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CN1359042A - Computer system and its anti-electromagnetic wave interference structure - Google Patents

Computer system and its anti-electromagnetic wave interference structure Download PDF

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Publication number
CN1359042A
CN1359042A CN00135999A CN00135999A CN1359042A CN 1359042 A CN1359042 A CN 1359042A CN 00135999 A CN00135999 A CN 00135999A CN 00135999 A CN00135999 A CN 00135999A CN 1359042 A CN1359042 A CN 1359042A
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motherboard
computer system
metal sheet
electromagnetic wave
metal
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CN1176412C (en
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张木财
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Acer Computer Co Ltd
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Acer Computer Co Ltd
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Abstract

A computer system and an anti-electromagnetic interference structure thereof comprise a metal shell, a mainboard and a plurality of shielding metal sheets. Wherein, two sides of the inner side of the metal shell at least comprise a pair of guide grooves which are approximately parallel and used for accommodating the mainboard. The shielding metal sheet can be clamped on the grounding layer, and its side surface is formed with several spring sheets and elastic fastening latches, and the elastic fastening latches are fastened on the through holes, and when the main board is slided into the guide groove, the spring sheets can be tightly contacted with the guide groove.

Description

电脑系统及其防电磁波干扰结构Computer system and its anti-electromagnetic wave interference structure

本发明涉及一种电脑系统及其防电磁波干扰结构,特别是涉及一种利用多个屏蔽金属片卡合在电脑系统主机板的侧边,并通过金属外壳内导槽的设计及主机板平行两侧边镀接地层来达成防止电磁波干扰的结构。The present invention relates to a computer system and its anti-electromagnetic wave interference structure, in particular to a system that utilizes a plurality of shielding metal sheets to be engaged on the side of the main board of the computer system, and through the design of the inner guide groove of the metal shell and the parallel two sides of the main board. The side is plated with a ground layer to achieve a structure that prevents electromagnetic wave interference.

市面上许多电子产品,例如:个人电脑或上网机等信息产品,通常以一个金属外壳包覆电脑系统主机板,其用意除保护内部的电子元件外,也用以降低电子元件所产生的电磁波。现已证实,电子产品产生过强的电磁波对人体会产生重大的伤害,尤其对于高工作频率的电子元件来说,电磁波的情况更是严重。因此,现行许多国家对于各项电子产品都需通过一定的安全标准测试通过,才能使用。Many electronic products on the market, such as information products such as personal computers or Internet access computers, usually use a metal casing to cover the computer system motherboard. The purpose is not only to protect the internal electronic components, but also to reduce the electromagnetic waves generated by the electronic components. It has been proven that excessive electromagnetic waves generated by electronic products will cause significant damage to the human body, especially for electronic components with high operating frequency, the situation of electromagnetic waves is even more serious. Therefore, in many countries, various electronic products must pass certain safety standard tests before they can be used.

在现有的技术中,金属外壳内主机板大都通过螺丝锁固在金属机壳内侧上,由此以降低主机板接地电位与金属外壳电位的电位差,从而降低因主机板接地电位与金属外壳电位的电位差过大所释放出的电磁波,此外,并通过主机板与金属外壳的接触,扩大电磁波传导面积,用以衰减电磁波所集中的能量。In the prior art, the motherboard in the metal casing is mostly locked on the inner side of the metal casing by screws, thereby reducing the potential difference between the ground potential of the motherboard and the potential of the metal casing, thereby reducing the potential difference between the ground potential of the motherboard and the metal casing. The electromagnetic wave released by the excessive potential difference of the potential, in addition, through the contact between the main board and the metal shell, the electromagnetic wave conduction area is enlarged to attenuate the energy concentrated by the electromagnetic wave.

图1显示现有技术中电脑系统主机,其为清楚表现主机板与金属外壳的关系,故将金属外壳的上盖移去。电脑系统主机10有一主机板11及包覆主机板11的金属外壳13。主机板11上形成的多个贯孔15,使螺丝12可将主机板11锁固于金属壳13的一面上。螺丝12下焊有一层锡并与形成在主机板11上的接地层14电接触,因此,通过降低主机板接地电位与金属外壳电位的电位差,而降低因主机板接地电位与金属外壳电位的电位差过大所释放出的电磁波,并通过主机板与金属外壳的接触,扩大电磁波传导面积,用以衰减电磁波所集中的能量。FIG. 1 shows a computer system mainframe in the prior art. In order to clearly show the relationship between the motherboard and the metal casing, the upper cover of the metal casing is removed. The computer system host 10 has a main board 11 and a metal shell 13 covering the main board 11 . A plurality of through holes 15 formed on the main board 11 enable the screws 12 to lock the main board 11 to one side of the metal shell 13 . A layer of tin is soldered under the screw 12 and is in electrical contact with the ground layer 14 formed on the motherboard 11. Therefore, by reducing the potential difference between the motherboard ground potential and the metal casing potential, the difference between the motherboard ground potential and the metal casing potential is reduced. The electromagnetic wave released by the excessive potential difference expands the electromagnetic wave transmission area through the contact between the main board and the metal shell to attenuate the concentrated energy of the electromagnetic wave.

本案针对上述现有技术中,该主机板需采用多个螺丝来锁固,且螺丝必须将主机板与金属外壳紧密接合,造成其组装相当麻烦的问题。此外,由于主机板仅由多个螺丝来锁固而造成主机板与金属外壳空隙增加,使电磁波更容易穿透因而造成电磁波外泄的情况更加严重。This case is aimed at the above-mentioned prior art, the main board needs to be locked by multiple screws, and the screws must tightly connect the main board and the metal casing, which makes its assembly very troublesome. In addition, since the main board is only locked by a plurality of screws, the gap between the main board and the metal casing increases, making it easier for electromagnetic waves to penetrate, thus causing more serious leakage of electromagnetic waves.

本发明的目的在于提供一种电脑系统及其防电磁波干扰结构,以解决上述问题。The object of the present invention is to provide a computer system and its anti-electromagnetic wave interference structure to solve the above problems.

本发明的目的是这样实现的,即提供一种电脑系统及其防电磁波干扰结构,包括:一金属外壳,用以包覆该电脑系统且其至少一内侧具有一导槽;一主机板,该主机板周缘形成一接地层且该主机板的厚度约与前述导槽的间隔相当,由此将该主机板固定在前述导槽内;及一屏蔽金属片,该屏蔽金属片至少包括由一对略呈平行的金属平板及金属侧板连接形成一具有开口的长方体,该屏蔽金属片可夹持在该主机板的接地层上,其中在该金属平板或金属侧板之一上,朝该导槽方向突设至少一弹片。The purpose of the present invention is achieved by providing a computer system and its anti-electromagnetic wave interference structure, including: a metal shell for covering the computer system and at least one inner side thereof has a guide groove; a main board, the A grounding layer is formed on the periphery of the motherboard, and the thickness of the motherboard is approximately equal to the distance between the aforementioned guide grooves, thereby fixing the motherboard in the aforementioned guide grooves; and a shielding metal sheet, the shielding metal sheet includes at least a pair of The slightly parallel metal plate and the metal side plate are connected to form a cuboid with an opening, and the shielding metal plate can be clamped on the ground layer of the main board, wherein on one of the metal plate or the metal side plate, a At least one shrapnel protrudes from the direction of the groove.

本发明还提供一种屏蔽金属片,嵌设于一主机板上用于防止一电子装置的电磁波干扰,至少包括:一对略呈平行的金属平板及金属侧板连接形成一具有开口的长方体,其中在该金属平板或金属侧板之一上朝该开口向外突设至少一弹片且朝该开口向内形成一弹性扣闩。The present invention also provides a shielding metal sheet embedded on a main board to prevent electromagnetic wave interference of an electronic device, at least comprising: a pair of slightly parallel metal flat plates and metal side plates connected to form a cuboid with an opening, Wherein, at least one elastic piece protrudes outward toward the opening on one of the metal flat plate or the metal side plate and forms an elastic buckle inward toward the opening.

更进一步说,本发明的电脑系统包括:一金属外壳、一主机板以及多个屏蔽金属片。该金属外壳,两相对内侧至少包括一对略呈平行的导槽用以收容该主机板,由此该主机板得以直接嵌入该导槽中而简化主机板与金属外壳的组装结合。此外,为降低主机板接地电位与金属外壳电位的电位差,可降低因主机板接地电位与金属外壳电位的电位差过大所释放出的电磁波,该主机板平行两侧边都镀有一接地层,并通过夹于该接地层上的屏蔽金属片上的弹片,使其主机板与金属外壳通过屏蔽金属片紧密接触,从而降低主机板接地电位与金属外壳电位的电位差,即降低因电位差过大所释放出的电磁波。Furthermore, the computer system of the present invention includes: a metal casing, a motherboard and a plurality of shielding metal sheets. The two opposite insides of the metal case include at least a pair of slightly parallel guide grooves for accommodating the main board, so that the main board can be directly inserted into the guide grooves to simplify the assembly and combination of the main board and the metal case. In addition, in order to reduce the potential difference between the ground potential of the motherboard and the metal casing, and reduce the electromagnetic waves released due to the excessive potential difference between the ground potential of the motherboard and the metal casing, the parallel sides of the motherboard are plated with a ground layer , and through the shrapnel on the shielding metal sheet sandwiched on the grounding layer, the motherboard and the metal casing are in close contact through the shielding metal sheet, thereby reducing the potential difference between the motherboard grounding potential and the metal casing potential, that is, reducing the potential difference caused by the potential difference. Electromagnetic waves released by the large.

下面结合附图,详细说明本发明的实施例,其中:Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:

图1为现有技术中电脑系统的主机板与金属外壳接合立体图,其中移去金属外壳的上盖以显示内部结构;FIG. 1 is a perspective view of the connection between the motherboard and the metal casing of the computer system in the prior art, wherein the upper cover of the metal casing is removed to show the internal structure;

图2为本发明中电脑系统的主机板、屏蔽金属片与金属外壳分解立体图,其中移去部分金属外壳以显示内部的结构;2 is an exploded perspective view of the motherboard, shielding metal sheet and metal casing of the computer system of the present invention, wherein part of the metal casing is removed to show the internal structure;

图3a-图3c为图2中屏蔽金属片的详细图,其中,图3a为正视立体图、图3b为后视立体图及图3c为侧视剖视图。3a-3c are detailed views of the shielding metal sheet in FIG. 2, wherein FIG. 3a is a front perspective view, FIG. 3b is a rear perspective view, and FIG. 3c is a side sectional view.

图2为本发明电脑系统的电脑系统的主机板、屏蔽金属片与金属外壳分解立体图。本发明的电脑系统可以是一种个人电脑或上网机等信息产品。如图2所示,电脑系统至少包括:一主机板22、多个嵌入主机板22周缘的屏蔽金属片23及用以包覆主机板22的金属外壳20。金属外壳20是由金属平板冲压形成略呈长方体且在两相对金属平板内侧各形成一导槽21。导槽21为一对平行的凸肋211且其间隔与主机板22的厚度相当,用以提供主机板22嵌入固定由此简化组装方式。且为强化主机板22与导槽21间的紧密接合。在主机板22插入导槽21前,本发明在主机板22两侧缘先安装多个具有弹性的屏蔽金属片23。由于屏蔽金属片23的厚度略大于凸肋211的间隔,所以当主机板22连同屏蔽金属片23插入导槽21时,屏蔽金属片23与凸肋211产生干涉配合而使主机板22稳固地装设在金属外壳20内。FIG. 2 is an exploded perspective view of the motherboard, the shielding metal sheet and the metal casing of the computer system of the present invention. The computer system of the present invention can be an information product such as a personal computer or an Internet machine. As shown in FIG. 2 , the computer system at least includes: a motherboard 22 , a plurality of shielding metal sheets 23 embedded in the periphery of the motherboard 22 , and a metal shell 20 for covering the motherboard 22 . The metal shell 20 is stamped from a metal plate to form a roughly rectangular parallelepiped, and a guide groove 21 is formed on the inside of two opposite metal plates. The guide groove 21 is a pair of parallel ribs 211 with a distance equal to the thickness of the main board 22 , which is used to provide the main board 22 to be embedded and fixed so as to simplify the assembly method. And to strengthen the tight connection between the motherboard 22 and the guide groove 21 . Before the main board 22 is inserted into the guide groove 21 , a plurality of elastic shielding metal sheets 23 are installed on the two side edges of the main board 22 in the present invention. Since the thickness of the shielding metal sheet 23 is slightly greater than the interval of the convex ribs 211, when the motherboard 22 and the shielding metal sheet 23 are inserted into the guide groove 21, the shielding metal sheet 23 and the convex rib 211 produce an interference fit so that the motherboard 22 is firmly installed. Set in the metal casing 20.

再参考图2,进一步说明主机板22的结构,主机板22通过具有多个电子元件及连接器形成在其上的一印刷电路板,以达成特定的功能,此部分为现有技术,故在本文中不再详述。值得注意的是,主机板22两侧周缘形成镀锡层,以作为接地层221。接地层221可与屏蔽金属片23电接触以使主机板22的接地电位与金属外壳20的电位相等。同时,在接地层221位置上还形成多个贯穿孔222用以固定屏蔽金属片23。With reference to Fig. 2 again, the structure of main board 22 is further described, main board 22 is formed on a printed circuit board with a plurality of electronic components and connectors, to achieve specific functions, this part is prior art, so in It will not be described in detail in this article. It is worth noting that tin plating layers are formed on both sides of the motherboard 22 as the grounding layer 221 . The ground layer 221 can be in electrical contact with the shielding metal sheet 23 so that the ground potential of the motherboard 22 is equal to the potential of the metal casing 20 . At the same time, a plurality of through holes 222 are formed at the position of the ground layer 221 for fixing the shielding metal sheet 23 .

参见图3a-图3c,其说明屏蔽金属片23的详细结构,其中图3a为正视立体图、图3b为后视立体图及图3c为侧视剖视图。屏蔽金属片23是由一对略呈平行的金属平板230及金属侧板231连接形成一具有开口的长方体,且可以是铜或铝等导电性较佳的材料,其经过冲压制造而一体成型。每一金属平板230或金属侧板231都可包括多个弹片232,而在本实施例中,弹性扣闩233则仅形成在之一的金属平板230上。弹片232及弹性扣闩233是直接在屏蔽金属片23上冲压而成的。如图所示,弹片232及弹性扣闩233在制造中,可通过模具的本身形状冲挤出来,因此无须经过二次加工,所以可减少制造成本。进一步参考图3c,弹片232是朝向金属平板230或金属侧板231的外侧突出,而使屏蔽金属片23的宽度略大于导槽21的间隔距离。相反地,弹性扣闩233则朝向金属平板230的内侧凹入,以此使屏蔽金属片23的弹性扣闩233可嵌入主机板22的贯穿孔222内。3a-3c, which illustrate the detailed structure of the shielding metal sheet 23, wherein FIG. 3a is a front perspective view, FIG. 3b is a rear perspective view and FIG. 3c is a side sectional view. The shielding metal sheet 23 is formed by connecting a pair of slightly parallel metal flat plates 230 and metal side plates 231 to form a cuboid with an opening, and can be made of copper or aluminum with better conductivity, which is integrally formed by stamping. Each metal plate 230 or metal side plate 231 may include a plurality of elastic pieces 232 , and in this embodiment, the elastic latch 233 is only formed on one of the metal plates 230 . The elastic piece 232 and the elastic latch 233 are directly stamped on the shielding metal piece 23 . As shown in the figure, the elastic piece 232 and the elastic latch 233 can be punched out through the shape of the mold itself during manufacture, so there is no need for secondary processing, so the manufacturing cost can be reduced. Further referring to FIG. 3 c , the elastic piece 232 protrudes toward the outside of the metal plate 230 or the metal side plate 231 , so that the width of the shielding metal piece 23 is slightly larger than the distance between the guide grooves 21 . On the contrary, the elastic latch 233 is recessed toward the inner side of the metal plate 230 , so that the elastic latch 233 of the shielding metal sheet 23 can be inserted into the through hole 222 of the motherboard 22 .

在安装主机板22时,首先将屏蔽金属片23开口对准主机板22边缘的接地层221推入。如图3c所示,因为弹性扣闩233朝向金属平板230的内侧凹入而形成倒钩,所以弹性扣闩233将可嵌入主机板22的贯穿孔222内,以此将屏蔽金属片23固定在主机板22上。当屏蔽金属片23装设在主机板22边缘且插入导槽21时,屏蔽金属片23的弹性扣闩233嵌入贯穿孔222内而固定在主机板22上,且屏蔽金属片23的弹片232受导槽21压缩形变而使主机板22保持在导槽21内。所以本发明可确保屏蔽金属片23不会因主机板22的晃动漏失与导槽21的接触,从而完成固定主机板22的目的,同时有效达到主机板22与金属外壳20的紧密结合。此外,根据上述发明,其可直接将屏蔽金属片23直接扣锁在主机板22两侧上,之后,再将主机板22直接滑入金属外壳20的导槽21内,即完成主机板与金属外壳的组装并符合防电磁波的干扰,有效简化现有技术的主机板与金属外壳的组装。When installing the main board 22 , first align the opening of the shielding metal sheet 23 with the ground layer 221 on the edge of the main board 22 and push it in. As shown in FIG. 3c, since the elastic latch 233 is recessed toward the inner side of the metal plate 230 to form a barb, the elastic latch 233 can be embedded in the through hole 222 of the motherboard 22, thereby fixing the shielding metal sheet 23 on On the motherboard 22. When the shielding metal sheet 23 is installed on the edge of the motherboard 22 and inserted into the guide groove 21, the elastic buckle 233 of the shielding metal sheet 23 is embedded in the through hole 222 and fixed on the motherboard 22, and the elastic piece 232 of the shielding metal sheet 23 is The guide groove 21 is compressed and deformed so that the motherboard 22 is held in the guide groove 21 . Therefore, the present invention can ensure that the shielding metal sheet 23 does not lose contact with the guide groove 21 due to the shaking of the main board 22 , thereby accomplishing the purpose of fixing the main board 22 and effectively achieving a tight connection between the main board 22 and the metal casing 20 . In addition, according to the above-mentioned invention, it can directly buckle and lock the shielding metal sheet 23 on both sides of the main board 22, and then slide the main board 22 directly into the guide groove 21 of the metal shell 20, that is, complete the connection between the main board and the metal shell. The assembly of the shell meets the requirement of anti-electromagnetic wave interference, which effectively simplifies the assembly of the main board and the metal shell in the prior art.

综上所述,虽然结合以上一较佳实施例揭露了本发明,然而其并非用以限定本发明,本领域技术人员在不脱离本发明的精神和范围内,可作各种的更动与润饰,例如:弹性扣闩233也可形成在底侧的金属平板230或导槽可形成在相邻的金属外壳内侧。因此本发明的保护范围应以权利要求所界定的为准。In summary, although the present invention has been disclosed in combination with the above preferred embodiment, it is not intended to limit the present invention. Those skilled in the art can make various modifications and changes without departing from the spirit and scope of the present invention. Modifications, such as elastic latches 233 can also be formed on the bottom side of the metal plate 230 or guide grooves can be formed on the inner side of the adjacent metal shell. Therefore, the protection scope of the present invention should be defined by the claims.

Claims (10)

1. computer system and structure for preventing electromagnetic wave interference thereof comprise:
One metal shell is in order to coat this computer system and its at least one inboard has a guide groove;
The thickness that one motherboard, this motherboard periphery form a ground plane and this motherboard is suitable with the interval of aforementioned guide groove approximately, thus this motherboard is fixed in the aforementioned guide groove; And
One shielded metal sheet, this shielded metal sheet comprises at least by a pair of parallel metal plate and the metal side plate of slightly being and is connected to form a rectangular parallelepiped with opening, this shielded metal sheet can be clamped on the ground plane of this motherboard, wherein on one of this metal plate or metal side plate, establish at least one shell fragment towards this guide groove direction is prominent.
2. a kind of computer system as claimed in claim 1 and structure for preventing electromagnetic wave interference thereof, wherein this shielded metal sheet can be a copper sheet and forms through stamped.
3. a kind of computer system as claimed in claim 1 and structure for preventing electromagnetic wave interference thereof, wherein this ground plane is made by directly plating one deck tin on this motherboard.
4. a kind of computer system as claimed in claim 1 and structure for preventing electromagnetic wave interference thereof, wherein this shell fragment is through stamped and integrally formed with this shielded metal sheet.
5. a kind of computer system as claimed in claim 1 and structure for preventing electromagnetic wave interference thereof, wherein the ground plane at this motherboard also forms a plurality of through holes.
6. a kind of computer system as claimed in claim 5 and structure for preventing electromagnetic wave interference thereof, wherein this shielded metal sheet also forms a plurality of elasticity snaps on the plane with respect to the through hole of this motherboard, and its direction is towards this through hole.
7. a kind of computer system as claimed in claim 1 and structure for preventing electromagnetic wave interference thereof, wherein this elasticity snap is through stamped and integrally formed with this shielded metal sheet.
8. shielded metal sheet, be embedded at the Electromagnetic Interference that is used to prevent an electronic installation on the motherboard, at least comprise: a pair of parallel metal plate and the metal side plate of slightly being is connected to form a rectangular parallelepiped with opening, wherein establishes at least one shell fragment and inwardly forms an elasticity snap towards this opening to evagination towards this opening on one of this metal plate or metal side plate.
9. a kind of shielded metal sheet as claimed in claim 8, wherein this shell fragment and this elasticity snap are through stamped and integrally formed with this shielded metal sheet.
10. a kind of shielded metal sheet as claimed in claim 8, wherein this motherboard periphery forms a ground plane, and has a plurality of through holes, and it is in order to be electrically connected with aforementioned elasticity snap.
CNB001359991A 2000-12-20 2000-12-20 Computer system and anti-electromagnetic wave interference structure thereof Expired - Fee Related CN1176412C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB001359991A CN1176412C (en) 2000-12-20 2000-12-20 Computer system and anti-electromagnetic wave interference structure thereof

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Application Number Priority Date Filing Date Title
CNB001359991A CN1176412C (en) 2000-12-20 2000-12-20 Computer system and anti-electromagnetic wave interference structure thereof

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CN1359042A true CN1359042A (en) 2002-07-17
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003100587A1 (en) * 2002-05-27 2003-12-04 Song Wang Thickened shell of heat source
CN102458067A (en) * 2010-10-29 2012-05-16 宏达国际电子股份有限公司 Hand-held electronic device
TWI581693B (en) * 2010-07-29 2017-05-01 富智康(香港)有限公司 Slide mechanism and slide type electronic device using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003100587A1 (en) * 2002-05-27 2003-12-04 Song Wang Thickened shell of heat source
TWI581693B (en) * 2010-07-29 2017-05-01 富智康(香港)有限公司 Slide mechanism and slide type electronic device using the same
CN102458067A (en) * 2010-10-29 2012-05-16 宏达国际电子股份有限公司 Hand-held electronic device
CN102458067B (en) * 2010-10-29 2015-09-09 宏达国际电子股份有限公司 handheld electronic device

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