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CN1737418A - LED lamp for improving heat radiation effect - Google Patents

LED lamp for improving heat radiation effect Download PDF

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Publication number
CN1737418A
CN1737418A CNA2005100364742A CN200510036474A CN1737418A CN 1737418 A CN1737418 A CN 1737418A CN A2005100364742 A CNA2005100364742 A CN A2005100364742A CN 200510036474 A CN200510036474 A CN 200510036474A CN 1737418 A CN1737418 A CN 1737418A
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CN
China
Prior art keywords
led
lamp
lamp housing
heat sink
heat
Prior art date
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Pending
Application number
CNA2005100364742A
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Chinese (zh)
Inventor
周应东
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to CNA2005100364742A priority Critical patent/CN1737418A/en
Publication of CN1737418A publication Critical patent/CN1737418A/en
Pending legal-status Critical Current

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

This invention relates to a LED light which can improve heat radiation effect. The light comprises a lamp body (1), a lamp body bottom cap (3), or a lamp body face cap (2), wherein the lamp body (1) can integrate the lamp body bottom cap (3) or the lamp body face cap (2) into a whole; the light also comprises a circuit which ha LED (4), electronic component and corresponding normal PCB printed circuit board (5); the circuit is in the lamp body or in the inner cavity of the lamp body bottom cap (3) or in the lamp body face cap (2); the printed circuit board has the corresponding filling hole with the LED (4), the LED pipe heat sink (7) will pass through the filling hole (6) and contact with the lamp body bottom cap (3) or lamp body (1) or lamp body face cap (2), forming the heat emission channel of the LED (4). By said invention, it can emit heat directly to air or water or earth.

Description

Improve the LED lamp of radiating effect
Technical field
The present invention relates to improve the LED lamp of radiating effect, particularly a kind of array type large power LED lamp.
Background technology
LED has that energy consumption is low, caloric value is lower and the advantage of long service life, can substitute conventional light source fully.Consider single chip LED luminosity deficiency, the LED lamp generally adopts the led array structure, has produced the difficult problem of LED lamp heat radiation thus.
In Chinese patent application publication number CN1277665A document, a kind of LED lamp heat sink conception is disclosed, its heat radiation is the heat that absorbs the pedestal that connects LED by the joint pin in the lamp body in this scheme, still in lamp body, dispel the heat then, because it is repeatedly to dispel the heat indirectly, and in the sealing lamp body, dispel the heat poor effect.
In Chinese patent application publication number CN1359137A document, a kind of heat pipe lamp heat sink conception is disclosed, its heat radiation is the heat that absorbs light-emitting device by super heat-conductive pipe one end in this scheme, in other end transfer of heat to the lamp body radiating piece that contacts with air, because it is still repeatedly heat radiation indirectly, effect is still not good.
In Chinese patent Granted publication CN2557805Y document, a kind of high-powered LED lamp heat sink conception is disclosed, its heat radiation is that heat by absorption of air LED in the lamp body is sent to the lamp body radiating piece that contacts with air in this scheme, still belongs to indirect heat radiation, and effect is also not good.
In Chinese patent application publication number CN1594962A document, a kind of LED lamp heat sink conception is disclosed, its heat radiation is that the heat of LED sees through that light source board reaches the heat conductive insulating film and the heat conductive insulating adhesive plaster reaches heat-dissipating casing again in this scheme, also is indirect heat radiation, and effect is still not good.
In Chinese patent application publication number CN1605794A document, a kind of heat sink conception of LED shot-light is disclosed, its heat radiation is to be sent to the heat-dissipating casing that contacts with air by the heat that air in the lamp body or inserts absorb LED in this scheme, is still indirect heat radiation, still poor effect.
In Chinese patent application publication number CN1603679A document, a kind of LED lamp heat sink conception is disclosed, its heat radiation is that the heat (mainly being the heat of LED basal part) of LED sees through wiring board and leads the heat radiation glue-line and is sent to heat sink in this scheme, still is indirect heat radiation, still poor effect.
Summary of the invention
The objective of the invention is to overcome the shortcoming of above-mentioned prior art, a kind of technical scheme with great heat radiation effect is provided, so that it is low to make a kind of energy consumption, long service life, the high-powered LED lamp that optical energy attenuation is little.
For this reason, the technical solution that the present invention proposes is: a kind of LED lamp, it comprises a lamp housing body, a lamp housing bottom, also can comprise a lamp housing cover, this lamp housing body can fuse with the lamp housing bottom, also can fuse with the lamp housing cover, one is contained in being provided with LED and electronic devices and components and corresponding conventional PCB printed circuit board (PCB) or being printed on circuit on lamp housing body or lamp housing cover or the lamp housing bottom inner chamber with thick-film technique in the lamp housing, described printed circuit board (PCB) is provided with and the corresponding containing hole of LED quantity, the LED body is heat sink to be passed containing hole and as LED secondary heat sink lamp housing bottom or lamp housing body or the thermo-contact of lamp housing cover, forms the heat dissipation channel of LED.
Wherein, described is to be made by Heat Conduction Material as the heat sink lamp housing bottom of LED secondary or lamp housing body or lamp housing cover, and preferable material is aluminium alloy, copper.
And described lamp housing bottom, lamp housing body, lamp housing cover all are exposed in the air or in the water or in the soil, and described San Re Zhu sheet also is exposed in the air or in the water or in the soil.
In addition, the area of described lamp housing bottom is not less than or less than the area of described printed circuit board (PCB).
The present invention is further illustrated below in conjunction with drawings and Examples.
Description of drawings
Fig. 1 is the LED wall lamp structural representation of the embodiment of the invention 1;
Fig. 2 is the sectional structure schematic diagram of wall lamp among Fig. 1;
Fig. 3 is the LED shot-light structural representation of the embodiment of the invention 2;
Fig. 4 is the sectional structure schematic diagram of shot-light among Fig. 3;
Fig. 5 is the LED street lamp holder structure schematic diagram of the embodiment of the invention 3;
Fig. 6 is the sectional structure schematic diagram of road lamp cap among Fig. 5;
Fig. 7 is the LED Cup lamp structure schematic diagram of the embodiment of the invention 4;
Fig. 8 is the sectional structure schematic diagram of cup lamp among Fig. 7;
Please noting as above in each accompanying drawing that same functional part is unified uses same numbering, and wherein 1 is the lamp housing body, and the 2nd, the lamp housing cover, the 3rd, the lamp housing bottom, the 4th, LED, the 5th, printed circuit board (PCB), the 6th, containing hole, the 7th, the LED body is heat sink, and the 8th, San Re Zhu sheet.
The specific embodiment
Embodiment 1 as shown in Figure 1 and Figure 2.The LED wall lamp is strip, and the rectangular direction in its upper edge is arranged one row single chip LED (4); The corresponding containing hole (6) that the LED body of every LED (4) heat sink (7) passes on the strip printed circuit board (PCB) (5) contacts with strip lamp housing bottom (3) direct heat, the heat of the overwhelming majority of LED (4) directly is passed to from LED body heat sink (7) as the heat sink lamp housing bottom (3) of LED (4) secondary, lamp housing bottom (3) and on fin (8) all directly be exposed in the air or soil (containing various walls) in heat radiation; Every LED (4) body then sees through lamp housing cover (2) and launch LED light outside lamp housing; The area of described lamp housing bottom (3) is slightly larger than the area of printed circuit board (PCB) (5); (3) are Ji San Zhu backing (8) is to be formed by the aluminium alloy manufacturing to described lamp housing bottom.
Experiment shows, the wall lamp of present embodiment, because lamp housing bottom (3) is heat sink directly to LED body heat sink (7) heat absorption as the huge secondary of LED (4) array, directly dispels the heat in air or in the water or in the soil (containing various walls), thereby has obtained very better heat radiating effect.
Embodiment 2 as shown in Figure 3, Figure 4.The LED shot-light is round shape, which is provided with the single chip LED (4) that is array; The corresponding containing hole (6) that the LED body of every LED (4) heat sink (7) passes on the printed circuit board (PCB) (5) of toroidal contacts with toroidal lamp housing bottom (3) direct heat, the heat of the overwhelming majority of LED (4) directly is passed to from LED body heat sink (7) as the heat sink toroidal lamp housing bottom (3) of LED (4) secondary, lamp housing bottom (3) and on San Re Zhu sheet (8) directly be exposed in the air or in the water or in the soil and dispel the heat; Every LED (4) body then sees through lamp housing cover (2) and launch LED light outside lamp housing; The area of described lamp housing bottom (3) is slightly larger than the area of printed circuit board (PCB) (5), so that printed circuit board (PCB) (5) is installed within the lamp housing body (1); Described lamp housing bottom (3) and last San Re Zhu sheet (8) thereof are to be formed by the aluminium alloy manufacturing.
Experiment shows, the shot-light of present embodiment because lamp housing bottom (3) is heat sink directly to LED body heat sink (7) heat absorption as the huge secondary of LED (4) array, directly dispels the heat in air or in the water or in the soil, thereby obtained very better heat radiating effect.
Embodiment 3 is as Fig. 5, shown in Figure 6.The rounded shape of LED road lamp cap, its row single chip LED (4) of going into battle; The corresponding containing hole (6) that the LED body of every LED (4) heat sink (7) passes on the toroidal printed circuit board (PCB) (5) contacts with toroidal lamp housing bottom (3) direct heat, the heat of the overwhelming majority of LED (4) directly is passed to from LED body heat sink (7) as the heat sink lamp housing bottom (3) of LED (4) secondary, lamp housing bottom (3) and on San Re Zhu sheet (8) directly be exposed in the air and dispel the heat; Every LED (4) body then sees through lamp housing cover (2) and launch LED light outside lamp housing; The area of described lamp housing bottom (3) is slightly larger than the area of printed circuit board (PCB) (5), so that printed circuit board (PCB) (5) is installed within the lamp housing body (1); Described lamp housing bottom (3) and last San Re Zhu sheet (8) thereof are to be formed by the aluminium alloy manufacturing.
Experiment shows, the street lamp of present embodiment because lamp housing bottom (3) is heat sink directly to LED body heat sink (7) heat absorption as the huge secondary of LED (4) array, directly dispels the heat in air, thereby obtained very better heat radiating effect.
Embodiment 4 is as Fig. 7, shown in Figure 8.LED cup lamp is the little cup-shaped of the big other end of an end, its row single chip LED (4) of going into battle; The corresponding containing hole (6) that the LED body of every LED (4) heat sink (7) passes on the printed circuit board (PCB) (5) contacts with lamp housing bottom (3) direct heat, the heat of the overwhelming majority of LED (4) directly is passed to from LED body heat sink (7) as the heat sink lamp housing body (1) of LED (4) secondary, lamp housing body (1) and on San Re Zhu sheet (8) directly be exposed in the air and dispel the heat; Every LED (4) body then sees through lamp housing cover (2) and launch LED light outside lamp housing; The area of described lamp housing body (1) is slightly larger than the area of printed circuit board (PCB) (5), so that printed circuit board (PCB) (5) is installed within the lamp housing body (1); Described lamp housing body (1) and last fin (8) thereof are to be formed by the aluminium alloy manufacturing.
Experiment shows, the cup lamp of present embodiment because lamp housing body (1) is heat sink directly to LED body heat sink (7) heat absorption as the huge secondary of LED (4) array, directly dispels the heat in air, thereby obtained very better heat radiating effect.
Above-mentioned four embodiment are exemplary embodiment of the present invention, in other different embodiment, can do different adjustment to technical scheme.Heat sink with lamp housing bottom (3) or lamp housing body (1) in above-mentioned four embodiment as the secondary of LED (4), in other embodiments can be heat sink as the secondary of LED (4) with lamp housing body (1) or lamp housing cover (2); In above-mentioned four embodiment, be provided with the printed circuit board (PCB) (5) of bearer circuit separately, can circuit directly be printed on lamp housing body (1) or lamp housing cover (2) or the lamp housing bottom (3) with thick-film technique in other embodiments; In different embodiment, as heat sink lamp housing bottom (3) or lamp housing body (1) or the lamp housing cover (2) of secondary and San Re Zhu sheet (8) is exposed in the air or in the water or in the soil or in other different outside air environment; In above-mentioned four embodiment, be slightly larger than the area of printed circuit board (PCB) (5) as the area of the heat sink lamp housing bottom (3) of LED (4) secondary, in different embodiment, can be equal to or less than printed circuit board (PCB) as the area of the heat sink lamp housing bottom (3) of LED (4) secondary.

Claims (9)

1, improves the LED lamp of radiating effect, it comprises a lamp housing body (1), a lamp housing bottom (3), also can comprise a lamp housing cover (2), this lamp housing body (1) can fuse with lamp housing bottom (3), also can fuse with lamp housing cover (2), one is contained in being provided with LED (4) and electronic devices and components and corresponding conventional PCB printed circuit board (PCB) (5) or being printed on circuit on lamp housing body (1) or lamp housing cover (2) or lamp housing bottom (3) inner chamber with thick-film technique in the lamp housing.It is characterized in that, described printed circuit board (PCB) (5) is provided with and the corresponding containing hole of LED (4) quantity (6), the LED body is heat sink (7) passes containing hole (6) and as LED (4) secondary heat sink lamp housing bottom (3) or lamp housing body (1) or lamp housing cover (2) thermo-contact, forms the heat dissipation channel of LED (4).
2, LED lamp as claimed in claim 1 is characterized in that, described LED lamp is a strip LED wall lamp.
3, LED lamp as claimed in claim 1 is characterized in that, described LED lamp is circle shape shot-light or underwater spotlight.
4, LED lamp as claimed in claim 1 is characterized in that, described LED lamp is the road lamp cap of circle shape.
5, LED lamp as claimed in claim 1 is characterized in that, described LED lamp is the cup lamp.
As the LED lamp of the arbitrary claim of claim 1 to 5, it is characterized in that 6, described is to be made by Heat Conduction Material as the heat sink lamp housing bottom (3) of LED secondary or lamp housing body (1) or lamp housing cover (2), preferable material is aluminium alloy, copper.
7, as the LED lamp of the arbitrary claim of claim 1 to 5, it is characterized in that, described as the heat sink lamp housing bottom (3) of LED secondary, lamp housing body (1), lamp housing cover (2) all is exposed in the air or in the water or in the soil, described radiating fin (8) also is exposed in the air or in the water or in the soil.
As the LED lamp of the arbitrary claim of claim 1 to 5, it is characterized in that 8, described as the heat sink lamp housing bottom (3) of LED secondary, its area is not less than the area of described printed circuit board (PCB) (5).
As the LED lamp of the arbitrary claim of claim 1 to 5, it is characterized in that 9, described as the heat sink lamp housing bottom (3) of LED secondary, its area is less than the area of described printed circuit board (PCB) (5).
CNA2005100364742A 2005-08-11 2005-08-11 LED lamp for improving heat radiation effect Pending CN1737418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2005100364742A CN1737418A (en) 2005-08-11 2005-08-11 LED lamp for improving heat radiation effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2005100364742A CN1737418A (en) 2005-08-11 2005-08-11 LED lamp for improving heat radiation effect

Publications (1)

Publication Number Publication Date
CN1737418A true CN1737418A (en) 2006-02-22

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ID=36080306

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005100364742A Pending CN1737418A (en) 2005-08-11 2005-08-11 LED lamp for improving heat radiation effect

Country Status (1)

Country Link
CN (1) CN1737418A (en)

Cited By (33)

* Cited by examiner, † Cited by third party
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WO2007143875A3 (en) * 2006-05-30 2008-02-28 Jen-Shyan Chen High-power and high heat-dissipating light emitting diode illuminating equipment
WO2009012636A1 (en) * 2007-07-20 2009-01-29 Xuliang Li A led street lamp
WO2009026736A1 (en) * 2007-08-24 2009-03-05 He Shan Lide Electronic Enterprise Company Ltd. An led street lamp
CN101373060B (en) * 2007-08-21 2010-06-16 浩然科技股份有限公司 LED street light
US7772036B2 (en) 2006-04-06 2010-08-10 Freescale Semiconductor, Inc. Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
CN101387379B (en) * 2007-09-14 2010-10-13 南京汉德森科技股份有限公司 Plant growth lamp of high-efficiency high-power LED light source
CN102226508A (en) * 2011-05-13 2011-10-26 肖方一 A kind of LED lamp and preparation method thereof
US8052301B2 (en) 2008-12-18 2011-11-08 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp
US8070306B2 (en) 2006-09-30 2011-12-06 Ruud Lighting, Inc. LED lighting fixture
CN101631985B (en) * 2006-12-22 2012-12-26 莫顿·格拉哈姆 light emitting device
US8434912B2 (en) 2006-02-27 2013-05-07 Illumination Management Solutions, Inc. LED device for wide beam generation
RU2487296C2 (en) * 2011-04-19 2013-07-10 Роман Дмитриевич Давыденко Illumination device
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US8727573B2 (en) 2010-09-01 2014-05-20 Cooper Technologies Company Device and apparatus for efficient collection and re-direction of emitted radiation
US8777457B2 (en) 2007-05-21 2014-07-15 Illumination Management Solutions, Inc. LED device for wide beam generation and method of making the same
US8783900B2 (en) 2008-12-03 2014-07-22 Illumination Management Solutions, Inc. LED replacement lamp and a method of replacing preexisting luminaires with LED lighting assemblies
US8845129B1 (en) 2011-07-21 2014-09-30 Cooper Technologies Company Method and system for providing an array of modular illumination sources
US8905597B2 (en) 2006-02-27 2014-12-09 Illumination Management Solutions, Inc. LED device for wide beam generation
CN104235713A (en) * 2014-09-15 2014-12-24 广东顺德西安交通大学研究院 High-power LED (Light-Emitting Diode) street lamp
CN104406120A (en) * 2014-12-18 2015-03-11 西南科技大学 Illuminating and landscaping integrated lamp system
WO2015062144A1 (en) * 2013-11-01 2015-05-07 梁卫昕 High-power led underwater lamp
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US9052086B2 (en) 2011-02-28 2015-06-09 Cooper Technologies Company Method and system for managing light from a light emitting diode
US9080739B1 (en) 2012-09-14 2015-07-14 Cooper Technologies Company System for producing a slender illumination pattern from a light emitting diode
US9140430B2 (en) 2011-02-28 2015-09-22 Cooper Technologies Company Method and system for managing light from a light emitting diode
US9200765B1 (en) 2012-11-20 2015-12-01 Cooper Technologies Company Method and system for redirecting light emitted from a light emitting diode
CN105136312A (en) * 2015-09-22 2015-12-09 中国科学院上海技术物理研究所 Elasticity testing socket for low-temperature application
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US9297517B2 (en) 2008-08-14 2016-03-29 Cooper Technologies Company LED devices for offset wide beam generation
US9541246B2 (en) 2006-09-30 2017-01-10 Cree, Inc. Aerodynamic LED light fixture
CN112086366A (en) * 2020-09-10 2020-12-15 中芯长电半导体（江阴）有限公司 System-in-package structure and packaging method of LED chip
WO2021128528A1 (en) * 2019-12-26 2021-07-01 深圳市帆锐科技有限公司 Exterior wall lamp and assembly method therefor
CN114458981A (en) * 2022-01-12 2022-05-10 浙江宏恩装饰工程有限公司 Stainless steel built-in wall washer lamp, the fixed installation structure of the lamp and its installation method

Cited By (53)

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US10174908B2 (en) 2006-02-27 2019-01-08 Eaton Intelligent Power Limited LED device for wide beam generation
US9388949B2 (en) 2006-02-27 2016-07-12 Illumination Management Solutions, Inc. LED device for wide beam generation
US8434912B2 (en) 2006-02-27 2013-05-07 Illumination Management Solutions, Inc. LED device for wide beam generation
US8905597B2 (en) 2006-02-27 2014-12-09 Illumination Management Solutions, Inc. LED device for wide beam generation
US9297520B2 (en) 2006-02-27 2016-03-29 Illumination Management Solutions, Inc. LED device for wide beam generation
US7772036B2 (en) 2006-04-06 2010-08-10 Freescale Semiconductor, Inc. Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
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EA014861B1 (en) * 2006-05-30 2011-02-28 Необульб Текнолоджиз Инк. High-power and high heat-dissipating light emitting diode illuminating equipment
WO2007143875A3 (en) * 2006-05-30 2008-02-28 Jen-Shyan Chen High-power and high heat-dissipating light emitting diode illuminating equipment
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US9080739B1 (en) 2012-09-14 2015-07-14 Cooper Technologies Company System for producing a slender illumination pattern from a light emitting diode
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CN104235713A (en) * 2014-09-15 2014-12-24 广东顺德西安交通大学研究院 High-power LED (Light-Emitting Diode) street lamp
CN104406120A (en) * 2014-12-18 2015-03-11 西南科技大学 Illuminating and landscaping integrated lamp system
CN105136312A (en) * 2015-09-22 2015-12-09 中国科学院上海技术物理研究所 Elasticity testing socket for low-temperature application
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