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CN1783521A - white light emitting diode - Google Patents

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CN1783521A
CN1783521A CNA2004100964412A CN200410096441A CN1783521A CN 1783521 A CN1783521 A CN 1783521A CN A2004100964412 A CNA2004100964412 A CN A2004100964412A CN 200410096441 A CN200410096441 A CN 200410096441A CN 1783521 A CN1783521 A CN 1783521A
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emitting diode
light emitting
chip
white light
diode chip
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陈庆仲
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Chunghwa Picture Tubes Ltd
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Chunghwa Picture Tubes Ltd
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Abstract

A white light LED includes a carrier, and a light emitting unit, a second LED chip and a phosphor disposed on the carrier. The light emitting unit is formed by connecting a first light emitting diode chip and a resistance element in series, and the first light emitting diode chip is suitable for emitting first color light. In addition, the second light emitting diode chip is suitable for emitting second color light and is connected with the light emitting unit in parallel. In addition, the fluorescent powder is arranged above the second light-emitting diode chip and is suitable for being excited by the second color light to generate a third color light. The white light LED has lower manufacturing cost and can provide better color saturation and display color temperature.

Description

白光发光二极管white light emitting diode

技术领域technical field

本发明是关于一种发光二极管,且特别是关于一种三波长型之白光发光二极管的发明。The present invention relates to a light-emitting diode, and in particular to a three-wavelength white light-emitting diode.

背景技术Background technique

发光二极管使用III-V族元素作为发光层之主要材质,并对此发光层施加电流,以通过电子与空穴的结合,将过剩的能量以光的形式释出,进而达到发光的目的。有别于传统的加热或放电等发光方式,由于发光二极管的发光现象是属于冷发光,因此其使用寿命较长,且无须预热时间(idling time)。此外,发光二极管亦具有反应速度快、体积小、用电省、污染低(不含水银)、高可靠性、适合批量生产等优点,因此其所能应用的领域十分广泛。近年来,由于发光二极管之发光效率不断地提高,使得白光发光二极管在例如扫描仪之光源、液晶屏幕之背光源或照明设备等应用领域上已有逐渐取代传统之日光灯与白灼灯泡的趋势。Light-emitting diodes use III-V elements as the main material of the light-emitting layer, and apply current to the light-emitting layer to release excess energy in the form of light through the combination of electrons and holes, thereby achieving the purpose of light emission. Different from traditional lighting methods such as heating or discharging, because the light emitting phenomenon of light emitting diodes is cold light emission, it has a long service life and no warm-up time (idling time) is required. In addition, light-emitting diodes also have the advantages of fast response speed, small size, low power consumption, low pollution (mercury-free), high reliability, and suitable for mass production, so they can be used in a wide range of fields. In recent years, due to the continuous improvement of the luminous efficiency of light-emitting diodes, white light-emitting diodes have gradually replaced traditional fluorescent lamps and incandescent bulbs in application fields such as scanner light sources, liquid crystal screen backlights, or lighting equipment.

公知的常见之白光发光二极管主要包括下列几种类型:Commonly known white light emitting diodes mainly include the following types:

一、同时使用红光、蓝光及绿光发光二极管芯片,以产生白光。其中,通过外加之驱动芯片可调整每一发光二极管芯片的驱动电压,以将上述发光二极管芯片所发出之单色光混光而产生三波长白光。然而,由于此种白光发光二极管需同时使用多个单色发光二极管芯片,而不同之单色发光二极管芯片,例如红光发光二极管芯片与蓝光发光二极管芯片,其适用之驱动电压并不相同,因此需外加驱动芯片来调整驱动电压,导致制造成本较高,而驱动线路也较为复杂。1. Use red light, blue light and green light-emitting diode chips at the same time to generate white light. Wherein, the driving voltage of each light-emitting diode chip can be adjusted through an external driving chip, so as to mix the monochromatic light emitted by the above-mentioned light-emitting diode chip to generate three-wavelength white light. However, since this white light emitting diode needs to use a plurality of single-color light-emitting diode chips at the same time, and different single-color light-emitting diode chips, such as red light-emitting diode chips and blue light-emitting diode chips, have different driving voltages, so An external driver chip is required to adjust the driving voltage, resulting in higher manufacturing costs and more complicated driving circuits.

二、以蓝光发光二极管芯片搭配黄色荧光粉,以产生白光。其中,黄色无机荧光粉受到蓝光发光二极管芯片所发出之蓝光照射之后,可发出黄色之荧光,且当黄色荧光与原有之蓝光混光后,便可得到二波长白光。然而,由于此种白光发光二极管之发光效率较低,且其为二波长型(仅由蓝光及黄光进行混光)之白光发光二极管,因此在色饱和度及显示色温上均不如其它三波长型之白光发光二极管。2. Use blue light-emitting diode chips with yellow phosphor to generate white light. Among them, the yellow inorganic phosphor can emit yellow fluorescence after being irradiated by the blue light emitted by the blue light-emitting diode chip, and when the yellow fluorescence is mixed with the original blue light, two-wavelength white light can be obtained. However, due to the low luminous efficiency of this kind of white light emitting diode, and it is a two-wavelength white light emitting diode (only blue light and yellow light are mixed), it is not as good as the other three wavelengths in terms of color saturation and display color temperature. type of white light-emitting diode.

发明内容Contents of the invention

有鉴于此,本发明的目的就是提供一种具有较低之制造成本,且驱动线路较为简单的白光发光二极管。In view of this, the object of the present invention is to provide a white light emitting diode with lower manufacturing cost and simpler driving circuit.

本发明的再一目的是提供一种具有较佳之色饱和度与显示色温的白光发光二极管。Another object of the present invention is to provide a white light emitting diode with better color saturation and display color temperature.

基于上述或其它目的,本发明提出一种白光发光二极管,包括承载器以及设置于此承载器上之发光单元与第二发光二极管芯片。其中,发光单元由第一发光二极管芯片与电阻元件串联而成,且第一发光二极管芯片适于发出第一色光。此外,第二发光二极管芯片适于发出第二色光,且第二发光二极管芯片与发光单元并联。Based on the above or other objectives, the present invention proposes a white light emitting diode, including a carrier, a light emitting unit and a second light emitting diode chip disposed on the carrier. Wherein, the light-emitting unit is composed of a first light-emitting diode chip and a resistance element connected in series, and the first light-emitting diode chip is suitable for emitting a first color light. In addition, the second light emitting diode chip is suitable for emitting light of the second color, and the second light emitting diode chip is connected in parallel with the light emitting unit.

在本发明之一较佳实施例中,上述之白光发光二极管例如还包括荧光粉,设置于第二发光二极管芯片之上方,且此荧光粉适于被第二色光激发而产生第三色光。In a preferred embodiment of the present invention, the above-mentioned white light emitting diode, for example, further includes phosphor powder disposed above the second light emitting diode chip, and the phosphor powder is suitable for being excited by the second color light to generate the third color light.

本发明还提出一种白光发光二极管,包括承载器、发光单元、第二发光二极管芯片以及第三发光二极管芯片。发光单元设置于该承载器上,且发光单元是由第一发光二极管芯片与电阻元件串联而成的,其中第一发光二极管芯片适于发出第一色光。此外,第二发光二极管芯片与第三发光二极管芯片设置于承载器上,其中第二发光二极管芯片适于发出第二色光,而第三发光二极管芯片适于发出第三色光,且发光单元、第二发光二极管芯片以及第三发光二极管芯片相互并联。The present invention also provides a white light emitting diode, including a carrier, a light emitting unit, a second light emitting diode chip and a third light emitting diode chip. The light-emitting unit is arranged on the carrier, and the light-emitting unit is composed of a first light-emitting diode chip and a resistance element connected in series, wherein the first light-emitting diode chip is suitable for emitting a first color light. In addition, the second light emitting diode chip and the third light emitting diode chip are arranged on the carrier, wherein the second light emitting diode chip is suitable for emitting light of the second color, and the third light emitting diode chip is suitable for emitting light of the third color, and the light emitting unit, the first light emitting diode chip The two LED chips and the third LED chip are connected in parallel.

基于上述说明,本发明之白光发光二极管通过内装之电阻元件来调整不同发光二极管芯片之间的驱动电压,以达到使用同一电源来驱动相互并联之发光二极管芯片之目的,因此在不需使用外加之驱动芯片的情形下,本发明之白光发光二极管可具有较低之制造成本与较为简单之驱动线路。此外,本发明亦可通过两个发光二极管芯片与荧光粉之搭配来产生三波长白光,与公知之二波长型的白光发光二极管相比,本发明之三波长型的白光发光二极管可提供较佳的色饱和度与显示色温。Based on the above description, the white light emitting diode of the present invention adjusts the driving voltage between different light emitting diode chips through the built-in resistance element, so as to achieve the purpose of using the same power supply to drive the light emitting diode chips connected in parallel, so there is no need to use an external In the case of a driving chip, the white light emitting diode of the present invention can have lower manufacturing cost and simpler driving circuit. In addition, the present invention can also produce three-wavelength white light through the combination of two light-emitting diode chips and phosphor powder. Compared with the known two-wavelength white light-emitting diode, the three-wavelength white light-emitting diode of the present invention can provide better The color saturation and display color temperature.

为让本发明之上述和其它目的、特征和优点能更明显易懂,下文特举较佳实施例,并配合附图,作详细说明如下。In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below and described in detail with accompanying drawings.

附图说明Description of drawings

图1A为本发明之一较佳实施例之一种白光发光二极管的剖视示意图。FIG. 1A is a schematic cross-sectional view of a white light emitting diode according to a preferred embodiment of the present invention.

图1B为图1A之白光发光二极管的线路图。FIG. 1B is a circuit diagram of the white light emitting diode in FIG. 1A .

图2为本发明之一较佳实施例之另一种白光发光二极管的线路图。FIG. 2 is a circuit diagram of another white light emitting diode according to a preferred embodiment of the present invention.

图3为本发明之其它实施例之一种白光发光二极管的剖视示意图。FIG. 3 is a schematic cross-sectional view of a white light emitting diode according to another embodiment of the present invention.

图4为本发明之其它实施例之另一种白光发光二极管的剖视示意图。FIG. 4 is a schematic cross-sectional view of another white light emitting diode according to other embodiments of the present invention.

主要元件标记说明Description of main component marking

100、200:白光发光二极管100, 200: white light emitting diode

102、402:承载器102, 402: carrier

102a、402a:凹穴102a, 402a: pockets

104、204:电源104, 204: power supply

110、210、310、410:红光发光二极管芯片110, 210, 310, 410: red light emitting diode chips

110a、220a:发光单元110a, 220a: light emitting unit

112、212:电阻元件112, 212: resistance element

114、314、414:红光114, 314, 414: red light

120、220、320、420:蓝光发光二极管芯片120, 220, 320, 420: blue LED chips

124、324、424:蓝光124, 324, 424: Blu-ray

134、334、434:黄光134, 334, 434: yellow light

140、340、440:荧光粉140, 340, 440: Phosphor powder

150、450:封装胶体150, 450: encapsulation colloid

230:绿光发光二极管230: Green LED

452:透明盖体452: Transparent cover

452a:底部452a: Bottom

具体实施方式Detailed ways

请同时参考图1A与1B,其中图1A为本发明之一较佳实施例之一种白光发光二极管的剖视示意图,而图1B为图1A之白光发光二极管的线路图。此外,为简化附图,以清楚表达本发明之特征,图1A之剖视示意图未表示相关之连接导线或基板之线路。如图1A与1B所示,白光发光二极管100包括红光发光二极管芯片110、蓝光发光二极管芯片120以及承载器102,其中承载器102例如是封装基板,而红光发光二极管芯片110与蓝光发光二极管芯片120例如设置于承载器102表面之凹穴102a内。此外,红光发光二极管芯片110与电阻元件112串联形成发光单元110a,且蓝光发光二极管芯片120与发光单元110a并联,并与承载器102耦接,以通过承载器102连接至电源104。Please refer to FIGS. 1A and 1B at the same time, wherein FIG. 1A is a schematic cross-sectional view of a white light emitting diode according to a preferred embodiment of the present invention, and FIG. 1B is a circuit diagram of the white light emitting diode of FIG. 1A . In addition, in order to simplify the drawings and clearly express the features of the present invention, the schematic cross-sectional view of FIG. 1A does not show the relevant connecting wires or circuits of the substrate. As shown in Figures 1A and 1B, the white light emitting diode 100 includes a red light emitting diode chip 110, a blue light emitting diode chip 120 and a carrier 102, wherein the carrier 102 is, for example, a package substrate, and the red light emitting diode chip 110 and the blue light emitting diode chip 110 The chip 120 is, for example, disposed in the cavity 102 a on the surface of the carrier 102 . In addition, the red light emitting diode chip 110 is connected in series with the resistance element 112 to form a light emitting unit 110a, and the blue light emitting diode chip 120 is connected in parallel with the light emitting unit 110a and coupled to the carrier 102 to be connected to the power supply 104 through the carrier 102.

请参考图2,该图为本发明之一较佳实施例之另一种白光发光二极管的线路图。白光发光二极管200例如具有红光发光二极管芯片210、蓝光发光二极管芯片220以及绿光发光二极管芯片230,用以在混光后输出三波长白光,其中红光发光二极管芯片210与电阻元件212串联形成发光单元220a,且蓝光发光二极管芯片220、绿光发光二极管芯片230分别与发光单元220a并联,以耦接至电源204。Please refer to FIG. 2 , which is a circuit diagram of another white light emitting diode according to a preferred embodiment of the present invention. The white light emitting diode 200 has, for example, a red light emitting diode chip 210, a blue light emitting diode chip 220 and a green light emitting diode chip 230 to output three-wavelength white light after light mixing, wherein the red light emitting diode chip 210 is connected in series with a resistor element 212 to form The light emitting unit 220 a , and the blue light emitting diode chip 220 and the green light emitting diode chip 230 are respectively connected in parallel with the light emitting unit 220 a to be coupled to the power source 204 .

在本发明之上述实施例中,由于红光发光二极管芯片所需之驱动电压较低,而蓝光发光二极管芯片与绿光发光二极管芯片所需之驱动电压较高,因此当发光单元、蓝光发光二极管芯片以及绿光发光二极管芯片耦接至同一电压源时,可通过电阻元件调整红光发光二极管芯片所获得之驱动电压,以使得红光发光二极管芯片得以正常运作。如此一来,将不需再分别对每一发光二极管芯片外加驱动芯片,以节省所需之制造成本,并简化驱动线路。In the above-mentioned embodiments of the present invention, since the driving voltage required by the red light emitting diode chip is low, and the driving voltage required by the blue light emitting diode chip and the green light emitting diode chip is relatively high, when the light emitting unit, the blue light emitting diode chip When the chip and the green light emitting diode chip are coupled to the same voltage source, the driving voltage obtained by the red light emitting diode chip can be adjusted through the resistance element, so that the red light emitting diode chip can operate normally. In this way, there is no need to separately add a driver chip to each light-emitting diode chip, so as to save the required manufacturing cost and simplify the driving circuit.

值得一提的是,上述之电阻元件例如是形成于承载器表面或是其内层线路上的金属薄膜或陶瓷薄膜。当然,在本发明其它的实施例中,电阻元件亦可以是独立之电阻器,其可通过通孔插装(Pin Through Hole,PTH)或表面贴装(Surface MountTechnology,SMT)等方式耦接至承载器。此外,虽然上述实施例所绘示之承载器是封装基板之形态,但在本发明其它实施例中,其还可以例如是封装支架,用以承载上述之发光二极管芯片与电阻元件,然其相关线路与设置方式因与上述实施例类似,因此不再重复赘述。It is worth mentioning that the above-mentioned resistance element is, for example, a metal thin film or a ceramic thin film formed on the surface of the carrier or its inner circuit. Of course, in other embodiments of the present invention, the resistance element can also be an independent resistor, which can be coupled to the carrier. In addition, although the carrier shown in the above embodiments is in the form of a packaging substrate, in other embodiments of the present invention, it can also be a packaging bracket, for carrying the above-mentioned light-emitting diode chips and resistor elements, but it is related The wiring and setting methods are similar to those of the above-mentioned embodiments, so the details will not be repeated here.

请再参考图1A,在本发明中,蓝光发光二极管芯片120上方还可设置有封装胶体150,其材质例如是环氧树脂,且此封装胶体150至少覆盖红光发光二极管芯片110、蓝光发光二极管芯片120,并可选择性地覆盖电阻元件112。此外,封装胶体150内例如掺杂有荧光粉140,其材质例如是Y3Al15O12∶Ce3+与Y3Al15O12∶Tb3+,其中荧光粉140适于被蓝光发光二极管芯片120所发出之蓝光124激发而产生波长介于520nm至620nm之间的色光,其例如是黄光134。如此一来,通过蓝光124、黄光134以及红光发光二极管芯片110所发出之红光114便可产生三波长白光。Please refer to FIG. 1A again. In the present invention, an encapsulant 150 may be provided above the blue light emitting diode chip 120, and its material is, for example, epoxy resin. chip 120 and optionally covers the resistive element 112 . In addition, the encapsulant 150 is doped with phosphor powder 140, for example, its material is Y 3 Al 15 O 12 : Ce 3+ and Y 3 Al 15 O 12 : Tb 3+ , wherein the phosphor powder 140 is suitable for being used by blue light emitting diodes. The blue light 124 emitted by the chip 120 is excited to generate colored light with a wavelength between 520 nm and 620 nm, such as yellow light 134 . In this way, the three-wavelength white light can be generated through the blue light 124 , the yellow light 134 and the red light 114 emitted by the red LED chip 110 .

除了上述实施例之外,本发明亦提供其它多种荧光粉的设置方式。请参考图3,该图为本发明之其它实施例之一种白光发光二极管的剖视示意图,其中荧光粉340直接涂覆于蓝光发光二极管芯片320之表面,其同样可被蓝光发光二极管芯片320所发出之蓝光324激发,而发出第三色光,例如黄光334,因此蓝光324、黄光334以及红光发光二极管芯片310所发出之红光314在混光后便可得到三波长白光。In addition to the above-mentioned embodiments, the present invention also provides various other arrangements of phosphors. Please refer to FIG. 3 , which is a schematic cross-sectional view of a white light emitting diode according to other embodiments of the present invention, wherein the phosphor powder 340 is directly coated on the surface of the blue light emitting diode chip 320 , which can also be covered by the blue light emitting diode chip 320 The emitted blue light 324 is excited to emit a third color light, such as yellow light 334 , so the blue light 324 , yellow light 334 and red light 314 emitted by the red LED chip 310 can be mixed to obtain three-wavelength white light.

此外,请参考图4,该图为本发明之其它实施例之另一种白光发光二极管的剖视示意图。其中,红光发光二极管芯片410、蓝光发光二极管芯片420设置于承载器402之凹穴402a内,且凹穴402a上方例如设置有透明盖体452,其材质例如是玻璃。此外,荧光粉440涂覆于透明盖体452之底部452a,且透明盖体452与凹穴402a所围成的空间内例如填充有封装胶体450,覆盖上述之红光发光二极管芯片410与蓝光发光二极管芯片420。其中,通过蓝光发光二极管芯片420所发出之蓝光424、红光发光二极管芯片410所发出之红光414以及荧光粉440受激发后所发出之黄光434便可得到三波长白光。In addition, please refer to FIG. 4 , which is a schematic cross-sectional view of another white light emitting diode according to other embodiments of the present invention. Wherein, the red light emitting diode chip 410 and the blue light emitting diode chip 420 are disposed in the cavity 402a of the carrier 402, and a transparent cover 452, such as glass, is disposed above the cavity 402a. In addition, the fluorescent powder 440 is coated on the bottom 452a of the transparent cover 452, and the space enclosed by the transparent cover 452 and the cavity 402a is filled with encapsulant 450 to cover the above-mentioned red light emitting diode chip 410 and the blue light emitting diode chip 410. Diode chip 420 . The three-wavelength white light can be obtained through the blue light 424 emitted by the blue LED chip 420 , the red light 414 emitted by the red LED chip 410 , and the yellow light 434 emitted by the excited phosphor 440 .

综上所述,本发明之白光发光二极管使驱动电压较低之发光二极管芯片(例如红光发光二极管芯片)串联电阻元件,其中此电阻元件例如可设置于承载器上,用以调整此发光二极管芯片所获得之驱动电压。此外,本发明还可通过第一发光二极管芯片与第二发光二极管芯片作为激发光源,并加入荧光粉,用以在受激发后产生波长介于520nm至620nm之间的第三色光,使得第一发光二极管芯片与第二发光二极管芯片所发出之色光可与此第三色光混光形成三波长白光。To sum up, in the white light emitting diode of the present invention, a light emitting diode chip (such as a red light emitting diode chip) with a lower driving voltage is connected in series with a resistance element, wherein the resistance element can be set on a carrier, for example, to adjust the light emitting diode. The driving voltage obtained by the chip. In addition, the present invention can also use the first light-emitting diode chip and the second light-emitting diode chip as excitation light sources, and add fluorescent powder to generate a third color light with a wavelength between 520nm and 620nm after being excited, so that the first The colored light emitted by the LED chip and the second LED chip can be mixed with the third colored light to form three-wavelength white light.

因此,本发明之白光发光二极管不需使用外加之驱动芯片,便可达到整合不同发光二极管芯片之驱动电压的目的,故可具有较低之制造成本,也可简化驱动线路。此外,本发明之白光发光二极管除了可使用三个发光二极管芯片作为光源之外,亦可采用两个发光二极管芯片搭配荧光粉的组合,以提供三波长白光,与公知的之二波长型的白光发光二极管相比,不仅具有较高之发光效率,且亦具有较佳之色饱和度与显示色温。Therefore, the white light emitting diode of the present invention can achieve the purpose of integrating the driving voltages of different light emitting diode chips without using an external driving chip, so it can have lower manufacturing cost and simplify the driving circuit. In addition, the white light emitting diode of the present invention can not only use three light emitting diode chips as the light source, but also use two light emitting diode chips and a combination of phosphor powder to provide three-wavelength white light, which is different from the known two-wavelength white light. Compared with light-emitting diodes, it not only has higher luminous efficiency, but also has better color saturation and display color temperature.

虽然本发明已以较佳实施例公开如上,然其并非用以限定本发明,任何发明所属技术领域的普通专业人员,在不脱离本发明之思想和范围内,当可作些许之更动与改进,因此本发明之保护范围当视权利要求书所界定者为准。Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any ordinary person in the technical field to which the invention belongs can make some changes and changes without departing from the spirit and scope of the present invention. Improvement, so the scope of protection of the present invention should be defined by the claims.

Claims (23)

1.一种白光发光二极管,其特征是包括:1. A white light emitting diode, characterized in that it comprises: 承载器;carrier; 发光单元,设置于该承载器上,其中该发光单元由第一发光二极管芯片与电阻元件串联而成,且该第一发光二极管芯片适于发出第一色光;以及A light-emitting unit is arranged on the carrier, wherein the light-emitting unit is composed of a first light-emitting diode chip and a resistance element connected in series, and the first light-emitting diode chip is suitable for emitting light of a first color; and 第二发光二极管芯片,设置于该承载器上,其中该第二发光二极管芯片适于发出第二色光,且该第二发光二极管芯片与该发光单元并联。The second light emitting diode chip is arranged on the carrier, wherein the second light emitting diode chip is suitable for emitting a second color light, and the second light emitting diode chip is connected in parallel with the light emitting unit. 2.根据权利要求1所述之白光发光二极管,其特征是该第一发光二极管芯片包括红光发光二极管芯片。2. The white light emitting diode according to claim 1, wherein the first light emitting diode chip comprises a red light emitting diode chip. 3.根据权利要求1所述之白光发光二极管,其特征是该第二发光二极管芯片包括蓝光发光二极管芯片。3. The white light emitting diode according to claim 1, wherein the second light emitting diode chip comprises a blue light emitting diode chip. 4.根据权利要求1所述之白光发光二极管,其特征是还包括荧光粉,设置于该第二发光二极管芯片之上方,且该荧光粉适于被该第二色光激发而产生第三色光。4. The white light emitting diode according to claim 1, further comprising a phosphor disposed above the second light emitting diode chip, and the phosphor is suitable for being excited by the second color light to generate a third color light. 5.根据权利要求4所述之白光发光二极管,其特征是该第三色光之波长介于520nm至620nm之间。5. The white light emitting diode according to claim 4, wherein the wavelength of the third color light is between 520nm and 620nm. 6.根据权利要求4所述之白光发光二极管,其特征是该荧光粉之材质包括Y3Al15O12∶Ce3+与Y3Al15O12∶Tb3+中之一种。6 . The white light emitting diode according to claim 4 , wherein the material of the phosphor comprises one of Y 3 Al 15 O 12 : Ce 3+ and Y 3 Al 15 O 12 : Tb 3+ . 7.根据权利要求4所述之白光发光二极管,其特征是该荧光粉涂覆于该第二发光二极管芯片之表面。7. The white light emitting diode according to claim 4, wherein the phosphor is coated on the surface of the second light emitting diode chip. 8.根据权利要求4所述之白光发光二极管,其特征是还包括封装胶体,设置于该承载器上,且该封装胶体至少覆盖该第一发光二极管芯片与该第二发光二极管芯片,而该荧光粉掺杂于该封装胶体内。8. The white light emitting diode according to claim 4, further comprising an encapsulant disposed on the carrier, and the encapsulant at least covers the first LED chip and the second LED chip, and the encapsulant Phosphor powder is doped in the encapsulation colloid. 9.根据权利要求8所述之白光发光二极管,其特征是该封装胶体之材质包括环氧树脂。9. The white light emitting diode according to claim 8, wherein the encapsulant is made of epoxy resin. 10.根据权利要求4所述之白光发光二极管,其特征是还包括透明盖体,设置于该承载器上,且该透明盖体覆盖于该第一发光二极管芯片与该第二发光二极管芯片之上方,而该荧光粉涂覆于该透明盖体之底部。10. The white light emitting diode according to claim 4, further comprising a transparent cover disposed on the carrier, and the transparent cover covers between the first light emitting diode chip and the second light emitting diode chip above, and the fluorescent powder is coated on the bottom of the transparent cover. 11.根据权利要求10所述之白光发光二极管,其特征是该透明盖体之材质包括玻璃。11. The white light emitting diode according to claim 10, wherein the transparent cover is made of glass. 12.根据权利要求1所述之白光发光二极管,其特征是该电阻元件包括金属薄膜与陶瓷薄膜中之一种。12. The white light emitting diode according to claim 1, wherein the resistor element comprises one of a metal thin film and a ceramic thin film. 13.根据权利要求1所述之白光发光二极管,其特征是该承载器包括封装支架与封装基板中之一种。13. The white light emitting diode according to claim 1, wherein the carrier comprises one of a package holder and a package substrate. 14.一种白光发光二极管,其特征是包括:14. A white light emitting diode, characterized in that it comprises: 承载器;carrier; 发光单元,设置于该承载器上,其中该发光单元由第一发光二极管芯片与电阻元件串联而成,且该第一发光二极管芯片适于发出第一色光;A light-emitting unit is arranged on the carrier, wherein the light-emitting unit is composed of a first light-emitting diode chip and a resistance element connected in series, and the first light-emitting diode chip is suitable for emitting a first color light; 第二发光二极管芯片,设置于该承载器上,其中该第二发光二极管芯片适于发出第二色光;以及a second light emitting diode chip disposed on the carrier, wherein the second light emitting diode chip is suitable for emitting light of a second color; and 第三发光二极管芯片,设置于该承载器上,其中该第三发光二极管芯片适于发出第三色光,且该发光单元、该第二发光二极管芯片以及该第三发光二极管芯片相互并联。The third LED chip is arranged on the carrier, wherein the third LED chip is suitable for emitting light of a third color, and the light emitting unit, the second LED chip and the third LED chip are connected in parallel. 15.根据权利要求14所述之白光发光二极管,其特征是该第一发光二极管芯片包括红光发光二极管芯片。15. The white light emitting diode according to claim 14, wherein the first light emitting diode chip comprises a red light emitting diode chip. 16.根据权利要求14所述之白光发光二极管,其特征是该第二发光二极管芯片包括蓝光发光二极管芯片。16. The white light emitting diode according to claim 14, wherein the second light emitting diode chip comprises a blue light emitting diode chip. 17.根据权利要求14所述之白光发光二极管,其特征是该第三发光二极管芯片包括绿光发光二极管芯片。17. The white light emitting diode according to claim 14, wherein the third light emitting diode chip comprises a green light emitting diode chip. 18.根据权利要求14所述之白光发光二极管,其特征是还包括封装胶体,设置于该承载器上,且该封装胶体至少覆盖该第一发光二极管芯片、该第二发光二极管芯片以及该第三发光二极管芯片。18. The white light emitting diode according to claim 14, further comprising an encapsulant disposed on the carrier, and the encapsulant at least covers the first LED chip, the second LED chip and the second LED chip. Three LED chips. 19.根据权利要求18所述之白光发光二极管,其特征是该封装胶体之材质包括环氧树脂。19. The white light emitting diode according to claim 18, wherein the encapsulant is made of epoxy resin. 20.根据权利要求14所述之白光发光二极管,其特征是还包括透明盖体,设置于该承载器上,且该透明盖体覆盖于该第一发光二极管芯片、该第二发光二极管芯片以及该第三发光二极管芯片之上方。20. The white light emitting diode according to claim 14, further comprising a transparent cover disposed on the carrier, and the transparent cover covers the first light emitting diode chip, the second light emitting diode chip and above the third LED chip. 21.根据权利要求20所述之白光发光二极管,其特征是该透明盖体之材质包括玻璃。21. The white light emitting diode according to claim 20, wherein the transparent cover is made of glass. 22.根据权利要求14所述之白光发光二极管,其特征是该电阻元件包括金属薄膜与陶瓷薄膜中之一种。22. The white light emitting diode according to claim 14, wherein the resistance element comprises one of a metal thin film and a ceramic thin film. 23.根据权利要求14所述之白光发光二极管,其特征是该承载器包括封装支架与封装基板中之一种。23. The white light emitting diode according to claim 14, wherein the carrier comprises one of a package holder and a package substrate.
CNA2004100964412A 2004-12-01 2004-12-01 white light emitting diode Pending CN1783521A (en)

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WO2008017207A1 (en) * 2006-08-02 2008-02-14 Helio Optoelectronics Corporation A light emitting diode circuit having a plurality of critical voltages and a light emitting diode device
WO2008104106A1 (en) * 2007-02-27 2008-09-04 He Shan Lide Electronic Enterprise Company Ltd. A method of producing white light and a white light led obtained by using such producing method
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US7635870B2 (en) 2006-07-24 2009-12-22 Everlight Electronics Co., Ltd. LED packaging structure
US8093600B2 (en) 2006-07-24 2012-01-10 Everlight Electronics Co., Ltd. LED packaging structure
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WO2008017207A1 (en) * 2006-08-02 2008-02-14 Helio Optoelectronics Corporation A light emitting diode circuit having a plurality of critical voltages and a light emitting diode device
CN101118920B (en) * 2006-08-02 2010-07-21 海立尔股份有限公司 Sub-adhesive substrate and high-voltage light-emitting diode chip with impedance element
WO2008104106A1 (en) * 2007-02-27 2008-09-04 He Shan Lide Electronic Enterprise Company Ltd. A method of producing white light and a white light led obtained by using such producing method
CN101261981B (en) * 2007-03-06 2010-11-17 先进开发光电股份有限公司 warm color light source
CN101373763B (en) * 2007-08-24 2010-11-10 富士迈半导体精密工业(上海)有限公司 Led
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CN102437153B (en) * 2011-11-09 2013-08-14 友达光电股份有限公司 Light emitting source and display panel thereof
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