CN1867602A - 潜固化剂和组合物 - Google Patents
潜固化剂和组合物 Download PDFInfo
- Publication number
- CN1867602A CN1867602A CNA2004800295996A CN200480029599A CN1867602A CN 1867602 A CN1867602 A CN 1867602A CN A2004800295996 A CNA2004800295996 A CN A2004800295996A CN 200480029599 A CN200480029599 A CN 200480029599A CN 1867602 A CN1867602 A CN 1867602A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- curing agent
- mass
- latent curing
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 claims abstract description 261
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 205
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 73
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 239000004202 carbamide Substances 0.000 claims abstract description 34
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 20
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 239000003566 sealing material Substances 0.000 claims abstract description 18
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- 125000004122 cyclic group Chemical group 0.000 claims abstract description 10
- -1 hydrogen compound Chemical class 0.000 claims description 114
- 150000001875 compounds Chemical class 0.000 claims description 80
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- 239000005056 polyisocyanate Substances 0.000 claims description 51
- 229920001228 polyisocyanate Polymers 0.000 claims description 51
- 239000012948 isocyanate Substances 0.000 claims description 45
- 239000004594 Masterbatch (MB) Substances 0.000 claims description 40
- 239000007795 chemical reaction product Substances 0.000 claims description 32
- 150000002513 isocyanates Chemical class 0.000 claims description 26
- 239000011258 core-shell material Substances 0.000 claims description 23
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- 229930185605 Bisphenol Natural products 0.000 description 10
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- 238000011156 evaluation Methods 0.000 description 8
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- 238000002156 mixing Methods 0.000 description 8
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 7
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 7
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- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 7
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 229920001223 polyethylene glycol Polymers 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
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- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 6
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- 239000002612 dispersion medium Substances 0.000 description 6
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- 239000000376 reactant Substances 0.000 description 6
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- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
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- DMDXQHYISPCTGF-UHFFFAOYSA-N n',n'-dipropylethane-1,2-diamine Chemical compound CCCN(CCC)CCN DMDXQHYISPCTGF-UHFFFAOYSA-N 0.000 description 1
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- PVYBFVZRZWESQN-UHFFFAOYSA-N n,n-diethyl-2-piperazin-1-ylethanamine Chemical compound CCN(CC)CCN1CCNCC1 PVYBFVZRZWESQN-UHFFFAOYSA-N 0.000 description 1
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- YLNSNVGRSIOCEU-UHFFFAOYSA-N oxiran-2-ylmethyl butanoate Chemical compound CCCC(=O)OCC1CO1 YLNSNVGRSIOCEU-UHFFFAOYSA-N 0.000 description 1
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- 229920001225 polyester resin Polymers 0.000 description 1
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- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
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- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
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- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
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- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010454 slate Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- JLEHSYHLHLHPAL-UHFFFAOYSA-N tert-butylurea Chemical compound CC(C)(C)NC(N)=O JLEHSYHLHLHPAL-UHFFFAOYSA-N 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
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- 150000003672 ureas Chemical class 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- DIHAURBCYGTGCV-UHFFFAOYSA-N xi-4,5-Dihydro-2,4(5)-dimethyl-1H-imidazole Chemical compound CC1CN=C(C)N1 DIHAURBCYGTGCV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 比较例1 | 比较例2 | ||
母炼胶型固化剂配合 | 环氧树脂用固化剂 | a-175份 | a-1100份 | a-2100份 | a-2100份 | a-2100份 | a-2100份 |
异氰酸酯成分 | OTI 4份 | TDI 1份OTI 7份 | LTI 7份 | MR200 3份LTI 7份 | TDI 8份 | MR400 10份 | |
活泼氢化合物 | D230 2份 | 水2份 | 水1.5份 | 水2份 | 水2份 | 水2份 | |
环氧树脂 | c-3300份 | c-4200份 | c-2200份 | c-4200份 | c-4200份 | c-1200份 | |
母炼胶型固化剂名称 | H-1 | H-2 | H-3 | H-4 | H-5 | H-6 | |
潜固化剂的分散性 | Δ | ◎ | ○ | ◎ | ◎ | ○ | |
单组分环氧树脂组合物的配合固化剂(固化剂名称:配合量)环氧树脂 | H-1:30份c-3:100份 | H-2:30份c-3:100份 | H-3:30份c-3:100份 | H-4:30份c-3:100份 | H-5:30份c-3:100份 | H-6:30份c-3:100份 | |
性能评价储藏稳定性固化性母炼胶保存稳定性 | △◎○ | ◎◎◎ | ◎◎○ | ◎○◎ | ×○× | ○×× |
Claims (17)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP352693/2003 | 2003-10-10 | ||
JP2003352693 | 2003-10-10 |
Publications (2)
Publication Number | Publication Date |
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CN1867602A true CN1867602A (zh) | 2006-11-22 |
CN100584872C CN100584872C (zh) | 2010-01-27 |
Family
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Application Number | Title | Priority Date | Filing Date |
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CN200480029599A Expired - Lifetime CN100584872C (zh) | 2003-10-10 | 2004-10-07 | 潜固化剂和组合物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070055039A1 (zh) |
EP (1) | EP1671997A1 (zh) |
JP (1) | JP4463208B2 (zh) |
KR (1) | KR100902204B1 (zh) |
CN (1) | CN100584872C (zh) |
TW (1) | TWI294434B (zh) |
WO (1) | WO2005035617A1 (zh) |
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CN107541014A (zh) * | 2016-06-28 | 2018-01-05 | 三键有限公司 | 环氧树脂组合物 |
US10032952B2 (en) | 2007-05-09 | 2018-07-24 | Hitachi Chemical Company, Ltd. | Connecting structure and solar cell module |
CN112992404A (zh) * | 2021-05-06 | 2021-06-18 | 西安宏星电子浆料科技股份有限公司 | 一种高导电率导电浆料 |
CN114929773A (zh) * | 2019-11-21 | 2022-08-19 | Swimc有限公司 | 用于储存制品的粘附涂层的两部分环氧组合物 |
CN118772377A (zh) * | 2024-09-10 | 2024-10-15 | 汉方新材料科技(嘉善)有限公司 | 一种脲类环氧固化促进剂、环氧导电银胶及制备方法 |
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TW200640978A (en) * | 2005-02-23 | 2006-12-01 | Asahi Kasei Chemicals Corp | Latent hardener for epoxy resin and epoxy resin composition |
WO2008010294A1 (fr) * | 2006-07-21 | 2008-01-24 | Hitachi Chemical Company, Ltd. | Matériau de connexion, structure de connexion d'éléments de circuits et procédé de connexion de circuits. |
JP2006316163A (ja) * | 2005-05-12 | 2006-11-24 | Nippon Kayaku Co Ltd | 液状エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
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KR100756799B1 (ko) | 2006-07-12 | 2007-09-07 | 제일모직주식회사 | 용융점이 서로 다른 두 가지 이상의 경화제를 포함하는 이방 도전성 접착제용 조성물 |
TWI476266B (zh) * | 2007-03-19 | 2015-03-11 | Namics Corp | 異方性導電膏 |
EP2157146A4 (en) * | 2007-06-13 | 2011-02-02 | Hitachi Chemical Co Ltd | ADHESIVE FILM FOR CIRCUIT CONNECTION |
US8084553B2 (en) * | 2008-01-10 | 2011-12-27 | Trillion Science, Inc. | Curable adhesive compositions, process, and applications |
US8067484B2 (en) * | 2010-03-12 | 2011-11-29 | Trillion Science, Inc. | Latent hardener with improved barrier properties and compatibility |
US8044154B2 (en) * | 2009-06-12 | 2011-10-25 | Trillion Science, Inc. | Latent hardener for epoxy compositions |
KR101695005B1 (ko) | 2010-04-01 | 2017-01-11 | 삼성전자 주식회사 | 나노결정/수지 조성물, 나노결정-수지 복합체 및 나노결정-수지 복합체의 제조방법 |
JP2012153814A (ja) * | 2011-01-26 | 2012-08-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
CN110591623B (zh) * | 2019-10-22 | 2022-09-02 | 惠州市亿铖达精细化工有限公司 | 一种快速固化环氧粘接胶 |
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JP2610900B2 (ja) * | 1987-10-27 | 1997-05-14 | ソニーケミカル 株式会社 | 熱硬化型異方性導電接着シート及びその製造方法 |
JPH03234782A (ja) * | 1990-02-13 | 1991-10-18 | Asahi Chem Ind Co Ltd | 管路の補修用一液性接着剤組成物 |
JP2914390B2 (ja) * | 1990-06-21 | 1999-06-28 | ナショナル・スターチ・アンド・ケミカル・インベストメント・ホールディング・コーポレーション | 改良されたエポキシ樹脂用硬化剤マスターバッチ |
US5548058A (en) * | 1990-05-28 | 1996-08-20 | W. R. Grace & Co.-Conn. | Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
JP3168016B2 (ja) * | 1991-03-11 | 2001-05-21 | ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション | エポキシ樹脂用硬化剤マスターバッチ |
US5480957A (en) * | 1991-05-28 | 1996-01-02 | W. R. Grace & Co.-Conn. | Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
US5591814A (en) * | 1993-02-18 | 1997-01-07 | W. R. Grace & Co.-Conn. | Curing agent masterbatch for epoxy resin and their preparation |
JP3031897B2 (ja) | 1998-10-14 | 2000-04-10 | 日東電工株式会社 | エポキシ樹脂硬化物およびこれを得るための硬化方法 |
JP2000230032A (ja) | 1998-12-08 | 2000-08-22 | Nitto Denko Corp | 熱硬化性樹脂組成物およびそれを用いた半導体装置 |
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2004
- 2004-10-07 WO PCT/JP2004/014866 patent/WO2005035617A1/ja active Application Filing
- 2004-10-07 US US10/574,981 patent/US20070055039A1/en not_active Abandoned
- 2004-10-07 KR KR1020067006798A patent/KR100902204B1/ko active IP Right Grant
- 2004-10-07 CN CN200480029599A patent/CN100584872C/zh not_active Expired - Lifetime
- 2004-10-07 JP JP2005514606A patent/JP4463208B2/ja not_active Expired - Lifetime
- 2004-10-07 EP EP04792163A patent/EP1671997A1/en not_active Withdrawn
- 2004-10-08 TW TW093130606A patent/TWI294434B/zh not_active IP Right Cessation
Cited By (8)
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CN103545402A (zh) * | 2007-05-09 | 2014-01-29 | 日立化成工业株式会社 | 导电体连接用部件、连接结构和太阳能电池组件 |
US10032952B2 (en) | 2007-05-09 | 2018-07-24 | Hitachi Chemical Company, Ltd. | Connecting structure and solar cell module |
US10186627B2 (en) | 2007-05-09 | 2019-01-22 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
CN107541014A (zh) * | 2016-06-28 | 2018-01-05 | 三键有限公司 | 环氧树脂组合物 |
CN107541014B (zh) * | 2016-06-28 | 2023-12-26 | 三键有限公司 | 环氧树脂组合物 |
CN114929773A (zh) * | 2019-11-21 | 2022-08-19 | Swimc有限公司 | 用于储存制品的粘附涂层的两部分环氧组合物 |
CN112992404A (zh) * | 2021-05-06 | 2021-06-18 | 西安宏星电子浆料科技股份有限公司 | 一种高导电率导电浆料 |
CN118772377A (zh) * | 2024-09-10 | 2024-10-15 | 汉方新材料科技(嘉善)有限公司 | 一种脲类环氧固化促进剂、环氧导电银胶及制备方法 |
Also Published As
Publication number | Publication date |
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JPWO2005035617A1 (ja) | 2006-12-21 |
TWI294434B (en) | 2008-03-11 |
KR100902204B1 (ko) | 2009-06-11 |
EP1671997A1 (en) | 2006-06-21 |
CN100584872C (zh) | 2010-01-27 |
JP4463208B2 (ja) | 2010-05-19 |
TW200528483A (en) | 2005-09-01 |
WO2005035617A1 (ja) | 2005-04-21 |
US20070055039A1 (en) | 2007-03-08 |
KR20060085668A (ko) | 2006-07-27 |
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