CN1373388A - Semiconductor device, manufacturing method thereof, and liquid crystal display using the semiconductor device - Google Patents

Abstract

A liquid crystal display device includes a circuit component, an electrode, a conductive bump, a substrate, a contact pad, a bonding device, and a spacer. The electrode is provided on one side of the circuit component; the conductive bump is formed on the electrode; the substrate is provided with a contact pad at a position corresponding to the conductive bump; the bonding device has a plurality of conductive particles for bonding the contact pad and the conductive bump; the spacer and the conductive bump are formed on the same side of the circuit component to separate the conductive particles. It can effectively avoid short circuit or poor contact of anisotropic conductive film during bonding and improve product quality. It is easier to rework the circuit component than the prior art.

Description

Semiconductor device, manufacturing method thereof, and liquid crystal display using the semiconductor device

The present invention relates to a semiconductor device and its manufacturing method, and a liquid crystal display using the semiconductor device, in particular to a semiconductor device using anisotropic conductive film (anisotropic conductive film, hereinafter referred to as ACF) for inter-component coupling and its manufacturing A method, and a liquid crystal display using the semiconductor device, wherein the proper degree of the above-mentioned coupling is enhanced by forming a special structure.

In some existing electronic devices, the connection between the components and the main circuit is performed through a conductive film (such as ACF). ACF is made by mixing non-conductive synthetic resin and conductive particles. As shown in the cross-sectional view of Figure 1A, the conductive particle 1 is about 3-5 μm in diameter, and its central part 1a is a polymer, while the outer wrapping Covered with metal conductor 1b, such as gold, nickel, tin, etc.

ACF is often used in the manufacture of liquid crystal displays, and some are used to directly package the driver chip of the panel on the glass substrate (commonly known in the field as COG, that is, chip on glass), or bond the driver chip to a flexible circuit board (COF, chip on FPC), and then bonded to the substrate method.

In addition, ACF is also suitable for the manufacturing process of bonding chips to general printed circuit boards (COB, chip onboard).

As shown in FIG. 1B , the substrate 4 represents the aforementioned glass substrate, flexible circuit board, printed circuit board or other circuit board components. During manufacture, contact pads (pads) 4a are formed on the substrate 4 for transmission of various signals and energy. On the other hand, thick conductive bumps (bumps) 3 a are formed on the leads of the chip 3 . Put the ACF 5 between the driver chip 3 and the substrate 4, then heat to change the viscosity of the ACF 5, and then press the driver chip 3 and the substrate 4. At this time, the corresponding contact pad 4a and the conductive bump 3a must be mutually alignment.

Since the conductive bump 3a has a certain thickness, the conductive particles 1 will be squeezed between the conductive bump 3a and the contact pad 4a. The extruded conductive particles 1 form an electrical connection between the conductive bump 3a and the contact pad 4a through the metal layer 1b coated on its outer periphery. The ACF is used for chip packaging, and the action of bonding the driving chip 3 and coupling the circuit can be completed at the same time.

When using ACF for chip packaging, a common problem is improper migration of conductive particles. Since the viscosity of the resin part in the ACF decreases after heating, when the conductive bump 3a and the contact pad 4a are pressed together, the conductive particles therebetween are easy to diffuse and migrate to the surrounding. One of the problems is as shown in FIG. 1C , the number of conductive particles 1 between the conductive bump 3 a and the contact pad 4 a is too small, which increases the coupling resistance. Furthermore, another problem as shown in FIG. 1D is that too many conductive particles 1 are concentrated between adjacent conductive bumps 3a, and a lateral electrical connection is generated, that is, to adjacent conductive bumps 3a and adjacent conductive bumps 3a. The contact pad 4a causes a short circuit. As chip functions increase day by day and the number of pins per unit area increases accordingly, the problem of short circuit will become more and more likely to occur.

For these problems, U.S. Patent No. 5,844,314 proposes a structure as shown in FIG. 1E , by producing flanges 3a1 on both sides of the end of the conductive bump 3a, an accommodating space can be formed during bonding to prevent conductive particles 1 flow to ensure the coupling quality between the conductive bump 3a and the contact pad 4a.

As shown in FIG. 1F , the method proposed in US Patent No. 5,903,056 is to provide protrusion structures on both sides of the contact pad 4 a of the substrate 4 , so as to achieve the effect similar to the above-mentioned US Patent No. 5,844,314 .

However, US Patent Nos. 5,844,314 and 5,903,056 do not solve the problem of short circuits between adjacent pins.

As shown in Figure 1G, the method proposed by U.S. Patent No. 5,650,919 is to produce a peak-shaped polymer structure 6 on one side of the substrate 4 of the bonded structure, so as to prevent the above-mentioned short circuit from occurring during bonding, and to limit the conductive particles 1 at the same time. migrate.

However, its disadvantage is that it cannot completely prevent the improper drift of conductive particles 1. In the top view shown in FIG. The method proposed in No. 1 can only prevent the migration of conductive particles 1 in one direction, so the above-mentioned problem of short circuit between adjacent contact pads may still occur during bonding.

Furthermore, the peak-shaped structure 6 proposed in this case occupies a relatively large space at the root 6a of the peak. In order to avoid poor contact caused by pins stuck at the other end during bonding, the accuracy of the bonding must be further improved, which will invisibly reduce quality and increase manufacturing costs.

In addition, when poor bonding or a short circuit occurs, and the driver chip needs to be reworked or replaced, since the prior art has provided barrier structures on the substrate 4, the structures for barriers often appear on the substrate 4. Damaged in the process of rework, and lost the effect of blocking the conductive particles 1 . Therefore, the method for disposing the above-mentioned barrier structure on the substrate 4 also needs to be improved.

The object of the present invention is to provide a semiconductor device, its manufacturing method and a liquid crystal display using the semiconductor device, so as to solve the above-mentioned problems.

The object of the present invention is achieved in that a liquid crystal display device is provided, comprising a circuit device, an electrode is provided on one side of the circuit device; a conductive bump, the A conductive bump is formed on the electrode; a substrate (substrate) is provided with a contact pad (bonding pad) corresponding to the position of the conductive bump; a bonding device (connecting means) has a plurality of conductive particles for bonding The contact pad and the conductive bump, wherein the conductive particles are used to electrically connect the contact pad and the conductive bump; and a barrier rib, formed on the same side of the circuit assembly as the conductive bump, for use to separate the conductive particles. Wherein, the spacer is made of insulating material, such as polyimide (PI).

The contact pad also includes a plurality of first contact pads and a plurality of second contact pads, wherein the first contact pad is an input terminal of the liquid crystal display, and the second contact pad is an output terminal of the liquid crystal display. The spacer also includes a first spacer, wherein the first spacer is parallel to the first direction and used for separating the conductive bumps between the first contact pads.

Furthermore, the spacer further includes a second spacer, wherein the second spacer is parallel to the first direction and is used to separate the conductive bumps between the second contact pads. And the spacer further includes a third spacer, wherein the third spacer is parallel to the second direction and is used to separate the conductive bump between the first contact pad and the second contact pad.

Wherein the first spacer can be connected to the adjacent third spacer to form an L-shaped or T-shaped structure. Likewise, the second spacer can be connected to the adjacent third spacer to form an L-shaped or T-shaped structure.

Furthermore, the bonding device is anisotropic conductive film (ACF). The material of the conductive bump may include any one of gold, copper, nickel, and tin. In addition, the substrate of the liquid crystal display device of the present invention is a glass substrate. In contrast, the circuit component is an integrated circuit (Integrated Circuit), a flexible printed circuit (Flexible Printed Circuit) or a printed circuit board (printed circuit board).

The present invention also provides a semiconductor device, including an electrode (electrode); a conductive bump (conductive bump), the conductive bump is arranged on the electrode; a contact pad (bonding pad); a bonding device (connecting means) , having a plurality of conductive particles for bonding the contact pad and the conductive bump, wherein the conductive particle is used for electrically connecting the contact pad and the conductive bump; and a barrier rib, which is disposed on the electrode with the electrode The same side is used to separate the conductive particles.

Wherein, the spacer is made of insulating material, such as polyimide (polyimide, PI); the contact pad also includes a plurality of first contact pads and a plurality of second contact pads, wherein the first contact pads are the liquid crystal The input end of the display, the second contact pad is the output end of the liquid crystal display; and, the spacer also includes a first spacer, wherein the first spacer is parallel to the first direction, and is used to separate the first contact pad between the conductive bumps; the spacer also includes a second spacer, wherein the second spacer is parallel to the first direction to separate the conductive bumps between the second contact pads; moreover, the spacer also A third spacer is included, wherein the third spacer is parallel to the second direction and is used for separating the conductive bump between the first contact pad and the second contact pad.

Wherein, the first spacer and the second spacer are connected to the adjacent third spacer to form an L-shaped or T-shaped structure.

Furthermore, the bonding device is anisotropic conductive film (ACF); and the material of the conductive bump may include any one of gold, copper, nickel, and tin.

The present invention also provides a method of manufacturing a semiconductor device, comprising the following steps:

A circuit component is provided, wherein a plurality of electrodes are provided on one side of the circuit component; a protective layer is formed on the circuit component and the electrodes are exposed; a plurality of conductive bumps corresponding to the electrodes are formed on the protective layer , and electrically connect the electrode to the conductive bump; and form a plurality of spacers, wherein the spacers are formed on the same side of the conductive bump and interposed between the conductive bumps.

Below in conjunction with accompanying drawing, describe embodiment of the present invention in detail, wherein:

Figure 1A is a schematic diagram of a typical conductive particle structure;

1B is a schematic diagram of a basic ACF bonding method between a driver chip and a glass substrate;

Figure 1C and Figure 1D are schematic diagrams of common problems in traditional ACF joining methods;

Figures 1E to 1G are schematic diagrams of several methods used to solve the problem shown in Figure 1C in the prior art;

Figure 1H is a schematic diagram of unsolved problems in the prior art;

2 is a schematic diagram of a partial structure of a liquid crystal display according to an embodiment of the present invention;

3 is a schematic diagram of a configuration of a spacer provided on a chip according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of another configuration of a spacer provided on a chip according to an embodiment of the present invention;

5a to 5c are schematic diagrams of the formation process of a typical conductive bump on a chip;

6a to 6g are schematic diagrams of the manufacturing process of the first and second spacers on the chip according to the embodiment of the present invention;

7 and 8 are schematic diagrams of different applications of the semiconductor device of the present invention.

Symbol Description:

1～conductive particle; 1b～metal layer; 3～chip; 3a～conductive bump; 4～substrate; 4a～contact pad; 5～ACF; 6～peak-shaped structure; 100～liquid crystal display; 10～chip; 11～ Base surface; 11a, 11b~both edges; 111~electrode; 112~protective layer; 113~interface metal layer; 114~photoresist layer; 115~opening; 116, 116'~PI layer; 117, 117' ～photoresist layer; 12～conductive bump; 13～first spacer; 14～second spacer; 15～third spacer; 20～substrate part; 21～contact pad; 21a～first contact Pad; 21b~second contact pad; 30~bonding device; 31~conductive particles; 01~first direction; 02~second direction.

first embodiment

With reference to Fig. 2, the first embodiment of semiconductor device of the present invention is a liquid crystal display 100, wherein comprises at least one chip 10 (for driving chip), is provided with a base surface 11, and this base surface 11 is provided near opposite two edges 11a, 11b There are at least two conductive bumps 12 .

Another substrate portion 20 , namely the glass panel of the LCD 100 , is provided with a plurality of contact pads 21 , wherein the conductive bumps 12 are disposed corresponding to the contact pads 21 .

Since the chip 10 must form an electrical connection with the substrate portion 20, a bonding device 30 is provided, wherein the bonding device 30 has a plurality of conductive particles 31 to bond the substrate portion 20 and the contact pad 21, and make the conductive particles 31 Squeezed between the contact pad 21 and the conductive bump 12 to form an electrical connection between the contact pad 21 and the conductive bump 12 . Wherein, the contact pad 21 also includes a plurality of first contact pads 21a and a plurality of second contact pads 21b, wherein the first contact pad 21a is the signal input terminal of the liquid crystal display, and the second contact pad 21b is the input terminal of the liquid crystal display. signal output.

In other words, in the design of the present invention, at least one barrier (barrierrib) is provided on the circuit assembly, wherein the conductive bumps 12 are formed on the same side of the circuit assembly to separate the conductive particles 31 and prevent improper conduction of the conductive particles 31. drift. The spacer is made of insulating material and is divided into a first spacer 13 , a second spacer 14 and a third spacer 15 . As shown in FIG. 2, the first spacer 13 is parallel to the first direction 01 to separate the conductive bumps 12 between adjacent first contact pads 21a; the second spacer 14 is also parallel to the first direction, Used to separate the conductive bumps 12 between the second contact pads 21b; moreover, the third spacer 15 is parallel to a second direction 02, used to separate the first contact pad 21a and the second contact pad 21b Conductive bump 12.

As shown in Figure 2, the first and second spacers 13, 14 are preferably connected to the adjacent third spacer 15 respectively to form an L-shaped (not shown) or T-shaped (as shown) structure .

The insulating material is preferably polyimide (PI). Wherein, the bonding device 30 is preferably an anisotropic conductive film (ACF) commonly used in the field. Furthermore, the material of the conductive bump 12 can be any one of gold, copper, nickel, and tin.

The device included in the typical COG manufacturing process of the above-mentioned liquid crystal display panel. In order to solve the aforementioned problems, see the following examples for details.

second embodiment

The second embodiment of the present invention is shown in FIG. 3 . There are four third spacers 15 in the center, generally arranged at four corners. The first and second spacers 13 , 14 are respectively connected to the adjacent third spacers 14 .

third embodiment

The third embodiment of the present invention, as shown in Figure 4, has two third spacers 15 in the center, arranged in two parallel lines, and the first and second spacers 13, 14 are respectively connected to the adjacent third spacers 15 , forming two connected T shapes.

In addition, in terms of manufacturing, the first, second and third spacers 13, 14, 15 and other devices of the present invention are preferably manufactured together in the chip conductive bump manufacturing process to save assembly procedures. As shown in FIGS. 5 a to 5 c , the conductive bumps of the chip according to the embodiment of the present invention are manufactured by a typical procedure.

As shown in Figure 5a, when the chip is performing the fabrication process of the conductive bump, in order to expose the exposed electrode (electrode) 111 on the base surface 11, a passivation layer (passivation layer) will be first formed and defined on the base surface. 112, and only the electrode 111 is exposed. Then it is covered with an interface metal layer 113 , which is usually an alloy of Ti and W. Finally, a photoresist layer 114 is coated on the interface metal layer 113, exposed and developed through a photomask (mask) and ultraviolet rays, and unnecessary photoresist layer is removed to form the opening in FIG. 5a 115 , and then as shown in FIG. 5 b , cover the cavity with a metal (usually Au, usually by evaporation). Referring to FIG. 5c, the bump 12 can be formed after removing the photoresist. The above is a typical manufacturing method of conductive bumps.

In order to form a predetermined barrier structure on the base surface 11 of the chip 10, in addition to forming conductive bumps, the manufacturing method of the present invention also includes the step of forming a barrier structure, and the detailed steps are shown in Figures 6a to 6g .

In FIG. 6 a , a passivation layer 112 is firstly formed and defined on the base surface, and only the electrode 111 is exposed. Then an interface metal layer 113 is covered. Then, as shown in Figure 6b, a PI layer 116 is coated on the interface metal layer 113, and then a photoresist layer 117 (positive photoresist or negative photoresist) is coated on the PI layer 116 as shown in Figure 6c. type photoresist). Then, as shown in Figure 6d, through an appropriate photomask (not shown), the manufacturing process of exposure, development and etching is carried out to remove the unnecessary photoresist layer and PI layer, and what is left is the predetermined The photoresist layer 117 ′ and the PI layer 116 ′ it protects are used as the first, second and third spacers 13 , 14 , 15 mentioned above.

Next, in the case of having the first spacers 13, 14, and the second spacer 15, repeat the manufacturing process shown in the above-mentioned Fig. 5a-Fig. 5c to form the procedure shown in Fig. 6e-Fig. 6g. As a result, the conductive bump 12 and the first spacers 13 , 14 and the second spacer 15 can be provided on the chip at the same time.

In addition to the COG manufacturing process of the above-mentioned liquid crystal display, the semiconductor device of the present invention can be applied to the manufacturing process of coupling electronic components to a general printed circuit board (PCB), as shown in FIG. 7, wherein the substrate 20 is a printed circuit board ; and the manufacturing process of bonding components to a flexible printed circuit (FPC), as shown in FIG. 8 , wherein the substrate 20 is a flexible printed circuit.

Based on the above, using the electronic device of the present invention, in the production process, it is possible to effectively avoid the uneven distribution of ACF due to improper movement and distribution of conductive particles during bonding, resulting in short circuits or poor contact between signal lines and even energy lines. . In addition, the spacer of the present invention is arranged on the chip, and this part of the manufacturing process can be handed over to the chip manufacturer, without performing other manufacturing processes on the glass panel of the liquid crystal display or the substrate of other circuit devices. The electronic device according to the present invention can effectively increase product quality and increase productivity.

In addition, when defective circuit components (such as driver chips) appear, the semiconductor device according to the present invention is easier to rework and replace the circuit components than the prior art. Wherein the spacer is arranged on the circuit assembly instead of on the substrate. Therefore, when reworking and cleaning the substrate, it will not be removed together with the spacer on it, so when the contact pad on the substrate is rejoined with another good circuit component (including the spacer on it), it will not be removed. Need to worry about the counter-work will damage the spacer.

Although the present invention has been described in conjunction with the above specific embodiments, it is not intended to limit the present invention. Any person skilled in the art can make changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection should be defined by the claims.

Claims (22)

1. A liquid crystal display device comprising: a circuit device (circuit device), an electrode (electrode) is provided on one side of the circuit device; a conductive bump formed on the electrode; a substrate (substrate), a contact pad (bondingpad) is provided on a position corresponding to the conductive bump; A connecting device (connecting means) has a plurality of conductive particles for bonding the contact pad and the conductive bump, wherein the conductive particles are used for electrically connecting the contact pad and the conductive bump; and A barrier rib is formed on the same side of the circuit assembly as the conductive bump to separate the conductive particles. 2. The liquid crystal display device as claimed in claim 1, wherein the spacer is made of insulating material. 3. The liquid crystal display device as claimed in claim 2, wherein the contact pad further comprises a plurality of first contact pads and a plurality of second contact pads, wherein the first contact pad is an input terminal of the liquid crystal display, and the second contact pad is The contact pad is the output of the LCD. 4. The liquid crystal display device as claimed in claim 3, wherein the spacer further comprises a first spacer, wherein the first spacer is parallel to the first direction for separating the conductive bumps between the first contact pads . 5. The liquid crystal display device as claimed in claim 3, wherein the spacer further comprises a second spacer, wherein the second spacer is parallel to the first direction for separating the conductive bumps between the second contact pads . 6. The liquid crystal display device as claimed in claim 3, wherein the spacer further comprises a third spacer, wherein the third spacer is parallel to the second direction for separating the first contact pad and the second contact pad conductive bumps. 7. The liquid crystal display device according to claim 4 and 6, wherein the first spacer is connected to the adjacent third spacer to form an L-shaped structure. 8. The liquid crystal display device as claimed in claim 6, wherein the first spacer is connected to the adjacent third spacer to form a T-shaped structure. 9. The liquid crystal display device as claimed in claim 6, wherein the second spacer is connected to the adjacent third spacer to form an L-shaped structure. 10. The liquid crystal display device as claimed in claim 6, wherein the second spacer is connected to the adjacent third spacer to form a T-shaped structure. 11. The liquid crystal display device as claimed in claim 2, wherein the insulating material is polyimide (PI). 12. The liquid crystal display device as claimed in claim 2, wherein the bonding means is an anisotropic conductive film (ACF). 13. The liquid crystal display device as claimed in claim 2, wherein the material of the conductive bump comprises any one of gold, copper, nickel, and tin. 14. The liquid crystal display device as claimed in claim 2, wherein the substrate is a glass substrate. 15. The liquid crystal display device as claimed in claim 2, wherein the circuit component is an integrated circuit (Integrated Circuit). 16. The liquid crystal display device as claimed in claim 2, wherein the circuit component is a flexible printed circuit (FPC). 17. A semiconductor device comprising: an electrode (electrode); a conductive bump (conductive bump), the conductive bump is arranged on the electrode; a bonding pad; A connecting device (connecting means) has a plurality of conductive particles for bonding the contact pad and the conductive bump, wherein the conductive particles are used for electrically connecting the contact pad and the conductive bump; and A barrier rib is disposed on the same side as the electrode to separate the conductive particles. 18. The semiconductor device according to claim 17, wherein the spacer is made of insulating material; The contact pad also includes a plurality of first contact pads and a plurality of second contact pads, wherein the first contact pad is an input terminal of the liquid crystal display, and the second contact pad is an output terminal of the liquid crystal display; The spacer also includes a first spacer, wherein the first spacer is parallel to the first direction and used to separate the conductive bumps between the first contact pads; The spacer further includes a second spacer, wherein the second spacer is parallel to the first direction for separating the conductive bump between the second contact pads; and The spacer further includes a third spacer, wherein the third spacer is parallel to the second direction and used to separate the conductive bump between the first contact pad and the second contact pad. 19. The semiconductor device as claimed in claim 18, wherein the first spacer and the second spacer are connected to adjacent third spacers to form an L-shaped structure. 20. The semiconductor device as claimed in claim 18, wherein the first spacer and the second spacer are connected to adjacent third spacers to form a T-shaped structure. 21. The semiconductor device as claimed in claim 18, wherein the insulating material is polyimide (polyimide, PI); the bonding means is anisotropic conductive film (ACF); and The material of the conductive bump includes any one of gold, copper, nickel and tin. 22. A method of manufacturing a semiconductor device, comprising the steps of: providing a circuit assembly, wherein a plurality of electrodes are provided on one side of the circuit assembly; forming a protective layer on the circuit component and exposing a part of the electrode; forming a plurality of conductive bumps corresponding to the electrodes on the protective layer, and electrically connecting the electrodes to the conductive bumps; and A plurality of spacers are formed, wherein the spacers are formed on the same side of the conductive bumps and interposed between the conductive bumps.

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