CN1796008A - Substrate treatment equipment and treatment method thereof - Google Patents
Substrate treatment equipment and treatment method thereof Download PDFInfo
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- CN1796008A CN1796008A CNA2005101346154A CN200510134615A CN1796008A CN 1796008 A CN1796008 A CN 1796008A CN A2005101346154 A CNA2005101346154 A CN A2005101346154A CN 200510134615 A CN200510134615 A CN 200510134615A CN 1796008 A CN1796008 A CN 1796008A
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- dry ice
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- carbon dioxide
- carrier gas
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- 239000000758 substrate Substances 0.000 title claims abstract description 84
- 238000011282 treatment Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 title description 16
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 223
- 235000011089 carbon dioxide Nutrition 0.000 claims abstract description 108
- 239000002245 particle Substances 0.000 claims abstract description 75
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 58
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000012545 processing Methods 0.000 claims abstract description 20
- 238000004140 cleaning Methods 0.000 claims abstract description 17
- 238000004381 surface treatment Methods 0.000 claims abstract description 17
- 238000011068 loading method Methods 0.000 claims abstract description 9
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 4
- 239000007921 spray Substances 0.000 claims description 75
- 239000012159 carrier gas Substances 0.000 claims description 52
- 238000002347 injection Methods 0.000 claims description 30
- 239000007924 injection Substances 0.000 claims description 30
- 238000002156 mixing Methods 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 12
- 238000003672 processing method Methods 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 10
- 238000005422 blasting Methods 0.000 claims description 4
- 238000002425 crystallisation Methods 0.000 claims description 3
- 230000008025 crystallization Effects 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
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- 238000004904 shortening Methods 0.000 abstract 1
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- 239000010408 film Substances 0.000 description 21
- 230000008569 process Effects 0.000 description 12
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- 238000010586 diagram Methods 0.000 description 5
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical group [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 4
- 239000013043 chemical agent Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000007738 vacuum evaporation Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Nozzles (AREA)
Abstract
本发明涉及一种基板处理装置，其包括：装载部，用于装载形成有物质膜的基板；干冰供给部，供给干冰粒子或二氧化碳；喷射处理部，包括一个以上的喷管，向上述基板上喷射由上述干冰供给部所提供的干冰粒子，或将二氧化碳固化后喷射到基板上，以对物质膜进行初步表面处理；表面处理部，对上述经过初步表面处理的物质膜进行选择性的去除。本发明使用不留残屑的干冰粒子，对物质膜进行改质或部分去除，并通过清洗或蚀刻等表面处理，去除经改质的物质膜，以此可缩短物质膜去除所需工时。
The present invention relates to a substrate processing device, which includes: a loading part for loading a substrate formed with a material film; a dry ice supply part for supplying dry ice particles or carbon dioxide; Spraying dry ice particles provided by the above-mentioned dry ice supply part, or spraying solidified carbon dioxide onto the substrate to perform preliminary surface treatment on the material film; the surface treatment part selectively removes the above-mentioned material film that has undergone preliminary surface treatment. The invention uses dry ice particles without residues to modify or partially remove the material film, and removes the modified material film through surface treatment such as cleaning or etching, thereby shortening the man-hour required for material film removal.
Description
Technical field
The present invention relates to substrate board treatment and processing method thereof, especially the material film of removing object is carried out upgrading, by cleaning or etching, can remove substrate board treatment and processing method thereof at an easy rate then through the material film of upgrading.
Background technology
Generally, LCD (LCD) is a kind of as substrate, and it comprises: substrate regions, and it comprises thin film transistor (TFT) and transparency electrode; Liquid crystal region is positioned on the substrate regions and carries out polarisation; The color filter plate zone is positioned on the liquid crystal region and determines color.
Make in the process of above-mentioned LCD, carry out the vacuum evaporation (vacuumevaporation) of film repeatedly and form pattern (Pattern).In vacuum evaporation or pattern forming process, unusual if film occurs, not that it is discarded, but reprocess (Rework).
Existing reprocessing process is, uses Wet-type cleaning equipment or dry type cleaning equipment, and to color filter plate (Color filter), the bad film of polyimides (Polyimide) etc. is optionally removed (Strip), carries out vacuum evaporation again.
At this moment, the chemical agent that is used to remove mainly is potassium hydroxide (KOH).
Above-mentioned polyimides has very strong corrosion resistance to chemicals, for bad film is thoroughly removed, needs the suitable time.
In addition, the Wet-type cleaning equipment volume is big, and because of a large amount of toxic chemical substances that use in the operating process, very harmful to operator ' s health.
Summary of the invention
The present invention is intended to address the above problem, and its purpose is, a kind of substrate board treatment and the processing method thereof that can carry out the removal of material film quickly and easily is provided.
Another object of the present invention is to, provide a kind of equipment volume little, and can reduce the substrate board treatment and the processing method thereof of noxious material use amount.
Another object of the present invention is to, a kind of flat-panel monitors such as LCD that not only are used in are provided, also substrate board treatment and the processing method thereof that can clean various micro-elements.
In addition, another object of the present invention is to, provide a kind of and in the processing substrate process, can improve ejection efficiency, and have the jet pipe of good machinability.
In order to achieve the above object, the present invention includes: loading part, load the substrate that is formed with the material film; The dry ice supply unit is supplied with dry-ice particle or carbon dioxide; Inject process portion comprises more than one jet pipe, and the dry-ice particle that is provided by above-mentioned dry ice supply unit is provided on aforesaid substrate, or with being ejected on the substrate after the carbon dioxide curing, so that the material film is carried out preliminary surface treatment; Surface treating part is optionally removed the preliminary surface-treated material of above-mentioned process film.
In addition, the present invention includes: in the loading stage, load the substrate that is formed with the material film; Pretreatment stage is sprayed dry-ice particle on the substrate of above-mentioned loading, so that the material film on the aforesaid substrate is carried out preliminary surface treatment; In the surface treatment stage, the preliminary surface-treated material of above-mentioned process film is carried out selective removal.
The present invention uses the dry-ice particle that does not stay detritus, the material film is carried out upgrading or part removal, and by surface treatments such as cleaning or etchings, remove the material film, can shorten material film demoulding with this and remove man-hour.
In addition, in the process of removing the material film, damage can not for the lower set ribbon of this material film, and because of the use amount of chemicals is few, both economical, also can reduce operating personnel and be exposed to time and number of times in the poisonous environment, improved security.
In addition, the present invention carries out repeatedly adiabatic expansion in a jet pipe, and uses the high structure of insulation effect, thereby has improved the production rate of dry-ice particle, has improved processing substrate efficient.
In addition, use straight tube shape jet pipe among the present invention, have good machinability, and can reduce the manufacturing expense of jet pipe.
Description of drawings
Fig. 1 is the formation schematic diagram of an embodiment of the present invention's substrate board treatment;
Fig. 2 a to Fig. 2 d is the cutaway view of the procedure of an embodiment in the present invention's the substrate processing method using same;
Fig. 3 is an embodiment schematic diagram of the injection apparatus of Fig. 1;
Fig. 4 is the structural representation of another embodiment of the present invention's substrate board treatment;
Fig. 5 is another embodiment schematic diagram of the dry ice supply unit of Fig. 4;
Fig. 6 to Figure 12 is respectively the cutaway view of another embodiment of the jet pipe among Fig. 5.
10: substrate 11: backplane level
12: remove object layer 20: flat board
21: cylinder 30: the dry ice supply unit
40: injection apparatus 50: the wet type device
60: control panel 70: exhaust portion
The specific embodiment
Below, the embodiment to the present invention is elaborated with reference to the accompanying drawings.
[embodiment 1]
Fig. 1 is the plane pie graph of an embodiment of substrate board treatment among the present invention.
As shown in the figure, the substrate board treatment among the present invention comprises: flat board 20, be provided with a plurality of cylinders 21, and be used to load the substrate 10 that needs demoulding; Dry ice supply unit 30 provides dry-ice particle; Injection apparatus 40 to the whole surface of the removal object film that is loaded in the substrate on above-mentioned dull and stereotyped 20, sprays the dry-ice particle that is provided by above-mentioned dry ice supply unit 30; Wet type device 50 carries out wet-cleaned to the removal destination layer of the substrate 10 that sprays through dry-ice particle on above-mentioned dull and stereotyped 20; Control panel 60 drives control to above-mentioned dull and stereotyped 20, dry ice supply unit 30 and injection apparatus 40.
Below, an embodiment of the substrate board treatment of the present invention with above-mentioned formation is elaborated.
Fig. 2 a to Fig. 2 d is the procedure cutaway view of an embodiment of the present invention's substrate processing method using same.
Shown in Fig. 2 a, be formed with color filter plate, polyimides or protective finish (Overcoating) etc. need the substrate 10 of the material film of removal, are loaded onto on dull and stereotyped 20.
At this moment, above-mentioned dull and stereotyped 20 cylinder 21 is rotated under the control of control panel 60, and aforesaid substrate 10 is loaded into dull and stereotyped 20 tops, and when loading was finished, the rotation of cylinder 21 then can stop.
The practical structures more complicated of aforesaid substrate 10 is simplified to it here, comprises the backplane level 11 of parts such as glass substrate, and is positioned at the removal object layer 12 on this backplane level 11.
Above-mentioned removal object layer 12 can be color filter plate, polyimides or protective finish.
Above-mentioned dull and stereotyped 20 are provided with a plurality of cylinders 21, are used for mounting substrate 10 and to wet type device 50 unloading.
After being formed with the substrate 10 of removing object layer 12 and being loaded on dull and stereotyped 20,30 of dry ice supply units provide dry-ice particle to injection apparatus 40.
At this moment, the dry ice that is provided to injection apparatus 40 by dry ice supply unit 30 has the particle footpath of 0.5～3.0mm.Why dry-ice particle directly being limited, is because when dry-ice particle footpath during less than 0.5mm, be difficult to change and remove the membranous of object layer 12, and particle diameter is when 3.0mm is above, and particle diameter is crossed and may well be brought damage to backplane level 11.
Above-mentioned dry ice supply unit 30 utilizes high pressure nitrogen or the injection dry ice that purifies air, and by the jet pipe on the injection apparatus 40, is ejected into substrate 10 surfaces that are loaded on dull and stereotyped 20.
Use above-mentioned nitrogen or purify air, can prevent that secondary pollution from taking place.
Secondly, shown in Fig. 2 b, whole or part surface evenly sprays dry-ice particle to the removal object layer 12 that is loaded in the substrate 10 on dull and stereotyped 20 by above-mentioned injection apparatus 40.
By this injection, above-mentioned removal object layer 12 sustains damage, thereby forms depression, or chaps, and a part is then removed fully.
Fig. 3 is the front schematic view of above-mentioned injection apparatus 40.
As shown in the figure, above-mentioned injection apparatus 40 comprises: from dull and stereotyped 20 tops apart from the certain distance and the movable stand 41 that can move with this flat board 20; Above above-mentioned dull and stereotyped 20, carry out at least more than one jet pipe 42 of straight reciprocating motion along above-mentioned movable stand 41.
Like this, the dry-ice particle that sprays by above-mentioned injection apparatus 40 evenly is ejected into above-mentioned removal object layer 12 full surfaces, and the depression or the be full of cracks that produce certain depths and area by removal object layer 12 surfaces that dry-ice particle impacted.
At this moment, pass through the above-mentioned depression or the be full of cracks that are taken place, remove object layer 12 and change, a part is then removed fully, exposes the backplane level 11 of removing object layer 12 belows.
The jet pipe 42 of above-mentioned injection apparatus 40 can be movably above-mentioned, also can be to dwindle to be provided with at interval and with stationary state to install, and can obtain identical effect.
After the dry-ice particle that sprays from above-mentioned jet pipe 42 impacted and removes object layer 12 surfaces, literizations and do not stay detritus at the removal object layer, and its volume sharply increases in the liter process made that to peel off effect more outstanding.
For the dry-ice particle that makes above-mentioned injection liter easily, above-mentioned dull and stereotyped 20 conditions such as temperature and pressure should be kept proper level.
Used dry-ice particle in the foregoing description, except dry-ice particle, risen the voltinism solids, also can obtain effect same by using other.
Secondly, shown in Fig. 2 c, remove object layer 12 surfaces and the impaired place substrate 10 in its surface moves to wet type device 50, use chemical agent that it is implemented wet-cleaned through dry ice blasting.
And, use the wet type of various chemical medicaments or dry type to remove (Wet/Dry strip), also can obtain same effect, impact and the removal object layer 12 of variation so long as can effectively remove through above-mentioned dry ice, its method is not limited.
Move to of injection or the immersion of the substrate 10 of above-mentioned wet type device 50, remove object layer 12 by chemical agent.
At this moment, depression has taken place or has chapped and the generation upgrading in above-mentioned removal object layer 12 surfaces, and these depressions or be full of cracks, makes chemical agent and remove object layer 12 contacts area to increase.
Like this, cleaning area increases, and can remove fast, and can reduce the medicament use amount, removes process cost and reduces.
In addition, by reducing the use amount and the service time of toxic chemical substances such as potassium hydroxide, significantly reduce operating personnel and be exposed to time in the noxious material.
Fig. 2 d removes the schematic diagram after object layer 12 is removed fully for through above-mentioned cleaning.
[embodiment 2]
Fig. 4 is another example structure schematic diagram of the present invention's substrate board treatment.
As shown in the figure, the substrate board treatment among the present invention comprises: flat board 20, be provided with a plurality of cylinders 21, and need to remove the substrate of handling 10 to load; Dry-ice particle to the whole surface of removal object film that is loaded in the substrate on above-mentioned dull and stereotyped 20, sprays in injection portion 40; Dry ice particles supply unit 31, storage is also supplied with particle (Pellet) shape dry ice; Pulverizing portion 32, it is 0.5 to 3.0mm particle that the graininess dry ice that dry ice particles supply unit 31 is provided is ground into particle diameter; Injection portion 33 sprays through the dry-ice particle the pulverized jet pipe by above-mentioned injection apparatus 40 above-mentioned; Wet type device 50 carries out wet-cleaned to the removal object layer of the substrate 10 that sprays through dry-ice particle on above-mentioned dull and stereotyped 20; Exhaust portion 70, the carbon dioxide that the foreign material that produced on above-mentioned dull and stereotyped 20 are become with the dry-ice particle literization carries out exhaust; Control panel 60 is controlled above-mentioned various piece.
Pass through said structure, granular dry-ice particle is stored in the dry ice particles supply unit 31, in pulverizing portion 32 dry ice of storage is ground into the dry-ice particle with certain particle diameter then, and uses high pressure to purify air or nitrogen, spray from the jet pipe of above-mentioned injection apparatus 40.
By to removing object layer 12 jet surface dry-ice particles, upgrading takes place in removal object layer 12 surfaces of substrate, like this, can easily remove removing object layer 12 in the wet type device 50, its effect proves absolutely in the foregoing description 1, no longer applies here and states.
Literization takes place in the above-mentioned dry-ice particle of removing object layer 12 that impacts, and by the carbon dioxide of literization generation and the particulate that impacts the removal object layer 12 that produces, discharges from exhaust portion 70 in company with air-flow.
[embodiment 3]
In the foregoing description 1 and embodiment 2, dry ice supply unit 30 is accepted the dry ice of solid shape from the outside, to substrate 10 jet surface dry ice, also can be, liquid or gas shape carbon dioxide and carrier gas (Carrier gas) are provided in dry ice supply unit 30, in jet pipe 42, carbon dioxide are changed over solid then and spray.
Fig. 5 is the structural representation of another embodiment of the substrate board treatment among the present invention.
As shown in the figure, the dry ice supply unit 30 in the present invention's the substrate board treatment comprises: carbon dioxide supply source 34 and carrier gas supply source 35 that carbon dioxide and carrier gas are provided respectively; The carbon dioxide that is provided to above-mentioned carbon dioxide supply source 34 cools off, and is provided to the cooling device 36 of the jet pipe 42 of injection apparatus 40; Detect the temperature of above-mentioned jet pipe 42, and according to its result, the temperature control part 37 that above-mentioned cooling device 36 actions are controlled; Respectively the nebulizer gas pressure and the flow of above-mentioned carrier gas supply source 35 are controlled, and supplied to the pressure regulating part 38 and the flow-control portion 39 of above-mentioned jet pipe 42.
Below, the 26S Proteasome Structure and Function of the embodiment of the invention is elaborated.
Carbon dioxide supply source 34 is the container of storaging liquid carbon dioxide, and carrier gas supply source 35 purifies air or the container of carrier gas such as nitrogen for storing.
When the carbon dioxide that above-mentioned carbon dioxide supply source 34 is provided sprays through jet pipe,, in cooling device 36, carbon dioxide is cooled off and is provided to the jet pipe 42 of injection apparatus 40 in order to convert solid-state dry-ice particle easily to.
Simultaneously, the carrier gas in the carrier gas supply source 35 also supplies on the jet pipe 42 of injection apparatus 40, and in the carrier gas supply, by pressure regulating part 38 and flow-control portion 39 its pressure and flow is controlled.
Like this, accept the jet pipe 42 of carrier gas and carbon dioxide,, utilize adiabatic expansion, make carbon dioxide solidization, thereby generate dry-ice particle, spray this dry-ice particle and carrier gas then by its structure through cooling off.
Fig. 6 is the schematic cross-section of an embodiment of jet pipe 42 among the present invention.
As shown in the figure, when in above-mentioned jet pipe 42, accepting carbon dioxide and carrier gas and spraying dry-ice particle, the carbon dioxide that flows into from carbon dioxide inflow entrance 43 is phase-changed into dry-ice particle during through first spray nozzle part 45, and spray with the state of aerosol (aeroso1), and pass through above-mentioned first spray nozzle part 45 outsides by the carrier gas that carrier gas inflow entrance 44 flows into, and the aerosol of first spray nozzle part, 45 injections together together, sprays from second spray nozzle part 46.
Promptly, above-mentioned jet pipe 42 structures are, be provided with first spray nozzle part 45 in second spray nozzle part, 46 inboards, carbon dioxide by 45 injections of first spray nozzle part and pressurization, form the aerosol that contains dry-ice particle at second spray nozzle part 46 through adiabatic expansion, the carrier gas of this aerosol and inflow second spray nozzle part 46 is injected into substrate 10 together.
The spout of above-mentioned first spray nozzle part 45 and second spray nozzle part 46 is more young than flowing into, so can apply high pressure to carbon dioxide, like this, carbon dioxide carries out adiabatic expansion and is phase-changed into dry-ice particle.
The carbon dioxide of above-mentioned cooling changes through excess pressure in the multiple spray nozzle part structure of jet pipe 42, is phase-changed into dry-ice particle, and is ejected into substrate 10, and substrate 10 surfaces are handled.
Be provided with temperature sensor in the above-mentioned jet pipe 42, temperature control part 37 is controlled the operation of cooling device 36 according to the temperature detection result of said temperature sensor.That is, when the temperature of jet pipe 42 is design temperature when above, start cooling device 36 cooled carbon dioxides, promoting phase transition process, and jet pipe 42 temperature are lower than when setting temperature, then stop cooling device 36 operations, stop up with the jet that prevents jet pipe 42.
Above-mentioned design temperature is that solidfied material generates optimum temperature, promptly-10 ℃ between-100 ℃.
Said structure is the structure that dry-ice particle and carrier gas mix and spray in second spray nozzle part 46, and its nozzle velocity is relatively low.
This weak the cleaning is applicable to the camera lens class with jet pipe, charge coupled device (Charge CoupledDevice:CCD), the strong cleanings of usefulness such as CMOS (Complementary-Metal-Oxide-Semiconductor) camera chip might damage the precise part of cleaning object.
When above-mentioned precise part cleans, behind the injection dry ice, directly unload without wet type device 50.
[embodiment 4]
Fig. 7 is the cutaway view of another embodiment of above-mentioned jet pipe 42.
As shown in the figure, another embodiment of jet pipe 42 described in the present invention's the embodiment 3 comprises: first spray nozzle part 45, the carbon dioxide that flows into by carbon dioxide inflow entrance 43 is carried out pressurized jet, and generate dry-ice particle by adiabatic expansion; Second spray nozzle part 46, the carrier gas that will flow into by carrier gas inflow entrance 44 and mix and spray by the dry ice that first spray nozzle part 45 generates; The 3rd spray nozzle part 47, to the dry ice and the carrier gas of spraying by above-mentioned second spray nozzle part 46, and the carrier gas that enters from second spray nozzle part, 46 outsides mixes the back injection.
Above-mentioned second spray nozzle part 46 porch are provided with, and make carrier gas optionally flow into first path 48 of the second spray nozzle part inboard; Make carrier gas flow into second path 49 of the 3rd spray nozzle part 47 inboards.
Above-mentioned first spray nozzle part 45 and second spray nozzle part 46 have identical function with jet pipe 42 as shown in Figure 6, and in the 3rd spray nozzle part 47, second spray nozzle part 47 is sprayed things and mix and spray by the carrier gas that first path 48 flows into.By said structure, can prevent the i.e. phenomenon of the 3rd spray nozzle part 47 surface generation condensate water in jet pipe 42 surfaces, improved cleaning efficiency.
That is, can prevent that external environment condition from causing the carbon dioxide temperature in the jet pipe 42 to rise, carry out adiabatic expansion easily, thereby improved the production rate of dry-ice particle, improve cleaning efficiency.
[embodiment 5]
Fig. 8 is another example structure figure of jet pipe 42 described in the embodiment 3.
As shown in the figure, its structure comprises: first spray nozzle part 45, second spray nozzle part 46 and three spray nozzle part 47 identical with above-mentioned Fig. 7, and be provided with first path 48 of on the 3rd spray nozzle part 47, supplying with carrier gas and second spray nozzle part 49 from carrier gas to second spray nozzle part 46 that supply with.
Wherein, the port of export bore of second spray nozzle part 46 outwards begins to keep go-no-go from the lining, increases gradually then.
Second spray nozzle part, 46 ports of export have above-mentioned shape, and the aerosol that contains dry ice that is sprayed solidifies uncured aqueous carbon dioxide through adiabatic expansion once more.By this dual adiabatic expansion structure, can generate larger-size dry-ice particle, and the dry-ice particle quantity of spraying increases also, thereby can clean by force.
[embodiment 6]
Fig. 9 is another example structure figure of jet pipe 42 described in the foregoing description 3.
As shown in the figure, jet pipe 42 comprises: first spray nozzle part 45, carbon dioxide and the carrier gas that flows into by carbon dioxide inflow entrance 43 and carrier gas inflow entrance 44 to be mixed, and its inside has most adiabatic expansion structures, thereby can spray the aerosol that contains dry-ice particle; Second spray nozzle part 46, with above-mentioned first spray nozzle part 45 outsides across a space, and the injection thing of the carrier gas supplied with by this space and above-mentioned first spray nozzle part 45 mixed and sprays.
Above-mentioned first spray nozzle part, 45 1 ends are provided with carrier gas inflow entrance 44 and flow into for carrier gas, and along with the inflow of this carrier gas, carbon dioxide flows into from the carbon dioxide inflow entrance 43 of first spray nozzle part, 45 sides.
In above-mentioned first spray nozzle part 45, carrier gas is relative less with the diameter of the part that carbon dioxide mixes, and is provided with most adiabatic expansion structures from these part to the first spray nozzle part 45 ports of export.
That is, the part that part that diameter is big and diameter are little is interlaced, and diameter is ascending.Like this, in first spray nozzle part 45 by adiabatic expansion repeatedly, obtain more, the dry-ice particle that particle diameter is bigger, and the aerosol that contains this dry-ice particle at second spray nozzle part 46 with after carrier gas mixes, be ejected into substrate 10.
This structure had both improved insulation effect, can carry out repeatedly adiabatic expansion again, thereby improve cleaning performance.
[embodiment 7]
Figure 10 is the cutaway view of another embodiment of jet pipe 42 described in the foregoing description 3.
As shown in the figure, jet pipe 42 comprises: mixing tube 81, for carrier gas and carbon dioxide inflow and mixing; Crystallize into long tube 82, be connected above-mentioned mixing tube 81 1 ends, and have than the littler internal diameter of mixing tube 81 internal diameters; Playpipe 83 is connected above-mentioned long tube 82 1 ends that crystallize into, and quickens the growth of wash particle, and with this particle spraying to the surface of substrate 10.
Above-mentioned mixing tube 81, crystallize into being shaped as of long tube 82 and playpipe 83, internal diameter and external diameter keep certain straight tube shape separately for they.
The mixing tube 81 of this straight tube shape crystallizes into long tube 82 and playpipe 83 and compares with nozzle structure described in the foregoing description 3 to embodiment 6, and its processability is good, and manufacturing cost is also low.
Above-mentioned mixing tube 81 is provided with, the inflow entrance 11,12 that carbon dioxide and carrier gas are flowed into respectively.Above-mentioned inflow entrance 43,44 can be provided with one or more respectively.
The position that is provided with of above-mentioned inflow entrance 43,44 is not particularly limited, and is same as Fig. 8, and the pipeline of carrier gas inflow entrance 44 directions being arranged to crystallize into long tube 82 and playpipe 83 is consistent for good.
Carbon dioxide and carrier gas through mixing in mixing tube 81, under the pressure of carrier gas that flows into by inflow entrance 43,44 and carbon dioxide, inflow crystallizes in the long tube 82.
Above-mentioned to crystallize into long tube 82 diameters littler than above-mentioned mixing tube 81 diameters, and along with pressure increases, carbon dioxide is converted to particulate, and its particulate gradually grows up, to form dry-ice particle.
Though with the use carbon dioxide be liquid still gas shape and some difference, along with gas or fluid pressure increase, carbon dioxide becomes the solid shape, this can obtain confirming from the transformation curve of carbon dioxide.
Above-mentionedly crystallize into pressure in the long tube 82 greater than the pressure in the mixing tube 81, by this pressure differential, when using the carbon dioxide of liquid or cryogenic gas shape, the crystallization of generation dry ice.
The above-mentioned diameter that crystallizes into long tube 82 should be within 20% to 50% scope of mixing tube 81 diameters.
Above-mentioned aerosol that contains dry ice and the carrier gas that crystallizes in the long tube 82 is injected into the surface of substrate 10 by playpipe 83.
Wherein, the diameter of playpipe 83 be mixing tube 18 diameters 10% to 30% between, like this, can provide higher pressure, increase once more and be created on the above-mentioned dry-ice particle size that crystallizes in the long tube 82, and liquid or gasiform carbon dioxide is converted into solid.
In addition, can carry out high-voltage high-speed and spray, improve cleaning efficiency.
Above-mentioned mixing tube 81 and crystallizing between the long tube 82, and the internal diameter coupling part that crystallizes between long tube 82 and the playpipe 83 is the inclined plane, thereby can prevent the generation of eddy current.
[embodiment 8]
Figure 11 is an embodiment cutaway view of the foregoing description 3 described jet pipes 42.
As shown in the figure, be provided with first and second between the mixing tube 81 of straight tube shape and the playpipe 83 and crystallize into long tube 84,85.
Second diameter that crystallizes into long tube 85 is connected first of mixing tube 81 to crystallize into the diameter of long tube 84 little than above-mentioned.
By successively straight tube being coupled together with diameter order from large to small, can be to the pressurization of carbon dioxide and carrier gas mixture implementation phase property, promptly crystallize into long tube 84 and second and crystallize into and generate dry ice in the long tube 85 respectively, and increase this dry ice particle diameter first.
Include above-mentioned second in the aerosol and crystallize into the dry ice that generates and increase particle diameter in the long tube 85, and be injected into substrate 10 surfaces by playpipe 83.
At this moment, the pressure increase in the playpipe 83 causes dry ice to generate and particle diameter increases, and the increase of dry ice quantity and the increase of particle diameter can further improve cleaning efficiency.
Above-mentioned mixing tube 81 and first crystallizes between the long tube 84, first crystallize into that long tube 84 and second crystallizes between the long tube 85, the second internal diameter coupling part that crystallizes between long tube 85 and the playpipe 83 is the inclined plane, takes place to prevent eddy current.
[embodiment 9]
Figure 12 is an embodiment cutaway view of jet pipe 42 described in the foregoing description 3.
As shown in the figure, jet pipe 42 basic comprisings are identical with formation among the embodiment 7, in crystallizing into long tube 82, can the temperature of carbon dioxide and carrier gas mist or aerosol be detected.
As can be known, be cooled to of the increase of the cryogenic gas of the following temperature of three phase point in the transformation curve of general material, be phase-changed into solid along with pressure, and a little more than the liquid of three phase point also along with the increase of pressure, can be phase-changed into solid.
To cause phase transformation by pressurization, need come detected temperatures so can increase temperature sensor 86 with the temperature maintenance of carbon dioxide within the specific limits.
More than, preferred embodiment specific among the present invention is illustrated, but the present invention being not limited in the foregoing description, this area professional can carry out various changes to the present invention within the scope of notion of the present invention.
Claims (16)
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040118311 | 2004-12-31 | ||
| KR1020040118311A KR100740827B1 (en) | 2004-12-31 | 2004-12-31 | Injection nozzle and cleaning system using the same |
| KR10-2004-0118311 | 2004-12-31 | ||
| KR10-2005-0049585 | 2005-06-10 | ||
| KR1020050049585A KR100622287B1 (en) | 2005-06-10 | 2005-06-10 | Precision Parts Cleaning Nozzle |
| KR1020050049585 | 2005-06-10 | ||
| KR1020050060565 | 2005-07-06 | ||
| KR1020050060565A KR20070005304A (en) | 2005-07-06 | 2005-07-06 | Substrate Processing Apparatus and Method |
| KR10-2005-0060565 | 2005-07-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1796008A true CN1796008A (en) | 2006-07-05 |
| CN1796008B CN1796008B (en) | 2010-12-01 |
Family
ID=36817451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005101346154A Expired - Fee Related CN1796008B (en) | 2004-12-31 | 2005-12-13 | Substrate processing device and processing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100740827B1 (en) |
| CN (1) | CN1796008B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101506623B (en) * | 2006-08-23 | 2011-07-06 | 应用材料股份有限公司 | Method for measuring precursor amounts in bubbler sources |
| CN101641185B (en) * | 2007-03-19 | 2012-11-07 | 阿尔弗雷德·凯驰两合公司 | Device for comminuting dry ice granules, and dry ice dispensing arrangement having such a device |
| CN103172476A (en) * | 2013-04-08 | 2013-06-26 | 中国工程物理研究院化工材料研究所 | Preparation method of submicron particle 1-oxo-diamino-3, 5-dinitropyrazine explosive |
| CN103831263A (en) * | 2012-11-23 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Method for washing technical cavity component |
| CN106269756A (en) * | 2016-08-10 | 2017-01-04 | 京东方科技集团股份有限公司 | Pressure detection method, device and glass cleaning equipment between hairbrush and glass substrate |
| CN107579018A (en) * | 2016-05-27 | 2018-01-12 | 细美事有限公司 | Substrate board treatment and substrate processing method using same |
| CN110416127A (en) * | 2019-07-24 | 2019-11-05 | 武汉大学深圳研究院 | A kind of device for cleaning chip and method |
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| KR101040565B1 (en) * | 2009-04-07 | 2011-06-16 | 주식회사 바이오메카트로닉 | Dry Ice Spray Cleaner |
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| KR101305256B1 (en) | 2012-12-18 | 2013-09-06 | 포항공과대학교 산학협력단 | A nozzle to generate superspeed uniform nano paticles and a device and method thereof |
| US10081091B2 (en) | 2015-06-12 | 2018-09-25 | Postech Academy-Industry Foundation | Nozzle, device, and method for high-speed generation of uniform nanoparticles |
| KR101779488B1 (en) * | 2015-06-30 | 2017-09-19 | 주식회사 아이엠티 | Micro carbon dioxide snow cleaning apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4806171A (en) * | 1987-04-22 | 1989-02-21 | The Boc Group, Inc. | Apparatus and method for removing minute particles from a substrate |
| KR100385431B1 (en) | 2000-09-19 | 2003-05-27 | 주식회사 케이씨텍 | Surface cleaning aerosol production system |
| KR100385432B1 (en) * | 2000-09-19 | 2003-05-27 | 주식회사 케이씨텍 | Surface cleaning aerosol production system |
| JP2004010221A (en) * | 2002-06-05 | 2004-01-15 | Ishikawajima Harima Heavy Ind Co Ltd | How to manage a ferry terminal chassis |
| JP4091357B2 (en) * | 2002-06-28 | 2008-05-28 | 大日本スクリーン製造株式会社 | Substrate processing apparatus and substrate cleaning method |
-
2004
- 2004-12-31 KR KR1020040118311A patent/KR100740827B1/en active IP Right Grant
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- 2005-12-13 CN CN2005101346154A patent/CN1796008B/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101506623B (en) * | 2006-08-23 | 2011-07-06 | 应用材料股份有限公司 | Method for measuring precursor amounts in bubbler sources |
| CN101641185B (en) * | 2007-03-19 | 2012-11-07 | 阿尔弗雷德·凯驰两合公司 | Device for comminuting dry ice granules, and dry ice dispensing arrangement having such a device |
| CN103831263A (en) * | 2012-11-23 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Method for washing technical cavity component |
| CN103172476A (en) * | 2013-04-08 | 2013-06-26 | 中国工程物理研究院化工材料研究所 | Preparation method of submicron particle 1-oxo-diamino-3, 5-dinitropyrazine explosive |
| CN107579018A (en) * | 2016-05-27 | 2018-01-12 | 细美事有限公司 | Substrate board treatment and substrate processing method using same |
| CN106269756A (en) * | 2016-08-10 | 2017-01-04 | 京东方科技集团股份有限公司 | Pressure detection method, device and glass cleaning equipment between hairbrush and glass substrate |
| CN106269756B (en) * | 2016-08-10 | 2018-09-25 | 京东方科技集团股份有限公司 | Pressure detection method, device and glass cleaning equipment between hairbrush and glass substrate |
| CN110416127A (en) * | 2019-07-24 | 2019-11-05 | 武汉大学深圳研究院 | A kind of device for cleaning chip and method |
| CN111632951A (en) * | 2020-05-20 | 2020-09-08 | 沪士电子股份有限公司 | Positioning hole glue removing device and method for PCB steel plate |
| CN112452946A (en) * | 2020-10-13 | 2021-03-09 | 东莞市欧莱溅射靶材有限公司 | Target cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060079561A (en) | 2006-07-06 |
| CN1796008B (en) | 2010-12-01 |
| KR100740827B1 (en) | 2007-07-19 |
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