily, the high speed of reply perforation simultaneously also becomes easy.

In this case, interior shape as the above-mentioned the 2nd interior perimembranous, can be the vertical interior shape that face constituted of opposite face with the circuit board of stripper plate, also can be the interior shape that the taper surface with the opposite face established practice constant inclination rake angle of the circuit board of stripper plate constitutes.

(2) in the method for punching of above-mentioned (1) described printed wiring circuit board, preferably on described stripper plate, form and send into the path that compressed air is used to above-mentioned through hole, and the air chamber that is communicated with above-mentioned path, is provided with around the upper end of the above-mentioned the 2nd interior perimembranous of above-mentioned punching hole.

By using such method, compressed air is sent on the whole inner face of through hole, therefore can thoroughly remove perforation bits remaining on the inner face of through hole.

Owing to the compressed air of sending into from path temporarily can be stranded in the air chamber, therefore can make the compressed-air actuated pressure and the flow that are admitted to through hole roughly keep certain again.Therefore, in above-mentioned the 2nd step or the 4th step, can transmit the fixing compressed air of homogenising, so can further remove perforation bits remaining on the inner face of through hole up hill and dale to through hole.

(3) in the method for punching of above-mentioned (1) described printed wiring circuit board, preferably around the above-mentioned punch die hole of described decking, form protuberance.

By using such method, the circuit board section that contacts with the peripheral part in punch die hole, compare with other circuit board section and to be clipped with big strength, thus the limit of collapsing on the peripheral part of through hole can be suppressed, thus can the good printed wiring circuit board of quality bills of materials.

For example; form under the situation of through hole at BOC with circuit board; BOC with the punch die of circuit board with the surface of metal die side on protected seam when covering because protective layer is soft, the situations such as limit of therefore on the peripheral part of through hole, can collapsing owing to implement perforation.But, if adopt method as described above,, clipped with big strength because the circuit board section that contacts with the peripheral part in punch die hole is compared with other circuit board section, so can suppress the peripheral part of the through hole limit of collapsing, can the good BOC circuit board of quality bills of materials.

(4) in the method for punching of above-mentioned (1) described printed wiring circuit board, preferably around the above-mentioned punch die hole of described decking, form ditch.

By using such method, identical with the effect of above-mentioned (3), the circuit board section that contacts with the peripheral part in punch die hole, compare with other circuit board section and to be clipped with big strength, so can suppress the peripheral part of the through hole limit of collapsing, can the good printed wiring circuit board of quality bills of materials.

(5) in the method for punching of above-mentioned (1) described printed wiring circuit board, preferably around the above-mentioned punching hole of described stripper plate, form protuberance.

By using such method, can be along through hole (inner face of the through hole) upper surface of covering board securely, so further the rejection iris bits attached to the upper surface of circuit board.

For example, form under the situation of through hole on circuit board, adhere to the perforation bits on the through hole wiring part nearby, can have the danger that is short-circuited if be formed at BOC.But, by using method as described above, can be along through hole (inner face of the through hole) upper surface of covering board securely, so further the rejection iris bits attached to being formed on the through hole wiring part nearby.

(6) in the method for punching of above-mentioned (1) described printed wiring circuit board, preferred coated with resins on the face relative of the face relative of described stripper plate and/or described decking with the printed wiring circuit board with the printed wiring circuit board.

By using such method, drift with metal die and punch die with metal die between configuration printed wiring circuit board or when clipping the printed wiring circuit board with stripper plate and decking, can be suppressed at the printed wiring circuit board surface cause do not wish the damage that produces.

BOC circuit board for example has form protective mulch in the wiring part on a face, is coated with the structure of protective layer on another side.When such BOC is formed through hole on circuit board; by using aforesaid method; can be suppressed at cause on the wiring part that forms on the surface of BOC with circuit board and the protective layer do not wish the damage that produces can form good BOC circuit board.

In this case, can use polyurethane (polyurethane resin) resin as the resin that applies usefulness.

Again, the thickness of the resin of coating is good with 5 μ m～40 μ m, and that better is 10 μ m～30 μ m.

(7) in the method for punching of above-mentioned (1) described printed wiring circuit board, described punching machine, it is the circuit board supplying device that the printed wiring circuit board can be provided between with metal die with metal die and above-mentioned punch die to above-mentioned drift, and then possess have can be respectively in the face of approximate horizontal along the y direction of principal axis of circuit board direction of transfer and along the x direction of principal axis vertical with foregoing circuit plate direction of transfer move and, the circuit board supplying device of the travelling carriage that can rotate around the z axle vertical with the face of above-mentioned approximate horizontal, and imaging apparatus; And contain following operation successively, that is: utilize above-mentioned imaging apparatus to take the assigned position of printed wiring circuit board, according to this shooting results, after calculating the axial side-play amount of z of printed wiring circuit board, around the z axle, rotate the above-mentioned travelling carriage of adjustment according to the axial side-play amount of above-mentioned z, with metal die the printed wiring circuit board is adjusted to the angle adjustment operation of correct angle with respect to above-mentioned drift, and utilize above-mentioned imaging apparatus to take the assigned position of printed wiring circuit board, according to this shooting results, on x direction of principal axis and/or y direction of principal axis, move and adjust above-mentioned travelling carriage, the printed wiring circuit board arrangement under the state of correct perforation enforcing location, is implemented the perforation process of perforation on the printed wiring circuit board.

By using such method, can utilize imaging apparatus to take the assigned position of printed wiring circuit board, according to this shooting results, calculate the axial side-play amount of z of printed wiring circuit board, around the z axle, rotate the adjustment travelling carriage according to the axial side-play amount of z, after with metal die the printed wiring circuit board being adjusted to correct angle with respect to drift, the printed wiring circuit board is bored a hole, even so the printed wiring circuit board not under the situation with correct angle configurations, also can be implemented perforation with metal die with respect to drift accurately.

Owing to when each time the printed wiring circuit board being bored a hole, can both on x direction of principal axis and/or y direction of principal axis, move adjustment, therefore can bore a hole accurately to travelling carriage again.

In this case, the angle adjustment operation gets final product implementing 1 time at least when drift provides the printed wiring circuit board with metal die and punch die between with metal die.On the other hand, to the mobile adjustment that travelling carriage carries out on x direction of principal axis and/or y direction of principal axis, carry out once at least at each perforation process.

(8) in the method for punching of the printed wiring circuit board described in above-mentioned (7), preferred described circuit board supplying device and then also have 2 anchor clamps that clamping printed wiring circuit board is used; Described punching machine and then also possess, be set between above-mentioned 2 anchor clamps of above-mentioned travelling carriage top and can move along the x direction of principal axis with above-mentioned travelling carriage, with the printed wiring circuit board from the circuit board guiding plate of circuit board position of readiness to perforation enforcing location guiding usefulness; Described 2 anchor clamps, formation can be with the structure of the printed wiring circuit board of the axial sandwich mounting of the x of above-mentioned circuit board guiding plate on foregoing circuit plate guided plate.

By using such method, the circuit board guiding plate that guiding printed wiring circuit board is used is set between 2 anchor clamps of travelling carriage top, and can move along the x direction of principal axis with travelling carriage, so the printed wiring circuit board can be directed along the x direction of principal axis and at circuit board guiding plate upper edge y direction of principal axis smoothly with the circuit board guiding plate.

In this case, the height of the upper surface of preferred circuit plate guided plate is set in than the position of punch die with the height high slightly (for example about 0.050mm～2.0mm) of the upper surface of metal die.

In the method for punching of above-mentioned (8) described printed wiring circuit board, the both sides ora terminalis of the circuit board position of readiness side end that constitutes difference clamping printed wiring circuit board of preferred described 2 anchor clamps.

By making in this way, can bore a hole to the enlarged regions of perforation enforcing location side end to circuit board position of readiness side end from the printed wiring circuit board.

Again, in this case, if the printed wiring circuit board after the process finishing of will boring a hole takes off from 2 anchor clamps, make it in the horizontal direction under the state of Rotate 180 degree, with 2 anchor clamps clampings, implement perforation once more, just can be at the enterprising eleven punch 11 of the Zone Full of printed wiring circuit board.

(9) in the method for punching of above-mentioned (8) described printed wiring circuit board, described punching machine preferably also possess be arranged on above-mentioned punch die with around the metal die, make the guiding of printed wiring circuit board more smoothly carry out other circuit board guiding plates that are fixed of usefulness.

At the printed wiring circuit board is under the situation of rigidity, and above-mentioned other circuit board guiding plates might not need.But, at the printed wiring circuit board is under the flexual situation, from the circuit board guiding plate when region in front transmits the printed wiring circuit board, the x direction of principal axis both ends of printed wiring circuit board and y direction of principal axis one side end are owing to gravity and sagging meeting causes printed wiring circuit board generation warpage and bending.Even under these circumstances, as the method for punching of above-mentioned (9) described printed wiring circuit board, by other circuit board guiding plates that are fixed with setting around the metal die at punch die, the warpage and the crooked generation of printed wiring circuit board can be suppressed effectively, the printed wiring circuit board can be transmitted smoothly.

In this case, preferably the height setting of the upper surface of other circuit board guiding plates in than the position of punch die with the height high slightly (for example about 0.050mm～2.0mm) of the upper surface of metal die.

(10) in the method for punching of each described printed wiring circuit board of above-mentioned (7)～(9), described perforation process preferably contains following operation successively, that is: mobile printing wired circuit board, make after the assigned position of printed wiring circuit board is in the coverage of above-mentioned imaging apparatus, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the 1st operation of the x direction of principal axis and the y direction of principal axis amount of movement of printed wiring circuit board according to this shooting results, and above-mentioned travelling carriage is moved adjustment on x direction of principal axis and/or y direction of principal axis according to above-mentioned x direction of principal axis and the axial amount of movement of y, after utilizing above-mentioned stripper plate to be crimped onto the printed wiring circuit board on the above-mentioned decking, on the perforation predetermined position of printed wiring circuit board, implement perforation, form the 2nd operation of through hole.

By making in this way, can according to the amount of movement of necessity move on x direction of principal axis and/or the y direction of principal axis adjust travelling carriage after, the printed wiring circuit board is bored a hole, so can implement high-precision perforation.

(11) in the method for punching of the printed wiring circuit board described in above-mentioned (10), in described the 1st operation, preferably calculate the calculating that the x direction of principal axis of printed wiring circuit board and the axial amount of movement of y and the axial side-play amount of z substitute the x direction of principal axis and the axial amount of movement of y of printed wiring circuit board; In described the 2nd operation, preferably according to above-mentioned x direction of principal axis and axial amount of movement of y and the axial side-play amount of z, above-mentioned travelling carriage is moved adjustment on x direction of principal axis, y direction of principal axis, and/or rotate adjustment around the z axle, replace according to above-mentioned x direction of principal axis and the axial amount of movement of y the mobile adjustment of above-mentioned travelling carriage on x direction of principal axis and/or y direction of principal axis.

By making in this way, can implement the more high-precision perforation of situation than the method for punching of above-mentioned (10) described printed wiring circuit board.

(12) in the method for punching of above-mentioned (10) described printed wiring circuit board, preferably after described the 2nd operation, also contain the printed wiring circuit board is moved predetermined distance, after the through hole that above-mentioned the 2nd operation is formed is disposed in the coverage of above-mentioned imaging apparatus, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, confirm whether above-mentioned through hole is formed at the 3rd operation of tram.

By making in this way, can confirm before the action of next time boring a hole whether the through hole that the 2nd operation forms is formed at correct position.That is to say,, can temporarily stop the printed wiring circuit board is bored a hole and taked measures necessary if the through hole that the 2nd operation forms is not formed on the correct position.

(13) in the method for punching of each described printed wiring circuit board of above-mentioned (7)～(9), described perforation process preferably contains following operation successively, that is: the printed wiring circuit board is provided to the perforation enforcing location, after utilizing above-mentioned stripper plate to be crimped onto the printed wiring circuit board on the above-mentioned decking, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis of printed wiring circuit board and the 1a operation of the axial side-play amount of y according to this shooting results, and when above-mentioned x direction of principal axis and the axial side-play amount of y are in permissible range, keeping the printed wiring circuit board to be crimped under the constant situation of state on the above-mentioned decking, on the printed wiring circuit board, implement perforation, when above-mentioned x direction of principal axis and the axial side-play amount of y are not in permissible range, remove the crimped status of above-mentioned stripper plate to the printed wiring circuit board, move the above-mentioned travelling carriage of adjustment according to above-mentioned x direction of principal axis and the axial side-play amount of y at x direction of principal axis and/or y direction of principal axis, utilizing after above-mentioned stripper plate is crimped onto the printed wiring circuit board on the above-mentioned decking, on the printed wiring circuit board, implement perforation, form the 2a operation of through hole.

By using such method, can according to the side-play amount of reality x direction of principal axis and/or y direction of principal axis move adjust travelling carriage after, the printed wiring circuit board is implemented perforation, therefore can implement high-precision perforation.In this case, be under state, to calculate side-play amount accurately, so can implement more high-precision perforation with stripper plate crimping printed wiring circuit board again.

(14) in the method for punching of each described printed wiring circuit board of above-mentioned (7)～(9), described perforation process preferably contains following operation successively, that is: the printed wiring circuit board is provided to the perforation enforcing location, after utilizing above-mentioned stripper plate that the printed wiring circuit board is crimped on above-mentioned decking, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis of printed wiring circuit board and the 1a operation of the axial side-play amount of y according to this shooting results, and, when above-mentioned x direction of principal axis and the axial side-play amount of y are in permissible range, keeping the printed wiring circuit board to be crimped under the constant situation of state on the above-mentioned decking, on the printed wiring circuit board, implement perforation, when above-mentioned x direction of principal axis and the axial side-play amount of y are not in permissible range, remove the crimped status of above-mentioned stripper plate to the printed wiring circuit board, move the above-mentioned travelling carriage of adjustment according to above-mentioned x direction of principal axis and the axial side-play amount of y at x direction of principal axis and/or y direction of principal axis, after utilizing above-mentioned stripper plate that the printed wiring circuit board is crimped on above-mentioned decking, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis and the axial side-play amount of y of printed wiring circuit board according to this shooting results, before above-mentioned x direction of principal axis and the axial side-play amount of y reach in the permissible range, remove crimping repeatedly and move the operation of adjusting the calculating of crimping shooting side-play amount, if above-mentioned thereafter x direction of principal axis and the axial side-play amount of y reach in the permissible range, just keeping the printed wiring circuit board to be crimped under the constant situation of state on the above-mentioned decking, on the printed wiring circuit board, implement perforation, form the 2b operation of through hole.

By using such method, can carry out the fine motion of travelling carriage repeatedly and adjust operation till side-play amount is in permissible range, so compare, can implement more high-precision perforation with the method for punching of above-mentioned (13) described printed wiring circuit board.

(15) in the method for punching of each described printed wiring circuit board of above-mentioned (7)～(9), described perforation process preferably contains following operation successively, that is: the printed wiring circuit board is provided to the perforation enforcing location, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis of printed wiring circuit board and the 1b operation of the axial side-play amount of y according to this shooting results, and when above-mentioned x direction of principal axis and the axial side-play amount of y are in permissible range, after utilizing above-mentioned stripper plate to be crimped on the printed wiring circuit board on the above-mentioned decking, on the printed wiring circuit board, implement perforation, when above-mentioned x direction of principal axis and the axial side-play amount of y are not in permissible range, on x direction of principal axis and/or y direction of principal axis, move the above-mentioned travelling carriage of adjustment according to above-mentioned x direction of principal axis and the axial side-play amount of y, after utilizing above-mentioned stripper plate that the printed wiring circuit board is crimped on above-mentioned decking, on the printed wiring circuit board, implement perforation, form the 2c operation of through hole.

By using such method, can according to real offset x direction of principal axis and/or y direction of principal axis move adjust travelling carriage after, on the printed wiring circuit board, implement perforation, therefore the situation with the method for punching of above-mentioned (13) described printed wiring circuit board is identical, can implement high-precision perforation.

(16) in the method for punching of each described printed wiring circuit board of above-mentioned (7)～(9), described perforation process preferably contains following operation successively, that is: the printed wiring circuit board is provided to the perforation enforcing location, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis of printed wiring circuit board and the 1b operation of the axial side-play amount of y according to this shooting results, and when above-mentioned x direction of principal axis and the axial side-play amount of y are in permissible range, after utilizing above-mentioned stripper plate to be crimped on the printed wiring circuit board on the above-mentioned decking, on the printed wiring circuit board, implement perforation, when above-mentioned x direction of principal axis and the axial side-play amount of y are not in permissible range, on x direction of principal axis and/or y direction of principal axis, move the above-mentioned travelling carriage of adjustment according to above-mentioned x direction of principal axis and the axial side-play amount of y, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis and the axial side-play amount of y of printed wiring circuit board according to this shooting results, before above-mentioned x direction of principal axis and the axial side-play amount of y reach in the permissible range, move repeatedly to adjust and take the operation that side-play amount is calculated, if above-mentioned thereafter x direction of principal axis and the axial side-play amount of y reach in the permissible range, just utilizing after above-mentioned stripper plate is crimped on above-mentioned decking with the printed wiring circuit board, on the printed wiring circuit board, implement perforation, form the 2d operation of through hole.

By using such method, can carry out the fine motion of travelling carriage repeatedly and adjust operation till side-play amount is in permissible range, so compare, can implement more high-precision perforation with the situation of the method for punching of above-mentioned (15) described printed wiring circuit board.

(17) in the method for punching of above-mentioned (13) described printed wiring circuit board, preferably in described 1a operation, calculate the x direction of principal axis of printed wiring circuit board and the axial side-play amount of y and the axial side-play amount of z and substitute the x direction of principal axis of printed wiring circuit board and the calculating of the axial side-play amount of y; Preferably in described 2a operation, according to above-mentioned x direction of principal axis and axial side-play amount of y and the axial side-play amount of z, above-mentioned travelling carriage is moved adjustment on x direction of principal axis, y direction of principal axis, and/or rotate adjustment around the z axle, substitute according to above-mentioned x direction of principal axis and the axial side-play amount of y the mobile adjustment of above-mentioned travelling carriage on x direction of principal axis and/or y direction of principal axis.

By using such method, can implement the more high-precision perforation of situation than the method for punching of the printed wiring circuit board described in above-mentioned (13).

(18) in the method for punching of each described printed wiring circuit board of above-mentioned (1), (3)～(7), preferably after above-mentioned the 3rd step, be included in make above-mentioned drift rising under the constant situation of the state that keeps clipping between above-mentioned stripper plate and the above-mentioned decking above-mentioned printed wiring circuit board after, once more compressed air is sent into above-mentioned through hole from above-mentioned drift with the metal die side by above-mentioned punching hole, consider the perforation that above-mentioned through hole inboard exists to be worth doing remove the 4th step by above-mentioned punch die hole with this.

By using such method, even on the inner face of through hole, produce new perforation bits owing to carry out the 3rd step, also can after drift is risen, compressed air be sent into through hole once more, remove such perforation bits by the punch die hole, therefore can remove perforation bits remaining on the inner face of through hole up hill and dale.

Again, the action of the 4th step is also identical with situation from the action of the 1st step to the 3 steps, is to carry out under the state that clips circuit board between stripper plate and the decking, and the situation that therefore can the rejection iris bits be attached to the upper surface of circuit board takes place.

In the method for punching of the printed wiring circuit board described in above-mentioned (1), (3)～(7) or (18), the external diameter of the internal diameter of preferred above-mentioned punching hole and above-mentioned drift (punch) is roughly the same.

Do not covered and the area of exposed portions serve by stripper plate by using such method, can reducing on the upper surface of circuit board, therefore further the rejection iris bits are attached to the circuit board upper surface.

Here, the minimal gap of only setting necessity between the outer surface of so-called " internal diameter in punching press (punch) hole and the external diameter of drift are roughly the same " interior perimeter surface of being meant punching hole and drift.

(19) in the method for punching of each described printed wiring circuit board of above-mentioned (1), (3)～(7), the bottom dead centre of the bottom dead centre of the above-mentioned drift of preferred above-mentioned the 1st step and the above-mentioned drift of above-mentioned the 3rd step is roughly the same.

In patent documentation 2 described method for punching, make drift at every turn all with slight distance stamping-out circuit board at leisure repeatedly repeatedly, so be necessary bottom dead centre (and top dead-centre), mechanism and the further complicated problem of method that through hole is used consequently take place to form at the drift of stroke (stroke) change each time.But, by utilizing method as described above, just there is no need to change the bottom dead centre of the drift of the 1st step and the 3rd step, so that form mechanism that through hole uses and the simplification of method becomes easier.

(20) in the method for punching of each described printed wiring circuit board of above-mentioned (1), (3)～(7), in above-mentioned the 1st step, preferably make the wiring part formation face of above-mentioned printed wiring circuit board be positioned at above-mentioned stripper plate side, above-mentioned drift is descended, on above-mentioned printed wiring circuit board, form through hole with this.

By adopting such method, the pattern that can form face according to the wiring part of printed wiring circuit board forms through hole accurately.

(21) in the method for punching of each described printed wiring circuit board of above-mentioned (1), (3)～(7), preferably set a plurality of drifts on metal die, set a plurality of punch dies hole corresponding on metal die with above-mentioned a plurality of drifts at described punch die at described drift.

By using such method, can form the more thorough high-quality through hole of removing of perforation bits quilt that produces on a plurality of through hole inner faces with 1 perforation action, so can enhance productivity.

(22) printed wiring circuit board of the present invention is characterized in that, is to use the method for punching of each the described printed wiring circuit board in above-mentioned (1), (3)～(7) to implement perforation processing.

Therefore, printed wiring circuit board of the present invention, use can be removed the method for punching of the printed wiring circuit board of the perforation bits that produce on the through hole inner face more up hill and dale and be implemented perforation processing, so become the printed wiring circuit board of the excellence that can more thoroughly remove the perforation bits that produce from the through hole inner face.

Again, printed wiring circuit board of the present invention, use can rejection iris the bits method for punching that be attached to the printed wiring circuit board of circuit board upper surface implement perforation processing, so become the high-quality printed wiring circuit board that can the rejection iris bits be attached to the circuit board upper surface.

And then also have, printed wiring circuit board of the present invention uses the method for punching of the printed wiring circuit board of the mechanism that makes through hole form usefulness easily and methods simplification to implement perforation processing, so become cheap printed wiring circuit board.

(23) BOC circuit board of the present invention is characterized in that, uses the method for punching of each the described printed wiring circuit board in above-mentioned (1), (3)～(7) to implement perforation processing.

Therefore, BOC circuit board of the present invention, owing to use the method for punching of the printed wiring circuit board that can remove the perforation bits that produce on the through hole inner face easily to implement perforation processing, therefore become the BOC circuit board of the excellence that can more thoroughly remove the perforation bits that take place on the through hole inner face.

Again, BOC circuit board of the present invention, owing to use the method for punching that can the rejection iris bits be attached to the printed wiring circuit board of circuit board upper surface to implement perforation processing, therefore become and to suppress the high-quality BOC circuit board that the circuit board upper surface adheres to the perforation bits.

And then also have, BOC circuit board of the present invention, owing to use the method for punching of the printed wiring circuit board of the mechanism that makes through hole form usefulness easily and methods simplification to implement perforation processing, so become cheap BOC circuit board.

Description of drawings

Fig. 1 is the general lay-out of BOC with circuit board 20.

Fig. 2 is the ideograph that BOC is amplified with the part of circuit board 20.

Fig. 3 is the ideograph of semiconductor device 1.

Fig. 4 is the front view of the punching machine 100 of expression example 1.

Fig. 5 is the plane of the punching machine 100 of expression example 1.

Fig. 6 is the side view of the punching machine 100 of expression example 1.

Fig. 7 is the plane of indication circuit plate feedway 400.

Fig. 8 is the side view of indication circuit plate feedway 400.

Fig. 9 is the front view of indication circuit plate feedway 400.

Figure 10 is the presentation graphs of explanation drift with metal die 620 usefulness.

Figure 11 is the presentation graphs of explanation punch die with metal die 640 usefulness.

Figure 12 is the explanation drift is used metal die 640 structures with metal die 620 and punch die a ideograph.

Figure 13 is the flow chart that the method for punching of the printed wiring circuit board that relates to of explanation example 1 is used.

Figure 14 is the flow chart that the method for punching of the printed wiring circuit board that relates to of explanation example 1 is used.

Figure 15 is the presentation graphs that the method for punching of the printed wiring circuit board that relates to of explanation example 1 is used.

Figure 16 is the presentation graphs that the method for punching of the printed wiring circuit board that relates to of explanation example 1 is used.

Figure 17 is the presentation graphs that the method for punching of the printed wiring circuit board that relates to of explanation example 2 is used.

Figure 18 is the flow chart that the method for punching of the printed wiring circuit board that relates to of explanation example 3 is used.

Figure 19 is the flow chart that the method for punching of the printed wiring circuit board that relates to of explanation example 4 is used.

Figure 20 is the flow chart that the method for punching of the printed wiring circuit board that relates to of explanation variation 1 is used.

Figure 21 is the flow chart that the method for punching of the printed wiring circuit board that relates to of explanation variation 2 is used.

Figure 22 is the flow chart that the method for punching of the printed wiring circuit board that relates to of explanation variation 3 is used.

Figure 23 is the ideograph that the punch die in the method for punching of the printed wiring circuit board that relates to of explanation variation 4 is used with the structure of metal die 640B.

Figure 24 is the ideograph that the drift in the method for punching of the printed wiring circuit board that relates to of explanation variation 5 is used with the structure of metal die 620C.

Figure 25 is the ideograph that the drift in the method for punching of the printed wiring circuit board that relates to of explanation variation 6 is used with the structure of metal die 640D with metal die 620D and punch die.

Figure 26 is the ideograph that the drift in the method for punching of the printed wiring circuit board that relates to of explanation variation 7 is used with the structure of metal die 620E.

The specific embodiment

Below, method for punching, printed wiring circuit board, the BOC to printed wiring circuit board of the present invention describes with circuit board and punching machine according to the example shown in the figure.

Before describing each example of the present invention in detail, the BOC that the method for punching that utilizes printed wiring circuit board of the present invention is formed through hole is with circuit board and have this BOC and describe with the semiconductor device of circuit board.

Fig. 1 is the general lay-out of BOC with circuit board 20.Fig. 2 amplifies the figure that also represents to pattern with BOC with the part of circuit board 20.Fig. 2 (a) is that Fig. 2 (b) is the A-A profile of Fig. 2 (a) with the BOC part amplification of circuit board 20, the plane of modal representation.Fig. 3 is the ideograph of semiconductor device 1.

BOC is with circuit board 20, shown in Fig. 2 (b), has base material layer 24 and is formed at protective layer 26,28 on two faces of base material layer 24.As base material layer 24, for example, the resin circuit board (thickness 200 μ ms) of BT (Bismaleimide Triazine) resin impregnated on the glass cloth matrix material is used.As protective layer 26,28, use for example organic protection layer of thickness 40 μ m.

BOC is with the through hole 22 that forms on the circuit board 20, shown in Fig. 2 (a), sees from the plane to be roughly Long Circle.Around through hole 22, form wiring part 30 with pad 32 and adhesion zone 34.Pad 32 and adhesion zone 34 for example, have the structure at the gold layer 36 of the surperficial superimposed layer thickness 3 μ m of the copper layer 38 of thickness 10 μ m.

Form the BOC usefulness circuit board 20 of through hole 22 as shown in Figure 1, after cutting one by one, be used as a part that constitutes semiconductor device 1 as BOC usefulness circuit board unit 20a.

Semiconductor device 1 has the BOC circuit board unit 20a of IC chip 10 and lift-launch IC chip 10 as shown in Figure 3.IC chip 10 is attached on the face of BOC with circuit board unit 20a by bonding agent C.On each pad 32, be fixed with solder splashes 36.The electrode 12 of adhesion zone 34 and IC chip 10 utilizes plain conductor 14 to connect by through hole 22.

Below, being example with each example describes with circuit board and punching machine method for punching, the BOC of printed wiring circuit board of the present invention.

[example 1]

At first, the summary of the punching machine 100 that example 1 is related to Fig. 4～Fig. 6 describes.

Fig. 4 is the front view of the punching machine 100 that relates to of expression example 1.Fig. 5 is the plane of the punching machine 100 that relates to of expression example 1.Fig. 6 is the side view of the punching machine 100 that relates to of expression example 1.

The punching machine 100 that example 1 relates to possesses as Fig. 4～shown in Figure 6: carry the apparatus main body 200, conveyance BOC of fixing various mechanisms (will narrate in the back) usefulness with the transport mechanism 300 of circuit board 20, be positioned at the circuit board supplying device 400 of transport mechanism 300 belows and BOC that circuit board supplying device 400 is provided with circuit board 20 implement the to bore a hole punch block mechanism 600 of usefulness.

Apparatus main body 200 is made of the board that the plane is roughly rectangle.Set the built-in control cabinet 210 that utilizes setting program to drive the controller (not shown) of each mechanism of control etc. in the right side of apparatus main body 200.On the axial both sides of the x of apparatus main body 200, the BOC after setting BOC before the mounting perforation processing and moving into portion 220 and mounting perforation and process with the circuit board of circuit board 20 takes out of portion 230 with the circuit board of circuit board 20.

Circuit board is moved into portion 220, has the loader mechanism 240 that the BOC before the perforation processing is arrived transport mechanism 300 usefulness with circuit board 20 conveyances.Again, omission is to the detailed description of loader mechanism 240.

Circuit board is taken out of portion 230, has from transport mechanism 300 to receive the collection box 250 that the BOC that bores a hole after processing uses circuit board 20 usefulness.Collection box 250 can move along the y direction of principal axis.

Transport mechanism 300 as shown in Figure 4, have and BOC is moved into portion 220 with circuit board 20 from circuit board take out of 2nd transport mechanism 320 of portion 230 conveyances from circuit board guiding plate 500 to circuit board with circuit board 20, be equipped on the apparatus main body 200 by upthrow 260 to the 1st transport mechanism 310 of following circuit board guiding plate 500 conveyances and with BOC.

Thus, only will bore a hole BOC before the processing offers circuit board with circuit board 20 and moves into the supply that portion 220 just can carry out BOC usefulness circuit board 20.Again, the BOC that only takes out of after portion's 230 recovery perforation are processed from circuit board just can carry out the recovery of BOC with circuit board 20 with circuit board 20.Therefore can improve the production efficiency of perforation work on the whole.Again, move into portion 220 from circuit board and take out of the 230 conveyance BOC of portion circuit board 20 with circuit board 20 and from circuit board guiding plate 500 to circuit board to circuit board guiding plate 500 conveyance BOC, be to utilize different transport mechanisms to carry out respectively, therefore can improve the production efficiency of whole perforation work.

Fig. 7 is the plane of indication circuit plate feedway 400.Fig. 8 is the side view of indication circuit plate feedway 400.Fig. 9 is the front view of indication circuit plate feedway 400.Again, among Fig. 8, omit the diagram of 2 anchor clamps 450,460, also omitted the diagram of anchor clamps 460 among Fig. 9.

Circuit board supplying device 400 is as Fig. 4～shown in Figure 6, have the travelling carriage 402 that can move respectively along the y direction of principal axis of circuit board direction of transfer and with x direction of principal axis that the circuit board direction of transfer intersects vertically and can rotate around the z axle, and clamping BOC is with two anchor clamps 450,460 of circuit board 20 usefulness.

Travelling carriage 402 is as Fig. 7～shown in Figure 9, has along the 1st travel mechanism 410 that the x direction of principal axis moves, along the 2nd travel mechanism 420 that the y direction of principal axis moves and the 3rd travel mechanism 430 that rotates around the z axle.

The 1st travel mechanism 410 has servomotor 412, a guide rail 418 (with reference to Fig. 5) that is supported on screw shaft the 414, the 1st workbench 416 on the servomotor 412 and extends along the x direction of principal axis, and is equipped on the apparatus main body 200.The 1st travel mechanism 410 is constituted as, and by driven the rotation of the screw shaft 414 that produces by servomotor 412, the 1st workbench 416 is moved on guide rail 418 along the x direction of principal axis.

The 2nd travel mechanism 420 has servomotor 422, a guide rail 428 that is supported on screw shaft the 424, the 2nd workbench 426 on the servomotor 422 and extends along the y direction of principal axis, and is equipped on the 1st workbench 416.The 2nd travel mechanism 420 is constituted as, and by driven the rotation of the screw shaft 424 that produces by servomotor 422, the 2nd workbench 426 is moved on guide rail 428 along the y direction of principal axis.

The 3rd travel mechanism 430 has servomotor 432, axle is supported on screw shaft the 434, the 3rd workbench 436 on the servomotor 432, gives the mobile member 438 of the 3rd workbench 436 and the sensor 440 that detects the origin position of mobile member 438 with revolving force, and is equipped on the 2nd workbench 426.The 3rd workbench 436 pivot suspensions can joltily be equipped on the mobile member 438 freely by the support of table 444 on the pivot 442 of the 2nd workbench 426.On the axial both sides of the x of the 3rd workbench 436, set the clamp holder 446,448 that is used for disposing respectively two anchor clamps 450,460 again.The 3rd travel mechanism 430 is constituted as, and by driven the rotation of the screw shaft 424 that produces by servomotor 432, is that pivot rotates around the z axle with pivot 442.

Two anchor clamps 450,460 possess respectively: have the rotatable parts 452,462 of clamping BOC with the function of circuit board 20, accept the fixed part 454,464 of rotatable parts 452,462, and the driving cylinder 456,466 that drives rotatable parts 452,462 usefulness, and be configured in respectively on the clamp holder 446,448 of the 3rd workbench 436.Also have, 2 anchor clamps 450,460 are constituted as, respectively the clamping BOC both sides ora terminalis of the circuit board position of readiness side end of circuit board 20.

Anchor clamps 450 in two anchor clamps 450,460 are constituted as, by by driving the rotation that drives the rotatable parts 452 that produce with cylinder 456, clamping BOC circuit board 20 between rotatable parts 452 and fixed part 454.For anchor clamps 460 also is same.

Between two anchor clamps 450,460 above the travelling carriage 402,, be configured by foot part 502 with the circuit board guiding plate 500 of circuit board 20 usefulness to perforation enforcing location guiding BOC from the circuit board position of readiness as Fig. 5 and shown in Figure 8.Circuit board guiding plate 500 can move along the x direction of principal axis with travelling carriage 402.The height of the upper surface of circuit board guiding plate 500 is set to, than aftermentioned punch die with the height of the upper surface of metal die 640 position of high 0.10mm only for example.

Be provided with around at the aftermentioned punch die and carry out other the circuit board guiding plate 510 (not shown) guiding usefulness, that be fixed of BOC more smoothly with circuit board 20 with metal die 640 again.The height of the upper surface of other circuit board guiding plate 510 is set to, than aftermentioned punch die with the height of the upper surface of metal die 640 position of high 0.10mm only for example.

Figure 10 is the schematic diagram of explanation drift with metal die 620 usefulness.Figure 10 (a) sees the figure of drift with metal die 620 gained from below, Figure 10 (b) is the A-A profile of Figure 10 (a), and Figure 10 (c) is the B-B profile of Figure 10 (a).Figure 11 is the schematic diagram of explanation punch die with metal die 640 usefulness.Figure 11 (a) sees the figure of punch die with metal die 640 gained from the top, Figure 11 (b) is the A-A profile of Figure 11 (a), and Figure 11 (c) is the B-B profile of Figure 11 (a).Figure 12 is the ideograph that the explanation drift is used with the structure of metal die 640 with metal die 620 and punch die.Figure 12 (a) is the ideograph that the explanation drift is used with the structure of metal die 640 with metal die 620 and punch die, and Figure 12 (b) is the figure that the peripheral part of punching hole 632 is amplified expression.

Again, among Figure 12, indicative icon drift metal die 620 and the punch die structure of metal die 640, positioning pin and location illustrate with the hole omission.Again, simplify, only illustrate a drift 622 in drift usefulness 3 drifts 622 of metal die 620, and only illustrate a punch die hole 646 in punch die usefulness 3 punch die holes 646 of metal die 640 for making explanation.

Punch block mechanism 600 as shown in Figure 6, have the BOC that provided by circuit board supplying device 400 is implemented the perforation usefulness with circuit board 20 perforation with metal die 610, install perforation with the perforation of metal die 610 usefulness with metal die installation portion 680 (not shown) and make the elevating mechanism 690 of boring a hole and using with metal die 610 liftings, be equipped on the inboard, front of punching machine 100.

Perforation is with metal die 610 as Figure 10～shown in Figure 12, have drift with metal die 620, punch die with metal die 640, determine 2 positioning pin 650 that drifts are used with the position of metal die 640 with metal die 620 and punch die with metal die installation portion 680 with respect to boring a hole.

Drift uses metal die 620 as Figure 10 and shown in Figure 12, have and roughly form oblong 3 drifts 622 (only illustrating 1 drift 622 among Figure 12), drift fishplate bar (punch plate) 624, backing plate (backing plate) 626 and stripper plate 630, the perforation that is installed on upside is with metal die installation portion 680.Drift fishplate bar 624 has the drift hole clipping (not shown) of blocking 3 drifts 622, is fixed in backing plate 626.

Stripper plate 630 has the punching hole 632 that can insert logical drift 622, but is held on the backing plate 626 with directing pin 658 free lifting twelve Earthly Branches as Figure 10 and shown in Figure 12.Around punching hole 632, form protuberance 638.On stripper plate 630, be provided with corresponding to the location of positioning pin 650 with hole 652 again.

Shown in Figure 12 (b), on the inner face of punching hole 632, formation by the interior shape corresponding to the outer shape of drift 622 constitute the 1st in perimembranous 634, and be located at perimembranous 634 in the 1st the upper end, have the shape of cross section bigger than the shape of cross section of perimembranous 634 in the 1st the 2nd in perimembranous 636.The interior shape of perimembranous 636 is with respect to the interior shape that constitutes with the conical surface of the relative face tilt predetermined angular of circuit board 20 with the BOC of stripper plate 630 in the 2nd.

On stripper plate 630, as Figure 10 and shown in Figure 12, form to BOC send into the through hole 22 of circuit board 20 path 660 that compressed air uses and communication paths 660 and around punching hole 632 the 2nd in the air chamber 662 of upper end setting of perimembranous 636.

Punch die as Figure 11 and shown in Figure 12, has decking 642 and backing plate 644 with metal die 640, is installed on the perforation metal die installation portion 680 of downside.Decking 642 is fixed in backing plate 644.Decking 642 has corresponding to 3 the punch die holes 646 of drift with 3 drifts 622 of metal die 620.Around punch die hole 646, form protuberance 647.On decking 642 and backing plate 644, be provided with corresponding to the location of positioning pin 650 with hole 654 again.

Though in Figure 12, omitted diagram, be equipped with the side of metal die 620 at drift BOC is carried out imaging apparatus for shooting 670 (with reference to Figure 15) with circuit board 20 again.

Positioning pin 650 sets to advancing and retreat along the z axle with in the metal die 640 at punch die as Figure 10 and shown in Figure 11.And, form can embed stripper plate 630 the location with hole 652, can insert logical punch die again and perforation is installed uses the location chimeric cylinder in hole (not shown) on the position of metal die 640 usefulness with the punch die of metal die installation portion 680 with hole 654 and then with being set at the location of metal die 640.

Then, utilize the method for punching of the printed wiring circuit board that Figure 13～Figure 15 relates to example 1 to describe.

Figure 13 and Figure 14 are the flow charts that the method for punching of the printed wiring circuit board that relates to of explanation example 1 is used.Figure 15 is the schematic diagram that the method for punching of the printed wiring circuit board that relates to of explanation example 1 is used.Figure 15 (a)～Figure 15 (d) is the 1st operation of method for punching of the printed wiring circuit board that relates to of explanation example 1 and the schematic diagram that the 2nd operation is used.

Again, among Figure 15, understand easily in order to make each operation that the following describes, illustrative diagram illustrates the structure of drift with metal die 620 grades.

The method for punching of the printed wiring circuit board that example 1 relates to, as shown in figure 13, contain the circuit board that the BOC before the perforation processing is provided to the perforation enforcing location with circuit board 20 supply with operation, with respect to perforation with metal die 610 with BOC with circuit board 20 adjust to the angle adjustment operation of correct angle, perforation process that BOC is bored a hole with circuit board 20 and the BOC circuit board recovery process of circuit board 20 after processing of will boring a hole from the enforcing location recovery of boring a hole.Perforation process contains the 1st operation shown in Figure 14 and the 2nd operation.The 1st operation contains (C1) circuit board mobile process and (C2) horizontal direction amount of movement calculation process in coverage.The 2nd operation contains (C3) horizontal direction amount of movement to be adjusted operation, (C4) circuit board and pushes operation and (C5) punching press perforate operation.Below in order this each operation is described.

(A) circuit board is supplied with operation

At first, the BOC that utilizes the 1st transport mechanism 310 mounting to be moved into portion 220 in circuit board moves into portion 220 to 500 conveyances of circuit board guiding plate with circuit board 20 from circuit board.If BOC passes through the 1st transport mechanism 310 by the assigned position of mounting on circuit board guiding plate 500 with circuit board 20, the rotatable parts 452,462 of 2 anchor clamps 450,460 are rotated, with the both sides of the edge respectively clamping of BOC respectively with the circuit board position of readiness side end of circuit board 20.Afterwards, travelling carriage 402 is moved adjustment on x direction of principal axis and/or y direction of principal axis, make BOC move to the perforation enforcing location from the circuit board position of readiness with circuit board 20.

(B) angle adjustment operation

At first, utilize 670 couples of BOC of imaging apparatus to take,, calculate the z axial side-play amount of BOC with circuit board 20 according to this shooting results with the assigned position of circuit board 20.At this moment, when this side-play amount is in the permissible range, enter (C) perforation process of back.This side-play amount according to the axial side-play amount of z, is rotated adjustment with travelling carriage 402 not in permissible range the time around the z axle, with metal die 620 BOC is adjusted to correct angle with circuit board 20 with respect to drift.

(C) perforation process

Utilize 670 couples of BOC of imaging apparatus to take with the assigned position of circuit board 20, according to this shooting results, travelling carriage 402 is being moved adjustment on x direction of principal axis and/or y direction of principal axis, BOC is disposed under the state on the correct perforation enforcing location with circuit board 20, BOC is implemented perforation with circuit board 20.Should (C) perforation process be categorized as, as (C1) circuit board mobile process in coverage of the 1st operation shown below and (C2) horizontal direction amount of movement calculation process and adjust operation, (C4) circuit board as (C3) horizontal direction amount of movement of the 2nd operation and push operation and (C5) punching press perforate operation.

(C1) the circuit board mobile process in coverage

Mobile BOC makes BOC place the coverage 672 interior (with reference to Figure 15 (a) and Figure 15 (b)) of imaging apparatus 670 with the position detection marks M of circuit board 20 with circuit board 20.

Again, in above-mentioned (B) angle adjustment operation, when BOC was positioned at the coverage 672 of imaging apparatus 670 with the position detection marks M of circuit board 20, omitting certainly should (C1) circuit board mobile process in coverage.

(C2) horizontal direction amount of movement calculation process

Utilize imaging apparatus 670 to take BOC circuit board 20 (the BOC position detection marks M of circuit board 20), according to this shooting results, calculate x direction of principal axis and the y axial amount of movement (BOC with x direction of principal axis and the y axial amount of movement of circuit board 20) of perforation till the predetermined position.

In this operation, also can omit the shooting that imaging apparatus 670 carries out again.At this moment, according to the shooting results in above-mentioned (B) angle adjustment operation, calculate x direction of principal axis and the y axial amount of movement of BOC with circuit board 20.

(C3) the horizontal direction amount of movement is adjusted operation

X direction of principal axis and the axial amount of movement of y according to above-mentioned (C2) horizontal direction amount of movement calculation process calculates move adjustment (with reference to Figure 15 (c)) with travelling carriage 402 on x direction of principal axis and/or y direction of principal axis.

(C4) circuit board is pushed operation

Drive elevating mechanism 690 drift is descended with metal die 620, utilize stripper plate 630 that BOC is crimped on punch die with circuit board 20 and use on the metal die 640 (with reference to Figure 15 (d)).

(C5) punching press perforate operation

Drive elevating mechanism 690 drift is descended more with metal die 620, BOC is bored a hole with circuit board 20.

BOC with before the necessary punch off of circuit board 20 enforcements, is carried out necessary number of times repeatedly with above-mentioned (C) perforation process.Finish the perforation processing work with circuit board 20 then to BOC.

(D) circuit board recovery process

Travelling carriage 402 is moved adjustment on x direction of principal axis and/or y direction of principal axis, make the BOC circuit board 20 after perforation is processed move to the perforation position of readiness from the perforation enforcing location.Then, the rotatable parts 452,462 of 2 anchor clamps 450,460 are rotated respectively, remove the clamp position of BOC with circuit board 20.

Then, utilize the 2nd transport mechanism 320 that the BOC of mounting state on circuit board guiding plate 500 is taken out of portion 230 conveyances from circuit board guiding plate 500 to circuit board with circuit board 20.The BOC that machines of perforation with circuit board 20 by mounting in circuit board is taken out of the collection box 250 of portion 230.

Like this, implement the perforation processing operation with circuit board 20 to BOC.

Like this, 100 couples of BOC of punching machine that the method for punching of the printed wiring circuit board that example 1 relates to is to use above-mentioned example 1 to relate to implement the method for punching of perforation usefulness with circuit board 20, contain operation as described below successively, promptly utilize imaging apparatus 670 to take the assigned position of BOC with circuit board 20, calculate the z axial side-play amount of BOC according to this shooting results with circuit board 20, according to the axial side-play amount of z travelling carriage 402 is rotated adjustment around the z axle then, with metal die 620 BOC is adjusted to the angle adjustment operation of correct angle with circuit board 20 with respect to drift, and utilize imaging apparatus 670 to take the assigned position of BOC with circuit board 20, according to this shooting results travelling carriage 402 is being moved adjustment on x direction of principal axis and/or y direction of principal axis, BOC is disposed at circuit board 20 under the state of correct perforation enforcing location, BOC is implemented the perforation process of perforation with circuit board 20.

Therefore, if the method for punching of the printed wiring circuit board that use example 1 relates to, utilize 670 couples of BOC of imaging apparatus to take with the assigned position of circuit board 20, calculate the z axial side-play amount of BOC according to this shooting results with circuit board 20, according to the axial side-play amount of z travelling carriage 402 is rotated adjustment around the z axle, after with metal die 620 BOC being adjusted to correct angle with circuit board 20 with respect to drift, can implement perforation with circuit board 20 to BOC, even so during not with correct angle configurations, also can implement the method for punching of boring a hole with metal die 620 accurately with respect to drift with circuit board 20 at BOC.

Again, owing to can both on x direction of principal axis and/or y direction of principal axis, move adjustment when BOC is bored a hole with circuit board 20 to travelling carriage 402 at every turn, so can implement accurately to bore a hole.

In this case, (B) the angle adjustment operation is implemented 1 time at least and is got final product when providing BOC with circuit board 20 with metal die 620 and punch die between with metal die 640 to drift.On the other hand, the mobile adjustment of on x direction of principal axis and/or y direction of principal axis travelling carriage 402 being carried out is carried out 1 time in each (C) perforation process at least.

In the method for punching of the printed wiring circuit board that example 1 relates to, above-mentioned (C) perforation process contains: as the 1st operation, (C1) circuit board mobile process in coverage and (C2) horizontal direction amount of movement calculation process, and as the 2nd operation, (C3) horizontal direction amount of movement adjusts operation, (C4) circuit board and pushes operation and (C5) punching press perforate operation.

By means of this, can according to the x direction of principal axis of necessity and the axial amount of movement of y travelling carriage 402 is being moved on x direction of principal axis and/or the y direction of principal axis adjust after, BOC is implemented perforation with circuit board 20, therefore can implement high-precision perforation.

Again, in the method for punching of the printed wiring circuit board that example 1 relates to, because can utilize above-mentioned (C3) horizontal direction amount of movement to adjust operation travelling carriage 402 is moved adjustment on x direction of principal axis and y direction of principal axis, so, when for example as example 1, using the drift that sets 3 drifts 622 to use metal die 620 (with reference to Figure 10 (a)), can do metal die smaller, therefore the metal die manufacturing cost can be suppressed in lower degree, the machining accuracy of each through hole can be improved simultaneously.On the other hand, for example when using the drift that respectively sets 9 drifts of 3 row totals in length and breadth to use metal die, owing to can form a large amount of through holes with 1 perforation action, therefore can make the perforation processing required time of each sheet printed wiring circuit board become shorter.

Here, the method for punching of the printed wiring circuit board that example 1 relates to is characterized in that, in above-mentioned (C5) punching press perforate operation, carries out following (the 1st step)～(the 3rd step).Figure 16 is the schematic diagram of the method for punching of the printed wiring circuit board that is used to illustrate that example 1 relates to.Figure 16 (a)～Figure 16 (f) is the figure of expression (the 1st step)～(the 3rd step).

(the 1st step)

By drift 622 being descended clipping under the state of BOC with circuit board 20 (with reference to Figure 16 (a)) between stripper plate 630 and the decking 642, at BOC with forming through hole 22 (with reference to Figure 16 (b)) on the circuit board 20.

(the 2nd step)

Keep clipping between stripper plate 630 and the decking 642 make drift 622 risings under the BOC situation constant with the state of circuit board 20 after, by punching hole 632 compressed air is sent into through hole 22 from drift with metal die 620 sides, remove the through hole 22 inboard perforation bits (with reference to Figure 16 (c)) that exist by punch die hole 646.

(the 3rd step)

Drift 622 is descended once more keeping clipping under the BOC situation constant between stripper plate 630 and the decking 642, remove the perforation of through hole 22 inboard existence by punch die hole 646 and consider (with reference to Figure 16 (d)) to be worth doing with the state of circuit board 20.

If the 3rd step finishes, drift 622 is risen (with reference to Figure 16 (e)), make stripper plate 630 risings (with reference to Figure 16 (f)) again.

Like this, if the method for punching of the printed wiring circuit board that use example 1 relates to, drift 622 is descended, at BOC formation through hole 22 on the circuit board 20, after drift 622 is risen, compressed air is sent into through hole 22, remove the perforation bits that through hole 22 inboards exist with this by punch die hole 646, drift 622 is descended once more, remove the perforation bits that through hole 22 inboards exist with this by punch die hole 646, even therefore under the situation that also remaining perforation is considered to be worth doing on the inner face of through hole 22 when the 2nd step finishes, also can descend once more, remove perforation bits remaining on the inner face of through hole 22 fully by in the 3rd step, making drift 622.Consequently, can remove the perforation bits that take place on the inner face of through hole 22 more up hill and dale.

Again, if the method for punching of the printed wiring circuit board that employing example 1 relates to, be to clip BOC between stripper plate 630 and the decking 642 with under the state of circuit board 20 always, carry out a succession of action till above-mentioned the 1st step to the 3 steps, therefore BOC is covered by stripper plate 630 with the upper surface of circuit board 20 always, can be attached to BOC circuit board 20 upper surfaces by the rejection iris bits.

Again, unnecessary number of times and the punching amount of as the situation of patent documentation 2 described method for punching, suitably setting, change the drift stamping-out of the method for punching of the printed wiring circuit board that example 1 relates to according to the material and the thickness of circuit board, but by adding up to 2 times simple stamping-out action to form straight through hole in the 1st step and the 3rd step, so make mechanism and the methods simplification that forms through hole 22 usefulness easily.

Therefore, the method for punching of the printed wiring circuit board that example 1 relates to is can remove the perforation bits that produce on through hole 22 inner faces more up hill and dale, simultaneously can also the rejection iris bits be attached to BOC with the upper surface of circuit board 20 and then make the mechanism of formation through hole 22 usefulness easily and the method for punching of the printed wiring circuit board of methods simplification.

More than, feature and effect utilization Figure 13～Figure 16 of the method for punching of the printed wiring circuit board that example 1 is related to have been described in detail, but the method for punching of the printed wiring circuit board that example 1 relates to also has following such feature and effect.

In the method for punching of the printed wiring circuit board that example 1 relates to, as Figure 10～shown in Figure 12, therefore the external diameter of the internal diameter of punching hole 632 and drift 622 is roughly the same, can reduce the area of the part that BOC exposes with not covered by stripper plate 630 on the upper surface of circuit board 20.Consequently further the rejection iris bits are attached to the upper surface of BOC with circuit board 20.

Here, so-called " external diameter of the internal diameter of punching hole 632 and drift 622 is roughly the same " be the inner peripheral surface that means punching hole 632 with the outer peripheral face of drift 622 between the minimal slit of only setting necessity.

In the method for punching of the printed wiring circuit board that example 1 relates to, form structure as described below (with reference to Figure 16 (c)), promptly shown in Figure 12 (b), on the inner face of punching hole 632, the 1st interior perimembranous 634 that formation is made of the interior shape corresponding with the outer shape of drift 622, and the upper end that is located at perimembranous 634 in the 1st, the 2nd interior perimembranous 636 with shape of cross section also bigger than the shape of cross section of the 1st interior perimembranous 634, the leading section of drift 622 from punching hole 632 the 1st in perimembranous 634 when rising in the 2nd perimembranous 636, compressed air is admitted to through hole 22 by punching hole 632.

Therefore, if the method for punching of the printed wiring circuit board that use example 1 relates to, it is such that then drift 622 plays so-called air valve, the leading section of drift 622 from punch die hole 646 to punching hole 632 the 1st in during position the perimembranous 634, compressed air is not admitted to through hole 22, and compressed air is admitted to through hole 22 when leading section perimembranous 634 in the 1st of drift 622 rises in the 2nd perimembranous 636.Consequently, needn't move up and down according to the high speed of drift 622 and at high speed compressed air be carried out ON/OFF control, so control becomes easily, the high speed of reply perforation simultaneously also becomes easy.

In the method for punching of the printed wiring circuit board that example 1 relates to, shown in Figure 10 and Figure 12 (a), on stripper plate 630, form to through hole 22 send into path 660 that compressed air uses and is communicated with path 660 and around punching hole 632 the 2nd in the air chamber 662 of upper end setting of perimembranous 636.By means of this, compressed air is transported to the inner surface of through hole 22 on full week, therefore can remove perforation bits remaining on the inner face of through hole 22 up hill and dale.Owing to the compressed air of sending into from path 660 temporarily can be stranded in air chamber 662, therefore compressed-air actuated pressure and the flow that is admitted to through hole 22 can be substantially maintained fixed again.Therefore, owing in above-mentioned the 2nd step, through hole 22 is carried a certain amount of compressed air of homogenising, can further remove perforation bits remaining on the inner face of through hole 22 up hill and dale.

In the method for punching of the printed wiring circuit board that example 1 relates to, the bottom dead centre of the bottom dead centre of the drift 622 of the 1st step and the drift 622 of the 3rd step is roughly the same, so there is no need to change the bottom dead centre of the drift 622 of the 1st step and the 3rd step, form the mechanism of through hole 22 usefulness and the simplification of method and become easier.

In the method for punching of the printed wiring circuit board that example 1 relates to, shown in Figure 12 (a), around the punch die hole 646 of decking 642, form protuberance 647.

For example; form under the situation of through hole at BOC with circuit board; protective layer is capped on the face of punch die with the metal die side of BOC with circuit board, because protective layer is soft, and the situations such as limit of therefore on the peripheral part of through hole, can collapsing owing to implement perforation.But, if the method for punching of the printed wiring circuit board that employing example 1 relates to, the BOC that contacts with the peripheral part in punch die hole 646 circuit board section of circuit board 20, compare with other circuit board section, by with big strength clamping, the generation on limit so the peripheral part that can suppress through hole 22 collapses can the good BOC circuit board of quality bills of materials.

In the method for punching of the printed wiring circuit board that example 1 relates to, shown in Figure 12 (b), around the punching hole 632 of stripper plate 630, form protuberance 638.

For example, form under the situation of through hole on circuit board, exist when adhering on the wiring part that through hole nearby forms to cause risk of short-circuits when perforation is considered to be worth doing at BOC.But, if the method for punching of the printed wiring circuit board that employing example 1 relates to, then owing to can BOC fully be covered with the upper surface of circuit board 20 along through hole 22 (inner face of through hole 22), therefore further rejection iris is considered to be worth doing attached to being formed on through hole 22 wiring part 30 nearby.

In the method for punching of the printed wiring circuit board that example 1 relates to, shown in Figure 16 (a) and Figure 16 (b), in above-mentioned the 1st step, be by clipping between stripper plate 630 sides, stripper plate 630 and the decking 642 under the BOC usefulness state of circuit board 20 with the wiring part formation face of circuit board 20 at BOC, drift 622 is descended, thereby at BOC with forming through hole 22 on the circuit board 20, so can form through hole 22 accurately with the pattern of the wiring part formation face of circuit board 20 according to BOC.

In the method for punching of the printed wiring circuit board that example 1 relates to, as Figure 10 and shown in Figure 11, set 3 drifts 622 on metal die 620 at drift, set 3 punch die holes 646 on metal die 640 at punch die corresponding to 3 drifts 622.Thus, can form a plurality of through holes 22 that can more thoroughly remove the excellence of the perforation bits that on the through hole inner face, produce with 1 perforation action, so can enhance productivity.

In the method for punching of the printed wiring circuit board that example 1 relates to, above-mentioned punching machine 100 is to be set to move along the x direction of principal axis between 2 anchor clamps 450,460 above the travelling carriage 402 and with travelling carriage 402, and then also possesses the punching machine that BOC is guided the circuit board guiding plate 500 of usefulness with circuit board 20 from the circuit board position of readiness to the perforation enforcing location.And 2 anchor clamps 450,460 are constituted as mounting in the sandwich of circuit board on the x of circuit board guiding plate 500 direction of principal axis of the BOC on the circuit board guiding plate 500.

Therefore, if the method for punching of the printed wiring circuit board that use example 1 relates to, then because the guiding BOC circuit board guiding plate 500 of circuit board 20 usefulness, be provided between 2 anchor clamps 450,460 of travelling carriage 402 tops and and move, so BOC is successfully guided along the x direction of principal axis and at circuit board guiding plate 500 upper edge y direction of principal axis with circuit board guiding plate 500 with circuit board 20 along the x direction of principal axis with travelling carriage 402.

In the method for punching of the printed wiring circuit board that example 1 relates to, 2 anchor clamps 450,460 are constituted as respectively the both sides ora terminalis clamping of BOC with the circuit board position of readiness side end of circuit board 20, therefore can be to boring a hole with the circuit board position of readiness side end of circuit board 20 enlarged regions till the enforcing location side end of boring a hole from BOC.

Again, in this case, BOC after the process finishing of will boring a hole takes off from two anchor clamps 450,460 with circuit board 20, make it in the horizontal direction under the state of Rotate 180 °, with 450,460 clampings of two anchor clamps, implement perforation once more, can implement perforation with the Zone Full of circuit board 20 at BOC.

In the method for punching of the printed wiring circuit board that example 1 relates to, above-mentioned punching machine 100 is, is set at punch die with around the metal die 640 and then also possess the punching machine that BOC is more successfully guided other circuit board guiding plates 510 (not shown) that are fixed of usefulness with circuit board 20.

Is under the situation of rigidity at BOC with circuit board 20, and above-mentioned other circuit board guiding plates 510 are not necessarily to need.But, is under the flexual situation at BOC with circuit board 20, from circuit board guiding plate 500 when region in front transmits BOC with circuit board 20, BOC with the x direction of principal axis both ends of circuit board 20 with y direction of principal axis one side end because gravity and sagging meeting causes circuit board 20 generation warpage and the bendings at BOC.Even under these circumstances, as implement the method for punching of the printed wiring circuit board that form 1 relates to, by other circuit board guiding plates 510 be fixed being set around with metal die 640 at punch die, can suppress BOC circuit board 20 effectively warpage and bending take place, can transmit BOC circuit board 20 smoothly.

BOC that example 1 relates to is with circuit board 20, adopts the processing of boring a hole of the method for punching of the printed wiring circuit board that above-mentioned example 1 relates to.

Therefore, the BOC that example 1 relates to circuit board 20, because use can be removed the method for punching of the printed wiring circuit board of the perforation bits that take place on through hole 22 inner faces more up hill and dale and be implemented perforation processing, therefore become the excellent BOC circuit board of being removed more up hill and dale by the perforation bits of through hole 22 inner faces generation.

Again, the BOC that example 1 relates to circuit board 20, can the rejection iris bits be attached to BOC with the processing of boring a hole of the method for punching of the printed wiring circuit board of the upper surface of circuit board 20 owing to use, therefore becoming bores a hole considers to be worth doing and is attached to BOC with the repressed high-quality BOC circuit board of the situation of circuit board 20 upper surfaces.

And then BOC that example 1 relates to is with circuit board 20, owing to use the method for punching of the printed wiring circuit board that easily makes the mechanism that forms through hole 22 usefulness and methods simplification to implement perforation processing, therefore becomes cheap BOC circuit board.

The punching machine 100 that example 1 relates to, be possess drift with drift 622 and stripper plate 630 with metal die 620 and punch die with decking 642 with metal die 640, BOC is implemented the punching machine of perforation processing with circuit board 20 circuit boards such as printed wiring such as grade.And, punching machine 100 possesses, drift 622 is descended to form the 1st function of through hole on the printed wiring circuit board, under the constant situation of the state that keeps clipping between stripper plate 630 and the decking 642 the printed wiring circuit board, make drift 622 risings, punching hole 632 by stripper plate 630 is sent to through hole from drift with metal die 620 sides with compressed air then, remove the 2nd function of the perforation bits that the through hole inboard exists with this punch die hole 646 by decking 642, and under the constant situation of the state that keeps clipping between stripper plate 630 and the decking 642 the printed wiring circuit board, drift 622 is descended once more, remove the 3rd function that perforation that the through hole inboard exists is considered to be worth doing with this by punch die hole 646.

Therefore, if the punching machine 100 that adopts example 1 to relate to, then at first utilize the 1st function that drift 622 is descended, on circuit board, form through hole, after utilizing the 2nd function that drift 622 is risen again compressed air is sent into through hole, with this perforation bits that through hole inboard exists are removed by punch die hole 646, utilize the 3rd function that drift 622 is descended once more, with this perforation bits that through hole inboard exists are removed by punch die hole 646, even therefore under situation owing to remaining perforation bits on the inner face of the 2nd function at through hole, also can drift 622 be descended once more, perforation bits remaining on the through hole inner face are thoroughly removed by utilizing the 3rd function.Consequently, can make the perforation bits printed wiring circuit board that removed more up hill and dale, excellent that the through hole inner face produces.

Again, if the punching machine 100 that adopts example 1 to relate to, then between stripper plate 630 and decking 642, clip under the state of circuit board always, above-mentioned the 1st function～the 3rd function is worked, therefore the upper surface of circuit board is covered by stripper plate 630 always, can make repressed, the high-quality printed wiring circuit board of situation that the circuit board upper surface adheres to the perforation bits.

Again, if the punching machine 100 that adopts example 1 to relate to, then there is no need as the situation of the punching machine that uses patent documentation 2 described method for punching, suitably to set, change the number of times and the punching amount of drift stamping-out according to the material and the thickness of circuit board, owing to utilize the 1st function and the 3rd function to add up to 2 times simple stamping-out action to form straight through hole, therefore make through hole form the mechanism and the methods simplification of usefulness easily.Therefore, can make cheap printed wiring circuit board.

[example 2]

Figure 17 is the schematic diagram of the method for punching of the printed wiring circuit board that is used to illustrate that example 2 relates to.Figure 17 (a)～Figure 17 (f) is the figure of expression (the 1st step)～(the 4th step).In Figure 17, the parts identical with the parts of explanation in the example 1 are marked with identical symbol, and omit its detailed description again.

The method for punching of the printed wiring circuit board that example 2 relates to, shown in Figure 17 (a)～Figure 17 (f), basically the method for punching of the printed wiring circuit board that relates to example 1 is identical, but after the 3rd step, also have the 4th step shown below, this point is different with the method for punching of the printed wiring circuit board that example 1 relates to.

(the 4th step)

Keep clipping between stripper plate 630 and the decking 642 make drift 622 risings under the BOC situation constant with the state of circuit board 20 after, by punching hole 632 compressed air is sent into through hole 22 from drift once more with metal die 620 sides, the perforation bits that through hole 22 inboards exist are removed (with reference to Figure 17 (e)) by punch die hole 646 with this.

If the 4th step finishes, just stop to send into compressed air, make stripper plate 630 risings (with reference to Figure 17 (f)).

Like this, the method for punching of the printed wiring circuit board that example 2 relates to, after the 3rd step, also has above-mentioned the 4th step, the method for punching of the printed wiring circuit board that relates to example 1 is different in this, but the situation of the method for punching of the printed wiring circuit board that relates to example 1 is the same, drift 622 is descended, on BOC circuit board 20, form through hole 22, after drift 622 is risen compressed air is sent into through hole 22, with this perforation bits that through hole 22 inboards exist are removed by punch die hole 646, in the 3rd step,, the through hole 22 inboard perforation bits that exist are removed by punch die hole 646 by drift 622 is descended once more.Therefore, even when the 2nd step finishes under the situation of the also remaining perforation of through hole 22 inner faces bits, also can descend once more by in the 3rd step, making drift 622, perforation remaining on through hole 22 inner faces is considered to be worth doing thoroughly removes.Consequently, can remove the perforation bits that produce on through hole 22 inner faces more up hill and dale.

Again, if the method for punching of the printed wiring circuit board that employing example 2 relates to, then clipping BOC between stripper plate 630 and the decking 642 with under the state of circuit board 20 always, carry out a succession of action till above-mentioned the 1st step to the 3 steps, therefore BOC is covered by stripper plate 630 with the upper surface of circuit board 20 always, can be attached to BOC circuit board 20 upper surfaces by the rejection iris bits.

Again, if the method for punching of the printed wiring circuit board that employing example 2 relates to then owing to pass through 2 times the straight through hole of simple stamping-out action formation altogether of the 1st step and the 3rd step, therefore makes the mechanism and the methods simplification of formation through hole 22 usefulness easily.

Therefore, the method for punching of the printed wiring circuit board that example 2 relates to, be the method for punching of the printed wiring circuit board that relates to example 1 same, can remove the perforation bits that produce on through hole 22 inner faces more up hill and dale, simultaneously can the rejection iris bits be attached to BOC with circuit board 20 upper surfaces, and then also make through hole 22 form the method for punching of the printed wiring circuit board of the mechanism of usefulness and methods simplification easily.

And then also have, in the method for punching of the printed wiring circuit board that example 2 relates to, after the 3rd step, also comprise above-mentioned the 4th step, even therefore on the inner face of through hole 22, produce new perforation bits owing to carry out the 3rd step, also can after drift 622 is risen, compressed air be sent into through hole 22 once more, such perforation bits are removed by punch die hole 646.Therefore, can further remove perforation bits residual on through hole 22 inner faces up hill and dale.

Again, the action of the 4th step is also identical with situation from the action of the 1st step to the 3 steps, be to carry out under with the state of circuit board 20 clipping BOC between stripper plate 630 and the decking 642, therefore BOC is covered by stripper plate 630 with the upper surface of circuit board 20, thereby can be attached to the generation of BOC with the situation of the upper surface of circuit board 20 by the rejection iris bits.

The method for punching of the printed wiring circuit board that example 2 relates to, after the 3rd step so also have beyond the 4th step this point aspect, the method for punching of the printed wiring circuit board that relates to example 1 is identical, so have the effect that the method for punching that uses the printed wiring circuit board that example 1 relates to obtains equally.

[example 3]

The method for punching of the printed wiring circuit board that example 3 relates to, as shown in figure 18, basically the method for punching of the printed wiring circuit board that relates to example 1 is identical, but after (C5) of the 2nd operation punching press perforate operation and then also have the 3rd operation, the method for punching of the printed wiring circuit board that relates to example 1 is different in this.

The 3rd operation as shown in figure 18, be included as make in the coverage 672 that the through hole 22 that the 2nd operation is formed is disposed at imaging apparatus 670 (C6) that BOC moves predetermined distance with circuit board 20 in coverage circuit board mobile process (its 2) and utilize imaging apparatus 670 to take BOC with circuit board 20, confirm whether through hole 22 is formed at (C7) through hole affirmation operation of tram.

Like this, the method for punching of the printed wiring circuit board that example 3 relates to, after (C5) of the 2nd operation punching press perforate operation, also have (C6) as the 3rd operation in coverage circuit board mobile process (its 2) and (C7) through hole confirm the operation this point, the method for punching of the printed wiring circuit board that relates to example 1 is different, but the situation of the method for punching of the printed wiring circuit board that relates to example 1 is the same, perforation process comprises as (C1) circuit board mobile process in coverage of the 1st operation and (C2) horizontal direction amount of movement calculation process, and adjusts operation as (C3) horizontal direction amount of movement of the 2nd operation, (C4) circuit board is pushed operation and (C5) punching press perforate operation.

Therefore, the method for punching of the printed wiring circuit board that example 3 relates to is the same with the method for punching of the printed wiring circuit board that example 1 relates to, can according to the x direction of principal axis of necessity and the axial amount of movement of y x direction of principal axis and/or y direction of principal axis move adjust travelling carriage 402 after, BOC is implemented perforation with circuit board 20, so can implement high-precision perforation.

Again, in the method for punching of the printed wiring circuit board that example 3 relates to, after (C5) of the 2nd operation punching press perforate operation, carry out (C6) as the 3rd operation in coverage circuit board mobile process (its 2) and (C7) through hole confirm operation, so can confirm before the action of boring a hole whether the through hole 22 of the 2nd operation formation is formed on the correct position next time.That is to say,, can temporarily stop BOC with the perforation of circuit board 20 and take measures necessary if the through hole 22 that the 2nd operation forms is not formed on the correct position.

[example 4]

The method for punching of the printed wiring circuit board that example 4 relates to comprises the identical operation of method for punching of the printed wiring circuit board that relates to example 1 basically.Specifically, comprise: the circuit board that the BOC before the processing of will boring a hole is provided to the perforation enforcing location with circuit board 20 supply with operation, with respect to perforation with metal die 610 with BOC with circuit board 20 adjust to correct angle the angle adjustment operation, to BOC implement the perforation process of perforation with circuit board 20 and the BOC circuit board 20 after processing of will boring a hole from the circuit board recovery process of the enforcing location recovery of boring a hole.But what the method for punching of the printed wiring circuit board that the method for punching of the printed wiring circuit board that example 4 relates to and example 1 relate to was different is the content of perforation process.

That is to say, in the method for punching of the printed wiring circuit board that example 1 relates to, perforation process comprises: as (C1) of the 1st operation circuit board mobile process and (C2) the horizontal direction amount of movement calculation process and adjust operation, (C4) circuit board as (C3) horizontal direction amount of movement of the 2nd operation and push operation and (C5) punching press perforate operation in coverage.Relative therewith, in the method for punching of the printed wiring circuit board that example 4 relates to, perforation process as shown in figure 19, comprise: push operation and (E2) horizontal direction side-play amount calculation process and push as (E3) circuit board of 2a operation and to remove operation, (E4) horizontal direction side-play amount and adjust operation, (E5) circuit board and push operation (its 2) and (E6) punching press perforate operation as (E1) circuit board of 1a operation.Below these (E1)～(E6) operations are described successively.

Again, the circuit board of the method for punching of the printed wiring circuit board that example 4 relates to is supplied with operation, angle adjustment operation and circuit board recovery process, supply with operation, (B) angle adjustment operation with (A) circuit board of explanation in the example 1 and (D) the circuit board recovery process is identical, therefore omit its detailed description.

(E1) circuit board is pushed operation

With respect to the BOC circuit board 20 that is configured between drift usefulness metal die 620 and the punch die usefulness metal die 640, drive elevating mechanism 690 drift is descended with metal die 620, utilize stripper plate 630 that BOC is crimped on punch die with on the metal die 640 with circuit board 20.

In (B) angle adjustment operation,, certainly omit and to push operation by (E1) circuit board utilizing stripper plate 630 BOC to be crimped on circuit board 20 under the situation of punch die with the state on the metal die 640 again.

(E2) horizontal direction side-play amount calculation process

Utilize imaging apparatus 670 to take BOC, calculate the side-play amount from correct perforation enforcing location (x direction of principal axis and y axial side-play amount) of BOC with circuit board 20 according to this shooting results with circuit board 20.At this moment, under the situation of side-play amount in permissible range of correct perforation enforcing location, enter following (E6) punching press perforate operation., enter following (E3) circuit board and push the releasing operation not under the situation in permissible range in the amount that departs from correct perforation enforcing location.

In addition, in this operation, also can omit the shooting that imaging apparatus 670 carries out.In this case, calculate the amount of BOC according to the shooting results in (B) angle adjustment operation with correct perforation enforcing location of departing from of circuit board 20.

(E3) circuit board is pushed the releasing operation

Drive elevating mechanism 690 drift is risen with metal die 620, remove the crimped status of 630 couples of BOC of stripper plate with circuit board 20.

(E4) the horizontal direction side-play amount is adjusted operation

The side-play amount from correct perforation enforcing location that above-mentioned according to utilizing (E3) horizontal direction side-play amount calculation process calculates moves on x direction of principal axis and/or y direction of principal axis and adjusts travelling carriage 402.

(E5) circuit board is pushed operation (its 2)

Drive elevating mechanism 690 drift is descended once more with metal die 620, utilize stripper plate 630 that BOC is crimped on punch die with on the metal die 640 with circuit board 20.

(E6) punching press perforate operation

Drive elevating mechanism 690 drift is further descended with metal die 620, BOC is implemented perforation with circuit board 20.

Number of times with necessity carries out above-mentioned operation repeatedly, up to BOC is carried out necessary punch off with circuit board 20.Then, finish the perforation processing operation with circuit board 20 to BOC.

Like this, the method for punching of the printed wiring circuit board that example 4 relates to, perforation process contains the operation of carrying out in the following order, promptly provide BOC circuit board 20 to the perforation enforcing location, after utilizing stripper plate 630 to be crimped on decking 642 on circuit board 20 BOC, utilize imaging apparatus 670 to take BOC circuit board 20, calculate BOC the x direction of principal axis of circuit board 20 and the 1a operation of the axial side-play amount of y according to this shooting results, and when x direction of principal axis and the axial side-play amount of y are in permissible range, keeping BOC to be crimped on circuit board 20 under the constant situation of state on the decking 642, at BOC circuit board 20 enterprising eleven punch 11s, when x direction of principal axis and the axial side-play amount of y are not in permissible range, remove the crimped status of 630 couples of BOC of stripper plate with circuit board 20, on x direction of principal axis and/or y direction of principal axis, move adjustment travelling carriage 402 according to x direction of principal axis and the axial side-play amount of y, after utilizing stripper plate 630 to be crimped on decking 642 on circuit board 20 BOC, at BOC circuit board 20 enterprising eleven punch 11s, form the 2a operation of through hole.

Therefore, if the method for punching of the printed wiring circuit board that employing example 4 relates to, then can according to real offset after moving adjustment travelling carriage 402 on x direction of principal axis and/or the y direction of principal axis, BOC be bored a hole with circuit board 20, therefore can implement high-precision perforation.Again, in this case, be to calculate side-play amount accurately under with the state of circuit board 20 with stripper plate 630 crimping BOC, therefore can implement more high-precision perforation.

More than, method for punching, printed wiring circuit board, BOC to printed wiring circuit board of the present invention is illustrated with circuit board and punching machine according to above-mentioned each example, but the present invention is not limited to above-mentioned each example, also can implement in various forms without departing from the spirit and scope of the present invention, for example also can be distortion as described below.

[variation 1]

Figure 20 is the flow chart of the method for punching of the printed wiring circuit board that is used to illustrate that variation 1 relates to.

The method for punching of the printed wiring circuit board that variation 1 relates to, as shown in figure 19, the identical operation of situation that comprises the method for punching of the printed wiring circuit board that relates to example 4, but in the method for punching of the printed wiring circuit board that variation 1 relates to, in the perforation process, (E5) circuit board in the 2a operation is pushed operation (its 2) and is carried out (E7) horizontal direction side-play amount calculation process (its 2) afterwards, and the situation of the method for punching of the printed wiring circuit board that this point and example 3 relate to is different.And, according to the side-play amount of utilizing (E7) horizontal direction side-play amount calculation process (its 2) to calculate, under the situation of side-play amount in permissible range of correct punch position, entering (E6) punching press perforate operation,, returning (E3) circuit board once more and pushing the releasing operation not under the situation in permissible range from the side-play amount of correct perforation enforcing location.

That is to say, the method for punching of the printed wiring circuit board that variation 1 relates to, it is characterized in that perforation process contains the following operation of carrying out in the following order, promptly in the 1a operation of above-mentioned example 4 explanations, and when x direction of principal axis and the axial side-play amount of y are in permissible range, keeping BOC to be crimped on circuit board 20 under the constant situation of state on the decking 642, bore a hole with enforcement on the circuit board 20 at BOC, when x direction of principal axis and the axial side-play amount of y are not in permissible range, remove the crimped status of 630 couples of BOC of stripper plate with circuit board 20, move adjustment travelling carriage 402 according to x direction of principal axis and the axial side-play amount of y at x direction of principal axis and/or y direction of principal axis, utilizing after stripper plate 630 is crimped on the decking 642 with circuit board 20 BOC, utilize imaging apparatus 670 to take BOC circuit board 20, calculate x direction of principal axis and the y axial side-play amount of BOC according to this shooting results with circuit board 20, remove crimping repeatedly and move the operation of adjusting the calculating of crimping shooting side-play amount, till x direction of principal axis and the axial side-play amount of y are in permissible range, if the axial side-play amount of x direction of principal axis and y reaches in the permissible range thereafter, just keeping BOC to be crimped on circuit board 20 under the constant situation of state on the decking 642, with implementing perforation on the circuit board 20, form the 2b operation of through hole 22 at BOC.

Therefore, if the method for punching of the printed wiring circuit board that employing variation 1 relates to, then can carry out the fine motion of travelling carriage 402 repeatedly and adjust operation in side-play amount reaches permissible range, so can implement the more high-precision perforation of method for punching of the printed wiring circuit board that relates to than example 4.

[variation 2]

Figure 21 is the flow chart of the method for punching of the printed wiring circuit board that is used to illustrate that variation 2 relates to.

The method for punching of the printed wiring circuit board that variation 2 relates to, as shown in figure 21, the identical operation of method for punching that comprises the printed wiring circuit board that relates to example 4, but in the method for punching of the printed wiring circuit board that variation 2 relates to, in perforation process, do not utilize stripper plate 630 with BOC with circuit board 20 be crimped on punch die carry out with metal die 640 (E2) horizontal direction side-play amount calculation process and (E4) the horizontal direction side-play amount adjust the operation this point, the situation of the method for punching of the printed wiring circuit board that relates to example 4 is different.

That is to say, the method for punching of the printed wiring circuit board that variation 2 relates to, it is characterized in that, perforation process contains the following operation of carrying out in the following order, promptly provide BOC with behind the circuit board 20 to the perforation enforcing location, utilize imaging apparatus 670 to take BOC circuit board 20, calculate BOC the x direction of principal axis of circuit board 20 and the 1b operation of the axial side-play amount of y according to this shooting results, and when x direction of principal axis and the axial side-play amount of y are in the permissible range, after utilizing stripper plate 630 to be crimped on the decking 642 with circuit board 20 BOC, bore a hole with enforcement on the circuit board 20 at BOC, when x direction of principal axis and the axial side-play amount of y are not in permissible range, on x direction of principal axis and/or y direction of principal axis, move adjustment travelling carriage 402 according to x direction of principal axis and the axial side-play amount of y, utilizing after stripper plate 630 is crimped on the decking 642 with circuit board 20 BOC, with implementing perforation on the circuit board 20, form the 2c operation of through hole 22 at BOC.

Therefore, if the method for punching of the printed wiring circuit board that employing variation 2 relates to, then can be after on x direction of principal axis and/or y direction of principal axis, moving adjustment travelling carriage 402 according to real offset, BOC is implemented perforation with circuit board 20, therefore the situation of the method for punching of the printed wiring circuit board that relates to example 4 is identical, can implement high-precision perforation.

[variation 3]

The method for punching of the printed wiring circuit board that variation 3 relates to, as shown in figure 22, the identical operation of situation that comprises the method for punching of the printed wiring circuit board that relates to variation 2, but in the method for punching of the printed wiring circuit board that variation 3 relates to, in the perforation process, carry out on (E7) horizontal direction side-play amount calculation process (its 2) this point after (E4) of 2c operation horizontal direction side-play amount is adjusted operation, the method for punching of the printed wiring circuit board that relates to variation 2 is different.And, according to the side-play amount of utilizing (E7) horizontal direction side-play amount calculation process (its 2) to calculate, under the side-play amount from correct perforation enforcing location is in situation in the permissible range, push operation through (E 1) circuit board and enter (E6) punching press perforate operation,, returning (E4) horizontal direction side-play amount once more and adjusting operation not under the situation in permissible range from the side-play amount of correct perforation enforcing location.

That is to say, the method for punching of the printed wiring circuit board that variation 3 relates to, it is characterized in that, perforation process contains the following operation of carrying out in the following order, promptly in above-mentioned variation 2 explanation the 1b operation, and when x direction of principal axis and the axial side-play amount of y are in permissible range, after utilizing stripper plate 630 that BOC is crimped on decking 642 with circuit board 20, bore a hole with enforcement on the circuit board 20 at BOC, when x direction of principal axis and the axial side-play amount of y are not in permissible range, on x direction of principal axis and/or y direction of principal axis, move adjustment travelling carriage 402 according to x direction of principal axis and the axial side-play amount of y, utilize imaging apparatus 670 to take BOC circuit board 20, calculate x direction of principal axis and the y axial side-play amount of BOC according to this shooting results with circuit board 20, move repeatedly to adjust and take the operation that side-play amount is calculated, till x direction of principal axis and the axial side-play amount of y reach in the permissible range, afterwards, if the axial side-play amount of x direction of principal axis and y reaches in the permissible range, just utilizing after stripper plate 630 is crimped on the decking 642 with circuit board 20 BOC, with implementing perforation on the circuit board 20, form the 2d operation of through hole 22 at BOC.

Therefore, if the method for punching of the printed wiring circuit board that employing variation 3 relates to, then can carry out the fine motion of travelling carriage 402 repeatedly and adjust operation, therefore till in side-play amount reaches permissible range, can implement the more high-precision perforation of method for punching of the printed wiring circuit board that relates to than variation 2.

[variation 4]

Figure 23 is the ideograph that the punch die of the method for punching of the printed wiring circuit board that relates to of explanation variation 4 is used with the structure of metal die 640B.

The different place of the method for punching of the printed wiring circuit board that the method for punching of the printed wiring circuit board that variation 4 relates to and example 1 relate to be on its method for punching employed punch die with the structure of metal die.That is to say, in the method for punching of the printed wiring circuit board that example 1 relates to, shown in Figure 12 (a), form protuberance 647 at punch die around with the punch die hole 646 of the decking 642 of metal die 640, with respect to this, in the method for punching of the printed wiring circuit board that variation 4 relates to, as shown in figure 23, punch die is with forming ditch 648 around the punch die hole 646 of the decking 642B of metal die 640B.

Like this, the method for punching of the printed wiring circuit board that variation 4 relates to, the method for punching of the printed wiring circuit board that relates to example 1 is different on the structure of the punch die that uses on its method for punching with metal die, but the situation of the method for punching of the printed wiring circuit board that relates to example 1 is the same, the BOC that peripheral part with punch die hole 646 is contacted is with the circuit board section of circuit board 20, with the strength clamping bigger than other circuit board section, the peripheral part that therefore can suppress through hole 22 limit of collapsing, thus can the good BOC circuit board of quality bills of materials.

[variation 5]

Figure 24 is that the drift of method for punching of the printed wiring circuit board that relates to of explanation variation 5 is with the ideograph of the structure of metal die 620C.

The method for punching of the printed wiring circuit board that variation 5 relates to, the different place of method for punching of the printed wiring circuit board that relates to example 1, be on this method for punching employed drift with the structure of metal die.Just in the method for punching of the printed wiring circuit board that example 1 relates to, shown in Figure 12 (a), form protuberance 638 at drift around with the punching hole 632 of the stripper plate 630 of metal die 620, with respect to this, in the method for punching of the printed wiring circuit board that variation 5 relates to, as shown in figure 20, do not form protuberance at drift around with the punching hole 632 of the stripper plate 630C of metal die 620C.

Like this, the method for punching of the printed wiring circuit board that variation 5 relates to, the method for punching of the printed wiring circuit board that relates to example 1 employed drift on its method for punching is different with the structure of metal die, but the method for punching of the printed wiring circuit board that relates to example 1 is the same, the BOC that peripheral part with punch die hole 646 is contacted is with the circuit board section of circuit board 20, with the strength clamping bigger than other circuit board section, the peripheral part that therefore can suppress through hole 22 limit of collapsing, thus can the good BOC circuit board of quality bills of materials.

[variation 6]

Figure 25 is the ideograph that the drift of the method for punching of the printed wiring circuit board that relates to of explanation variation 6 is used with the structure of metal die 640D with metal die 620D and punch die.

The method for punching of the printed wiring circuit board that variation 6 relates to, the different place of method for punching of the printed wiring circuit board that relates to example 1, be on its method for punching employed drift with metal die and punch die structure with metal die.Specifically, in the method for punching of the printed wiring circuit board that variation 6 relates to, as shown in figure 25, drift with the face relative with circuit board 20 of the stripper plate 630D of metal die 620D and punch die with BOC with the decking 642D of metal die 640D with the BOC face relative with circuit board 20 on, apply polyurethane resin R.The thickness of polyurethane resin R is for example 20 μ m.

When the BOC that uses in the method for punching to printed wiring circuit board of the present invention forms through hole 22 with circuit board 20; if the method for punching of the printed wiring circuit board that employing variation 6 relates to; then can avoid the wiring parts 30 that form with circuit board 20 surface at BOC and protective layer 26,28 (all with reference to Fig. 2) to go up formation and not wish the scar that takes place, therefore can form the BOC circuit board of high-quality.

[variation 7]

Figure 26 is the ideograph that the drift of the method for punching of the printed wiring circuit board that relates to of explanation variation 7 is used with the structure of metal die 620E.

The method for punching difference of the printed wiring circuit board that the method for punching of the printed wiring circuit board that variation 7 relates to and example 1 relate to, be employed stripper plate in its method for punching punching hole the 2nd in the interior shape of perimembranous.Promptly, in the method for punching of the printed wiring circuit board that example 1 relates to, shown in Figure 12 (a), the interior shape of the 2nd interior perimembranous 636 of the punching hole 632 of stripper plate 630, it is the interior shape that constitutes with the taper surface of the relative face tilt predetermined angular of circuit board 20 with BOC with respect to stripper plate 630, with respect to this, in the method for punching of the printed wiring circuit board that variation 7 relates to, as shown in figure 26, the interior shape of the 2nd interior perimembranous 636E of the punching hole 632E of stripper plate 630E (not shown) is the interior shape with respect to the face formation vertical with BOC usefulness circuit board 20 opposite faces of stripper plate 630E.

Like this, the method for punching of the printed wiring circuit board that variation 7 relates to, the method for punching of the printed wiring circuit board that relates to example 1, the punching hole of the stripper plate that in its method for punching, uses the 2nd in be different on the interior shape of perimembranous, but the situation of the method for punching of the printed wiring circuit board that relates to example 1 is the same, when the leading section perimembranous 634E in the 1st that is constituted as at drift 622 rose in the 2nd perimembranous 636E, compressed air was admitted to through hole 22 by punching hole 632E.Therefore, drift 622 plays a part so-called air valve, the leading section of drift 622 from punch die hole 646 in the 1st during the position the perimembranous 634E, compressed air is not admitted to through hole 22, when leading section perimembranous 634E in the 1st of drift 622 rose in the 2nd perimembranous 636E, compressed air began to be admitted to through hole 22.Consequently, needn't move up and down according to the high speed of drift 622 and at high speed compressed air be carried out break-make (ON/OFF) control, therefore control becomes easily, and the high speed of reply perforation simultaneously also becomes easy.

And then, in the method for punching of printed wiring circuit board of the present invention, can certainly have below shown in distortion.

(1) in the method for punching of the printed wiring circuit board that above-mentioned example 1 relates to,, be illustrated as example with the perforation process that comprises above-mentioned the 1st operation and operation the 2nd, but the present invention is not limited to this as perforation process.It also can be such method, for example, in the 1st operation, substitute the x direction of principal axis of BOC usefulness circuit board 20 and the calculating of the axial amount of movement of y to calculate BOC with the x direction of principal axis of circuit board 20 and the axial amount of movement of y and the axial side-play amount of z, in the 2nd operation, according to x direction of principal axis and axial amount of movement of y and the axial side-play amount of z, with travelling carriage 402 at the x direction of principal axis, move adjustment on the y direction of principal axis, and/or around the z axle, rotate adjustment, replace on x direction of principal axis and/or y direction of principal axis, moving adjustment travelling carriage 402 with this according to x direction of principal axis and the axial amount of movement of y.

(2) in the method for punching of the printed wiring circuit board that above-mentioned example 3 relates to,, be that example is illustrated with the perforation process that comprises above-mentioned 1a operation and 2a operation, but the present invention is not limited to this as perforation process.It also can be such method, for example, in the 1a operation, substitute the x direction of principal axis of BOC usefulness circuit board 20 and the calculating of the axial side-play amount of y to calculate BOC with the x direction of principal axis of circuit board 20 and the axial side-play amount of y and the axial side-play amount of z, in the 2a operation, according to x direction of principal axis and axial side-play amount of y and the axial side-play amount of z, with travelling carriage 402 at the x direction of principal axis, move adjustment on the y direction of principal axis, and/or around the z axle, rotate adjustment, replace on x direction of principal axis and/or y direction of principal axis, moving adjustment travelling carriage 402 with this according to x direction of principal axis and the axial side-play amount of y.

(3) in the method for punching of the printed wiring circuit board that above-mentioned example 1 relates to, in above-mentioned (B) angle adjustment operation, not utilize stripper plate 630 that BOC is crimped on punch die with on the metal die 640 with circuit board 20, take by imaging apparatus 670, according to this shooting results, calculate BOC and be illustrated as an example, but the present invention is not limited to this with the situation of the axial side-play amount of z of circuit board 20.Also can be in above-mentioned (B) angle adjustment operation, utilizing stripper plate 630 BOC to be crimped on punch die with circuit board 20 with under the state of metal die 640, utilize imaging apparatus 670 to take, calculate the z axial side-play amount of BOC with circuit board 20 according to this shooting results.

(4) in above-mentioned each example, be applicable to that with method for punching BOC is illustrated as illustration with the situation of circuit board, but the present invention is not limited to this with printed wiring circuit board of the present invention, can certainly use it for other printed wiring circuit boards.

Claims

1. the method for punching of a printed wiring circuit board, be to use and possess drift with metal die and have the punching machine of the punch die of decking with metal die with drift and stripper plate, on the printed wiring circuit board, implement the method for punching of the printed wiring circuit board of perforation processing usefulness, this method for punching contains following steps successively: descend by make above-mentioned drift under the state that clips above-mentioned printed wiring circuit board between above-mentioned stripper plate and the above-mentioned decking, form the 1st step of through hole on above-mentioned printed wiring circuit board;

After making above-mentioned drift rising under the constant situation of the state that keeps clipping between above-mentioned stripper plate and the above-mentioned decking above-mentioned printed wiring circuit board, punching hole by above-mentioned stripper plate is sent into above-mentioned through hole from above-mentioned drift with the metal die side with compressed air, removes the 2nd step of the perforation bits that exist on the above-mentioned through hole inboard with this punch die hole by above-mentioned decking; And

Under the constant situation of the state that keeps clipping between above-mentioned stripper plate and the above-mentioned decking above-mentioned printed wiring circuit board, above-mentioned drift is descended once more, consider the perforation that above-mentioned through hole inboard exists to be worth doing remove the 3rd step by above-mentioned punch die hole with this; It is characterized in that, form structure as described below, that is: on the inner face of above-mentioned punching hole, formation is by interior shape constituted in the 1st perimembranous corresponding to above-mentioned drift outer shape, and be located at perimembranous in the 1st the upper end, have the shape of cross section also bigger than the shape of cross section of perimembranous in the above-mentioned the 1st the 2nd in perimembranous; The leading section of above-mentioned drift from above-mentioned punching hole the above-mentioned the 1st in perimembranous when rising in the above-mentioned the 2nd perimembranous, compressed air is admitted to above-mentioned through hole by above-mentioned punching hole.

2. the method for punching of printed wiring circuit board as claimed in claim 1, it is characterized in that, on described stripper plate, formation is sent into the path that compressed air is used to above-mentioned through hole, and be communicated with above-mentioned path, around above-mentioned punching hole the above-mentioned the 2nd in the upper end of perimembranous and the air chamber that is provided with.

3. the method for punching of printed wiring circuit board as claimed in claim 1 is characterized in that, forms protuberance around the above-mentioned punch die hole of above-mentioned decking.

4. the method for punching of printed wiring circuit board as claimed in claim 1 is characterized in that, forms ditch around the above-mentioned punch die hole of above-mentioned decking.

5. the method for punching of printed wiring circuit board as claimed in claim 1 is characterized in that, forms protuberance around the above-mentioned punching hole of above-mentioned stripper plate.

6. the method for punching of printed wiring circuit board as claimed in claim 1 is characterized in that, coated with resins on the face relative with the printed wiring circuit board of the face relative with the printed wiring circuit board of described stripper plate and/or described decking.

7. the method for punching of printed wiring circuit board as claimed in claim 1, it is characterized in that, described punching machine, be to provide the circuit board supplying device of printed wiring circuit board to above-mentioned drift between with metal die with metal die and above-mentioned punch die, be and then possess and have and in the face of approximate horizontal, to move respectively along the y direction of principal axis of circuit board direction of transfer and along the x direction of principal axis vertical with foregoing circuit plate direction of transfer, and, the circuit board supplying device of the travelling carriage that can rotate around the z axle vertical and the punching machine of imaging apparatus with the face of above-mentioned approximate horizontal;

And contain following operation successively, that is:

Utilize above-mentioned imaging apparatus to take the assigned position of printed wiring circuit board, according to this shooting results, after calculating the axial side-play amount of z of printed wiring circuit board, around the z axle, rotate the above-mentioned travelling carriage of adjustment according to the axial side-play amount of above-mentioned z, with metal die the printed wiring circuit board is adjusted to the angle adjustment operation of correct angle with respect to above-mentioned drift, and

Utilize above-mentioned imaging apparatus to take the assigned position of printed wiring circuit board, according to this shooting results, on x direction of principal axis and/or y direction of principal axis, move and adjust above-mentioned travelling carriage, the printed wiring circuit board arrangement under the state of correct perforation enforcing location, is implemented the perforation process of perforation on the printed wiring circuit board.

8. the method for punching of printed wiring circuit board as claimed in claim 7 is characterized in that, described circuit board supplying device, and then also have 2 anchor clamps that clamping printed wiring circuit board is used; Described punching machine and then also possess, be set between above-mentioned 2 anchor clamps of above-mentioned travelling carriage top and can move along the x direction of principal axis with above-mentioned travelling carriage, with the printed wiring circuit board from the circuit board guiding plate of circuit board position of readiness to perforation enforcing location guiding usefulness;

Described 2 anchor clamps, formation can be in the structure of the printed wiring circuit board of the axial sandwich mounting of the x of foregoing circuit plate guided plate on foregoing circuit plate guided plate.

9. the method for punching of printed wiring circuit board as claimed in claim 8, it is characterized in that, described punching machine and then also possess be arranged on above-mentioned punch die with around the metal die, make the guiding of printed wiring circuit board more smoothly carry out the punching machine of other circuit board guiding plates usefulness, that be fixed.

10. as the method for punching of each described printed wiring circuit board of claim 7～9,

It is characterized in that described perforation process contains following operation successively, that is:

The mobile printing wired circuit board, make after the assigned position of printed wiring circuit board is in the coverage of above-mentioned imaging apparatus, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the 1st operation of the x direction of principal axis and the y direction of principal axis amount of movement of printed wiring circuit board according to this shooting results, and

According to above-mentioned x direction of principal axis and the axial amount of movement of y above-mentioned travelling carriage is moved adjustment on x direction of principal axis and/or y direction of principal axis, after utilizing above-mentioned stripper plate to be crimped onto the printed wiring circuit board on the above-mentioned decking, on the perforation predetermined position of printed wiring circuit board, implement perforation, form the 2nd operation of through hole.

11. the method for punching of printed wiring circuit board as claimed in claim 10, it is characterized in that, in described the 1st operation, x direction of principal axis and axial amount of movement of y and the axial side-play amount of z to calculate the printed wiring circuit board substitute the calculating of the x direction of principal axis and the axial amount of movement of y of printed wiring circuit board;

In described the 2nd operation, with according to above-mentioned x direction of principal axis and axial amount of movement of y and the axial side-play amount of z, above-mentioned travelling carriage is moved adjustment and/or rotate adjustment around the z axle on x direction of principal axis, y direction of principal axis, replace according to above-mentioned x direction of principal axis and the axial amount of movement of y the mobile adjustment of above-mentioned travelling carriage on x direction of principal axis and/or y direction of principal axis.

12. the method for punching of printed wiring circuit board as claimed in claim 10 is characterized in that, after described the 2nd operation, and then also contains:

The printed wiring circuit board is moved predetermined distance, so that after the through hole that above-mentioned the 2nd operation forms is disposed in the coverage of above-mentioned imaging apparatus, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, confirm whether above-mentioned through hole is formed at the 3rd operation of tram.

13. the method for punching as each described printed wiring circuit board of claim 7～9 is characterized in that described perforation process contains following operation successively, that is:

The printed wiring circuit board is provided to the perforation enforcing location, after utilizing above-mentioned stripper plate to be crimped onto the printed wiring circuit board on the above-mentioned decking, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis of printed wiring circuit board and the 1a operation of the axial side-play amount of y according to this shooting results, and

When above-mentioned x direction of principal axis and the axial side-play amount of y are in permissible range, keeping the printed wiring circuit board to be crimped under the constant situation of state on the above-mentioned decking, on the printed wiring circuit board, implement perforation, when above-mentioned x direction of principal axis and the axial side-play amount of y are not in permissible range, remove the crimped status of above-mentioned stripper plate to the printed wiring circuit board, move the above-mentioned travelling carriage of adjustment according to above-mentioned x direction of principal axis and the axial side-play amount of y at x direction of principal axis and/or y direction of principal axis, utilizing after above-mentioned stripper plate is crimped onto the printed wiring circuit board on the above-mentioned decking, on the printed wiring circuit board, implement perforation, form the 2a operation of through hole.

14. the method for punching as each described printed wiring circuit board of claim 7～9 is characterized in that described perforation process contains following operation successively, promptly

The printed wiring circuit board is provided to the perforation enforcing location, after utilizing above-mentioned stripper plate that the printed wiring circuit board is crimped on above-mentioned decking, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis of printed wiring circuit board and the 1a operation of the axial side-play amount of y according to this shooting results, and

When above-mentioned x direction of principal axis and the axial side-play amount of y are in permissible range, keeping the printed wiring circuit board to be crimped under the constant situation of state on the above-mentioned decking, on the printed wiring circuit board, implement perforation, when above-mentioned x direction of principal axis and the axial side-play amount of y are not in permissible range, remove the crimped status of above-mentioned stripper plate to the printed wiring circuit board, move the above-mentioned travelling carriage of adjustment according to above-mentioned x direction of principal axis and the axial side-play amount of y at x direction of principal axis and/or y direction of principal axis, after utilizing above-mentioned stripper plate that the printed wiring circuit board is crimped on above-mentioned decking, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis and the axial side-play amount of y of printed wiring circuit board according to this shooting results, before above-mentioned x direction of principal axis and the axial side-play amount of y reach in the permissible range, remove crimping repeatedly and move the operation of adjusting the calculating of crimping shooting side-play amount, if above-mentioned thereafter x direction of principal axis and the axial side-play amount of y reach in the permissible range, just keeping the printed wiring circuit board to be crimped under the constant situation of state on the above-mentioned decking, on the printed wiring circuit board, implement perforation, form the 2b operation of through hole.

15. the method for punching as each described printed wiring circuit board of claim 7～9 is characterized in that described perforation process contains following operation successively, that is:

The printed wiring circuit board is provided to the perforation enforcing location, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis of printed wiring circuit board and the 1b operation of the axial side-play amount of y according to this shooting results, and

When above-mentioned x direction of principal axis and the axial side-play amount of y are in permissible range, after utilizing above-mentioned stripper plate to be crimped on the printed wiring circuit board on the above-mentioned decking, on the printed wiring circuit board, implement perforation, when above-mentioned x direction of principal axis and the axial side-play amount of y are not in permissible range, on x direction of principal axis and/or y direction of principal axis, move the above-mentioned travelling carriage of adjustment according to above-mentioned x direction of principal axis and the axial side-play amount of y, after utilizing above-mentioned stripper plate that the printed wiring circuit board is crimped on above-mentioned decking, on the printed wiring circuit board, implement perforation, form the 2c operation of through hole.

16. the method for punching as each described printed wiring circuit board of claim 7～9 is characterized in that described perforation process contains following operation successively, that is:

When above-mentioned x direction of principal axis and the axial side-play amount of y are in permissible range, after utilizing above-mentioned stripper plate to be crimped on the printed wiring circuit board on the above-mentioned decking, on the printed wiring circuit board, implement perforation, when above-mentioned x direction of principal axis and the axial side-play amount of y are not in permissible range, on x direction of principal axis and/or y direction of principal axis, move the above-mentioned travelling carriage of adjustment according to above-mentioned x direction of principal axis and the axial side-play amount of y, utilize above-mentioned imaging apparatus to take the printed wiring circuit board, calculate the x direction of principal axis and the axial side-play amount of y of printed wiring circuit board according to this shooting results, before above-mentioned x direction of principal axis and the axial side-play amount of y reach in the permissible range, move repeatedly to adjust and take the operation that side-play amount is calculated, if above-mentioned thereafter x direction of principal axis and the axial side-play amount of y reach in the permissible range, just utilizing after above-mentioned stripper plate is crimped on above-mentioned decking with the printed wiring circuit board, on the printed wiring circuit board, implement perforation, form the 2d operation of through hole.

17. the method for punching of printed wiring circuit board as claimed in claim 13, it is characterized in that, in the described 1a operation, x direction of principal axis and axial side-play amount of y and the axial side-play amount of z to calculate the printed wiring circuit board substitute the x direction of principal axis of printed wiring circuit board and the calculating of the axial side-play amount of y;

In described 2a operation, with according to above-mentioned x direction of principal axis and axial side-play amount of y and the axial side-play amount of z, above-mentioned travelling carriage is moved adjustment and/or rotate adjustment around the z axle on x direction of principal axis, y direction of principal axis, substitute according to above-mentioned x direction of principal axis and the axial side-play amount of y the mobile adjustment of above-mentioned travelling carriage on x direction of principal axis and/or y direction of principal axis.

18. the method for punching as each the described printed wiring circuit board in the claim 1,3～7 is characterized in that, contains:

After above-mentioned the 3rd step, after making above-mentioned drift rising under the constant situation of the state that keeps clipping between above-mentioned stripper plate and the above-mentioned decking above-mentioned printed wiring circuit board, once more compressed air is sent into above-mentioned through hole from above-mentioned drift with the metal die side by above-mentioned punching hole, consider the perforation that above-mentioned through hole inboard exists to be worth doing remove the 4th step by above-mentioned punch die hole with this.

19. the method for punching as each the described printed wiring circuit board in the claim 1,3～7 is characterized in that, the bottom dead centre of the above-mentioned drift of the bottom dead centre of above-mentioned drift and above-mentioned the 3rd step is roughly the same in above-mentioned the 1st step.

20. method for punching as each the described printed wiring circuit board in the claim 1,3～7, it is characterized in that, in above-mentioned the 1st step, make the wiring part formation face of above-mentioned printed wiring circuit board be positioned at above-mentioned stripper plate side, above-mentioned drift is descended, on above-mentioned printed wiring circuit board, form through hole with this.

21. method for punching as each the described printed wiring circuit board in the claim 1,3～7, it is characterized in that, set a plurality of drifts at described drift on metal die, set a plurality of punch dies hole corresponding on metal die with above-mentioned a plurality of drifts at described punch die.

22. a printed wiring circuit board is characterized in that, uses the method for punching of each the described printed wiring circuit board in the claim 1,3～7 to implement perforation processing.

23. a BOC circuit board is characterized in that, uses the method for punching of each the described printed wiring circuit board in the claim 1,3～7 to implement perforation processing.