CN1383358A - Packaging structure for electronic products - Google Patents
Packaging structure for electronic products Download PDFInfo
- Publication number
- CN1383358A CN1383358A CN 01131267 CN01131267A CN1383358A CN 1383358 A CN1383358 A CN 1383358A CN 01131267 CN01131267 CN 01131267 CN 01131267 A CN01131267 A CN 01131267A CN 1383358 A CN1383358 A CN 1383358A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic products
- packaging structure
- products according
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 230000000694 effects Effects 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 4
- 230000005669 field effect Effects 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a packaging structure for electronic products, which comprises a first circuit board, a second circuit board, a connecting element and a packaging structure, wherein the second circuit board has better heat transfer effect than the first circuit board and carries a part of electronic elements with large heating power, and the connecting element is used for electrically connecting the first circuit board and the second circuit board. The invention can improve the heat dissipation effect and the volume utilization.
Description
The present invention relates to a kind of encapsulating structure that is used for electronic product.
The surface-mounted technology of the most of employing of electronic component now (Surface Mounting Technology; SMT) be welded on the printed circuit board (PCB) (PCB); (DC to DC converter) is example with DC-to-DC converter; the main electronic component that is disposed on the circuit board comprises capacitor; resistor; inductance; transformer; diode; metal oxide semiconductor field-effect electric crystal (MOSFET); naked crystalline substance etc.; when DC-to-DC converter operates; these electronic components can produce the heat that power does not wait; if fail heat is transferred to the external world effectively; then excessive heat can cause the electronic component fault; make system-down, even cause whole system to lose function fully.For low power electronic component, perhaps can utilize free convection (Naturalconvection) heat can be taken away, then must utilize forced convertion (Forceconvection) could take away heat rapidly as for high-power element.And no matter be the size that free convection or its thermal resistance of forced convertion (Thermal resistance) all depend on area of dissipation, therefore generally set up radiator (heatsink) and be the normal cooling mechanism that uses to increase area of dissipation.The printed circuit board (PCB) of commonly using mainly forms substrate by one layer or more Copper Foil and by organic substances such as epoxides, polyester and is constituted, because the thermal expansion coefficient difference of organic substance and Copper Foil is too big, and the each point inequality of being heated on the printed circuit board (PCB), therefore, often cause significant thermal stress (thermal stress), the electronic component function is reduced.With the glass epoxy resin base plate (FR-4 PCB) commonly used is example, the shortcoming that accumulation of heat is still arranged, the fan heat radiation is had living space and the restriction of effect and install additional during actual the use, and this kind substrate is difficult for applying radiator and it is comparatively special to need in the design of fin, so cost is quite high.And after this kind substrate installed radiator additional, its radiating effect was also undesirable.Secondly,, make the heat concentrations, cause life of product to reduce with the difficult further heat radiation of the electronic component (for example SO-08, SOT-23, wafer etc.) of mold encapsulation.
A kind of high thermal conductive substrate (highly thermalconductive substrate) in order to solve the shortcoming of above-mentioned thermal stress, to develop at present, high thermal conductive substrate commonly used comprises for example metal substrate and ceramic substrate (ceramic substrate).Fig. 1 is the structural representation of existing metal substrate, the structure of metal substrate 10 from bottom to top is followed successively by basalis (base Layer) 11, dielectric layer (dielectric layer) 12 and circuit layer (circuit layer) 13, wherein basalis 11 is generally about 0.5 to the 3.2 millimeter aluminium of thickness, copper or other metals, and 13 of circuit layers are tens of extremely Copper Foils of hundreds of microns for thickness.Ceramic substrate is then with aluminium oxide (Al
2O
3) or beryllium oxide (BeO) be base material, its structure is a prior art, does not give unnecessary details at this.Because the heat-conducting effect of high thermal conductive substrate is good, thus can overcome the thermal stress and the concentrated shortcoming of heat of above-mentioned traditional printed circuit board (PCB), however this kind high thermal conductive substrate also has following shortcoming:
(1) price of high thermal conductive substrate is high far beyond traditional printed circuit board (PCB), for example exceeds about 10 times of prices than glass glass epoxy printed board (FR-4 PCB) substrate;
(2) heat-conducting effect of high thermal conductive substrate is splendid, causes the heat of the electronic component of big heating power very easily to be passed to the electronic component of low heating power, thereby influences the function of the electronic component of low heating power.
The object of the present invention is to provide a kind of encapsulating structure, to promote the radiating effect of electronic component.
Another object of the present invention is to provide a kind of encapsulating structure, to promote the volume utilization and the rational spatial configuration of electronic product.
Another purpose of the present invention is to provide a kind of encapsulating structure, to reduce the packaging cost of electronic product.
For achieving the above object, the encapsulating structure that is used for an electronic product of the present invention, it comprises: a first circuit board; One second circuit board, it has the desirable heat-transfer effect of more described first circuit board, and is loaded with the electronic component that part has big heating power; And a Connection Element, use so that described first circuit board is electrically connected with described second circuit board generation.
The encapsulating structure that is used for electronic product as described, wherein said electronic product are a DC-to-DC converter (DC to DC converter).
The encapsulating structure that is used for electronic product as described, wherein said first circuit board be selected from comprise copper clad laminate (Copper Clad Laminate, CCL), one of glass epoxy resin base plate (FR-4 PCB) and thermoplasticity substrate.
The encapsulating structure that is used for electronic product as described, wherein said second circuit board are high thermal conductive substrate (highly thermal conductive substrate).
The encapsulating structure that is used for electronic product as described, wherein said high thermal conductive substrate are metal substrate or ceramic substrate (ceramic substrate).
The encapsulating structure that is used for electronic product as described, wherein said electronic component with big heating power are selected from the group that comprises transformer, MOSFET, naked crystalline substance (bare die), diode, winding (winding) and inductance (inductor).
The encapsulating structure that is used for electronic product as described, wherein said Connection Element are a high thermal conductivity material.
The encapsulating structure that is used for electronic product as described, wherein said high thermal conductivity material one of are selected from the group that comprises copper, silver, gold.
The encapsulating structure that is used for electronic product as described, wherein said second circuit board is positioned at the top of described first circuit board.
The encapsulating structure that is used for electronic product as described, wherein said Connection Element is column, in order to support described second circuit board.
The encapsulating structure that is used for electronic product as described, wherein said second circuit board are positioned at a side of described first circuit board.
The encapsulating structure that is used for electronic product as described, wherein said Connection Element are wire, strip or tabular.
The encapsulating structure that is used for electronic product as described, wherein said second circuit board also are provided with a radiator (heatsink).
Adopt technique scheme of the present invention, encapsulating structure of the present invention has the following advantages: eliminated thermal stress and heat radiation easily, the heat that the electronic component of big heating power spreads out of rapidly can not influence low power electronic component; Required high thermal conductive substrate area is low far beyond prior art, and cost can reduce significantly; Because the relative position of its first circuit board and second circuit board can optionally dispose, so have more elasticity for the volume utilization of electric equipment casing; Its second circuit board also can be established radiator with the raising radiating effect, thereby can avoid existing glass epoxy resin base plate to be difficult for installing and the not good shortcoming of radiating effect; Because its good heat dispersion, this helps electronic product towards high-power and miniaturization development.
For clearer understanding purpose of the present invention, characteristics and advantage, preferred embodiment of the present invention is elaborated below in conjunction with accompanying drawing.
Fig. 1 is a schematic diagram of commonly using metal substrate;
Fig. 2 (a) is the schematic perspective view of the encapsulating structure of the present invention's first preferred embodiment;
Fig. 2 (b) is the front view of the encapsulating structure of the present invention's first preferred embodiment;
Fig. 3 (a) is the stereogram of the encapsulating structure of the present invention's second preferred embodiment;
Fig. 3 (b) is the front view of the encapsulating structure of the present invention's second preferred embodiment.
It is schematic perspective view and the front view that is respectively the encapsulating structure of the present invention's first preferred embodiment that Fig. 2 (a) reaches (b).The encapsulating structure that the present invention is used for electronic product comprises a first circuit board 20, a second circuit board 30 and a Connection Element 41.
The heat excessive influence that electronic component spread out of that has big heating power for fear of part is to other electronic components, and the elasticity of promotion heat radiation and spatial configuration and utilization, main feature of the present invention is: (1) second circuit board 30 needs to have better heat-transfer effect than first circuit board 20, and (2) have the electronic component arrangements of big heating power on second circuit board 30 with part.Therefore, first circuit board 20 is optional from the printed circuit board (PCB) of commonly using, copper clad laminate (Copper Clad Laminate for example, CCL), glass epoxy resin base plate (FR-4 PCB) or thermoplasticity substrate, second circuit board 30 then is high thermal conductive substrate (highlythermal conductive substrate), metal substrate of for example commonly using or ceramic substrate (ceramicsubstrate).
To assemble a DC-to-DC converter (DC to DC converter) is example, and required main electronic component comprises capacitor, resistor, inductance, transformer, diode, metal oxide semiconductor field-effect electric crystal (MOSFET), naked crystalline substance (bare die), winding (winding) etc.For realizing purpose of the present invention, the electronic component 31 that part can be had big heating power is configured on the second circuit board 30, these electronic components 31 with big heating power comprise transformer, metal oxide semiconductor field-effect electric crystal (MOSFET), naked crystalline substance, diode, inductance or winding, the electronic component 21 of 30 little heating powers of main configuration of second circuit board.Certainly, consider according to factors such as circuit needs, spatial configuration, costs, but first circuit board 20 reserve parts have the electronic component (not shown) of big heating power, and the electronic component (not shown) of the little heating power of the also configurable part of second circuit board 30.In the present embodiment, second circuit board 30 is the tops that are positioned at first circuit board 20, be respectively welded on the contact mat 22,32 of first circuit board 20 and second circuit board 20 with a bronze medal post 41 again, therefore, the column 41 of highly heat-conductive material not only is used for being electrically connected and hot link of first circuit board 20 and 30 of second circuit boards, and has the effect that supports second circuit board 30.
This kind encapsulating structure can make the electronic component with big heating power conduct heat on the splendid second circuit board 30 of heat-transfer effect, because the back side of second circuit board 30 is a flat board, radiator quite makes things convenient for and cost of manufacture is cheap so add, and after setting up a radiator (not shown) on the second circuit board 30, just can remove the heat on the second circuit board 30 rapidly.
Fig. 3 (a) and 3 (b) are respectively the schematic perspective view and the front view of the encapsulating structure of the present invention's second preferred embodiment.In the present embodiment, removing second circuit board 30 is sides that are positioned at first circuit board 20, making first circuit board 20 produce the Connection Element that is electrically connected with second circuit board 30 is that its operation principle is identical with first embodiment of the invention outside the bar 42 (also can be wire or tabular) of highly heat-conductive material.
In sum, of the present inventionly be for the encapsulating structure of electronic product and Main Differences and the progressive of prior art:
(1) existing electronic component arrangements is had the generation thermal stress at the encapsulating structure of same printed circuit board (PCB) And the difficult shortcoming of heat radiation; In addition, existing with the encapsulation knot of electronic component arrangements at same high thermal conductive substrate Structure is the cost costliness not only, and the heat that the electronic component of big heating power spreads out of rapidly very easily affects small-power The function of electronic component; And encapsulating structure of the present invention can be avoided the shortcoming of above-mentioned two kinds of prior aries.
(2) to be used for the encapsulating structure of electronic product be electronic component arrangements with the big heating power of tool in the present invention On the splendid high thermal conductive substrate of heat-transfer effect, so the heat radiation of the electronic component of big heating power is splendid, and So the electronic component of neglecting greatly required big heating power of high thermal conductive substrate and deciding is required high thermal conductive substrate Area is low far beyond prior art, and cost can reduce significantly. Being applied to DC-to-dc converter as example, The height that encapsulating structure of the present invention uses the encapsulating structure of high thermal conductive substrate can reduce more than 20% is approximately more fully led The hot substrate area. Simultaneously, first circuit board 20 required areas of the present invention also adopt fully than existing skill Printed circuit board (PCB) is little.
(3) the present invention is used for the first circuit board 20 and second circuit board 30 of the encapsulating structure of electronic product Relative position can optionally dispose, so have more elasticity for the volume utilization of electric equipment casing.
(4) second circuit board 30 of the encapsulating structure for electronic product provided by the present invention can be further If radiator, to improve radiating effect, the glass epoxy resin base plate that can avoid commonly using is difficult for installing and loosing The shortcoming that thermal effect is not good.
(5) heat radiation of the encapsulating structure for electronic product provided by the present invention is good, for electronic product Develop towards high-power and miniaturization and very to have an advantage.
In sum, the encapsulating structure for electronic product provided by the present invention have radiating effect good, The advantage that elasticity is good and cost is not high is used in the space, and can exempt the shortcoming that runs in the prior art.
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01131267 CN1383358A (en) | 2001-04-25 | 2001-08-31 | Packaging structure for electronic products |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01221415.9 | 2001-04-25 | ||
| CN01221415 | 2001-04-25 | ||
| CN 01131267 CN1383358A (en) | 2001-04-25 | 2001-08-31 | Packaging structure for electronic products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1383358A true CN1383358A (en) | 2002-12-04 |
Family
ID=25740540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01131267 Pending CN1383358A (en) | 2001-04-25 | 2001-08-31 | Packaging structure for electronic products |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1383358A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100538580C (en) * | 2007-09-11 | 2009-09-09 | 陈业宁 | A kind of temperature control box dedicated for electronic element packaging |
| CN101794847B (en) * | 2009-02-03 | 2012-07-04 | 佰鸿工业股份有限公司 | Solid-state light source packaging structure with low thermal impedance and manufacturing method thereof |
| CN108541195A (en) * | 2018-05-31 | 2018-09-14 | 赫星科技有限公司 | Unmanned aerial vehicle, flight controller and heat radiation structure thereof |
| CN108551748A (en) * | 2018-05-31 | 2018-09-18 | 赫星科技有限公司 | Unmanned aerial vehicle, flight controller and heat dissipation method thereof |
| CN112954887A (en) * | 2021-04-09 | 2021-06-11 | 华域视觉科技(上海)有限公司 | Circuit structure and electric control device |
-
2001
- 2001-08-31 CN CN 01131267 patent/CN1383358A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100538580C (en) * | 2007-09-11 | 2009-09-09 | 陈业宁 | A kind of temperature control box dedicated for electronic element packaging |
| CN101794847B (en) * | 2009-02-03 | 2012-07-04 | 佰鸿工业股份有限公司 | Solid-state light source packaging structure with low thermal impedance and manufacturing method thereof |
| CN108541195A (en) * | 2018-05-31 | 2018-09-14 | 赫星科技有限公司 | Unmanned aerial vehicle, flight controller and heat radiation structure thereof |
| CN108551748A (en) * | 2018-05-31 | 2018-09-18 | 赫星科技有限公司 | Unmanned aerial vehicle, flight controller and heat dissipation method thereof |
| CN112954887A (en) * | 2021-04-09 | 2021-06-11 | 华域视觉科技(上海)有限公司 | Circuit structure and electric control device |
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