CN1926698B - Deposition of Conductive Polymers - Google Patents
Deposition of Conductive Polymers Download PDFInfo
- Publication number
- CN1926698B CN1926698B CN2004800424516A CN200480042451A CN1926698B CN 1926698 B CN1926698 B CN 1926698B CN 2004800424516 A CN2004800424516 A CN 2004800424516A CN 200480042451 A CN200480042451 A CN 200480042451A CN 1926698 B CN1926698 B CN 1926698B
- Authority
- CN
- China
- Prior art keywords
- organic
- layer
- solution
- lower electrode
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001940 conductive polymer Polymers 0.000 title claims description 29
- 230000008021 deposition Effects 0.000 title claims description 16
- 239000010410 layer Substances 0.000 claims abstract description 101
- 239000012044 organic layer Substances 0.000 claims abstract description 10
- 238000002360 preparation method Methods 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 33
- 229920002120 photoresistant polymer Polymers 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 20
- 238000007639 printing Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 12
- -1 cation salt Chemical class 0.000 claims description 10
- 238000001556 precipitation Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 230000005484 gravity Effects 0.000 claims description 4
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 3
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 3
- 230000006798 recombination Effects 0.000 claims description 2
- 238000005215 recombination Methods 0.000 claims description 2
- 239000003153 chemical reaction reagent Substances 0.000 claims 6
- 238000004062 sedimentation Methods 0.000 claims 1
- 230000001376 precipitating effect Effects 0.000 abstract description 37
- 238000000151 deposition Methods 0.000 abstract description 31
- 238000001035 drying Methods 0.000 abstract description 18
- 239000011368 organic material Substances 0.000 abstract description 13
- 239000000243 solution Substances 0.000 description 53
- 239000000463 material Substances 0.000 description 37
- 229920000642 polymer Polymers 0.000 description 32
- 239000010408 film Substances 0.000 description 18
- 238000007641 inkjet printing Methods 0.000 description 11
- 239000012776 electronic material Substances 0.000 description 8
- 238000009835 boiling Methods 0.000 description 7
- 229920000620 organic polymer Polymers 0.000 description 7
- 229920000144 PEDOT:PSS Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000005525 hole transport Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 229920000123 polythiophene Polymers 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000006193 liquid solution Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 150000003384 small molecules Chemical class 0.000 description 5
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000767 polyaniline Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000002524 organometallic group Chemical group 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010405 anode material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000002322 conducting polymer Substances 0.000 description 2
- 239000000039 congener Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000000313 electron-beam-induced deposition Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 125000000609 carbazolyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3NC12)* 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005441 electronic device fabrication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/20—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Thin Film Transistor (AREA)
- Photovoltaic Devices (AREA)
Abstract
在制备有机层之前,在有机电子器件的下电极层上沉积沉淀剂。在沉积所述沉淀剂之后,在沉淀剂之上沉积有机材料。当使有机材料干燥成被处理表面上的膜时,沉淀剂引起更均匀且平坦的轮廓。
A precipitant is deposited on the bottom electrode layer of the organic electronic device prior to the preparation of the organic layer. After depositing the precipitating agent, an organic material is deposited over the precipitating agent. Precipitating agents result in a more uniform and even profile when drying the organic material into a film on the treated surface.
Description
技术领域technical field
本发明一般涉及薄膜器件处理和制备领域。更具体地,本发明涉及基于有机发光二极管的显示器和其它电子器件的制备,其中所述制备使用选择沉积。The present invention generally relates to the field of thin film device processing and fabrication. More specifically, the present invention relates to the fabrication of OLED-based displays and other electronic devices using selective deposition.
背景技术Background technique
基于LED(发光二极管)的显示器和发光系统具有多种应用。这种显示器和发光系统通过布置多个光电元件(“elements”)、例如单独LED的阵列来设计。传统上基于半导体技术的LED使用无机材料,但近来,对于某些应用来说有机LED(“OLED”)开始受欢迎。使用有机材料的其它元件/器件的例子包括有机太阳能电池、有机晶体管、有机检测器和有机激光器。还有许多生物技术应用,例如利用有机材料的用于DNA识别的生物芯片、组合的合成等。Displays and lighting systems based on LEDs (Light Emitting Diodes) have a variety of applications. Such displays and lighting systems are designed by arranging a plurality of optoelectronic elements ("elements"), such as arrays of individual LEDs. LEDs based on semiconductor technology have traditionally used inorganic materials, but recently, organic LEDs ("OLEDs") have become popular for certain applications. Examples of other elements/devices using organic materials include organic solar cells, organic transistors, organic detectors, and organic lasers. There are also many biotechnological applications, such as biochips for DNA recognition utilizing organic materials, combinatorial synthesis, etc.
一般OLED包括夹在阳极和阴极之间的两个或多个薄的至少部分导电的有机层(例如,导电空穴传输聚合物层(HTL)和发射聚合物层,其中发射聚合物层发光)。在施加的正向电位下,阳极注入空穴到导电的聚合物层中,而阴极注入电子到发射聚合物层中。注入的空穴和电子每个都朝着带相反电荷的电极移动并复合以在发射聚合物层中形成激子。通过发射辐射和处理,激子回到较低能态,并发光。A typical OLED comprises two or more thin, at least partially conductive organic layers (eg, a conductive hole transport polymer layer (HTL) and an emissive polymer layer, where the emissive polymer layer emits light) sandwiched between an anode and a cathode. . At an applied positive potential, the anode injects holes into the conducting polymer layer and the cathode injects electrons into the emissive polymer layer. The injected holes and electrons each move towards oppositely charged electrodes and recombine to form excitons in the emissive polymer layer. By emitting radiation and processing, the excitons return to a lower energy state and emit light.
其它的有机电子器件、例如有机晶体管和有机传感器一般也包含导电有机(聚合物)层和其它的有机层。许多的这些OLED或其它有机电子器件可以在例如显示系统中的衬底之上被布置成图案。在衬底之上图案化有机电子器件的一种方式是通过光刻建立袋,然后利用被称为喷墨印刷的工艺。在公布的标题为“Organic ElectroluminescentDevice and Method of Manufacturing Thereof”的专利申请号US2002/0060518A1中公开了使用光致抗蚀剂层来限定用于喷墨印刷的袋。在喷墨印刷中,聚合物或有机溶液通过将多滴溶液从印刷头排放到袋中来沉积。喷墨印刷的一个普通应用是图案化多颜色OLED像素(例如RGB图案化的像素)以制造彩色显示器。Other organic electronic devices, such as organic transistors and organic sensors, generally also contain conductive organic (polymer) layers and other organic layers. Many of these OLEDs or other organic electronic devices can be arranged in a pattern on a substrate, for example in a display system. One way of patterning organic electronic devices on top of a substrate is to create pockets by photolithography, followed by a process known as inkjet printing. The use of a photoresist layer to define pockets for inkjet printing is disclosed in published patent application number US2002/0060518A1 entitled "Organic Electroluminescent Device and Method of Manufacturing Thereof". In inkjet printing, a polymer or organic solution is deposited by discharging multiple drops of the solution from a printhead into a bag. One common application of inkjet printing is patterning multi-color OLED pixels (eg RGB patterned pixels) to make color displays.
图1示出了用于沉积溶液的现有技术的喷墨印刷系统。在图1中,正被制备的OLED显示器包括衬底109和衬底109上的阳极112。堤(bank)结构115位于阳极112上;堤结构具有孔118,通过其露出阳极(孔118可以是袋或线)。HTL 121位于阳极112的露出部分上。发射聚合物层122位于HTL 121上。在此,通过将包括发射聚合物的溶液滴124排放到HTL上、然后干燥该发射聚合物溶液来形成发射聚合物层122。通过印刷头130的喷嘴127排放发射聚合物溶液。即使发射聚合物层122具有平坦的或均匀的干燥轮廓,如果它们直接沉积在阳极112上,则HTL121的存在将影响它们的轮廓,因为它们在HTL 121的顶部上被干燥。因此,重要的是,HTL 121和发射聚合物层都具有平坦的均匀轮廓。在当前的技术状况下,HTL 121一般具有非常不均匀且凹陷的轮廓,如图2(a)所示。Figure 1 shows a prior art inkjet printing system for depositing a solution. In FIG. 1 , an OLED display being fabricated includes a substrate 109 and an anode 112 on the substrate 109 . A bank structure 115 is located on the anode 112; the bank structure has a hole 118 through which the anode is exposed (the hole 118 may be a pocket or a wire). The HTL 121 is located on the exposed portion of the anode 112. An emissive polymer layer 122 is on the HTL 121. Here, the emissive polymer layer 122 is formed by discharging a solution drop 124 including the emissive polymer onto the HTL, and then drying the emissive polymer solution. The emissive polymer solution is discharged through the nozzles 127 of the printhead 130 . Even if emissive polymer layers 122 have a flat or uniform drying profile, if they are deposited directly on anode 112, the presence of HTL 121 will affect their profile as they are dried on top of HTL 121. It is therefore important that both the HTL 121 and the emissive polymer layer have a flat uniform profile. In the current state of the art, HTL 121 generally has a very uneven and concave profile, as shown in Fig. 2(a).
正如所观察到的,干燥的图案是很不均匀的且示出了在表示一滴导电聚合物溶液的滴200的边缘上的堆积。这是由于在滴200的不同区域处蒸发速率的不同,产生了表面张力变化,其又导致物质从中心朝着滴200的边缘移动,因此在边缘比在中心最终沉积更多的物质。这种现象通常称作为Marangoni效应。该现象的普通例子是干燥咖啡点(coffee stain),其显示出在点的边缘比在中心更突出(颜色更暗)。As can be observed, the dried pattern was quite uneven and showed build-up on the edge of the
当如同在滴210的情况下存在正常的倾斜光致抗蚀剂块时,当干燥时滴210的轮廓仍是基本不均匀的。在影响该器件的有用部分的边缘存在积聚。随着干燥膜的厚度增加且变得越不均匀,通过那部分膜的电流降低,导致从那些部分发出更少的光。这是因为在膜的非均匀区域中,电特性没有保持很恒定。这将留下在可接受的器件性能方面实际可用的较少膜,如所示的。While there is a normal sloping photoresist patch as in the case of
图2(b)示出了与干燥表面上的液体溶液有关的力。如所示的,液体溶液包含很细的颗粒(小分子),其具有将溶液拉向表面的可忽略的重力作用。在滴的边缘,毛细和表面张力拉引滴易于朝着边缘拉引溶液,这导致变干材料在那些边缘的堆积。当膜变干时,如所示的,由于Marangoni效应而引起轮廓不是很均匀且在边缘比在中心厚得多。Figure 2(b) shows the forces associated with a liquid solution on a dry surface. As shown, the liquid solution contains very fine particles (small molecules) that have negligible gravitational effects pulling the solution towards the surface. At the edges of the drops, capillary and surface tension pulls on the drops tend to pull the solution towards the edges, which leads to a build-up of dried material at those edges. When the film dries, the profile is not very uniform due to the Marangoni effect and is much thicker at the edges than in the center as shown.
希望制备比一般观察到的导电聚合物膜在厚度上更均匀且由此具有更平坦的轮廓的导电聚合物膜。It would be desirable to produce conductive polymer films that are more uniform in thickness and thus have a flatter profile than is typically observed for conductive polymer films.
发明内容Contents of the invention
根据本发明,在制备有机层之前,在有机电子器件的下电极层上沉积沉淀剂。在沉积沉淀剂之后,在沉淀剂之上沉积有机材料。当有机材料被干燥成被处理表面上的膜时,沉淀剂引起更均匀且平坦的轮廓。According to the invention, a precipitating agent is deposited on the lower electrode layer of the organic electronic device prior to the preparation of the organic layer. After depositing the precipitating agent, an organic material is deposited over the precipitating agent. Precipitating agents result in a more uniform and even profile as the organic material dries into a film on the treated surface.
在本发明的一个实施例中,将沉淀剂旋涂(spin-coat)到下电极层上。在OLED是底部发射的情况下,下电极层用作阳极,而且有机材料是导电聚合物溶液。有机材料沉积在沉淀剂之上,并且在一些情况下,可以通过喷墨印刷技术来选择性地沉积。在有机材料将被喷墨印刷成形成于下电极层之上的袋中的实施例中,沉淀剂还可以被印刷,而不是被旋涂。In one embodiment of the invention, the precipitating agent is spin-coated onto the lower electrode layer. In the case of OLEDs which are bottom emitting, the bottom electrode layer serves as the anode and the organic material is a conductive polymer solution. The organic material is deposited over the precipitating agent, and in some cases, may be selectively deposited by inkjet printing techniques. In embodiments where the organic material is to be inkjet printed into pockets formed over the lower electrode layer, the precipitating agent may also be printed rather than spin coated.
附图简介Brief introduction to the drawings
图1说明了用于制备图案化表面的喷墨印刷系统的例子。Figure 1 illustrates an example of an inkjet printing system used to prepare a patterned surface.
图2(a)说明了当有和没有光致抗蚀剂的情况下滴下物质时液体物质的干燥图案。Figure 2(a) illustrates the drying pattern of a liquid substance when the substance is dropped with and without photoresist.
图2(b)示出了与干燥表面上的液体溶液有关的力。Figure 2(b) shows the forces associated with a liquid solution on a dry surface.
图3(a)说明了与干燥沉积在沉淀剂上并在其中溶解的有机溶液滴有关的力。Figure 3(a) illustrates the forces associated with drying a drop of organic solution deposited on and dissolved in a precipitant.
图3(b)说明了沉积在沉淀剂上并在其中溶解的有机溶液滴的所得到的干燥轮廓。Figure 3(b) illustrates the resulting drying profile of a drop of organic solution deposited on and dissolved in a precipitating agent.
图3(c)说明了根据本发明利用沉淀剂的印刷工艺。Figure 3(c) illustrates a printing process utilizing a precipitation agent according to the present invention.
图4说明了根据本发明的OLED器件各层的截面。Figure 4 illustrates a cross-section of the layers of an OLED device according to the invention.
图5示出了根据本发明利用沉淀剂制备OLED的工作流程。Fig. 5 shows the workflow of OLED preparation using precipitating agent according to the present invention.
具体实施方式Detailed ways
根据本发明,沉积有机(例如,导电聚合物)溶液的干燥轮廓通过在沉积有机溶液之前在沉积表面上沉积沉淀剂来改变。当有机溶液被干燥成被处理表面上的膜时,沉淀剂会引起更均匀且更平坦的轮廓。在OLED器件的情况下,沉淀剂沉积在下电极层上,其在底部发射OLED中是阳极。对于通过干燥沉积在器件上(在沉淀剂之上)的有机溶液形成的导电聚合物或其它有机层,使用沉淀剂产生了基本均匀且平坦的轮廓。According to the present invention, the drying profile of the deposited organic (eg, conductive polymer) solution is altered by depositing a precipitant on the deposition surface prior to depositing the organic solution. Precipitating agents cause a more uniform and flatter profile when the organic solution dries into a film on the treated surface. In the case of OLED devices, the precipitant is deposited on the lower electrode layer, which in bottom-emitting OLEDs is the anode. The use of a precipitant produces a substantially uniform and planar profile for a conductive polymer or other organic layer formed by drying an organic solution deposited on the device (over the precipitant).
沉淀剂可以按多种方式沉积,包括但不限于旋涂、浸渍涂布和喷墨印刷。沉淀剂优选是,1)可溶于水或水基媒质,2)具有30%或更高的溶解度,3)具有高沸点以防止快速蒸发,以及4)具有关于有机溶液的最小反应性。沉淀剂致使有机溶液的颗粒变成“重的”或尺寸上变得更大以使得重力作用更大。增加的重力作用将以更好的方式补偿毛细和表面张力。这又将更多在垂直于沉积表面而不是与之平行的方向上拉引有机溶液的分子。这减小了在干燥的同时溶液朝边缘的运动,由此引起平坦且更均匀的膜。Precipitating agents can be deposited in a variety of ways including, but not limited to, spin coating, dip coating, and inkjet printing. Precipitating agents are preferably 1) soluble in water or water-based media, 2) have a solubility of 30% or greater, 3) have a high boiling point to prevent rapid evaporation, and 4) have minimal reactivity with organic solutions. The precipitating agent causes the particles of the organic solution to become "heavy" or larger in size so that the effect of gravity is greater. The added gravitational effect will compensate capillary and surface tension in a better way. This in turn will pull more of the molecules of the organic solution in a direction perpendicular to the deposition surface rather than parallel to it. This reduces movement of the solution towards the edges while drying, thereby resulting in a flatter and more uniform film.
在本发明的一些实施例中,公开了一种制备有机电子器件的工艺,由此,1)在沉积表面上沉积沉淀剂,2)在沉淀剂之上沉积有机溶液。沉淀剂与沉积的有机溶液结合并溶解在该溶液中。使得有机溶液蒸发并干燥成具有基本平坦且均匀的轮廓的一层膜。在干燥该有机层之后,进行其它步骤以完成有机电子器件制备。这样制备的有机电子器件的例子包括OLED、有机晶体管、有机太阳能电池等等。In some embodiments of the present invention, a process for fabricating an organic electronic device is disclosed whereby 1) a precipitating agent is deposited on a deposition surface, and 2) an organic solution is deposited over the precipitating agent. The precipitating agent combines with the deposited organic solution and dissolves in this solution. The organic solution is allowed to evaporate and dry to a film with a substantially flat and uniform profile. After drying the organic layer, other steps are performed to complete the organic electronic device fabrication. Examples of organic electronic devices thus prepared include OLEDs, organic transistors, organic solar cells, and the like.
在本发明的一个实施例中,使用的沉淀剂是沸点约为240摄氏度的碳酸丙烯。在本发明的其它实施例中,使用的沉淀剂是沸点约为205摄氏度的苯甲醇。在本发明的其它实施例中,使用的沉淀剂是沸点约处于100-102摄氏度之间的二氧杂环乙烷。在本发明的其它实施例中,沉淀剂可以包括二价阳离子盐溶液。In one embodiment of the present invention, the precipitating agent used is propylene carbonate with a boiling point of about 240 degrees Celsius. In other embodiments of the invention, the precipitating agent used is benzyl alcohol with a boiling point of about 205 degrees Celsius. In other embodiments of the invention, the precipitating agent used is dioxane having a boiling point between about 100-102 degrees Celsius. In other embodiments of the invention, the precipitating agent may comprise a divalent cation salt solution.
图3(a)说明了与沉积在沉淀剂上并在其中溶解的有机溶液滴干燥有关的力。根据本发明,有机溶液的滴300沉积在溶解于其中的沉淀剂(未单独示出)之上。如图3(a)所示,沉淀剂会使该滴的颗粒变得尺寸大并且结合在一起以增加它们的重量和重力对它们的影响,由此在正交于沉积表面310的方向上向下拉引它们。这将至少部分地补偿毛细和表面张力的影响,所述毛细和表面张力趋向于将溶液的颗粒拉引向沉积的滴300的边缘。Figure 3(a) illustrates the forces associated with the drying of an organic solution droplet deposited on and dissolved in a precipitating agent. According to the present invention, a
图3(b)说明了沉积在沉淀剂并在其中溶解的有机溶液滴的所得到的干燥轮廓。如所示的,干燥成膜305的滴显示出更平坦均匀的轮廓。更显著地,如上所述,显著地减小了溶液朝着干燥膜305的边缘的堆积。Figure 3(b) illustrates the resulting drying profile of a drop of organic solution deposited on and dissolved in a precipitating agent. As shown, the drop dried into
图3(c)说明了根据本发明使用沉淀剂的印刷工艺。将沉淀剂320沉积到由在沉积表面之上制备的光致抗蚀剂结构330所限定示出的袋中。在沉积沉淀剂320之后,一滴或多滴有机溶液(未被标记)沉积到沉淀剂320上。有机溶液与沉淀剂320混合导致溶液的颗粒结合并变得更大。大颗粒尺寸有助于改变干燥的方向动态(directionaldynamics),以使得溶液在滴的边缘干燥的比一般的少。由于这种交互作用溶液干燥成均匀平坦的膜340,如所示的。在该例子中假定该溶液扩展或具有足够大的体积以接触光致抗蚀剂结构330的壁,如所示的。有机溶液可以是单滴或结合在一起成一团的独立滴的序列,这取决于液体的体积、所用的印刷技术等等。Figure 3(c) illustrates a printing process using a precipitation agent according to the present invention.
在制造的器件是OLED的本发明的一个实施例中,有机溶液是可以由例如聚乙烯二氧化噻吩(“PEDOT”)和聚苯乙烯磺酸(“PSS”)(下文“PEDOT:PSS溶液”)形成的导电聚合物溶液。对于底部发射OLED器件,沉积表面是阳极层的表面,例如其包括ITO(氧化铟锡)。以下论述沉淀剂、PEDOT:PSS以及其它有机溶液和沉积表面的例子。In one embodiment of the invention where the fabricated device is an OLED, the organic solution can be prepared from, for example, polyethylene dioxide thiophene ("PEDOT") and polystyrene sulfonic acid ("PSS") (hereinafter "PEDOT:PSS solution") ) to form a conductive polymer solution. For bottom emitting OLED devices, the deposition surface is the surface of the anode layer, eg comprising ITO (Indium Tin Oxide). Examples of precipitants, PEDOT:PSS, and other organic solutions and deposition surfaces are discussed below.
图4示出了根据本发明的有机电子器件405的实施例的截面图。如图4所示,有机电子器件405包括衬底408上的第一电极411。如说明书和权利要求中所使用的,术语“在......上”包括多层处于物理接触的情况以及多层通过一个或多个中间层隔开的情况。对于像素化(pixilated)应用可图案化第一电极411,或对于背光应用未图案化第一电极411。如果电子器件405是晶体管,则第一电极例如可以是所述晶体管的源和漏接触。光致抗蚀剂材料沉积在第一电极411上并被图案化,以形成具有露出第一电极411的孔的堤结构414。该孔可以是袋(例如,OLED显示器的像素)或线。堤结构414是使一个袋与另一个袋或一条线与另一条线电隔离的绝缘结构。FIG. 4 shows a cross-sectional view of an embodiment of an organic electronic device 405 according to the invention. As shown in FIG. 4 , the organic electronic device 405 includes a
将一种或多种有机材料沉积到孔中以形成有机叠层416的一个或多个有机层。有机叠层416位于第一电极411上。有机叠层416包括空穴传输(导电聚合物)层(“HTL”)417和其它的有源电子层420。如果第一电极411是阳极,则HTL 417位于第一电极411上。可替换地,如果第一电极是阴极,则有源电子层420位于第一电极411上,以及HTL 417位于有源电子层420上。电子器件405还包括有机叠层416上的第二电极423。如果电子器件405是晶体管,则第二电极423例如可以是所述晶体管的栅接触。还可增加不同于图4中所示的其它层,包括在第一电极411和有机叠层416之间、和/或在有机叠层416和第二电极423之间的绝缘层。以下更详细地描述根据本发明的这些层中的一些。One or more organic materials are deposited into the holes to form one or more organic layers of
衬底408:Substrate 408:
衬底408可以是可支撑在其上的有机层和金属层的任何材料。衬底408可以是透明的或不透明的(例如,不透明衬底用在顶部发射器件中)。通过改变或过滤可通过衬底408的光波长,可以改变由该器件发出的光的颜色。衬底408可以包括玻璃、石英、硅、塑料或不锈钢;优选地,衬底408包括薄的、柔性玻璃。衬底408的优选厚度取决于所使用的材料和该器件的应用。衬底408可以是薄片或连续膜的形式。例如,连续膜可以用于卷式(roll-to-roll)制造工艺,其尤其适合于塑料、金属和金属化的塑料箔。衬底还可以具有内置的晶体管或其它开关元件以控制该器件的操作。
第一电极411:The first electrode 411:
在一种结构中,第一电极411用作阳极(阳极是导电层,其用作空穴注入层且包括功函数大于约4.5eV的材料)。典型的阳极材料包括金属(例如铂、金、钯、铟等);金属氧化物(例如氧化铅、氧化锡、ITO等);石墨;掺杂的无机半导体(例如硅、锗、砷化镓等);和掺杂的导电聚合物(例如聚苯胺、聚吡咯、聚噻吩等)。In one configuration, the
对该器件内产生的光的波长,第一电极411可以是透明的、半透明的或不透明的。第一电极411的厚度从约10nm到约1000nm,优选从约50nm到约200nm,更优选为约100nm。一般可以利用用于沉积薄膜(例如包括真空蒸发、溅射、电子束沉积或化学汽相沉积)的本领域中公知的技术中的任何一种来制备第一电极411。The
在替换结构中,第一电极层411用作阴极(阴极是导电层,其用作电子注入层且包括具有低功函数的材料)。在例如顶部发射OLED的情况下,阴极,而不是阳极,沉积在衬底408上。以下在“第二电极423”的部分中列出了典型的阴极材料。In an alternative structure, the
堤结构414:Dike Structures 414:
堤结构414由光致抗蚀剂材料、例如聚酰亚胺或聚硅氧烷制成。光致抗蚀剂材料可以是正光致抗蚀剂材料或负光致抗蚀剂材料。堤结构414是使一个袋与另一个袋或一条线与另一条线电隔离的绝缘结构。堤结构414具有露出第一电极411的孔415。孔415可表示袋或线。通过对光致抗蚀剂材料应用光刻技术或通过利用丝网印刷或苯胺印刷以所希望的图案沉积块材料来图案化堤结构414。如图4所示,堤结构414例如可以具有在其中堤结构414的侧壁和第一电极411之间的角度是钝角的梯形结构。可替换地,实际上堤结构可以是半圆或弯曲的。The
HTL 417:HTL 417:
HTL 417具有比电子迁移率更高的空穴迁移率并且用于使空穴从第一电极411有效地传输到基本均匀的有机聚合物层420。HTL 417由聚合物或小分子材料制成。例如,HTL 417可以由形式为小分子或聚合物的叔胺或咔唑衍生物、导电聚苯胺(“PANI”)或PEDOT:PSS制成。HTL 417具有从约5nm到约1000nm、优选从约20nm到约500nm以及更优选从约50到约250nm的厚度。The
HTL 417用作:(I)缓冲,以提供与衬底的良好接合;和/或(2)空穴注入层,以促进空穴注入;和/或(3)空穴传输层,以促进空穴传输。
可以利用选择沉积技术或非选择沉积技术沉积HTL 417。选择沉积技术的例子包括例如喷墨印刷、弯曲印刷和丝网印刷。非选择沉积技术的例子包括例如旋涂、浸渍涂布、网状涂布、和喷射涂布。如果使用印刷技术,则将空穴传输材料沉积在第一电极411上,然后使其干燥。干燥的材料代表空穴传输层。
如上所述,根据本发明,在任何沉积用于形成HTL 417的有机材料之前,在第一电极层411上沉积沉淀剂。典型的HTL材料的一个例子是PEDOT:PSS溶液,例如Baytron P AI4083,其具有PEDOT与PSS一份对六份的比。在沉积HTL材料之前,在第一电极411上添加沉淀剂产生了干燥的HTL 417,其比一般情况在轮廓上更均匀且平坦。然而使用由H.C.Starck、Bayer AG的分部制造的Baytron P AI4083仅仅是示范性的。As described above, according to the present invention, a precipitant is deposited on the
通过在其上要干燥溶液的表面(例如,第一电极411)上沉积沉淀剂,本发明可以用于提供任何PEDOT:PSS溶液或任何有机溶液的平坦且均匀的干燥轮廓。可以沉积用于导电聚合物溶液的示范性沉淀剂是:1)沸点在100-102℃左右的二氧杂环乙烷,2)沸点在240℃左右的碳酸丙烯,3)沸点在205℃左右的苯甲醇,和4)高浓度的二价阳离子盐,例如氯化钙和/或硫酸镁,只要盐是水可溶解的,以便引起沉淀。The present invention can be used to provide a flat and uniform drying profile of any PEDOT:PSS solution or any organic solution by depositing a precipitating agent on the surface (eg first electrode 411 ) on which the solution is to be dried. Exemplary precipitants that can be deposited for conducting polymer solutions are: 1) dioxane with a boiling point around 100-102°C, 2) propylene carbonate with a boiling point around 240°C, 3) a boiling point around 205°C Benzyl alcohol, and 4) high concentrations of divalent cation salts, such as calcium chloride and/or magnesium sulfate, as long as the salt is water soluble so as to cause precipitation.
有源电子层420:Active electronic layer 420:
有源电子层420可以包括一层或多层。有源电子层420包括有源电子材料。有源电子材料可以包括单一有源电子材料、有源电子材料的组合、或单一或组合有源电子材料的多层。优选地,至少一种有源电子材料是有机的。The
对于有机LED(OLED),有源电子层316包含至少一种发光的有机材料。这些有机发光材料一般分成两种。称作为聚合发光二极管或PLED的第一种OLED利用聚合物作为部分有源电子层420。实际上,聚合物可以是有机的或有机金属的。如在此所使用的,术语“有机”还包括有机金属材料。优选地,使这些聚合物在有机溶剂(例如甲苯或二甲苯)中变成溶剂化物,并旋涂到该器件上,尽管其它方法是可以的。尤其优选利用有源电子层316中的聚合有源电子材料的器件。除发光的材料外,有源电子层420还可包括响应于光吸收改变其电特性的光响应材料。一般光响应材料用在检测器和将光能转换成电能的太阳能面板中。For an organic LED (OLED), the active electronic layer 316 includes at least one light-emitting organic material. These organic light-emitting materials are generally classified into two types. The first type of OLED, known as a polymeric light emitting diode or PLED, utilizes a polymer as part of the active
如果有机电子器件是OLED或有机激光器,则有机聚合物是发光的电致发光(“EL”)聚合物。发光有机聚合物可以是例如具有共轭重复单元的EL聚合物,尤其是在其中以共轭的形式接合相邻重复单元的EL聚合物,例如聚噻吩、聚亚苯基、聚噻吩乙烯撑、或聚-p-亚苯基乙烯撑或它们的同族、共聚物、衍生物或其混合物。更具体地,有机聚合物可以是例如:聚芴;发射白、红、蓝、黄或绿光且是2-或2,5-取代基的聚-p-亚苯基乙烯撑的聚-p-亚苯基乙烯撑;聚螺聚合物。If the organic electronic device is an OLED or an organic laser, the organic polymer is an electroluminescent ("EL") polymer that emits light. The light-emitting organic polymer can be, for example, an EL polymer having conjugated repeat units, especially EL polymers in which adjacent repeat units are joined in a conjugated form, such as polythiophene, polyphenylene, polythiophenevinylene, Or poly-p-phenylene vinylene or their congeners, copolymers, derivatives or mixtures thereof. More specifically, the organic polymer may be, for example: polyfluorene; poly-p - phenylene vinylene; polyspiro polymer.
如果有机电子器件是有机太阳能电池或有机光检测器,则有机聚合物是响应于光吸收改变其电特性的光响应材料。光响应材料将光能转换成电能。If the organic electronic device is an organic solar cell or an organic photodetector, an organic polymer is a photoresponsive material that changes its electrical properties in response to light absorption. Photoresponsive materials convert light energy into electrical energy.
如果有机电子器件是有机晶体管,则有机聚合物例如可以是聚合的和/或低聚半导体。聚合半导体可以包括例如聚噻吩、聚(3-烷基)噻吩、聚噻吩基乙烯撑、聚(对-亚苯基乙烯撑)、或聚芴或它们的同族、共聚物、衍生物或其混合物。If the organic electronic device is an organic transistor, the organic polymer can be, for example, a polymeric and/or oligomeric semiconductor. Polymeric semiconductors may include, for example, polythiophene, poly(3-alkyl)thiophene, polythienylvinylene, poly(p-phenylenevinylene), or polyfluorene or their congeners, copolymers, derivatives, or mixtures thereof .
除了聚合物外,发荧光或磷光的小有机分子可以用作存在于有源电子层316中的发光材料。不同于应用为溶液或悬浮液的聚合物材料,小分子发光材料优选通过蒸发、升华或有机汽相沉积法来沉积。PLED材料和小有机分子的组合还可以用作有源电子层。例如,PLED可与小有机分子化学衍生或与小有机分子简单混合以形成有源电子层316。In addition to polymers, small organic molecules that fluoresce or phosphoresce can be used as light emitting materials present in the active electronic layer 316 . Unlike polymeric materials applied as solutions or suspensions, small molecule luminescent materials are preferably deposited by evaporation, sublimation or organic vapor deposition. Combinations of PLED materials and small organic molecules can also serve as active electronic layers. For example, a PLED may be chemically derivatized or simply mixed with small organic molecules to form the active electron layer 316 .
除发光的有源电子材料外,有源电子层420可以包括能够进行电荷传输的材料。电荷传输材料包括可以传输载荷子的聚合物或小分子。例如,可使用有机材料,例如聚噻吩、衍生的聚噻吩、低聚聚噻吩、衍生的低聚聚噻吩、并五苯、包括C60的组合物、和包括衍生的C60的组合物。有源电子层420还可包括半导体,例如硅或砷化镓。The active
第二电极(423):Second electrode (423):
在一个实施例中,当电位施加在第一电极411和第二电极423两端时,第二电极423用作阴极。在该实施例中,当电位施加在用作阳极的第一电极411和用作阴极的第二电极423两端时,光子从有源电子层420被释放,其穿过第一电极411和衬底408。In one embodiment, the
虽然可以用作阴极的许多材料对于本领域技术人员是公知的,但最优选使用包括铝、铟、银、金、镁、钙和钡的组合物、或其组合、或其合金。While many materials that can be used as cathodes are known to those skilled in the art, it is most preferred to use a combination comprising aluminum, indium, silver, gold, magnesium, calcium and barium, or combinations thereof, or alloys thereof.
优选地,第二电极423的厚度从约10到约1000纳米(nm),更优选从约50到约500nm,最优选从约100到约300nm。虽然对于本领域普通技术人员来说可以沉积第一电极材料的许多方法是公知的,但优选真空沉积法,例如物理汽相沉积(PVD)。还可使用其它层(未示出)、例如阻挡层和吸气层来保护电子器件。这些层在本领域中是公知的,且在此没有具体地论述。Preferably, the thickness of the
图5示出了根据本发明制备有机电子器件的工作流程。首先,在衬底之上制备/图案化下电极层(步骤510)。在OLED器件的情况下,下电极层优选用作阳极。典型的阳极材料包括金属(例如,铝、银、铜、铟、钨、铅等);金属氧化物;石墨;掺杂的无机半导体(例如掺杂的硅、砷化镓等);和掺杂的导电聚合物(例如聚苯胺、聚噻吩等)。对于OLED,下电极层一般足够薄以成为半透明且使至少一部分光透过(在底部发射OLED中)。同样地,可在制备步骤510中使用任何薄膜沉积法。这些包括、但不限于真空蒸发、溅射、电子束沉积、化学汽相沉积、蚀刻和本领域中公知的其它技术和其组合。一般该工艺还包括在受控空气下的烘焙或退火步骤,以优化阳极层的导电性和光透射性。然后光刻可以用于限定下电极层中的任意图案。Fig. 5 shows the workflow for fabricating organic electronic devices according to the present invention. First, a bottom electrode layer is prepared/patterned over a substrate (step 510). In the case of OLED devices, the lower electrode layer is preferably used as anode. Typical anode materials include metals (e.g., aluminum, silver, copper, indium, tungsten, lead, etc.); metal oxides; graphite; doped inorganic semiconductors (e.g., doped silicon, gallium arsenide, etc.); Conductive polymers (such as polyaniline, polythiophene, etc.). For OLEDs, the bottom electrode layer is generally thin enough to be semi-transparent and transmit at least some light (in bottom emitting OLEDs). Likewise, any thin film deposition method may be used in the preparation step 510 . These include, but are not limited to, vacuum evaporation, sputtering, electron beam deposition, chemical vapor deposition, etching and other techniques known in the art and combinations thereof. Typically the process also includes a baking or annealing step under controlled atmosphere to optimize the conductivity and light transmission of the anode layer. Photolithography can then be used to define arbitrary patterns in the lower electrode layer.
下一个步骤是增加光致抗蚀剂堤结构以限定阳极层中的袋(步骤520)。光致抗蚀剂堤通过对光致抗蚀剂材料应用光刻技术(或通过利用丝网印刷或苯胺印刷来在所希望的图案中沉积堤材料)来制备。光致抗蚀剂材料一般分成两种类型,正的或负的。正光致抗蚀剂是在暴露于光的地方溶解的光致抗蚀剂。负光致抗蚀剂是在除暴露于光的地方之外的任何位置溶解的光致抗蚀剂。根据在形成光致抗蚀剂堤时的需要可以使用正的或负的光致抗蚀剂。光致抗蚀剂化学和工艺(例如可以用于将光致抗蚀剂图案化成堤的光刻、烘焙、显影、蚀刻和辐射曝光)对于本领域技术人员来说是公知的。The next step is to add photoresist bank structures to define pockets in the anode layer (step 520). Photoresist banks are prepared by applying photolithographic techniques to the photoresist material (or by using screen printing or flexographic printing to deposit the bank material in the desired pattern). Photoresist materials are generally classified into two types, positive or negative. Positive photoresists are photoresists that dissolve where exposed to light. Negative photoresist is photoresist that dissolves everywhere except where it is exposed to light. Positive or negative photoresist can be used as desired in forming the photoresist banks. Photoresist chemistry and processes such as lithography, baking, development, etching, and radiation exposure that can be used to pattern photoresist into banks are well known to those skilled in the art.
根据本发明,下一个步骤是沉积沉淀剂到由光致抗蚀剂结构限定的袋中(步骤525)。沉淀剂将改变跟随它的导电聚合物溶液的分子特性、使分子更大并且更易受重力的影响。在本发明的一个实施例中,利用选择沉积技术印刷沉淀剂。在本发明的替换实施例中,步骤525可代替之前的步骤520,以便在制备光致抗蚀剂结构之前沉积沉淀剂。在这些实施例中,沉淀剂可以被旋涂沉积或浸渍/滚压。According to the present invention, the next step is to deposit a precipitation agent into the pocket defined by the photoresist structure (step 525). The precipitating agent will change the molecular properties of the conductive polymer solution that follows it, making the molecules larger and more susceptible to gravity. In one embodiment of the invention, the precipitant is printed using a selective deposition technique. In an alternative embodiment of the present invention, step 525 may replace the previous step 520 to deposit a precipitant prior to preparing the photoresist structure. In these embodiments, the precipitant may be deposited by spin coating or dipped/rolled.
接下来,通过在沉淀剂之上沉积导电聚合物溶液(步骤530)来印刷导电聚合物层。优选利用印刷技术例如喷墨印刷(丝网印刷、苯胺印刷)来施加导电聚合物层。尤其是,在该情况下,在由光致抗蚀剂堤限定的袋内印刷导电聚合物层。通过沉积有机溶液到沉淀剂之上的袋中并使该混合物干燥来印刷导电聚合物层。于是干燥膜代表导电聚合物层。添加沉淀剂能够使导电聚合物层在完成干燥之后具有均匀平坦的轮廓。导电聚合物层还称作为空穴传输层(“HTL”)。导电聚合物层用于改善例如电荷平衡、显示器稳定性、接通电压、显示器亮度、显示器效率和显示器寿命。导电聚合物层用于相对于施加到其两端的电位增强OLED的空穴流量,由此有助于更节省能量地将空穴注入到发射聚合物层中用于复合。Next, a conductive polymer layer is printed by depositing a conductive polymer solution over the precipitating agent (step 530). The conductive polymer layer is preferably applied using printing techniques such as inkjet printing (screen printing, flexographic printing). In particular, in this case a conductive polymer layer is printed inside pockets defined by banks of photoresist. The conductive polymer layer is printed by depositing an organic solution into a pocket over a precipitating agent and allowing the mixture to dry. The dry film then represents the conductive polymer layer. The addition of a precipitating agent enables the conductive polymer layer to have a uniform and flat profile after drying is complete. The conductive polymer layer is also referred to as a hole transport layer ("HTL"). Conductive polymer layers are used to improve, for example, charge balance, display stability, turn-on voltage, display brightness, display efficiency, and display lifetime. The conductive polymer layer serves to enhance the hole flux of the OLED relative to the potential applied across it, thereby facilitating more energy-efficient injection of holes into the emissive polymer layer for recombination.
然后根据步骤535,印刷发射聚合物层。发射聚合物层主要负责从OLED发射光,并且由此是如上所论述的电致发光的、半导电的且有机(有机-金属)类型的材料。在喷墨印刷中,可以有多种不同的发射聚合物质。例如,在印刷头中可以有红、绿和蓝发光聚合物,其取决于由袋限定的给定像素位置中要发射的所希望颜色地被沉积。在由袋限定的精确区域中通过印刷头将发射聚合物物质沉积在导电聚合物层上。发射聚合物层由印刷头沉积的物质的干燥产生。Then according to step 535, the emissive polymer layer is printed. The emissive polymer layer is primarily responsible for emitting light from the OLED, and is thus an electroluminescent, semiconducting and organic (organo-metallic) type of material as discussed above. In inkjet printing, a variety of different emissive polymeric substances are possible. For example, in the printhead there may be red, green and blue light emitting polymers deposited depending on the desired color to be emitted in a given pixel location defined by the pocket. The emissive polymer substance is deposited on the conductive polymer layer by a print head in precise areas defined by the pockets. The emissive polymer layer results from the drying of the material deposited by the print head.
导电聚合物层和发射聚合物层可以通过将液体溶液沉积在限定袋的光致抗蚀剂提之间来印刷。该液体溶液可以是能够在压力下流动的任何“流体”或可变形团,且可包括溶液、墨水、浆糊、乳胶、分散剂等等。该液体还包含影响沉积滴的粘性、接触角、变厚、亲合力、干燥、稀释度等的其它物质或由其补充。The conductive polymer layer and the emissive polymer layer can be printed by depositing a liquid solution between layers of photoresist that define pockets. The liquid solution may be any "fluid" or deformable mass capable of flowing under pressure, and may include solutions, inks, pastes, latexes, dispersions, and the like. The liquid also contains or is supplemented by other substances that affect the viscosity, contact angle, thickening, affinity, drying, dilution, etc. of the deposited droplet.
在印刷发射聚合物层之后,形成/沉积上电极层(步骤540)。在OLED器件中,上电极层用作阴极(如果下电极层是阳极)。以上论述了阴极层材料。在上电极层下面还可使用绝缘材料例如LiF、NaF、CsF等来通过隧穿增强注入。一般利用真空蒸发或类似的技术并且常使用特别设计的沉积器件来形成/沉积下电极层。例如增加掩模和光致抗蚀剂的其它步骤通常可在阴极沉积步骤540之前进行。然而,这些不是具体列举的,因为它们不具体涉及本发明的新颖方面。在工作流程中还可包括其它步骤(未示出),如增加连接阳极线与电源的金属线。图5的工作流程不旨在包含所有的并且仅仅是示范性的。例如,在制备OLED之后,通常将其封装以保护所述层不受环境损伤或曝光。这些其它的处理步骤在本领域中是公知的并且不是本发明的主题。After printing the emissive polymer layer, a top electrode layer is formed/deposited (step 540). In an OLED device, the upper electrode layer acts as the cathode (if the lower electrode layer is the anode). Cathode layer materials are discussed above. An insulating material such as LiF, NaF, CsF, etc. may also be used under the upper electrode layer to enhance implantation by tunneling. The lower electrode layer is typically formed/deposited using vacuum evaporation or similar techniques and often using specially designed deposition equipment. Other steps such as adding a mask and photoresist can typically be performed prior to cathode deposition step 540 . However, these are not specifically listed as they do not specifically relate to the novel aspects of the invention. Other steps (not shown) may also be included in the workflow, such as adding a metal wire connecting the anode wire and the power supply. The workflow of Figure 5 is not intended to be all inclusive and is merely exemplary. For example, after an OLED is fabricated, it is typically encapsulated to protect the layers from environmental damage or exposure. These other processing steps are well known in the art and are not the subject of the present invention.
沉淀剂的引入可以用于提供沉积在其上的任何导电聚合物溶液或任何有机溶液的平坦且均匀的干燥轮廓。由此本发明不限于任意一种类型的沉淀剂或沉积溶液。The introduction of a precipitating agent can be used to provide a flat and uniform drying profile of any conductive polymer solution or any organic solution deposited thereon. Thus the present invention is not limited to any one type of precipitant or deposition solution.
虽然说明了本发明的实施例,其中它主要结合在OLED显示器内,但几乎使用干燥膜层的任何类型的电子器件可以是针对这些实施例的可能应用。尤其是,本发明还可用于太阳能电池、晶体管、光电晶体管、激光器、光电检测器、或光耦合器。它还可用于生物应用(例如生物传感器)或化学应用(例如组合合成等的应用)中。较早描述的OLED显示器可以用在例如计算机显示器、交通工具的信息显示器、电视监控器、电话机、印刷机和照明标志的应用中的显示器内。While embodiments of the invention are described where it is primarily incorporated within OLED displays, virtually any type of electronic device using dry film layers may be a possible application for these embodiments. In particular, the invention can also be used in solar cells, transistors, phototransistors, lasers, photodetectors, or optocouplers. It can also be used in biological applications (such as biosensors) or chemical applications (such as applications in combinatorial synthesis, etc.). The OLED displays described earlier can be used in displays in applications such as computer monitors, information displays for vehicles, television monitors, telephones, printing presses, and illuminated signs.
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/758,478 | 2004-01-14 | ||
US10/758,478 US20050151129A1 (en) | 2004-01-14 | 2004-01-14 | Deposition of conducting polymers |
PCT/EP2004/014801 WO2005069402A1 (en) | 2004-01-14 | 2004-12-29 | Deposition of conducting polymers |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1926698A CN1926698A (en) | 2007-03-07 |
CN1926698B true CN1926698B (en) | 2010-06-02 |
Family
ID=34740137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800424516A Expired - Fee Related CN1926698B (en) | 2004-01-14 | 2004-12-29 | Deposition of Conductive Polymers |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050151129A1 (en) |
EP (1) | EP1709701B1 (en) |
JP (1) | JP2007524235A (en) |
KR (2) | KR101200001B1 (en) |
CN (1) | CN1926698B (en) |
TW (1) | TWI259018B (en) |
WO (1) | WO2005069402A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE518259T1 (en) * | 2004-11-09 | 2011-08-15 | Creator Technology Bv | SELF-ALIGNED METHOD FOR PRODUCING ORGANIC TRANSISTORS |
JP5098159B2 (en) * | 2005-11-29 | 2012-12-12 | 凸版印刷株式会社 | Thin film transistor manufacturing method |
JP2008109116A (en) * | 2006-09-26 | 2008-05-08 | Dainippon Printing Co Ltd | Organic semiconductor element, manufacturing method of the organic semiconductor element, organic transistor array and display |
JP5216237B2 (en) * | 2007-05-16 | 2013-06-19 | パナソニック株式会社 | Semiconductor device and manufacturing method thereof |
US20100071765A1 (en) * | 2008-09-19 | 2010-03-25 | Peter Cousins | Method for fabricating a solar cell using a direct-pattern pin-hole-free masking layer |
US9196426B2 (en) | 2009-12-14 | 2015-11-24 | California Institute Of Technology | Electrodes incorporating nanostructured polymer films for electrochemical ion storage |
WO2011077476A1 (en) * | 2009-12-22 | 2011-06-30 | パナソニック株式会社 | Display device and method for manufacturing same |
JP2012089857A (en) * | 2011-11-28 | 2012-05-10 | Dainippon Printing Co Ltd | Method of producing patterned body, and organic thin film transistor |
CN114914278A (en) * | 2022-04-07 | 2022-08-16 | 合肥京东方卓印科技有限公司 | Display panel, preparation method thereof and display device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1172765A (en) * | 1966-04-18 | 1969-12-03 | Gaf Corp | Improvements in or relating to Electroplating Aluminium with Copper or Chromium |
FR2690567A1 (en) * | 1992-04-24 | 1993-10-29 | Alsthom Cge Alcatel | Electrochemical generators and super condensers prodn. - by conductive ion ink screen printing current collector, electrode, electrolytic separator and encapsulating layers in situ e.g. on circuit board with electronically conductive material |
EP1083775A1 (en) * | 1999-03-29 | 2001-03-14 | Seiko Epson Corporation | Composition, method for preparing film, and functional element and method for preparing the same |
EP1372195A2 (en) * | 1997-09-02 | 2003-12-17 | Seiko Epson Corporation | Organic el element manufacturing process and organic el element |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60243280A (en) | 1984-05-14 | 1985-12-03 | Alps Electric Co Ltd | Formation of transparent electrode |
JPH0424970A (en) | 1990-05-16 | 1992-01-28 | Canon Inc | Organic solar cell |
GB2331400B (en) * | 1996-07-29 | 2001-01-17 | Cambridge Display Tech Ltd | Electroluminescent devices with electrode protection |
US6316786B1 (en) * | 1998-08-29 | 2001-11-13 | International Business Machines Corporation | Organic opto-electronic devices |
JP3951162B2 (en) * | 2000-03-31 | 2007-08-01 | セイコーエプソン株式会社 | Microstructure manufacturing method, organic EL device manufacturing method, and electronic device manufacturing method |
ATE475198T1 (en) * | 2000-11-17 | 2010-08-15 | Tpo Displays Corp | ORGANIC ELECTROLUMINENCE COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
US6861091B2 (en) * | 2000-12-27 | 2005-03-01 | Canon Kabushiki Kaisha | Self-assembly of organic-inorganic nanocomposite thin films for use in hybrid organic light emitting devices (HLED) |
JP3949975B2 (en) | 2001-05-24 | 2007-07-25 | 三菱レイヨン株式会社 | Latex, polymer, and polymer coagulation and recovery method |
JP2003155289A (en) * | 2001-07-09 | 2003-05-27 | Merck Patent Gmbh | Mono-, oligo-, and polydithienopyridines and their use as charge transfer materials |
EP1338431A3 (en) * | 2002-02-08 | 2003-10-01 | Fuji Photo Film Co., Ltd. | Visible image receiving material having surface hydrophilicity |
JP3925257B2 (en) * | 2002-03-15 | 2007-06-06 | セイコーエプソン株式会社 | Connection line penetrating structure in airtight chamber, discharge device including the same, liquid crystal display device manufacturing method, organic EL device manufacturing method, electron emission device manufacturing method, PDP device manufacturing method, electrophoretic display device manufacturing Method, color filter manufacturing method, organic EL manufacturing method, spacer forming method, metal wiring forming method, lens forming method, resist forming method, and light diffuser forming method |
JP4239560B2 (en) * | 2002-08-02 | 2009-03-18 | セイコーエプソン株式会社 | Composition and method for producing organic conductive film using the same |
JP3900125B2 (en) * | 2002-11-26 | 2007-04-04 | セイコーエプソン株式会社 | Method for manufacturing organic electroluminescence device |
-
2004
- 2004-01-14 US US10/758,478 patent/US20050151129A1/en not_active Abandoned
- 2004-12-29 CN CN2004800424516A patent/CN1926698B/en not_active Expired - Fee Related
- 2004-12-29 JP JP2006548177A patent/JP2007524235A/en active Pending
- 2004-12-29 KR KR1020067016254A patent/KR101200001B1/en not_active IP Right Cessation
- 2004-12-29 EP EP04804387A patent/EP1709701B1/en not_active Ceased
- 2004-12-29 KR KR1020127006578A patent/KR20120039760A/en not_active Application Discontinuation
- 2004-12-29 WO PCT/EP2004/014801 patent/WO2005069402A1/en active Application Filing
-
2005
- 2005-01-12 TW TW094100838A patent/TWI259018B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1172765A (en) * | 1966-04-18 | 1969-12-03 | Gaf Corp | Improvements in or relating to Electroplating Aluminium with Copper or Chromium |
FR2690567A1 (en) * | 1992-04-24 | 1993-10-29 | Alsthom Cge Alcatel | Electrochemical generators and super condensers prodn. - by conductive ion ink screen printing current collector, electrode, electrolytic separator and encapsulating layers in situ e.g. on circuit board with electronically conductive material |
EP1372195A2 (en) * | 1997-09-02 | 2003-12-17 | Seiko Epson Corporation | Organic el element manufacturing process and organic el element |
EP1083775A1 (en) * | 1999-03-29 | 2001-03-14 | Seiko Epson Corporation | Composition, method for preparing film, and functional element and method for preparing the same |
Non-Patent Citations (2)
Title |
---|
JP平4-24970A 1992.01.28 |
JP昭60-243280A 1985.12.03 |
Also Published As
Publication number | Publication date |
---|---|
EP1709701A1 (en) | 2006-10-11 |
KR101200001B1 (en) | 2012-11-12 |
EP1709701B1 (en) | 2012-04-18 |
CN1926698A (en) | 2007-03-07 |
JP2007524235A (en) | 2007-08-23 |
KR20120039760A (en) | 2012-04-25 |
TW200527945A (en) | 2005-08-16 |
TWI259018B (en) | 2006-07-21 |
WO2005069402A1 (en) | 2005-07-28 |
KR20060123535A (en) | 2006-12-01 |
US20050151129A1 (en) | 2005-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20060159842A1 (en) | Printing of organic electronic devices | |
US7132788B2 (en) | Optimal bank shapes for inkjet printing | |
KR101628405B1 (en) | Electronic devices and methods of making the same using solution processing techniques | |
US7629061B2 (en) | Heterostructure devices using cross-linkable polymers | |
Lan et al. | Inkjet printing for electroluminescent devices: emissive materials, film formation, and display prototypes | |
US6555840B1 (en) | Charge-transport structures | |
TWI238023B (en) | Organic electroluminescent device, manufacturing method thereof, and electronic apparatus thereof | |
KR101366655B1 (en) | Neutralized anode buffer layers to improve processing and performances of organic electronic devices | |
US7022534B2 (en) | Optimal bank height for inkjet printing | |
US20070087469A1 (en) | Particulate for organic and inorganic light active devices and methods for fabricating the same | |
WO2005041322A1 (en) | Solvent mixtures for an organic electronic device | |
US20060231844A1 (en) | Organic optoelectronic device | |
JP2007027763A (en) | Organic light emitting diode device having multiple stacked layers, and organic light emitting diode device | |
JP2007095343A (en) | Method of manufacturing printed material, and printed material | |
CN1926698B (en) | Deposition of Conductive Polymers | |
US20050156176A1 (en) | Method for printing organic devices | |
US20050276910A1 (en) | Post processing of films to improve film quality | |
US7407716B2 (en) | Light emitting devices with multiple light emitting layers to achieve broad spectrum | |
Xie | Solution-Processed Organic Light-Emitting Devices | |
US20060065889A1 (en) | Compositions for making organic thin films used in organic electronic devices | |
JP2007027130A (en) | Organic electronic device manufacturing method and organic electronic device | |
JP2007533091A (en) | Method for patterning functional material on a substrate | |
CN113707832A (en) | Display device and manufacturing method thereof | |
CN113707820A (en) | Display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: OSRAM OLED GMBH Free format text: FORMER OWNER: OSRAM OPTO SEMICONDUCTORS GMBH + CO. OHG Effective date: 20150507 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150507 Address after: Regensburg, Germany Patentee after: OSRAM OLED GmbH Address before: Regensburg, Germany Patentee before: OSRAM OPTO SEMICONDUCTORS GmbH |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 |
|
CF01 | Termination of patent right due to non-payment of annual fee |