CN1662133A - Electronic component mounting device - Google Patents

Abstract

he objective of the invention is to provide an apparatus for mounting electronic components capable of improving efficiency in mounting work to a substrate. The electronic component mounting device is provided with substrate-holding means 31 and 32 in the middle of the transfer path by transfer means 21 and 22 of a substrate K, a first positioning mechanism that positions the head along the guide frame with the aid of head guide frames 51 and 52 arranged over the transfer path, and a second positioning mechanism that positions the head along the transfer direction. Each head 40 is arranged at the mutually opposite surface side of each guide frame. The heads held by one guide frame and the heads held by the other guide frame perform mounting operation only to the mutually different substrates held by the substrate-holding means.

Description

Electronic component mounting device

technical field

The present invention relates to an electronic component mounting device for positioning and mounting electronic components at predetermined positions with respect to a substrate.

Background technique

[Patent Document 1] JP-A-2003-243894

In the conventional electronic component mounting apparatus, there are: a substrate conveying unit that conveys the substrate in a predetermined direction; a substrate holding unit that is installed in the middle of the substrate conveying path; Orientation settings. In addition, it also has: a head unit for sucking the substrate conveyed along each guide frame; a guide moving mechanism for moving the guide frame along the substrate conveying direction; An electronic component supply unit of an electronic component (for example, refer to Patent Document 1).

Moreover, each of the above-mentioned electronic component supply units is composed of a plurality of electronic component feeding devices arranged in a row along the substrate conveying direction, and the electronic component supply units on both sides are divided into areas for delivering electronic components to the head unit of one guide frame, and The area where electronic components are handed over to another head unit.

In addition, in the mounting operation of the electronic component, first, the substrate is conveyed by the substrate conveying unit, and held on the substrate holding portion. Then, through the movement of each guide frame and the movement of the head unit along the guide frame, each head unit reciprocates between each predetermined electronic component feeding device and the substrate, thereby mounting the electronic component.

In the above-mentioned conventional electronic component mounting apparatus, head units are disposed on opposite sides of the respective guide frames, thereby reducing the movement stroke of the head unit in the conveyance direction and improving work efficiency by speeding up mounting work.

Furthermore, while one head unit is mounting the substrate, the other head unit receives the electronic components by the electronic component supply unit, and the control of the mounting operation is alternately performed to further improve work efficiency.

However, in the operation control described above, if the mounting time of one head unit is longer than the electronic component receiving time of the other head unit, the other head unit generates a waiting time, and there is a problem that the efficiency of the mounting work is insufficient.

Contents of the invention

The object of the present invention is to improve the efficiency of installation work.

Invention 1 includes: a transport unit that transports a substrate on which electronic components are mounted in a predetermined direction; a substrate holding unit that is provided in the middle of a transport path of the transport unit for mounting electronic components; and a head unit that can hold and release electronic components; a guide frame for the head unit, which is provided across the conveyance path in a direction intersecting with the substrate conveyance direction. In addition, it also has: a first positioning mechanism for moving and positioning the head unit along the guide frame; a second positioning mechanism for moving the guide frame to move and position the head unit in the conveying direction; and a mechanism for supplying various electronic components to the head unit. An electronic component supply unit; an operation control unit that controls the mounting operation of the electronic component on the substrate. Moreover, the following structure is adopted: two substrate holding units and two first positioning mechanisms are respectively provided along the conveying path, and respective head units are arranged on the sides of the guide frames of each positioning mechanism facing each other, and the motion control unit performs the following control: The head unit supported by one guide frame and the head unit supported by the other guide frame only perform mounting operations on substrates held by mutually different substrate holding units.

In the above configuration, the two substrates are respectively conveyed to and held by the substrate holding portion by the conveying unit. In addition, each head unit receives electronic components from the electronic component supply unit through the cooperation of the first and second positioning mechanisms, and mounts the electronic components only on the substrate held on any one of the predetermined substrate holding parts.

In this way, since each head unit determines which board of the board holding part to mount the board according to the guide frame, there is no waiting time for avoiding interference as when two head units are used to mount one board. On the other hand, although the number of electronic components per unit time per substrate may be more when two head units are alternately mounted, in the structure of the present invention, since the mounting work is performed on two substrates at the same time , so the number of electronic components mounted per unit time per two substrates exceeds the case where two head units are alternately mounted.

Invention 2 has the same structure as the invention described in Invention 1, and adopts a structure in which an operation control unit performs operation control of carrying out a substrate on which a mounting operation has been performed by one substrate holding unit without being held again by another substrate holding unit. .

In the above configuration, two boards are carried in, mounted on the respective board holding parts, and then carried out together.

Invention 3 has the same structure as the invention described in Invention 1, and adopts a structure in which the operation control unit performs operation control of carrying out the substrate after performing the mounting operation on the two substrate holding parts for one substrate.

In the above configuration, after one substrate is mounted on one substrate holding portion, it is transferred to the other substrate holding portion, and then mounted on. In addition, when the preceding substrate is moved to the next substrate holding section, the mounting operation for the next substrate is carried out in the preceding substrate holding section, whereby the mounting operation consisting of two steps can be sequentially and continuously performed.

Invention 4 has the same structure as any one of Inventions 1, 2, or 3, and adopts a structure in which a plurality of head units are provided on each guide frame.

In the above structure, each substrate is component-mounted by a plurality of head units.

Invention 5 has the same structure as the invention described in Invention 4, and adopts a structure in which a substrate moving unit for moving the substrate holding unit in the transfer direction is provided for each substrate holding unit.

For example, when assuming that there is no substrate moving unit, when a plurality of head units of each guide frame mount components on one substrate, when one head unit positions the guide frame in the transport direction for mounting on the substrate, The other head units are also positioned at the same position in the conveyance direction. Therefore, during this period, electronic components cannot be received, resulting in a waiting time.

Therefore, in the above configuration, when positioning the guide frame in the conveying direction so that any one of the head units receives the electronic component, the substrate moving unit moves the substrate holding portion to a predetermined position in the conveying direction so that the other The head unit can perform mounting work on the substrate. In this way, receiving and mounting of electronic components can be performed in parallel without waiting time.

In the invention described in Invention 1, since the two head units are determined on which substrate holding part to mount the substrate, it is not necessary to set up an interference avoidance as in the case of mounting one substrate with two head units. The waiting time, and the installation work on two substrates at the same time. Therefore, by improving the efficiency of mounting work for two substrates, the efficiency of mounting work for consecutive substrates can be improved as a result.

Furthermore, since the two substrate holding parts are provided in common with one conveyance path, compared with the conventional case where two electronic component mounting devices are provided, space can be greatly saved.

In addition, since the two head units are arranged opposite to each other on the opposite sides of the two guide frames, compared with the case where the head units are provided on the same side of the two guide frames, since the head units are not separated by the guide frames, correspondingly, the head units can be used. The distance between the head units is close to each other. In addition, at the same time, the two substrate holding parts can be arranged close to each other. Therefore, miniaturization of the entire device can be realized.

In the invention described in claim 2, since the substrate mounted on one substrate holding unit is carried out without being held again on another substrate holding unit, independent mounting operations of two types of substrates can be performed in parallel by this control. In addition, the mounting work of two independent boards does not mean, for example, the mounting work that is related to each other when a part of the electronic components to be mounted on the board and other parts are separately mounted, but refers to the work on two different boards. Installation work.

In the invention according to claim 3, since one substrate is transferred to two substrate holding parts and the mounting work is performed therein, the mounting work consisting of two processes can be sequentially and continuously performed. Therefore, mounting work on a plurality of substrates can be efficiently performed.

In the invention described in claim 4, since components are mounted with a plurality of head units per substrate, further efficiency of work can be achieved.

In the invention described in claim 5, while the guide frame is positioned by the board moving unit, electronic component reception by any one head unit and electronic component mounting by other head units can be performed in parallel, and further efficiency of the mounting work can be realized.

Description of drawings

FIG. 1 is a perspective view of an electronic component mounting device according to an embodiment of the present invention.

Fig. 2 is a plan view of the electronic component mounting device.

Fig. 3 is an enlarged perspective view of the head unit shown in Fig. 1 .

Fig. 4 is a block diagram showing a control system of the electronic component mounting apparatus.

FIG. 5 is an explanatory view showing the operation of the substrate moving unit shown in FIG. 1 .

Symbol Description

10: Electronic component mounting device; 21, 22: Belt transport mechanism (transport unit); 31, 32: Board stage; 40: Head unit; 51, 52: Guide frame; 70: Electronic component supply unit; 80: Action Control unit; K: base plate.

Detailed ways

--Overall structure of the embodiment--

Next, an electronic component mounting apparatus 10 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 . FIG. 1 is a perspective view of an electronic component mounting apparatus 10, and FIG. 2 shows a plan view.

In addition, the electronic component mounting apparatus 10 is an apparatus that transports the board K in the transport direction, fixes it at a predetermined position on the board transport path, and mounts electronic components on the board K.

In the following description, the conveyance direction of the substrate K is defined as the X-axis direction, and the direction substantially perpendicular to the conveyance direction of the substrate K is defined as the Y-axis direction (see FIGS. 1 to 5 ).

As shown in FIGS. 1 and 2, the electronic component mounting apparatus 10 has: a rectangular frame-shaped base 2; transport units 21, 22 for transporting the substrate K along the X-axis direction (transporting from right to left in FIG. 2); Substrate stages 31 , 32 serving as two substrate holding units for mounting electronic components are provided in the middle of the conveyance paths of the conveyance units 21 , 22 . And it also has: substrate moving units 33, 34 for moving and positioning each substrate stage 31, 32 along the X-axis direction; a plurality of head units 40 that can hold and release electronic components; Two Y-axis positioning mechanisms as the first positioning mechanism for moving and positioning; and an X-axis positioning mechanism as the second positioning mechanism for moving and positioning each head unit 40 in the X-axis direction. It also includes an electronic component supply unit 70 for supplying various electronic components to each head unit 40 , and an operation control unit 80 for controlling the operation of mounting electronic components on the substrate K (see FIG. 4 ).

--Base and transport unit--

The upper surface of the base 2 is formed flat along the X-Y plane, and a recess is formed in the center thereof. Inside the concave portion, the substrate stages 31 and 32 and the substrate moving units 33 and 34 are housed and arranged.

The conveying unit is constituted by two belt conveying mechanisms 21 and 22 respectively provided at both ends in the X-axis direction at the middle position in the Y-axis direction on the upper surface of the base 2 . The respective belt conveyance mechanisms 21 and 22 are arranged along the same line along the X-axis direction, and the line on which the conveyance mechanisms 21 and 22 are arranged serves as a conveyance path.

--Substrate stage and substrate moving unit--

The two substrate stages 31 and 32 are arranged along the transport path at the center of the base 2 on the upstream side and downstream side (the substrate stage 31 is on the upstream side and the substrate stage 32 is on the downstream side).

Furthermore, each substrate moving unit 33 , 34 includes a guide rail capable of guiding each substrate stage 31 , 32 to move in the X-axis direction, and an unillustrated actuator (for example, a linear motor) that applies a reciprocating force along the guide rail.

The substrate moving unit 33 reciprocates the substrate stage 31 between a position closest to the tape transport mechanism 21 and a mounting operation position near the center of the chassis 2 (position shown in FIG. 2 ).

In addition, the substrate stage 32 is reciprocated by the substrate moving unit 34 between a mounting operation position (position shown in FIG.

On the upper surface of each substrate stage 31, 32, a belt mechanism (not shown) which conveys the substrate in the X-axis direction, and a clamp mechanism (not shown) which clamps and holds the substrate K at a predetermined position are provided.

In addition, the heights of the belt mechanisms of the respective substrate stages 31 and 32 and the aforementioned belt transport mechanisms 21 and 22 are set to be the same. In this way, the substrate stage 31 delivers the substrate K from the closest tape transport mechanism 21 .

In addition, among the substrate stages 31-32, the substrate stages 31, 32 are mutually moved to the mounting operation position, and the substrates are exchanged by driving the mutual belt mechanism in the state of being closest to each other.

Furthermore, between the substrate stage 32 and the belt conveyance mechanism 22 , the substrate K is delivered and delivered in a state where the substrate stage 32 and the belt conveyance mechanism 22 are closest to each other.

In addition, when the substrate K is held on each substrate stage 31, 32, it is detected that the front end portion of the substrate K has reached the substrate stage by using a substrate sensor (not shown) provided on each substrate stage 31, 32. The specified position on the object table 31, 32, thereby starting the clamping mechanism. In this way, on each of the substrate stages 31 and 32 , the substrate K is always held in a state where the tip portion is positioned at a predetermined position.

--Electronic component supply unit--

The electronic component supply units 70 are provided on both sides in the Y-axis direction, that is, at both ends in the Y-axis direction of the chassis 2 across the substrate conveyance path.

Each electronic component supply unit 70 is composed of a plurality of tape feeders 71 (feeders) arranged side by side in the X-axis direction, and a feeder table (bank) on which each tape feeder 71 is placed. 72 poses. Each tape feeder 71 is a device in which, for example, electronic components such as capacitors in a rectangular parallelepiped shape are accommodated at approximately equal intervals on a tape wound on a bobbin, and the electronic components are exposed to the air by feeding out the tape. The desired position is handed over to each head unit. In addition, as shown in FIGS. 1 and 2 , the plurality of tape feeders 71 of each electronic component supply unit 70 is divided into a plurality of (three in FIGS. 1 and 2 ) feeder groups and arranged.

--Y-axis positioning mechanism--

The two Y-axis positioning mechanisms are respectively arranged on the upper surface of the base 2 at the upstream side and the downstream side in the substrate conveyance direction (X-axis direction). Furthermore, the Y-axis positioning mechanism on the upstream side in the substrate conveyance direction has a guide frame 51 that supports the two head units 40 so as to be movable in the Y-axis direction, and a linear motor 53 that gives each head unit 40 a moving amount (see FIG. 4 ). Further, the Y-axis positioning mechanism on the downstream side in the substrate conveying direction has a guide frame 52 that supports the two head units 40 so as to be movable in the Y-axis direction, and a linear motor 54 that gives each head unit 40 a moving amount (see FIG. 4 ).

Each of the above-mentioned guide frames 51 and 52 is a substantially gate-shaped member arranged in a state of straddling the conveyance path and in a state in which its longitudinal direction is along the Y-axis direction. In addition, each guide frame 51, 52 supports the head unit 40 on the sides facing each other.

In addition, the linear motor of each Y-axis positioning mechanism arrange|positions the stator along the longitudinal direction in each guide frame 51,52, and arrange|positions the mover on the head unit 40. Also, each head unit 40 can be positioned in the Y-axis direction according to its resolution.

--X-axis positioning mechanism--

The above-mentioned two guide frames 51 and 52 are respectively provided with leg portions on the lower portions in the vicinity of both end portions. On the other hand, the X-axis positioning mechanism has guide rails 61, 62 that support the guide frames 51, 52 so that they can move along the X-axis direction at both ends of the upper surface of the base 2 in the Y-axis direction; and The linear motors 63 and 64 (refer to FIG. 4 ) that give the respective guide frames 51 and 52 a moving amount in the X-axis direction.

One linear motor 63 drives the guide frame 51 , and the other linear motor 64 drives the guide frame 52 . In this way, each head unit 40 can be positioned along the X-axis direction according to the resolution of each guide frame 51 , 52 .

Using this X-axis positioning mechanism and the above-mentioned Y-axis positioning mechanism on the upstream side, the two head units 40 supported by the guide frame 51 can move freely in the Y-axis direction and the X-axis direction, and can move to the substrate stage at the installation work position. 31 is the receiving port of each tape feeder for substantially the entire area of the substrate K and a part of the area on the upstream side in the transport direction of the two electronic component supply units 70 .

In addition, using the X-axis positioning mechanism and the above-mentioned Y-axis positioning mechanism on the downstream side, the two head units 40 supported by the guide frame 52 can move freely in the Y-axis direction and the X-axis direction, and can move to the substrate loading position at the installation position. The receiving port of each tape feeder is the substantially entire area of the board|substrate K of the table 32, and the remaining partial area on the downstream side of the conveyance direction of the two electronic component supply units 70.

Here, the total movable area of the two head units 40 of the guide frame 51 and the total movable area of the two head units 40 of the guide frame 52 are, with respect to all the tape feeders 71 of the two electronic component supply units 70, most It is desirable to assign without omission or duplication, but it is also possible to perform settings so as to cause partial duplication of some electronic components with high mounting frequency. Also in this case, substantially the entire area of the substrate K of the substrate stage 31 at the mounting work position is set so as to be included only in the total movable area of the two head units 40 of the guide frame 51 . Also, substantially the entire area of the substrate K of the substrate stage 32 at the mounting work position is set so as to be included only in the total movable area of the two head units 40 of the guide frame 52 .

In addition, here, instead of the moving mechanism using the linear motors 53, 54, 63, 64, the X-axis positioning mechanism and each Y-axis positioning mechanism may be a moving mechanism that combines a motor and a belt. Movement mechanism of electric motor and ball screw.

--head unit--

FIG. 3 shows a perspective view of the head unit 40 . Each head unit 40 has a main body 41 supported by respective guide frames 51 , 52 , and a total of six suction nozzles 42 , three of which are arranged side by side in the X-axis direction on both ends of the main body 41 in the Y-axis direction. The suction nozzle 42 holds the electronic component by sucking it at its lower end with a suction device (not shown), and releases the electronic component by stopping the suction. In addition, each suction nozzle 42 is supported vertically movably, and can be moved and positioned vertically when receiving and mounting an electronic component.

--Control system of electronic component installation device--

FIG. 4 is a block diagram showing a control system of the electronic component mounting apparatus 10 . As shown in FIG. 4, the control system of the electronic component mounting apparatus 10 is mainly used to control the linear motors 53, 54 of the Y-axis positioning mechanism, the linear motors 63, 64 of the X-axis moving mechanism, and the linear motors of the substrate moving units 33, 34. control. Furthermore, as shown in FIG. 4 , it includes at least a CPU 81 that executes various processes and controls in accordance with predetermined control programs, and a system ROM 82 that stores programs for executing various processes and controls and data required for various processes and controls. . Furthermore, it is constituted to include: RAM 83 as a work area for various processes for storing various data; I/F (interface) 84 for realizing connection between CPU 81 and various devices; and inputting various settings and operation instructions. An operation panel 85; an auxiliary storage device 87 for reading/writing external storage media. In addition, each of the above-mentioned linear motors is connected to the I/F 84 through a motor driver not shown.

The auxiliary storage device 87 having the aforementioned CPU 81 , ROM 82 , RAM 83 , and external storage medium 86 functions as an operation control unit 80 that controls the mounting operation of electronic components.

And, the above-mentioned external storage medium 86 stores the position coordinate data of the X-Y coordinate system representing the mounting position of the electronic component with respect to the substrate K, and the position coordinate data of the X-Y coordinate system representing the receiving position of the electronic component to be mounted and its mounting position. order etc.

The above-mentioned CPU 81 restricts the two parts supported by the guide frame 51 on the upstream side (right side of FIG. The range of movement of the head unit 40. In addition, the movement range includes the entire surface of the substrate K on the substrate stage 31 at the mounting operation position and the entire receiving position of the group of tape feeders 71 on the upstream side of the electronic component supply unit 70 in the conveying direction. (R1 in Figure 2).

Moreover, CPU81 performs operation control based on the program memorize|stored in ROM82, and the position coordinate data which shows the mounting position of an electronic component, and the receiving position recorded in the external storage medium 86. Furthermore, the movement range of the two head units 40 supported by the guide frame 52 on the downstream side in the conveying direction (left side in FIG. 2 ) is restricted. In addition, the range of movement is between the entire surface of the substrate K on the substrate stage 32 including the mounting operation position and all receiving positions of the remaining part of the tape feeder 71 group on the downstream side of the conveying direction of the electronic component supply unit 70. range (R2 in Figure 2).

In addition, it is set so that the moving regions R1 of the two head units 40 supported by the guide frame 51 and the moving regions R2 of the two head units 40 supported by the guide frame 52 do not overlap, but they are combined to include all the belt feeders. Material device 71.

In addition, the CPU 81 performs the operation according to the program stored in the ROM 82 through cooperation of the belt mechanism provided on the substrate stage 31, the belt mechanism provided on the substrate stage 32, the substrate moving unit 34, and the belt transport mechanism 22. An operation of carrying out the substrate K on which electronic components are mounted on the substrate stage 31 to the outside of the apparatus is controlled.

In addition, the CPU 81 performs electronic components on the substrate stage 32 through cooperation of the belt mechanism provided on the substrate stage 32, the substrate moving unit 34, and the belt conveyance mechanism 22 according to the program stored in the ROM 82. Operation control of carrying out the mounted substrate K to the outside of the device.

That is, through the above-mentioned two operation controls, the substrate K mounted on the substrate stage 31, 32 is carried out to the outside of the apparatus without performing the next mounting on another substrate stage.

In addition, as shown in FIG. 5, the CPU 81, according to the program stored in the ROM 82, regarding the two head units 40 supported by the same guide frame 51 (52), when one head unit 40 receives electrons from one of the tape feeders 71 When the component is positioned at the receiving position, the other head unit 40 is positioned at a predetermined mounting position by the linear motor 53 (54) in the Y-axis direction. At the same time, the head unit 40 and the substrate K are relatively positioned in the X-axis direction by the substrate moving unit 33 ( 34 ) so as to reach a predetermined mounting position.

That is, when one head unit 40 (head unit on the upper side in FIG. 5 ) is positioned at the receiving position of any one of the tape feeders 71 of the electronic component supply unit 70, the same guide frame 51 (52) supports the The other head unit 40 is also fixed at the same position in the X-axis direction. Therefore, positioning of the other head unit 40 to the mounting position of the substrate K can only be performed in the Y-axis direction. Therefore, in this case, the operation control is performed by using the substrate moving unit 33 (34) to move the substrate stage 31 (32) in the X-axis direction from the mounting work position, and moving the head unit 40 ( FIG. 5 ) in the X-axis direction. The head unit on the lower side) is relatively positioned to the mounting position of the substrate K.

In this way, while one of the two head units 40 supported by the same guide frame 51 (52) is receiving the electronic component, the other can be mounted on the board.

--Description of the operation of the electronic component mounting device--

In the electronic component mounting apparatus 10 configured as described above, first, the first substrate K is carried in by the tape conveyance mechanism, and delivered to the substrate stage 31 . Then, the first substrate K is moved downstream in the conveying direction of the substrate stage 31 by the substrate moving unit 33 , delivered to the substrate stage 32 , and clamped. In addition, the second substrate K is carried in by the belt transport mechanism 21 , delivered to the substrate stage 31 , clamped, and then transported to the mounting operation position by the substrate moving unit 33 together with the substrate stage 31 .

Then, when the substrate stages 31 and 32 are transported to the substrate mounting position, the mounting operation of the electronic component supply unit starts. However, here, as for the first substrate K, the second substrate K does not have to wait for the second substrate K to be conveyed to the mounting work position together with the substrate stage 32. The installation work starts at the working position.

Each head unit 40 mounted on each guide frame 51, 52 is moved and positioned within the above-mentioned ranges R1, R2, respectively, and predetermined electronic component receiving and mounting operations are repeated.

At this time, the two head units 40 installed on the same guide frame 51 (52), when one head unit moves to the receiving position of the electronic component through the cooperation of the X-axis positioning mechanism and the Y-axis positioning mechanism, the other head unit moves through the Y-axis positioning mechanism. The mounting position of the substrate K is positioned by cooperation of the axis positioning mechanism and the substrate moving unit 33 (34). That is, two head units 40 supported by the same guide frame 51 (52) can perform receiving work of one head unit and mounting work of the other head unit in parallel.

Moreover, when the substrate K on the substrate stage 32 is installed, the substrate stage 32 is moved to the downstream side by the driving of the substrate moving unit 34, the clamping state of the substrate is released, and the substrate K is delivered by driving the belt mechanism. Give belt transport mechanism 22. The board|substrate K is carried out to the exterior of an apparatus by this tape conveyance mechanism 22. As shown in FIG.

On the other hand, when the mounting of the substrate K on the substrate stage 31 is completed, if the substrate unloading from the substrate stage 32 has not been completed, it is waited for completion. In addition, when the unloading of the substrate on the substrate stage 32 is completed, the substrate clamping state is released, and the substrate is transferred from the substrate stage 31 to the substrate stage 32 by driving the belt mechanism. Then, the substrate stage 32 is moved to the downstream side by the driving of the substrate moving unit 34 , and the substrate K is delivered to the belt conveyance mechanism 22 by the driving of the belt mechanism. The board|substrate K is carried out to the exterior of an apparatus by this tape conveyance mechanism 22. As shown in FIG.

--Effect of the embodiment--

In the electronic component mounting apparatus 10 configured as described above, it is determined for each of the guide frames 51 , 52 which substrate K held by the head unit 40 is to be mounted on which substrate stage 31 , 32 . In addition, it is determined for each guide frame 51 , 52 which part of the head unit 40 receives components from the group upstream and the group downstream in the substrate transfer direction of the tape feeder 71 of each electronic component supply unit 70 . .

Therefore, the head units of the respective guide frames 51, 52 will not interfere when being installed and received. Therefore, there is no need to provide a waiting time for interference avoidance, and since the mounting work is performed on two boards at the same time, the mounting work efficiency of the two boards can be improved, resulting in the improvement of the mounting work efficiency of consecutive boards.

In addition, since the two substrate stages 31 and 32 are provided on one conveyance path, it is possible to significantly save space compared with the case of an electronic component mounting apparatus in which two single stages are provided.

And, since the two guide frames 51, 52 are oppositely provided with each head unit 40 on the side opposite to each other, the head unit 40 of one guide frame 51 and the head unit 40 of the other guide frame 52 can not be aligned in the X-axis direction. Get as close as possible within the range of interference. At the same time, since the board stages 31 and 32 can be arranged close to each other during the mounting work, the electronic component mounting apparatus 10 can be downsized in the X-axis direction.

Also, in a state where two head units 40 are mounted on each guide frame 51, 52 and the guide frames 51, 52 are positioned at the electronic component receiving position of one of the head units 40, the other can be moved by the substrate moving units 33, 34. A head unit 40 is positioned to the mounting position of the substrate K. As shown in FIG. Therefore, receiving and mounting of electronic components can be performed at the same time, and further efficiency of mounting work can be achieved.

--other--

In the above-mentioned structure, when the electronic components are mounted on the respective substrate stages 31, 32 by the operation control unit 80, the operation control is performed to carry out all the substrates on the substrate stages 31, 32 directly. Other motion controls are available. For example, the CPU 81 moves and holds the substrate K mounted on the substrate stage 31 on the upstream side to the substrate stage 32 on the downstream side according to a control program stored in the ROM 82 . Operation control may be performed such that a new substrate K is supplied to the substrate stage 31 on the upstream side, and the sequentially carried substrates are mounted on each substrate stage 31 , 32 in two steps.

In this way, since one substrate K is mounted separately via the two substrate stages 31, 32, the mounting operation consisting of two processes can be performed sequentially and continuously, and the mounting operation on a plurality of substrates can be performed more efficiently.

Claims (4)

1. electronic component mounting apparatus is characterized in that having:

The conveyance unit, it carries out the substrate that electronic unit is installed along the prescribed direction conveyance;

The substrate holding unit, it is located in the way in conveyance path of described conveyance unit, is used to carry out the installation exercise of described electronic unit;

Head unit, it can keep and discharge described electronic unit;

First detent mechanism, it has crosses over the leading truck that described conveyance path is used along the described head unit of the direction setting of substrate transferring direction intersection relatively, carries out along the running fix of the described head unit of this leading truck;

Second detent mechanism, it moves described leading truck, carries out along the running fix of the described head unit of described conveyance direction;

The electronic unit feed unit, it supplies with various electronic units to described head unit; And

Action control unit, its installation action to the described relatively substrate of electronic unit is controlled;

Described substrate holding unit and described first detent mechanism all respectively are provided with two along described conveyance path, and, on the leading truck of described each detent mechanism at mutual opposite face side configuration head unit separately;

Described action control unit is carried out following control: by the head unit of a leading truck support and the head unit that is supported by another leading truck, only the substrate that is kept by different mutually substrate holding units is carried out installation action.

2. electronic component mounting apparatus according to claim 1 is characterized in that,

Described action control unit is carried out following action control: will take out of and need not to be kept once more by another substrate holding unit with the substrate that a substrate holding unit has carried out installation exercise.

3. electronic component mounting apparatus according to claim 1 is characterized in that,

Described action control unit is carried out following action control: a substrate is being carried out taking out of this substrate behind the installation action with described two substrate maintaining parts.

4. according to any described electronic component mounting apparatus in the claim 1,2 or 3, it is characterized in that, on described each leading truck, be provided with a plurality of head units.

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