CN1946278A - Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment - Google Patents

Abstract

The present invention provides a heat exchanger, a method of manufacturing the heat exchanger, a liquid cooling system, a light source device, a projector, an electronic device unit, and electronic equipment that are well bonded to each other when forming a plurality of fine flow paths by laminating thin plates. A method of manufacturing a heat exchanger (10) having a plurality of fine flow paths (11), comprising: a step of forming a plurality of thin plate members (1a-1d) into a predetermined shape; 1d) A step of diffusion bonding.

Description

Heat exchanger, manufacturing method thereof, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment

technical field

The present invention relates to a heat exchanger having a plurality of fine flow paths, a method of manufacturing the heat exchanger, and the like.

Background technique

In recent years, projectors have been pursued for miniaturization, high luminance, long life, low cost, and the like. For example, regarding miniaturization, the size of a liquid crystal panel (light modulation element) is reduced from 1.3 inches diagonally to about 0.5 inches, and the area ratio is smaller than 1/6.

As the light source of the projector, miniaturization is achieved by using a light-emitting diode (LED: Light Emitting Diode) or a laser diode (LD: Laser Diode) as a solid-state light source. LED light sources and the like are advantageous as light sources for projectors, including a small power supply, instant on/off, wide color reproducibility, and long life. In addition, since it does not contain harmful substances such as mercury, it is also good from the viewpoint of environmental protection.

However, as the luminance of LED light sources and the like increases, heat generation from LED light sources increases and luminous efficiency decreases, so it is necessary to take measures against heat generation. The generally used forced air cooling method with a fan is insufficient in cooling efficiency, and the noise of the fan is a problem.

Therefore, there is a method of forcibly cooling LED light sources and the like with a heat exchanger having a plurality of flow paths through which liquid flows. As such a heat exchanger, as disclosed in Patent Document 1, a method of laminating a plurality of thin plates and welding them to form a plurality of flow paths has been proposed.

Patent Document 1: JP-A-2005-166855 Gazette

However, in the above technique, there is a problem that the solder used for joining the thin plates flows into the flow path and blocks the flow path. In addition, since the solder is interposed between the thin plates, there is a problem that the thermal conductivity in the stacking direction of the thin plates is greatly reduced. Furthermore, since a metal different from the thin plate is interposed, the occurrence of electrolytic corrosion becomes a problem.

Contents of the invention

The present invention was made in view of the above circumstances, and an object of the present invention is to provide a method of manufacturing a heat exchanger in which thin plates can be satisfactorily bonded when forming a plurality of fine flow paths by laminating thin plates.

In the heat exchanger, the manufacturing method of the heat exchanger, the liquid cooling system, the light source device, the projector, the electronic device unit, and the electronic equipment according to the present invention, the following means are employed to solve the above problems.

The first invention is a method of manufacturing a heat exchanger having a plurality of fine flow paths, including the steps of forming a plurality of thin plate members into a predetermined shape, and stacking and diffusion bonding the plurality of thin plate members.

According to the present invention, since different metals are not interposed between the thin plate members, the thin plate members can be satisfactorily joined. In addition, it is possible to reliably avoid troubles such as clogging of fine flow paths with other metals, occurrence of electrolytic corrosion, and reduction of thermal conductivity in the lamination direction of thin plates.

In addition, the diffusion bonding step includes alternately arranging a plurality of first thin plate members forming voids constituting the fine flow paths and a plurality of second thin plate members constituting partition walls between the fine flow paths. The step of arranging the first thin plate member and the second thin plate member in both ends or one end of the stacking direction in the lamination direction, forming a third thin plate member having a through-hole communicating with the aforementioned fine flow path and a liquid delivery pipe connected to the through-hole, and the process of applying pressure in a direction substantially parallel to the lamination direction of the first thin plate member and the second thin plate member on the region of the third thin plate member except at least the liquid delivery pipe, so even when the pressure is applied In the case where the liquid delivery pipe is formed on the surface, by applying pressure while avoiding the liquid delivery pipe, a substantially equal pressure can be applied to the plurality of thin plate members, thereby achieving good diffusion bonding.

In addition, since it includes the process of cutting the above-mentioned plurality of thin plate members integrated by diffusion bonding into a plurality and singulating into a plurality of heat exchangers, it is possible to efficiently manufacture a plurality of heat exchangers substantially at the same time, so it is possible to An inexpensive heat exchanger is realized.

The second invention is a heat exchanger having a plurality of fine flow paths, including a plurality of first thin plate members forming voids constituting the fine flow paths, and a plurality of first thin plate members constituting partition walls between the fine flow paths. For the second thin plate member, the plurality of first thin plate members and the plurality of second thin plate members are alternately diffusion bonded.

According to the present invention, since different metals are not interposed between the thin plate members, the joints of the thin plate members are performed well, whereby it is possible to reliably avoid the occurrence of electrolytic corrosion and the occurrence of fine flow paths being clogged by other metals. Defective conditions such as a decrease in thermal conductivity in the lamination direction of thin plates.

In addition, since the first thin plate member and the second thin plate member have a third thin plate member formed with a through-hole communicating with the fine flow path at both ends or one end of the stacking direction, it is possible to simultaneously form the liquid Inlet and outlet.

In addition, since the tube joint portion to which the liquid delivery tube can be connected is formed on the end surface of the above-mentioned through hole, the introduction tube and the outlet tube of the liquid can be easily attached.

The third invention is a liquid cooling system having a heat absorber in thermal contact with a heat-generating component, a pump for supplying liquid to the heat absorber, and a radiator for dissipating heat from the liquid discharged from the heat absorber, wherein the heat absorber As the heat exchanger, the heat exchanger manufactured by the method of the first invention, or the heat exchanger of the second invention is used.

According to the present invention, it is possible to realize a liquid cooling system with high heat exchange efficiency even if the contact area with the heat-generating components is small.

The fourth invention is a light source device comprising a solid-state light-emitting light source that emits light and heat by supplying current, and a liquid cooling unit for cooling the solid-state light-emitting light source, wherein the liquid cooling system of the third invention is used as the liquid cooling unit.

According to the present invention, since the heat generation of the solid-state light-emitting light source can be effectively suppressed, a high-intensity light source device can be realized.

According to a fifth invention, the projector has the light source device according to the fourth invention. According to the present invention, a compact and high-intensity projector can be realized.

The sixth invention is an electronic device unit including an electronic device that generates heat by supplying electric current, and a liquid cooling unit for cooling the electronic device, wherein the liquid cooling system of the third invention is used as the liquid cooling unit.

According to the present invention, since heat generation of electronic devices can be effectively suppressed, an electronic device unit with high processing capacity can be realized.

According to a seventh invention, the electronic device has the electronic device unit according to the sixth invention. According to the present invention, a compact electronic device with high processing capability can be realized.

Description of drawings

FIG. 1 is a diagram showing a schematic configuration of a heat exchanger.

Fig. 2 is a diagram showing a laminated board.

Fig. 3 is a cross-sectional view showing a modified example of the internal structure of the heat exchanger.

Fig. 4 is a diagram showing a modified example of the laminated board.

Fig. 5 is a diagram showing a method of applying pressure to laminated boards at the time of diffusion bonding.

Fig. 6 is a diagram showing a method of manufacturing a plurality of heat exchangers substantially simultaneously.

FIG. 7 is a diagram showing a schematic configuration of a liquid cooling system.

8 is a plan view showing a schematic configuration of a light source device.

Fig. 9 is a cross-sectional view of the light source device.

FIG. 10 is a schematic diagram showing a schematic configuration of a projector.

FIG. 11 is a diagram showing a piping configuration of a liquid cooling system provided in a projector.

FIG. 12 is a diagram showing a schematic configuration of an information processing device.

Label description

1a...laminated plate (second thin plate member), 1b...laminated plate (first thin plate member), 1c...laminated plate (third thin plate member), 1d...laminated plate (thin plate member), 2...introduction tube (liquid delivery pipe), 3...outlet pipe (liquid delivery pipe), 10...heat exchanger, 11...flow path, 12...partition wall, 15...groove, 20...liquid cooling system, 22...liquid delivery pipe, 24 ...pump, 26...radiator, 100...light source device, 120...LED chip, 500...projector, 512, 513, 514...light source device, 700...electronic device unit, 702...CPU, C...water (liquid), H …heating stuff

Detailed ways

Hereinafter, embodiments of the heat exchanger, the manufacturing method of the heat exchanger, the liquid cooling system, the light source device, the projector, the electronic device unit, and the electronic equipment of the present invention will be described with reference to the accompanying drawings.

〔Heat exchanger〕

Fig. 1 is a diagram showing a schematic configuration of a heat exchanger, Fig. 1(a) is a perspective view, Fig. 1(b) is a longitudinal sectional view, and Fig. 1(c) is a transverse sectional view.

The heat exchanger 10 is a plate-shaped member formed by laminating a plurality of metal thin plates (laminated plates 1a, 1b, etc.) with high thermal conductivity such as copper or aluminum, and has a plurality of liquids such as water W inside it. The fine flow path 11.

As shown in FIG. 1( a ), on the side of the heat exchanger 10 , an introduction pipe 2 for introducing water W into the inside, and an outlet pipe 3 for discharging the water W introduced inside are connected. In addition, the main surface of the heat exchanger 10 is formed flat so as to be in contact with the heating element H. As shown in FIG.

The direction perpendicular to the main surface in contact with the heating element H (the thickness direction of the heat exchanger 10 ) is defined as the Z direction, and the flow direction of the water W in the channel 11 is defined as the X direction.

As shown in FIG. 1( b ), a plurality of fine flow paths 11 are formed inside the heat exchanger 10 . In order to increase the contact area of the flow channel 11 with the water W, the aspect ratio (height-to-width ratio) of the cross-sectional shape of the flow channel 11 is formed to be large. Specifically, as shown in FIG. 1( c ), each flow channel 11 is formed in a substantially rectangular shape with a height of 2 to 3 mm and a width of about 50 to 100 μm.

With this configuration, the water W introduced into the heat exchanger 10 from the introduction pipe 3 is divided into a plurality of fine flow paths 11 and then discharged to the outside from the outlet pipe 3 . The flow rate of the water W is, for example, about 3 cc/sec.

Fig. 2 is a diagram showing a laminated board.

As described above, the heat exchanger 10 is formed by laminating the laminated plates 1a, 1b having high thermal conductivity such as copper or aluminum. The laminated plates 1a, 1b, etc. are formed into a predetermined shape by pressing or etching, and these laminated plates 1a, 1b are laminated and diffusion bonded by heating under pressure to form the heat exchanger 10.

The laminated plate 1 a (second thin plate member) is a thin plate member constituting a partition wall 12 for partitioning a plurality of flow paths 11 formed inside the heat exchanger 10 . As shown in FIG. 2( a ), the laminated board 1 a has a solid rectangular central part, and through-holes 31 and 32 are formed on both end sides in the longitudinal direction. The central solid portion constitutes the partition wall 12 . On the other hand, the through-holes 31 and 32 constitute a part of the flow path formed inside the heat exchanger 10, and the voids 13 formed on the upstream side and the downstream side of the plurality of fine flow paths 11, 14 (see Figure 1(b)).

In addition, the cavities 13 and 14 are spaces provided in order to allow the water W to flow through each of the plurality of flow paths 11 substantially uniformly. In addition, although the through-hole part 31 is formed in rectangular shape in FIG. 2, it may be formed in circular shape etc. as well.

The laminated plate 1 b (first thin plate member) is a thin plate member for constituting a plurality of flow paths 11 formed inside the heat exchanger 10 . The laminated plate 1b is formed in a rectangular frame shape as shown in FIG. Cavity portions 13 , 14 are formed on the upstream and downstream sides of the flow path 11 .

Furthermore, the outer shape of the laminated board 1b is the same as that of the laminated board 1a, and furthermore, the shape of a part of the through-hole portion 33 of the laminated board 1b is formed to coincide with a part of the through-hole portions 31, 32 of the laminated board 1a. .

Then, when these members are pressurized and heated, mutual diffusion occurs at the contact portion, and the two are bonded. A bonding method utilizing this is diffusion bonding. This joint does not happen instantaneously, but after a part is joined, the joint part is enlarged by the surface tension at the sharp part of the contact end, and the non-joint part (called the void (Void)) shrinks, and it disappears soon, and the entire contact surface is covered. join.

Since the base material does not enter the liquid phase during joining, there is no problem of clogging the flow path 11 due to solder flowing into the flow path 11 as in the case of using solder. In addition, there is no problem that the thermal conductivity in the stacking direction is greatly lowered due to solder being sandwiched between the laminated boards 1a, 1b, and the like. Furthermore, there is no problem of electrolytic corrosion due to the interposition of metals different from the laminated plates 1a, 1b.

In this way, the laminated plates 1a, 1b, etc. are stacked and joined by diffusion bonding, and the heat exchanger 10 having a plurality of flow channels 11 having a fine cross-sectional shape can be favorably formed.

Furthermore, as shown in FIG. 1(b), the introduction pipe 2 may be formed in advance on the laminated plate 1c (third thin plate member) or laminated plate 1d disposed at both ends of the heat exchanger 10 in the lamination direction. and outlet pipe 3. This laminated sheet 1c or laminated sheet 1d is also diffusion-bonded simultaneously with the laminated sheets 1a and 1b.

Diffusion bonding is generally performed by applying a compressive force in a direction substantially parallel to the lamination direction to the stacked laminated plates 1a to 1d, and then heating them to about 500 to 800°C. Also, this bonding is performed under reduced pressure (in vacuum). This is to prevent corrosion of the laminated boards 1a to 1d and the like.

FIG. 3 is a cross-sectional view showing a modified example of the internal structure of the heat exchanger, and FIG. 4 is a diagram showing a modified example of a laminated plate.

As shown in FIG. 3, it is also possible to form the inlet flow paths 16, 17 near the flow path 11 connected to the central part from the inlet pipe 2 and the outlet pipe 3 of the heat exchanger 10, so that the water W can easily flow to the plurality of flow paths 11. The flow path 11 in the middle part flows. In this case, the gaps 13 and 14 are formed narrower than in the case of FIG. 1 . In addition, the introduction channels 16 and 17 are constituted by laminated plates 1a and 1b.

That is, among the laminated plates 1a, 1b, the laminated plates (laminated plates 1a ₁ , 1a ₂ , 1b ₁ , 1b ) arranged on the side of the inlet pipe 2 and the outlet pipe 3 from the vicinity of the flow path 11 in the central portion ₂ ) Further forming through-hole portions 36 and the like for constituting the introduction flow paths 16 and 17.

Specifically, as shown in FIG. 4 , in the laminated plates 1a ₁ , 1b ₁ , there are further formed parts that constitute the introduction flow paths 16 , 17 that are connected to the introduction pipe 2 and the outlet pipe 3 (communicating in the Y direction). part of the through hole 36,37. In the laminated plates 1a ₂ , 1b ₂ , through hole portions 19 constituting portions connected to the void portions 13 , 14 (parts communicating in the X direction) are further formed.

In addition, in FIG. 3, the pipe joint holes 4, 5 for connecting the inlet pipe 2 and the outlet pipe 3 may be formed in advance in the laminated plate 1c or the laminated plate 1d.

In addition, in this embodiment, although the case where laminated boards 1a, 1b etc. are laminated|stacked in the Y direction was demonstrated, it may form by laminating|stacking them in the X direction.

Fig. 5 is a diagram showing a method of applying pressure to laminated boards at the time of diffusion bonding.

In the case of the diffusion-bonded laminated plates 1a to 1d, after laminating the laminated plates 1a to 1d, it is necessary to apply pressure in a direction substantially parallel to the lamination direction. However, since the inlet pipe 2 and the outlet pipe 3 are formed in advance in the laminated plate 1c, it is necessary to apply pressure in a region avoiding such an inlet pipe 2 and the outlet pipe 3.

Specifically, as shown in FIG. 5( a ), the laminated boards 1 a to 1 d are stacked, and the laminated board 1 d is placed in close contact with the bottom plate B. As shown in FIG. Then, as shown in FIG. 5( b ), a pressure P is applied to a region R of the laminated plate 1 c except for the inlet pipe 2 and the outlet pipe 3 .

Thereby, since substantially uniform pressure in the stacking direction is applied to the laminated plates 1a to 1d constituting the heat exchanger 10, these laminated plates 1a to 1d are satisfactorily bonded.

FIG. 6 is a diagram showing a method of manufacturing a plurality of heat exchangers 10 substantially simultaneously.

The size of the heat exchanger 10 is about several centimeters square. Therefore, it is not efficient to separately manufacture the heat exchanger 10 by forming, laminating, and diffusion bonding the small laminated plates 1a to 1d.

Therefore, each of the laminated boards 1a-1d is formed in the state connected to X direction and Z direction (refer FIG. 1, FIG. 4) in multiple. Then, the laminated sheets 1a to 1d thus formed are sequentially stacked in the Y direction, and further diffusion bonding is performed. Thereby, as shown in FIG. 6( a ), a plurality of heat exchangers 10 are manufactured in a state of being connected in the X direction and the Z direction.

In addition, when the pressure P is applied to the laminated plate 1c, the pressure P is applied to the region R except the inlet pipe 2 and the outlet pipe 3 as described above. For example, with a jig G shown in FIG. 6(b), the region R of the laminated board 1c is pressed.

Then, the integrated body of the plurality of heat exchangers 10 is cut with a wire saw or the like to perform singulation. Specifically, a plurality of heat exchangers 10 can be obtained by cutting along the dotted line shown in FIG. 6( a ).

By using such a manufacturing method, a plurality of heat exchangers 10 can be manufactured efficiently, and cost reduction of the heat exchanger 10 can be achieved.

〔Liquid Cooling System〕

Next, the liquid cooling system 20 including the heat exchanger 10 described above will be described.

FIG. 7 is a diagram showing a schematic configuration of the liquid cooling system 20 .

The liquid cooling system 20 has a heat exchanger 10, a liquid delivery pipe 22 connected to the inlet pipe 2 and the outlet pipe 3 of the heat exchanger 10, a pump 24 arranged at the liquid delivery pipe 22 on the inlet pipe 2 side, and a pump 24 arranged at the outlet The radiator 26 of the liquid delivery pipe 22 on the pipe 3 side.

With this configuration, the water W is supplied from the pump 24 to the inside of the heat exchanger 10 through the liquid delivery pipe 22 and the introduction pipe 2 . The heat exchanger 10 is in contact with the heat generating body H, and the heat from the heat generating body H is transferred to the water W flowing through the internal flow path 11 .

The water W heated by absorbing the heat of the heating element H is introduced from the outlet pipe 3 to the radiator 26 via the liquid delivery pipe 22 . Then, in the radiator 26, the heat of the water W is dissipated to the atmosphere.

According to the liquid cooling system 20, since the heat exchanger 10 is small, even if the contact area with the heating element H is small, the cross-sectional shape of the flow path 11 has a large aspect ratio, so the heat exchange efficiency is high. Therefore, the heat generating body H can be cooled efficiently.

〔Light source device〕

Next, the light source device 100 having the liquid cooling system 20 described above will be described.

FIG. 8 is a plan view showing a schematic configuration of the light source device 100 , and FIG. 9 is a cross-sectional view of the light source device 100 .

The light source device 100 includes a base 110 , an LED chip 120 (solid light source), a resin frame 130 , and a cover 140 .

The base 110 mounts the LED chip 120 and is closely connected to the above-mentioned liquid cooling system 20 .

The LED chips 120 emit light and generate heat by supplying current, and are flip-chip mounted on submounts (submounts) formed of silicon or the like and formed with wiring for supplying power to the LED chips 120. A thermally conductive adhesive (for example, silver paste) is mounted on the submount 110 .

In addition, a reflector 114 is arranged on the upper surface of the first base 110 , and a resin frame 130 is arranged to surround the reflector 114 . Furthermore, the cover 140 is supported by the upper part of the resin frame 130, and the space formed by the cover 140 and the resin frame 130 is filled with silicone oil or the like.

As shown in FIGS. 8 and 9 , molded outer leads (outer leads) 131, 132 are embedded on the resin frame 130, and one end of the outer leads 131, 132 is connected to the flexible substrates 117, 118 disposed on the base 110. , and the other end is connected to the connection pad formed on the submount 121 through the wire 122 or the like. Also, power is supplied to the LED chip 120 via the submount 121 , the flexible substrates 117 , 118 , the external wires 131 , 132 and the wire 122 .

Furthermore, in this embodiment, three metal wires 122 are connected to each of the external wires 131 and 132 , and the number of metal wires 122 can be changed according to the amount of power supplied to the LED chip 120 .

In light source device 100 configured in this way, when current is supplied to LED chip 120 , light is emitted from LED chip 120 , and the emitted light is emitted from light source device 100 through cover 140 . Then, the light emitted laterally from the LED chip 120 is reflected toward the cover 140 by the reflector 114 , and then is emitted from the light source device 100 through the cover 140 .

Furthermore, in the light source device 100, since the above-mentioned liquid cooling system 20 (heat exchanger 10) is closely connected to the base 110, by making the water W flow in the flow path 11 of the heat exchanger 10, it can effectively Cooling the LED chip 120 can prevent damage to the LED chip 120 due to heat. Therefore, the light source device 100 has high luminance and good reliability.

〔Projector〕

Next, a projector 500 including the light source device 100 described above will be described.

FIG. 10 is a schematic diagram showing a schematic configuration of the projector 500 . FIG. 11 is a diagram showing a piping configuration of a liquid cooling system provided in the projector 500 .

The projector 500 has light source devices 512 , 513 , and 514 , liquid crystal light valves 522 , 523 , and 524 , a cross dichroic prism 525 , and a projection lens 526 .

The three light source devices 512 , 513 , and 514 are constituted by the light source device 100 described above. LED chips emitting red (R), green (G), and blue (B) light are used for the light source devices 512 , 513 , and 514 , respectively. Furthermore, as a uniform illumination system for uniforming the illuminance distribution of the light source light, a rod lens or a fly-eye lens may be disposed behind each light source device.

The light beam from the red light source device 512 passes through the superposition lens 535R, is reflected by the reflection mirror 517 , and enters the liquid crystal light valve 522 for red light. In addition, the light beam from the green light source device 513 is transmitted through the superposition lens 535G and enters the liquid crystal light valve 523 for green light.

In addition, the light beam from the blue light source device 514 passes through the superposition lens 535B, is reflected by the reflection mirror 516 , and enters the blue light liquid crystal light valve 524 .

Furthermore, when a fly-eye lens is used as a uniform illumination system, the light beams from the respective light sources are superimposed on the display area of the liquid crystal light valve via the overlapping lens, and the liquid crystal light valve is uniformly illuminated.

In addition, polarizing plates (not shown) are arranged on the incident side and the outgoing side of each of the liquid crystal light valves 522 , 523 , and 524 . Furthermore, only linearly polarized light in a predetermined direction among the light beams from the light source devices 512 , 513 , and 514 transmits the incident-side polarizing plate, and enters the liquid crystal light valves 522 , 523 , and 524 .

In addition, a polarization conversion unit (not shown) may be provided in front of the incident-side polarizing plate. In this case, the light beam reflected by the polarizing plate on the incident side can be recycled to be incident on each liquid crystal light valve, and the utilization efficiency of light can be improved.

The three color lights modulated by the respective liquid crystal light valves 522 , 523 , and 524 are incident on the cross dichroic prism 525 . This prism is formed by pasting four rectangular prisms, and a dielectric multilayer film reflecting red light and a dielectric multilayer film reflecting blue light are arranged in a cross shape on the inner surface. Three kinds of colored light are synthesized by these dielectric multilayer films to form light for displaying color images.

Then, the combined light is projected onto a projection screen 527 by a projection lens 526 as a projection optical system, and an enlarged image is displayed.

Since the light source devices 512, 513, and 514 of the present embodiment include the liquid cooling system 20 for cooling the LED chips, high luminance can be achieved and low-cost manufacturing can be achieved. Therefore, it is possible to provide the projector 500 with excellent display characteristics at low cost.

Furthermore, as the pipeline configuration of the liquid cooling system 20 in the light source devices 512, 513, 514, it can also be the series pipeline type shown in FIG. 11(a), and the parallel pipeline type shown in FIG. 11(b). of a certain kind.

In addition, although an LED chip is used as a solid-state light-emitting light source, a semiconductor laser or the like can also be used as a solid-state light-emitting light source. Furthermore, although liquid crystal light valves are used as the light modulation means in the above projector, a micromirror array device or the like can also be used as the light modulation means.

〔Electronic device unit, electronic equipment〕

Next, the electronic device unit 700 and the information processing device 800 having the above-mentioned liquid cooling system 20 will be described.

FIG. 12 is a schematic diagram showing an example of an information processing device 800 such as a personal computer.

The information processing device (electronic device) 800 has an input unit 802 such as a keyboard, an information processing device main body (housing) 804, a display unit 806, and the like.

Furthermore, an electronic device unit 700 constituted by a CPU (Central Processing Unit) 702 and a liquid cooling system 20 for liquid cooling the CPU (Central Processing Unit) 702 is provided inside the information processing device main body 804 . Furthermore, as the pump used for the liquid cooling system 20 of the electronic device unit, it is preferable to use a micropump.

The heat generated by the CPU during driving is absorbed by the liquid cooling system 20 and suppressed below a certain temperature. Thereby, high processing capability can be exhibited. Thus, the information processing device 800 having a high computing capability can be realized.

In addition, the electronic device having the electronic device unit 700 is not limited to the information processing device 800 . Any electronic device may be used as long as it has a heating element H that should be cooled to a certain temperature or lower.

Although the best embodiments of the heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment according to the present invention have been described above with reference to the accompanying drawings, the present invention is of course not limited to the above embodiments. . The various shapes, combinations, etc. of the components shown in the above-mentioned embodiments are just examples, and various changes can be made based on design requirements and the like without departing from the spirit of the present invention.

For example, the liquid supplied to the inside (flow path) of the heat exchanger is not limited to water. Any liquid suitable for the cooling medium will suffice.

Claims (11)

1. the manufacture method of a heat exchanger, this heat exchanger has a plurality of fine channels, and this manufacture method is characterised in that, comprising:

A plurality of thin-plate elements form predetermined shape operation and

The aforementioned a plurality of thin-plate elements of lamination, make the operation of its diffusion bond.

2. the manufacture method of heat exchanger as claimed in claim 1 is characterized in that, aforementioned diffusion bond operation comprises:

Alternatively configuration is formed with a plurality of the 1st thin-plate elements in the space that constitutes aforementioned fine channel and a plurality of the 2nd thin-plate elements of the aforementioned fine channel of formation partition wall each other, and both ends or one end at the stack direction of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element, configuration be formed with the through hole that is communicated in aforementioned fine channel and be connected in this through hole liquid delivery tube the 3rd thin-plate element operation and

To aforementioned the 3rd thin-plate element except the zone of aforementioned liquids feed tube at least, by with the direction of the stack direction almost parallel of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element, the operation of exerting pressure.

3. the manufacture method of heat exchanger as claimed in claim 1 or 2 is characterized in that, comprising: the aforementioned a plurality of thin-plate elements that become one by diffusion bond cut into a plurality of, make its monolithic turn to the operation of a plurality of heat exchangers.

4. heat exchanger, it has a plurality of fine channels, it is characterized in that, has:

Be formed with the space that constitutes aforementioned fine channel a plurality of the 1st thin-plate elements and

Constitute a plurality of the 2nd thin-plate elements of aforementioned fine channel partition wall each other,

Aforementioned a plurality of the 1st thin-plate element and aforementioned a plurality of the 2nd thin-plate element be diffusion bond alternatively.

5. heat exchanger as claimed in claim 4 is characterized in that, the both ends or one end at the stack direction of aforementioned the 1st thin-plate element and aforementioned the 2nd thin-plate element have the 3rd thin-plate element that is formed with the through hole that is communicated in aforementioned fine channel.

6. heat exchanger as claimed in claim 5 is characterized in that, is formed with the pipe junction surface that can connect liquid delivery tube at the end face of aforementioned through hole.

7. liquid cooling system, it has:

With the heat dump of heat generating components thermo-contact,

To the pump of aforementioned heat dump feed fluid and

Make the radiator of the liquid heat radiation of discharging from aforementioned heat dump,

It is characterized in that,

As aforementioned heat dump, adopt heat exchanger by any one the described method manufacturing in the claim 1 to 3, perhaps adopt any one the described heat exchanger in the claim 4 to 6.

8. light supply apparatus, it has: the solid luminescence light source of and heating luminous and cool off the liquid cooling portions of this solid luminescence light source by supplying electric current, it is characterized in that, adopt the described liquid cooling system of claim 7 as aforementioned liquid cooling portions.

9. a projector is characterized in that, has the described light supply apparatus of claim 8.

10. electronic device unit, it has: electronic device that generates heat by supplying electric current and the liquid cooling portions that cools off this electronic device, it is characterized in that, as aforementioned liquid cooling portions, adopt the described liquid cooling system of claim 7.

11. an electronic equipment is characterized in that, has the described electronic device unit of claim 10.

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