CN1704762A

CN1704762A - Internal circuit detection method and detection device used therefor

Info

Publication number: CN1704762A
Application number: CN 200410042818
Authority: CN
Inventors: 张铭元
Original assignee: MINWAY TECH Ltd
Current assignee: MINWAY TECH Ltd
Priority date: 2004-05-26
Filing date: 2004-05-26
Publication date: 2005-12-07

Abstract

The invention is a method for detecting internal circuit and its applied detection device, mainly making the detection platform to form a detection surface by selecting arrangement mode, the detection device integrates the chip with decoder circuit, circuit switch and metal test contact by integrated packaging technology, making the metal test contact distributed on the top of the chip by high density arrangement mode, if so, when the object to be detected contacts the detection internal circuit with the detection platform, any circuit contact on the object to be detected has several test contacts corresponding to it, making the invention cover any object to be detected with circuit structure.

Description

The pick-up unit of interior circuit detecting method and utilization thereof

Technical field

The present invention is about the pick-up unit of circuit detecting method in a kind of and utilization thereof, especially finger is a kind of directly designs test contacts on the integrated circuit (IC) wafer surface, after making wafer form pick-up unit and selected arrangement laying, can be configured to the detection faces of a high-density test contact easily, the detection method and the device thereof of circuit measuring point in carrying out for the arbitrary measured object of correspondence with circuit structure.

Background technology

General various its interior electric circuit inspection mode (as shown in Figure 6) of measured object with circuit structure, majority is to utilize mechanical structure to form, connect with trickle probe 10 ends and to establish signal conductor 20, and according to the circuit junction position on the measured object 30 the corresponding exclusive spring dials seat 10A that is configured to, and signal conductor 20 distributions are connected to computer equipment, if this, when utilization two corresponding dials seat 10A folders are surveyed measured object 30, can see through programmed control, transmit detection signal to two dials seat 10A with signal conductor 20 and go up specific probe 10, thus to reach the effect that detects interior circuit.

Utilize the detection platform (such as special-purpose dials, general-purpose dials or flying probe platform etc.) of above-mentioned employing probe 10 as touch detection point, because of each detecting point spacing distance to each other, be subject to the physical dimension influence of probe 10 and can't give precise treatment, the detecting dot density that makes on the detection platform to be had can't reduce, so for accurate day by day measured object 30, be not enough to corresponding the detection.Again, the detection platform of forming with probe 10 must be in the mode of manual work when making, probe 10 is implanted is one by one detected pedestal, and make signal conductor 20 distribution in succession one by one, reality for take a lot of work, the time-consuming utmost point is not inconsistent economic benefit.

Summary of the invention

Fundamental purpose of the present invention, be to provide the pick-up unit of a kind of interior circuit detecting method and utilization thereof, mainly make detection platform in selected mode of arranging, pick-up unit is configured to one has the detection faces of high-density test contact, in tested material and detection platform being touched mutually detect during circuit, arbitrary circuit junction on the tested material all has the corresponding some test contacts that touch with it, makes detection platform contain and is suitable for circuit in arbitrary tested material detection.

Secondary objective of the present invention, be to provide the pick-up unit of a kind of interior circuit detecting method and utilization thereof, this pick-up unit is mainly with integrated encapsulated circuit technology, decoder circuit, contactor and the integration of metallic test contact are linked on the wafer, and the metallic test contact is directly designed on kind of the wafer surface, make the surface of wafer have the check point that high density distributes.

Another object of the present invention, it is the pick-up unit that is to provide a kind of interior circuit detecting method and utilization thereof, lay on the detection faces of the selected arrangement of order wafer and have a conductive film, make can the disappear high low head degree of on measured object circuit junction of this conductive film, make measured object measuring point and wafer inspection face that more shape is docile, improve the smart Huaihe River degree of test.

The object of the present invention is achieved like this: circuit detecting method in a kind of, it mainly is to make detection platform with a plurality of selected detection faces that are arranged in of pick-up unit with high-density test contact, in measured object and detection platform being touched detect during circuit, arbitrary circuit junction on the measured object all has the corresponding number of metal test contacts that touches with it, makes each circuit junction carry out signal conduction by the metallic test contact on the computer equipment control detection device and detection one by one.

The equal distribution of each pick-up unit of described detection platform connect to computer equipment with programmed control.

The pick-up unit of circuit in a kind of the detection, mainly the pedestal that has a spring device by wafer and is formed, the chosen place encapsulation of wafer surface is arranged with a plurality of metallic test contacts, make each metallic test contact see through encapsulated wafer processing procedure and with wafer in integrated circuit conducting in succession, wafer is suitably tied the top end face of being located at this pedestal, is configured to a pick-up unit.

This metallic test contact is arranged at wafer surface with highdensity selected arrangement mode.

This pick-up unit is that distribution connects to computer equipment and with programmed control.

Respectively have additional a conductive film between the detection face of measured object and two detection platform.

This pedestal can be selected to arrange to lay and put on the detection platform, makes it to be configured to the detection face of a large-scale high-density test contact.

Description of drawings

Figure 1 shows that the amplification schematic perspective view of wafer among the present invention.

Figure 2 shows that among the present invention and constitute the laying synoptic diagram that detects face with pick-up unit.

Figure 3 shows that checkout equipment arrangement plan of the present invention.

Figure 4 shows that the present invention cooperates the enforcement view of conductive film.

Figure 5 shows that the enforcement attitude shape diagrammatic cross-section of conductive film among the present invention.

Figure 6 shows that the existing structural profile synoptic diagram of implementing detection with probe.

The figure number explanation

10 probe 10A spring dials seats

20 signal conductors, 30 measured objects

1 detection platform, 2 pick-up units

21 wafers, 22 metallic test contacts

23 integrated circuit, 24 pedestals

3 measured objects, 31 circuit junctions

4 computer equipments, 5 conductive films

Embodiment

As Fig. 1～shown in Figure 3, the pick-up unit of circuit detecting method and utilization thereof design in the present invention, major technique is to make detection platform 1 be configured to one with a plurality of pick-up units 2 have the detection faces of high-density test contact, during circuit, the arbitrary circuit junction 31 on the measured object 3 all has the corresponding number of metal test contacts 22 that touches with it in measured object 3 and detection platform 1 being touched mutually detect.

For reaching this technical characterictic, must break through the utilization means of existing integrated circuit switch, make integrated circuit switch need not see through encapsulated wafer, the application kenel of built-up circuit plate is used, and metallic test contact 22 is directly seen through the action of encapsulated wafer 21, this is from being directed at integrated circuit 23 (as shown in Figure 1) in succession, make metallic test contact 22 be laid in the surface of wafer 21 with highdensity arrangement mode, integrated circuit 23 is then broken up to lay and is taken shape between each metallic test contact 22, so can overcome metallic test contact 22 and arrange intercommunity following and integrated circuit 23 in high density.

As shown in Figure 2, so will being packaged with 21 groups of knots one of wafer of metallic test contact 22 and integrated circuit 23, the present invention has on the pedestal 24 of spring device, make it be configured to a pick-up unit 2, and selected the arrangement laid number pick-up unit 2 after detection platform 1, is to make detection platform 1 be configured to the detection face of a large-scale high-density test contact.

As shown in Figure 3, when the present invention uses in actual detected, be to get two detection platform 1 to set up in the mode that the detection faces with a plurality of pick-up units 2 is mutual correspondence, make the distribution of the wafer 21 of each detection platform 1 connect to a computer equipment 4, after making measured object 3 be folded in two detection faces, arbitrary circuit junction 31 of this measured object 3 is touched by one or more metallic test contact 22 correspondences all can, makes computer equipment 4 fully carry out signal conduction at each circuit junction 31 and detection one by one.

In addition, as Fig. 4 and shown in Figure 5, for guaranteeing that measured object 3 is when detecting, its each circuit junction 31 and pairing metallic test contact 22 all are complete leading and touch and do not hinder, make and between the detection face of measured object 3 and two detection platform 1, set up a conductive film 5, the characteristic of utilizing this conductive film 5 to have elasticity and electrically conduct, conductive film 5 can be reached disappear the effect of circuit junction 31 high low heads on measured object 3, make the circuit junction 3 of measured object 3 and the state that touches of metallic test contact 22 that more shape is firmly docile, can improve test accuracy.

Claims

1, a kind of interior circuit detecting method, it is characterized in that, it mainly is to make detection platform with a plurality of selected detection faces that are arranged in of pick-up unit with high-density test contact, in measured object and detection platform being touched detect during circuit, arbitrary circuit junction on the measured object all has the corresponding number of metal test contacts that touches with it, makes each circuit junction carry out signal conduction by the metallic test contact on the computer equipment control detection device and detection one by one.

2, circuit detecting method in as claimed in claim 1 is characterized in that, the equal distribution of each pick-up unit of described detection platform connect to computer equipment with programmed control.

3, the pick-up unit of circuit in a kind of the detection, it is characterized in that, mainly the pedestal that has a spring device by wafer and is formed, the chosen place encapsulation of wafer surface is arranged with a plurality of metallic test contacts, make each metallic test contact see through encapsulated wafer processing procedure and with wafer in integrated circuit conducting in succession, wafer is suitably tied the top end face of being located at this pedestal, is configured to a pick-up unit.

4, as the pick-up unit of circuit in the detection as described in the claim 3, it is characterized in that this metallic test contact is arranged at wafer surface with highdensity selected arrangement mode.

5, as the pick-up unit of circuit in the detection as described in the claim 3, it is characterized in that this pick-up unit is that distribution connects to computer equipment and with programmed control.

6, as the pick-up unit of circuit in the detection as described in the claim 3, it is characterized in that, respectively have additional a conductive film between the detection face of measured object and two detection platform.

As the pick-up unit of circuit in the detection as described in the claim 3, it is characterized in that 7, this pedestal can be selected to arrange to lay and put on the detection platform, makes it to be configured to the detection face of a large-scale high-density test contact.