CN1696595A - Heat pipe and manufacturing method thereof - Google Patents

Abstract

A heat pipe and its manufacturing method, the manufacturing method includes the following steps: providing a catheter; processing the conduit to shape the conduit; inserting a plastic bar into the conduit; forming a capillary structure; separating the plastic bar and the guide pipe; and injecting a working fluid and forming a closed space. The heat pipe of the invention can avoid the damage of the capillary structure of the existing pipe caused by the subsequent processing because the shape processing of the heat pipe is carried out firstly and then the internal capillary structure is formed, thereby keeping the complete capillary structure and improving the integral heat conduction capability of the heat pipe.

Description

Heat pipe and manufacturing method thereof

technical field

The present invention relates to a heat pipe and its manufacturing method, in particular to a heat pipe manufacturing method with high heat conduction efficiency.

Background technique

With the advancement of technology, the number of transistors per unit area of electronic components is increasing, resulting in an increase in heat generation during operation. On the other hand, the operating frequency of electronic components is getting higher and higher, and the heat (switch loss) caused by the on/off transition when the transistor is working is also the reason for the increase in the heat generation of electronic components. In recent years, due to the rapid development of semiconductor technology and IC packaging technology, the calculation speed of the chip has been greatly improved, which relatively makes the heat consumption of the chip increase with the increase of the clock frequency when the chip is in operation. Dealing with the heat will reduce the computing speed of the chip, and even affect the life of the chip in severe cases.

Therefore, how to effectively deal with the heat consumption, the current method is mostly to use external fans and cooling fins to maintain the chip at an effective operating temperature. In order to quickly dissipate heat, the faster fan operation will increase the power consumption and noise, and increasing the heat dissipation fins can improve the heat conduction performance, but it will make the economy of space utilization worse. And because the heat pipe (heat pipe) can transmit a large amount of heat for a considerable distance under a small cross-sectional area and temperature difference, and can operate without an external power supply, it does not require power supply and space utilization economy Under consideration, heat pipes are gradually and widely used in electronic products.

Please refer to FIG. 1 , which is a flowchart of a conventional heat pipe manufacturing method. Generally, the manufacturing method of the traditional heat pipe includes the following steps. First, in step 102, a hollow copper tube is provided as a conduit, and one end of the hollow copper tube has been sealed first. Next, in step 104, a rod is inserted into the catheter. Since one end of the hollow copper tube has been sealed first, generally speaking, the seal is in the shape of a cone with a convex center, so one end of the rod can be placed on the top of the cone-shaped seal for positioning. In this way, a space with a fixed gap is formed between the pipe wall of the conduit and the bar. The used rod is, for example, a stainless steel rod, graphite rod or rigid rod made of other materials.

Then, in step 106, copper powder is filled in the gap space between the tube wall and the bar, and the copper powder can be further compressed to make the copper powder compact according to the requirements of the process. Next, in step 108 , sintering makes the filled copper powder form a capillary structure on the tube wall. Thereafter, in step 110, the rod is withdrawn from the conduit. In step 112, a working fluid is injected. Here, depending on the capillary structure formed, the order of injecting the working fluid and vacuuming can be reversed before sealing. Finally, in step 114 , the completed cylindrical heat pipe is bent or flattened into a flat shape, so as to meet the requirements of the shape of the heat dissipation component used in the electronic component that generates heat.

However, after the heat pipe is manufactured, the original round and straight heat pipe must be reprocessed into a curved or flat heat pipe for practical application. In this way, the capillary structure inside the heat pipe is damaged in the local area where the pipe is bent or flattened, and loses its heat conduction function, so that the overall heat conduction capacity of the heat pipe decreases. The loss can even reach more than 70%, and its impact cannot be ignored.

Contents of the invention

Therefore, in order to solve the above-mentioned problems, the object of the present invention is to propose a method for manufacturing a heat pipe, which first processes the shape of the heat pipe, and then forms the capillary structure inside the heat pipe, so as to avoid the capillary structure inside the existing pipe from being affected by subsequent processing. It can maintain a complete capillary structure and improve the overall heat conduction capacity of the heat pipe.

According to a method of manufacturing a heat pipe in one aspect of the present invention, the heat pipe is applied in a heat dissipation assembly of an electronic component, and needs to be shaped according to the shape of the heat dissipation component of the electronic assembly. The manufacturing method includes the following steps: (a) providing a catheter; (b) processing to shape the catheter; (c) inserting a plastic rod into the catheter; (d) forming a capillary structure; (e) separating the plastic rod from the catheter; and (f) injecting a working fluid And form a closed space.

A method of manufacturing a heat pipe according to another aspect of the present invention includes the following steps: (a) providing a pipe; (b) processing to shape the pipe; (c) inserting a molded rod into the pipe; (d) separating molding rod and conduit; (e) forming a capillary structure; and (f) injecting a working fluid and forming a closed space.

In the step of processing and shaping the catheter, the catheter is formed by bending or flattening. The surface of the molded rod has a plurality of protrusions, which are used to make the gap between the catheter wall and the molded rod consistent. The material of the protrusions can be the same as that of the capillary structure, and it is used as one of the raw materials of the capillary structure when forming the capillary structure. Alternatively, the protrusions can be directly vaporized or liquefied after being heated before separating the shaped rod from the catheter. The material of the shaping rod is a flexible material that can be drawn directly from the catheter. Furthermore, the molded rod is a material with a lower ignition point than the material forming the capillary structure, and is vaporized or liquefied after heating to separate from the catheter. Alternatively, the material of the molded rod is a material that can be dissolved by an organic solvent, such as high molecular organic matter, and the molded rod is separated from the catheter by being dissolved by the organic solvent. An organic solvent is for example acetone.

A heat pipe according to another aspect of the present invention at least includes: a pipe forming a closed space and having an inner wall; a capillary structure formed on the inner wall of the pipe; and a working fluid contained in the pipe Inside; wherein, the capillary structure is formed on the inner wall of the conduit after the conduit has been processed and shaped.

In order to further illustrate the above-mentioned purpose, structural features and effects of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a flowchart of a conventional heat pipe manufacturing method.

FIG. 2 is a flowchart of a method for manufacturing a heat pipe according to a first embodiment of the present invention.

FIG. 3 is a flow chart of a method for manufacturing a heat pipe according to a second embodiment of the present invention.

Detailed ways

first embodiment

Please refer to FIG. 2 , which is a flowchart of a method for manufacturing a heat pipe according to a first embodiment of the present invention. The manufacturing method of the heat pipe in this embodiment includes the following steps. First, in step 202, a catheter is provided. The material of the catheter is, for example, plastic, metal, alloy or non-metallic material. In this embodiment, a copper pipe is preferably used as an example. Next, in step 204 , the conduit is first bent, flattened, or otherwise shaped to bend, flatten, or otherwise shape in order to meet the shape of the heat dissipation component of the heat-generating electronic component to be used subsequently.

Next, in step 206 , a plastic rod is inserted into the conduit, so that a space with a fixed gap is formed between the tube wall of the conduit and the plastic rod. Since the catheter has been processed into a curved or flat shape, the material of the molded rod must be a flexible material. Moreover, in order to keep the gap space between the tube wall of the catheter and the plastic rod consistent, a plurality of protrusions are additionally arranged on the surface of the plastic rod. The gap space between the molded rod and the molded rod is used to make the gap between the catheter wall and the molded rod consistent.

Then, in step 208 , copper powder is filled in the gap space between the tube wall and the molding rod. Next, in step 210, a capillary structure is formed. The capillary structure can be meshwick, fiber wick, sinter wick, or groove wick. There are many ways to form the capillary structure, such as sintering, adhesion, filling, deposition and so on. Since the copper tube is used as the conduit in this embodiment, in this step, copper powder or other metal alloy powder is used to fill the gap space between the conduit wall and the plastic rod, and then heated and sintered to make the filled Copper powder forms a capillary structure on the catheter wall. In addition, according to the needs of different processes, the copper powder can be compressed before heating and sintering to make the copper powder compact, and then heated and sintered to form capillary structures with different porosity or different structures. Here, special attention should be paid to the fact that if different materials are used as fillers, corresponding solvents or binders may be added to increase the tight filling of copper powder. At the same time, before heating and sintering, the corresponding Optionally add a drying step or debinding step to remove solvent or binding agent.

Afterwards, in step 212, the molded rod and the catheter are separated. Finally, in step 214 , the working fluid is injected and vacuumed, and the other end of the conduit is sealed to complete the manufacturing process of the heat conduit. The working fluid is, for example, inorganic compounds, water, alcohols, liquid metals such as mercury, ketones, refrigerants such as HFC-134a, or other organic compounds. Generally speaking, water is more commonly used as the working fluid. Here, according to the difference in the formed capillary structure, the corresponding surface tension between the working fluids is different, and the order of injecting the working fluid and vacuuming can be changed in due course before sealing. Generally speaking, if the sintered capillary structure is formed, the best effect can be achieved by injecting the working fluid first and then vacuuming. If the formed capillary structure is a network capillary structure or a groove-like capillary structure, the method of vacuuming first and then injecting the working fluid can avoid the disadvantage of excessive extraction of the working fluid when vacuuming first.

second embodiment

Please refer to FIG. 3 , which is a flowchart of a method for manufacturing a heat pipe according to a second embodiment of the present invention. This embodiment is similar to the manufacturing method described in the first embodiment. First, in step 302 , a conduit, preferably a copper pipe, is provided. Next, in step 304 , the conduit is first bent, flattened or otherwise shaped to be curved, flat or otherwise shaped for the shape of the heat dissipation component of the heat-generating electronic component to be applied subsequently.

Next, in step 306 , a plastic rod is inserted into the conduit, so that a space with a fixed gap is formed between the tube wall of the conduit and the plastic rod. In step 308, copper powder is filled in the gap space between the tube wall and the molding rod. Since the copper pipe is used as the conduit in this embodiment, in this step, copper powder or other metal alloy powder is used to fill the gap space between the conduit wall and the molded rod. In addition, according to the particle size of the copper powder used and the porosity of the capillary structure to be formed, different process steps can be designed separately. For example, after the copper powder is filled, the copper powder can be further compressed to make the copper powder more closely bonded. Here, special attention should be paid to the fact that if different materials are used as fillers, corresponding solvents or binders may be added to increase the tight filling effect of copper powder. At the same time, before the capillary structure is formed, it will be relatively Correspondingly, a drying step or a binding agent removal step is added to remove the solvent or binding agent.

Then, in step 310, the molded rod and the catheter are separated. Then, in step 312, a capillary structure is formed. There are many ways to form capillary structures, such as sintering, adhesion, filling, deposition, etc. Finally, in step 314 , the working fluid is injected and vacuumed, and the other end of the conduit is sealed, and the manufacturing process of the heat pipe is completed. Here, according to the difference in the formed capillary structure, the corresponding surface tension between the working fluids is different, and the order of injecting the working fluid and vacuuming can be changed in due course before sealing. Generally speaking, if the sintered capillary structure is formed, the best effect can be achieved by injecting the working fluid first and then vacuuming. If the formed capillary structure is a network capillary structure or a groove-like capillary structure, the method of vacuuming first and then injecting the working fluid can avoid the disadvantage of excessive extraction of the working fluid when vacuuming first.

The difference from the first embodiment is that in this embodiment, the molded rod is first separated from the conduit, and then heated and sintered to form a capillary structure. The implementation sequence of these two steps can be adjusted according to the needs of different manufacturing processes. As for the material of the plastic rod used, in addition to being a flexible material, and preferably equipped with a plurality of protrusions on the surface of the plastic rod, the material of the plastic rod used , can be a material with a lower ignition point than the material forming the capillary structure, or the material of the used plastic rod is a material that can be dissolved by an organic solvent.

When the material of the molding rod is a flexible material, the molding rod can be directly drawn out from the conduit to separate from the conduit. Furthermore, when the material of the molding rod is a flexible material, and a plurality of protrusions are preferably arranged on the surface of the molding rod, the material of the protrusions is the same as the capillary structure, When the capillary structure is formed by sintering, the protrusion can be directly sintered as one of the raw materials of the capillary structure. Alternatively, the material of the protrusions is a material with a lower ignition point than the material forming the capillary structure, which can be vaporized or liquefied after being heated during sintering.

When the molded rod is a material with a lower ignition point than the material forming the capillary structure, the molded rod can be directly vaporized or liquefied after being heated, so that it can be separated from the catheter. Alternatively, the material of the molding rod is a material that can be dissolved by an organic solvent, so the molding rod can be separated from the catheter after being dissolved by the organic solvent. For example, when a high-molecular organic substance is used as the material of the molding rod, the organic solvent used is acetone.

To sum up, in the heat pipe manufacturing method disclosed in the present invention, the shape of the heat pipe is processed first, and then the capillary structure inside the heat pipe is formed. This method prevents the capillary structure inside the existing conduit from being damaged due to subsequent processing, can maintain a complete capillary structure, and improves the overall heat conduction capacity of the heat conduit. Moreover, the heat pipe manufactured by this method is used in the heat dissipation component of the electronic component, and can be shaped in advance according to the shape of the heat dissipation component of the electronic component, so that the heat pipe can fully contact the surface of the electronic component and improve the heat dissipation effect .

Although the present invention has been described with reference to the current specific embodiments, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate the present invention, and other modifications can be made without departing from the spirit of the present invention. Various equivalent changes or substitutions, therefore, as long as the changes and modifications to the above embodiments are within the spirit of the present invention, they will all fall within the scope of the claims of the present application.

Claims (13)

1. heat pipe manufacture method comprises:

One conduit is provided;

Process this conduit and make this conduit moulding;

Insert a plastotype bar in this conduit;

Separate this plastotype bar and this conduit;

Form a capillary structure; And

Inject a working fluid and form a confined space.

2. heat pipe manufacture method as claimed in claim 1, it is characterized in that this heat pipe is to be applied in the radiating subassembly of an electronic building brick, and the shape according to the radiating subassembly of this electronic building brick needs moulding, wherein making the step of this conduit moulding in processing is to utilize mode crooked or that flatten, makes this conduit moulding.

3. heat pipe manufacture method as claimed in claim 1 is characterized in that the surface of this plastotype bar has a plurality of ridge portions, uses so that this duct wall is consistent with the gap between this plastotype bar.

4. heat pipe manufacture method as claimed in claim 3, the material that it is characterized in that this ridge portion are identical with this capillary structure, when forming this capillary structure as one of raw material of this capillary structure.

5. heat pipe manufacture method as claimed in claim 3 is characterized in that, before separating this plastotype bar and this conduit, this ridge portion is heated back vaporization or liquefaction.

6. heat pipe manufacture method as claimed in claim 1, the material that it is characterized in that this plastotype bar are the flexual materials of a tool, and this plastotype bar can directly extract out in this conduit, make with this conduit and separate.

7. heat pipe manufacture method as claimed in claim 1 it is characterized in that this plastotype bar is that a material with respect to this capillary structure of formation is the material than low ignition point, and this plastotype bar makes with this conduit and separates in heating the back vaporization or liquefying.

8. heat pipe manufacture method as claimed in claim 1, the material that it is characterized in that this plastotype bar are materials that can be dissolved by an organic solvent, and this plastotype bar is with by the mode of this organic solvent dissolution, makes with this conduit and separates.

9. heat pipe manufacture method as claimed in claim 8, the material that it is characterized in that this plastotype bar are macromolecule organics, and this organic solvent is an acetone.

10. heat pipe comprises at least:

One conduit forms a confined space and has an inwall;

One capillary structure is formed on this inwall of this conduit; And

One working fluid is placed in this conduit;

Wherein, this capillary structure is after conduit is processed plastotype, just is formed on this inwall of this conduit.

11. heat pipe as claimed in claim 10, it is characterized in that heat pipe is to be applied in the radiating subassembly of an electronic building brick, and the shape according to the radiating subassembly of this electronic building brick needs moulding, wherein making the step of this conduit moulding in processing is to utilize mode crooked or that flatten, makes this conduit moulding.

12. heat pipe as claimed in claim 10, it is characterized in that this capillary structure be selected from netted capillary structure, fibrous capillary structure, sintering capillary structure, ditch shape capillary structure one of them, and this capillary structure is the method for utilizing sintering, sticking together, fill, deposit one of them, is formed on this inwall of this conduit.

13. heat pipe as claimed in claim 10, it is characterized in that this working fluid be selected from inorganic compound, water, alcohols, liquid metal, ketone, refrigerant, organic compound one of them, and the material of this conduit be selected from plastics, metal, alloy, nonmetallic materials one of them.

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