Summary of the invention
The objective of the invention is to use and make toughener by the Nano filling after the coupling agent treatment and cooperate Resins, epoxy and epoxy resin toughened mixture to make host, the high-strength epoxy impregnating varnish that preparation poling low temperature uses down, make it both increase intensity and the resistance to brittle fracture energy of epoxy insulation varnish under utmost point low temperature, do not influence its saturating machine again.
The present invention is the high-strength epoxy impregnating varnish that uses under a kind of utmost point low temperature, it is characterized in that with Resins, epoxy and epoxy resin toughened mixture be host, to have toughness reinforcing acid anhydrides be solidifying agent, the nano silicon filler is that toughener is prepared from.
Adopt the coupling agent treatment Nano filling, prevent that it is agglomerating because of surface action power, described coupling agent can be r-aminopropyl triethoxysilane, r-glycidyl ether oxygen propyl trimethoxy silicane, r-(metacryloxy) propyl trimethoxy silicane.
Its formulation by weight is:
80~120 parts of Resins, epoxy
5~40 parts of toughness reinforcing epoxies
50~130 parts on acid anhydrides
5~15 parts of nano silicon fillers
Its formulation by weight can also for:
80~120 parts of Resins, epoxy
5~40 parts of toughness reinforcing epoxies
50~130 parts on acid anhydrides
5~15 parts of nano silicon fillers
1~5 part of coupling agent
The preparation method of the high-strength epoxy impregnating varnish that a kind of utmost point low temperature uses down, it is characterized in that at first with Resins, epoxy and epoxy resin toughened mixing, be heated to 150~250 ℃, vacuumize, dewatered 1~4 hour, and slowly added Nano filling again, slowly be cooled to room temperature after fully stirring through coupling agent treatment, Nano filling is suspended in the resin, adds anhydride curing agent at last again.
The preparation method of the high-strength epoxy impregnating varnish that a kind of utmost point low temperature uses down is characterized in that described coupling agent treatment is meant coupling agent and Nano filling mixed to mix thoroughly.
The using method of the high-strength epoxy impregnating varnish that a kind of utmost point low temperature uses down is characterized in that condition of cure: 80~130 ℃ solidified 1~2 hour down, and 140~150 ℃ solidified 1~2 hour, and 160~190 ℃ solidified 5~15 hours.
Effect of the present invention:
The high-strength epoxy impregnating varnish that the utmost point low temperature of the present invention's preparation uses down, after measured:
(1), according to GB GB
1149-81Recording to draw and cut under the intensity room temperature greater than 13.1MPa, is greater than 15.2Mpa in the time of-196 ℃.
(2), room-temperature impact strength is greater than 16.2kg.cm/cm
2
(3), cold cycling impacts, promptly-196 ℃ five minutes, room temperature five minutes, ℃ five minutes again-196, room temperature five minutes .... greater than the not embrittlement of 20 circulation samples.
(4), cold and hot (room temperature-liquid nitrogen) shrinkage coefficient is less than 0.65%.(5) puncture of insulation, under the room temperature greater than 23.4KV/mm.(5), air content is less than 1.7%.
(6) viscosity 40 ℃ less than 63 seconds, viscosity less than time of 75 seconds greater than 10 hours.
Table 1 is listed insullac of the present invention (LH-5) and domestic Shanghai synthetic resin plant 1149,6895, external Britain rutherford experiment chamber 01,02,10,20,30, and the performance of several insullac such as CTD-101K is relatively.LH-4 is the room temperature strength height not only, and intensity is also higher during-196 ℃ of utmost point low temperature.
Table 2 is listed insullac of the present invention (LH-5) and domestic Shanghai synthetic resin plant 1149,6895, and the electric property of several insullac such as external Britain rutherford experiment chamber CTD-101K relatively.
Table 3 is listed the air content after insullac of the present invention (LH-5) saturating machine and the curing thereof.
Table 4 is listed insullac of the present invention (LH-5) and domestic Shanghai synthetic resin plant 1149,6895, external Britain rutherford experiment chamber CTD-101K, and 71A, the cold and hot shrinkage coefficient of several insullac such as 79 is relatively.
Table 1:
The performance sample | Tensile strength (MPa) chamber 77K | Shearing resistance (MPa) chamber 77K | Shock strength (kg.cm/cm
2)
| Room temperature liquid nitrogen cycle index |
?LH-5 | >35???>40. | >13.1??????????>15.2 | >16.2 | >20 |
?1149 | ?31????33.5 | ?6.0????????????7.4 | ?10.7 | <5 |
?6895 | ?34????36 | ?8.0????????????8.3 | ?13.4 | <5 |
?RAL1-PH | | ?8.4±0.8???????8.9±0.6 | | |
?01 | | ?8.7±0.8???????12±0.2 | | |
?02 | | ?7.8±1.5???????11±1.6 | | |
?10 | | ?8.6±0.4???????12.8±0. | | |
?20 | | ?9.3±0.4???????9.8±1.8 | | |
?30 | | ?6.2±0.7???????11.1±0.2 | | |
?CTD-101K | | ?10.2???????????18.0 | | <20 |
Table 2:
The performance sample | ρ
s(Ω)
| ρ
v(Ω.m)
| E
B(KV/mm)
| tgδ |
?LH-5 | >3.5×10
16 | >2.1×10
17 | >28.4 | <0.0017 |
?1149 | ?1.2×10
14 | 6.5×10
16 | 30.5 | ?0.0016 |
?6895 | ?3.9×10
14 | 4.5×10
16 | 37.2 | ?0.012 |
?CTD-101K | | | >26 | |
Table 3:
Air content (%) | Viscosity (being coated with 4) 40 ℃ (S) | Viscosity less than time of 75S (hour) |
????<1.7 | ????<63 | ????>10 |
Table 4:
Insullac | ??LH-5 | ?1149 | ?6895 | ?CTD-101K | ?71A | ?79 |
The cold and hot contraction of room temperature liquid nitrogen system | <0.0083 | ?0.011 | ?0.013 | ?0.013 | ?0.010 | ?0.011 |
Embodiment
Embodiment 1:
At first Resins, epoxy 80 grams and toughness reinforcing epoxy 5 grams are mixed and heated to 150 ~ 250 ℃, the degassing, dewater and slowly add nano silicon 5 grams after 1~4 hour again, slowly be cooled to room temperature after fully stirring, nano silicon is suspended in the Resins, epoxy, adds solidifying agent acid anhydrides 50 grams at last again and solidify condition of cure: 80~130 ℃ solidified 1~2 hour down, 140~150 ℃ solidified 1~2 hour, and 160~190 ℃ solidified 5~15 hours.
Embodiment 2:
At first Resins, epoxy 120 grams and toughness reinforcing epoxy 40 grams are mixed and heated to 150~250 ℃, the degassing, dewater and slowly add nano silicon 15 grams after 1~4 hour again, r-aminopropyl triethoxysilane 5 grams, slowly be cooled to room temperature after fully stirring, nano silicon is suspended in the Resins, epoxy, adds solidifying agent acid anhydrides 130 grams at last again and solidify.Condition of cure: 80~130 ℃ solidified 1~2 hour down, and 140~150 ℃ solidified 1~2 hour, and 160~190 ℃ solidified 5~15 hours.
Embodiment 3:
At first Resins, epoxy 100 grams and toughness reinforcing epoxy 30 grams are mixed and heated to 150~250 ℃, the degassing, dewater and slowly add nano silicon 10 grams after 1~4 hour again, r-aminopropyl triethoxysilane 1 gram, slowly be cooled to room temperature after fully stirring, nano silicon is suspended in the Resins, epoxy, adds solidifying agent acid anhydrides 100 grams at last again and solidify.Condition of cure: 80~130 ℃ solidified 1~2 hour down, and 140~150 ℃ solidified 1~2 hour, and 160~190 ℃ solidified 5~15 hours.
Embodiment 4:
At first Resins, epoxy 90 grams and toughness reinforcing epoxy 20 grams are mixed and heated to 150~250 ℃, the degassing, dewater and slowly add nano silicon 8 grams after 1~4 hour again, r-aminopropyl triethoxysilane 2 grams, slowly be cooled to room temperature after fully stirring, nano silicon is suspended in the Resins, epoxy, adds solidifying agent acid anhydrides 95 grams at last again and solidify.Condition of cure: 80~130 ℃ solidified 1~2 hour down, and 140~150 ℃ solidified 1~2 hour, and 160~190 ℃ solidified 5~15 hours.
Embodiment 5:
At first Resins, epoxy 110 grams and toughness reinforcing epoxy 35 grams are mixed and heated to 150~250 ℃, the degassing, dewater and slowly add nano silicon 7 grams after 1~4 hour again, r-aminopropyl triethoxysilane 4 grams, slowly be cooled to room temperature after fully stirring, nano silicon is suspended in the Resins, epoxy, adds solidifying agent acid anhydrides 105 grams at last again and solidify.Condition of cure: 80~130 ℃ solidified 1~2 hour down, and 140~150 ℃ solidified 1~2 hour, and 160~190 ℃ solidified 5~15 hours.
Embodiment 6:
At first Resins, epoxy 120 grams and toughness reinforcing epoxy 40 grams are mixed and heated to 150~250 ℃, the degassing, dewater and slowly add nano silicon 15 grams after 1~4 hour again, r-glycidyl ether oxygen propyl trimethoxy silicane 5 grams, slowly be cooled to room temperature after fully stirring, nano silicon is suspended in the Resins, epoxy, adds solidifying agent acid anhydrides 130 grams at last again and solidify.Condition of cure: 80~130 ℃ solidified 1~2 hour down, and 140~150 ℃ solidified 1~2 hour, and 160~190 ℃ solidified 5~15 hours.
Embodiment 7:
At first Resins, epoxy 100 grams and toughness reinforcing epoxy 30 grams are mixed and heated to 150~250 ℃, the degassing, dewater and slowly add nano silicon 10 grams after 1~4 hour again, r-(metacryloxy) propyl trimethoxy silicane 1 gram, slowly be cooled to room temperature after fully stirring, nano silicon is suspended in the Resins, epoxy, adds solidifying agent acid anhydrides 100 grams at last again and solidify.Condition of cure: 80~130 ℃ solidified 1~2 hour down, and 140~150 ℃ solidified 1~2 hour, and 160~190 ℃ solidified 5~15 hours.