CN1346164A - Integrated circuit socket with contact pad - Google Patents
Integrated circuit socket with contact pad Download PDFInfo
- Publication number
- CN1346164A CN1346164A CN 00124625 CN00124625A CN1346164A CN 1346164 A CN1346164 A CN 1346164A CN 00124625 CN00124625 CN 00124625 CN 00124625 A CN00124625 A CN 00124625A CN 1346164 A CN1346164 A CN 1346164A
- Authority
- CN
- China
- Prior art keywords
- contact
- contact mat
- integrated circuit
- mat
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 47
- 238000003780 insertion Methods 0.000 claims description 17
- 230000037431 insertion Effects 0.000 claims description 17
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 229920001971 elastomer Polymers 0.000 claims description 11
- 239000000806 elastomer Substances 0.000 claims description 11
- 238000009826 distribution Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000008676 import Effects 0.000 claims description 4
- 238000010301 surface-oxidation reaction Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 11
- 230000006870 function Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012956 testing procedure Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Abstract
An IC socket with contact pads is composed of base unit with base, contact terminals and elastic body for providing electric connection with said contact terminals and ensuring the compactness of assembly, inserting plate with soft plate, hard plate and buffer layer, adapter unit with pressing mechanism for fixing or releasing IC, and top cover unit with spring and mechanism coupled to the pressing mechanism of adapter unit.
Description
The socket of the relevant a kind of integrated circuit (IC) of the present invention, particularly relevant a kind of integrated circuit socket with contact mat.
The development of semi-conductor industry in recent years is quite quick, when live width from the progress of micron μ m grade to inferior micron, even during to deep-sub-micrometer, (Integrated Circuit, integrated level IC) is more and more big, and its life cycle is more and more short for integrated circuit.Add the diversity of product demand, the IC of various different application functions, size and pin Pin Assignment constantly occurs especially.In semiconductor fabrication, after IC completed, the many testing procedures of the experience of still needing can guarantee its function and quality.For example in aging (Burn in) test, may just comprise whether test I C external pins is intact, whether all pin inputs all are the testing procedure of high impedance, IC energy consumption situation and aspects such as basic logic and voltage level.In addition, when carrying out this class testing, its most basic hardware configuration is socket Socket or the connector Connector that puts the IC element.
The connector of IC element all is the socket of specific pin and purposes traditionally, for example socket of central processor CPU, memory Memory or the like.For above-mentioned test of wearing out for IC, the mode that socket traditionally can only be designed to fix, and the IC product that aims at difference in functionality designs, and utilizes fixed clamp structure above the socket then, as fixing IC and have the function of conducting circuit concurrently.But traditional clamp structure is the mode of needle-like contact, and is therefore bigger to the injury of tin ball, for example wears out the tin ball bonding and connects the surface, cause the cataclysm of tin geometry of sphere shape, measuring current resistance by the interface when making test I C strengthens, and also is that contact impedance is too high, causes the electrical property variation of IC integral body.
Therefore, for the contact area of guaranteeing tin ball and contact mat has the excellent contact interface, be beneficial to by measuring current, contact interface must keep excellent electric characteristics, also promptly must suitably locate the IC element to contact mat.Yet traditional needle-like way of contact is unfavorable for that obviously measuring current passes through, because contact area is too little.In addition, about non-destroyed area (None Damage Zone; NDZ) infringement problem, NDZ is the important area that IC is soldered to circuit board, therefore when the IC element test, must keep good NDZ characteristic all the time, for example complete geometry external form and good electrical properties, make that the IC element test finishes after, can NDZ be welded on the circuit board.And, because the needle-like contact is for directly forcing in the IC element, making contact mat directly locate fast with the IC element contacts, be easy to generate the uneven phenomenon of the application of force, and between a plurality of tin balls with the contact mat otherness of relative position up and down, also be not to be to have consistent characteristic with the spacing of contact mat between a plurality of tin balls at All Ranges.Therefore, had and too late stress produces, and caused tin ball and contact mat to be pasted together, and caused the IC element to block on pedestal, generation and the puzzlement that is difficult for taking off the IC element at same contact interface.
Therefore, the main purpose of the present invention provides the integrated circuit socket that a kind of defective that can overcome the insertion plate existence of traditional circuit socket has the insertion plate of contact mat.
The object of the present invention is achieved like this: a kind of integrated circuit socket Socket with contact mat Pad, it is characterized in that: this socket includes at least: a base unit, wherein include pedestal, contact terminal and elastomer, this elastomer is positioned at the first half of this pedestal, and this contact terminal is fixed in the bearing groove of this pedestal; One inserts plate, be positioned at this base unit top, have a soft board, its top has a plurality of contact mats, with so that the pin of integrated circuit component contacts conducting with these contact mats, one resilient coating Stop Layer is positioned on this soft board, is used to cushion the pressure that this integrated circuit component moves down, and produce contact interface closely, and a hardboard, be positioned at this resilient coating top, in order to this soft board of fixed support and this resilient coating; One adapter device is positioned at the top of this base unit and this insertions plate, wherein includes adapter seat and pressure member, and this adapter seat can provide the location correcting function of this integrated circuit component, and this pressure member then can compress or discharge this integrated circuit component; And a capping device, being positioned at the top of this base unit, this insertion plate and this adapter device, it has loam cake and spring, and wherein this loam cake can vertical upper and lower motion, and presses member coupling with this of this adapter device.
This soft board has flexible Compliance, can make when this integrated circuit component is positioned to this soft board, has the function of automatic adjustment Auto-guide, among correct importing tin ball.
This resilient coating is selected from one of large area distribution, small area distribution and a strip region distribution group pattern.This large area distributes to comprise and exposes a contact area.This small area distributes to comprise and exposes a contact mat zone.This strip region distributes to comprise and exposes a contact mat strip region.
Each pattern of these contact mats is to be selected from one of a ring-like contact mat, a convex contact mat or a bulge loop type contact mat group mould assembly formula.
This ring-like contact mat has a contact circular arc, in order to produce the contact of line style circular arc.
This convex contact mat has one or several cusps, in order to puncture tin ball surface oxidation layer electric current is passed through smoothly.
This bulge loop type contact mat has a contact circular arc.
This bulge loop type contact mat more comprises one or several cusps, with this pin surface oxide layer that punctures, makes measuring current pass through easily.
These contact mat patterns comprise a central perforation or a plurality of cusp, have the structure of the function of automatic importing Auto-guide in order to formation.
This contact mat pattern more comprises this central authorities' perforation and both combinations of these cusps, has the structure of automatic import feature in order to formation.
The contact mat that this first contact mat of this insertion plate is a concave shape, and the pin that can guide this integrated circuit component enters.
This inserts this first contact mat of plate, can be directly and the pin of this integrated circuit component contact with each other conducting.
The invention provides a kind of integrated circuit socket with contact mat pad, this socket mainly comprises: (1) base unit, wherein include pedestal, contact terminal and elastomer, elastomer is positioned at the first half of pedestal, and contact terminal is to be fixed in the bearing groove of pedestal; (2) insert plate, be positioned at the base unit top, have first contact mat, second contact mat and lead above, first contact mat is via the lead and the second contact mat electrical property conducting, and the mutual conducting of the pin of first contact mat and integrated circuit component, second contact mat then contacts conducting with the contact terminal of base unit, has location hole simultaneously on the insertion plate so that aim at the base unit of bottom; (3) adapter device, the top that is positioned at base unit and inserts plate wherein includes the adapter seat and presses member, and the adapter seat can provide the location correcting function of integrated circuit component, presses member then can compress or discharge integrated circuit component; And (4) capping device, be positioned at base unit, insert plate, the top of adapter device, wherein include loam cake and spring, loam cake can vertical upper and lower motion, and and the pressure member coupling of adapter device.
The contacting pattern of tin ball of the present invention and contact mat has preferable protection effect to the tin ball, also is difficult for making the tin ball to produce distortion and influences electrical property contacting.In addition, because the tin ball is that line contacts or the partial face contact with the contacting pattern of contact mat, so the contact electrical property is preferable.And non-destroyed area NDZ can easily keep, and forms preferable contact interface.Wherein, the deflection of tin ball is littler with respect to the some contact of traditional needle-like, and the bonding problem that causes blocking the IC circuit element of tin ball and contact mat that therefore do not have produces.
Describe the present invention in detail below in conjunction with accompanying drawing and have structure, feature and the effect of the integrated circuit socket of contact mat.
Fig. 1 is the decomposition diagram according to integrated circuit socket of the present invention;
Fig. 2-Fig. 5 is according to three views after the integrated circuit socket module combination of the present invention;
Fig. 6 is according to insertion plate front view of the present invention;
Fig. 7 is the schematic diagram that contacts with the IC element according to insertion plate of the present invention;
Fig. 8-Figure 10 is three schematic diagrames according to preferable resilient coating pattern of the present invention; And
Figure 11-Figure 13 is three preferable contacting pattern schematic diagrames according to tin ball of the present invention and contact mat.
Consult the decomposition diagram of the integrated circuit socket of Fig. 1.IC socket module among the figure is respectively the base unit (Base Unit) 100 that is positioned at the bottom, and this base unit 100 has terminal and can be connected on the printed circuit board (PCB) large assemblies such as (not shown); Insert plate Interposer200, have contact mat Pad and lead, as the usefulness of electrical property connection; Adapter device Adapter Unit300 has Ka Feng, closely to fasten entire I C socket module; Capping device Cover Unit400, the device that picks and places as IC.
Consult three views after the integrated circuit socket module combination of Fig. 2-Fig. 5.The section AA of Fig. 2 is shown among Fig. 5, and cross section BB then is shown among Fig. 3, Fig. 4.For the purpose of understanding easily, be illustrated with four main devices, wherein insert plate 200 and be key character of the present invention: (1) base unit 100.Consult Fig. 5, base unit 100 by pedestal Base110, contact terminal ContactPin150,160 and elastomer Elastomer190 form.Has bearing groove in the pedestal 110, in order to place contact terminal 150,160 and elastomer 190.Wherein, elastomer 190 is installed on the first half of pedestal 110, and has compressibility or the property upheld.When the assembling of entire module socket is finished,, the IC element in the test can closely be engaged, with inserting plate 200 and base unit 100 so that the good electrical properties contact to be provided by the elastic reaction of elastomer 190.
Still see also Fig. 5, insert plate 200 and be close to pedestal 110, wherein between insertion plate and pedestal, elastomer 190 is installed.Employed fixedly contact terminal 150 in the pedestal 110, its effect are to make the insertion plate 200 on upper strata carry out electrical property with the printed circuit board (PCB) (not shown) of bottom to be connected.The standing part 154 of contact terminal 150 is to be installed on the groove seat of pedestal 110, and mid portion has more the cantilever beam Cantilever156 and the contact portion 158 of U type, because the special tectonic of this cantilever beam 156 makes terminal have flexibility.When the insertion plate 200 on upper strata and base unit 100 fit together, contact portion 158 will with insert plate 200 and contact with each other, and, keep good electrical properties to connect between the plate 200 and make contact portion 158 and insert by the elasticity of U type cantilever beam 156.
(2) insert plate 200.See also the front view of the insertion plate 200 of Fig. 6.Inserting plate 200 is made up of contact mat 210, lead 220, pad 230, soft board 260, hardboard 250 and resilient coating StopLayer270, and at the two ends of inserting plate 200, utilization is processed to form location hole 240, makes that inserting plate 200 can cooperate with the location pin do assembling on the base unit 100.During actual executable operations, the contact mat 210 that is positioned at mid portion can contact with the tin ball on the IC element pin, makes signal transfer to pad 230 by lead 220 then, is passed on the circuit of printed circuit board (PCB) via contact terminal more at last.
Consult the schematic diagram that the insertion plate of Fig. 7 contacts with the IC element.Wherein soft board 260 has advantages such as lower dielectric constant, high glass transition temperature Tg and favorable mechanical character, extremely is fit to be applied to the test of aspects such as high temperature and high frequency.Hardboard 250 is that exotic material is made, because soft board 260 is a soft thin plate, so need are with hardboard 250 fixed support in addition.Contact mat 210 in the soft board 260 is the tin balls 510 that are used to place IC element 500, and is first through coarse localization when putting IC element 500, and then guided by the contact mat 210 of fixed swage height, so that tin ball 510 is imported in the contact mat 210 exactly.And, be arranged in the contact mat 210 of soft board 260, be connected to pad 230 via lead 220, and this pad 230 promptly and the contact portion 158 of the contact terminal 150 of Fig. 6 contact with each other and produce conducting state.Pad 230 is that copper material is made, produce oxidation when avoiding actual test, and the contact portion that it can be exposed is draped over one's shoulders the anti-oxidation conductive layer of multiple one deck.Flexible Compliance is another advantage of soft board, and when being defined as the IC element and being positioned to contact mat on the soft board, soft board is adjusted the characteristic of Auto-guide automatically.Because the contact area of forming with a plurality of contact interfaces can cause contact area to produce bending phenomenon because the size of tin ball is inhomogeneous, this moment, the contact pressure of each tin ball was inconsistent, can form different electrical characteristics.Therefore, the flexible advantage of soft board can be appropriate cooperate with cutting and in compliance with the appearance characteristics of IC circuit board, produces self-adjusting effect, makes the contact pressure of all tin balls reach unanimity.
Consult Fig. 8-Figure 10, in the preferred embodiment of the present invention, resilient coating 270 patterns are according to the area size that exposes, include three kinds of patterns: (1) large area distributes, and as shown in Figure 8, exposes contact area 520, has preferable flexibility, because contact area has soft board; (2) small area distributes, and as shown in Figure 9, only exposes contact mat zone 530, has the equally distributed contact interface of preferable pressure; (3) strip region distributes, and as shown in figure 10, exposes contact mat strip region 540, and resilient coating 270 is topped on soft board, but only exposes contact mat strip region 540.
Consult Figure 11-Figure 13, in the preferred embodiment of the present invention, contact mat 210 comprises three kinds of patterns: (1) ring-like contact mat 620, as shown in figure 11, have a contact circular arc 622, and be compared to the needle-like contact, the contact of line style circular arc can produce the contact of better electrical performance.And when IC element 500 contacted with soft board 260, the space that the perforation 624 of ring-like contact mat 620 central authorities is reserved can effectively protect the non-destroyed area NDZ626 of tin ball 510 to avoid suffering damage.(2) the convex contact mat 640, as shown in figure 12, have one or several cusps Tip642, three cusps for example, tin ball 510 surface oxide layers make electric current pass through contact area smoothly and cusp 642 can puncture, in addition, convex contact mat 640 can be poor with the level of contact mat relative position about in the of 640 to tin ball 510, produces good compensating action.(3) bulge loop type contact mat 660, as shown in figure 13, has a contact circular arc 662, similarly, be compared to the needle-like contact, this contacts circular arc 662, and one or several cusps 664, three cusps for example, the oxide layer on the tin ball surface that is used to puncture, the both is enough to improve the differences in height that electrical property effect and balance tin ball 510 sizes produce.And the space that the perforation 666 of bulge loop type contact mat 660 central authorities is reserved can make tin ball 510 not have the problem generation that non-destroyed area 668 is damaged.More than all types of contact mats 210 of the present invention can be positioned on soft board 260 or the film, and have the function of automatic importing, can make easily and apace location of tin ball 510.No matter the geometry appearance of contact mat 210 is central perforation, cusp or both combinations, when the tin ball arrives contact mat 210 because of pressurized, all is enough to produce firm contact effect, and utilizes central perforation edge to import the tin ball of IC element.
(3) adapter device 300.Get back to Fig. 2-Fig. 5, show that in the drawings inserting between plate 200 and the capping device 400 is adapter device 300, comprise adapter seat Adapter Base330 (being shown among Fig. 4) in addition, press member Depressor310, reach axle Shaft320 elements such as (being shown among Fig. 3).Wherein adapter seat 330 is in order to the location correcting function of IC element 500 to be provided, when IC element 500 is placed, it successfully to be dropped in the test section, to be beneficial to insert plate 200 contacts.
(4) capping device 400.Comprise elements such as loam cake and spring, can do simultaneously reciprocating motion vertically, and drive the pressure member 310 of coupling, to press or to discharge IC element 500.Other consults Fig. 4, shown also among the figure that capping device 400 is in two upper and lower different positions, wherein being positioned at the spring 410 of capping device 400, is elastic force required during as the loam cake vertical moving, and can be in four corners of capping device 400 mounting spring 410 simultaneously.
The contacting pattern of tin ball of the present invention and contact mat has preferable protection effect to the tin ball, can prevent that more the tin ball from producing distortion, to produce the good electrical properties contact.In addition, because the tin ball is that line contacts or the partial face contact with the contacting pattern of contact mat, so the contact electrical property is preferable.And non-destroyed area NDZ can be subjected to the complete maintenance of contact mat, and forms preferable contact interface.In addition, the deflection of tin ball is more slight with respect to the some contact of traditional needle-like, and the bonding problem that causes blocking the IC circuit element of tin ball and contact mat that therefore do not have produces.
In sum, in the integrated circuit socket with contact mat of the present invention, the contacting pattern of tin ball and contact mat has preferable protection effect to the tin ball, also is difficult for making the tin ball to produce distortion and influences electrical properties.In addition, the tin ball is that line contacts or the partial face contact with the contacting pattern of contact mat, and it is preferable therefore to contact electrical characteristic.And non-destroyed area NDZ remains complete, and forms preferable contact interface.In addition, the geometry deformation of tin ball is littler with respect to traditional needle-like juxtaposition metamorphose amount, and the bonding problem that causes blocking the IC element of tin ball and contact mat that therefore do not have produces.
Claims (15)
1, a kind of integrated circuit socket with contact mat, it is characterized in that: this socket includes at least: a base unit, wherein include pedestal, contact terminal and elastomer, this elastomer is positioned at the first half of this pedestal, and this contact terminal is fixed in the bearing groove of this pedestal; One inserts plate, be positioned at this base unit top, have a soft board, its top has a plurality of contact mats, with so that the pin of integrated circuit component contacts conducting with these contact mats, one resilient coating is positioned on this soft board, is used to cushion the pressure that this integrated circuit component moves down, and produce contact interface closely, and a hardboard, be positioned at this resilient coating top, in order to this soft board of fixed support and this resilient coating; One adapter device is positioned at the top of this base unit and this insertions plate, wherein includes adapter seat and pressure member, and this adapter seat can provide the location correcting function of this integrated circuit component, and this pressure member then can compress or discharge this integrated circuit component; And a capping device, being positioned at the top of this base unit, this insertion plate and this adapter device, it has loam cake and spring, and wherein this loam cake can vertical upper and lower motion, and presses member coupling with this of this adapter device.
2, the integrated circuit socket with contact mat as claimed in claim 1 is characterized in that: this soft board has flexibility (Compliance), can make when this integrated circuit component is positioned to this soft board, has self-adjusting function, among correct importing tin ball.
3, the integrated circuit socket with contact mat as claimed in claim 1 is characterized in that: this resilient coating is selected from one of large area distribution, small area distribution and a strip region distribution group pattern.
4, the integrated circuit socket with contact mat as claimed in claim 3 is characterized in that: this large area distributes to comprise and exposes a contact area.
5, the integrated circuit socket with contact mat as claimed in claim 3 is characterized in that: this small area distributes to comprise and exposes a contact mat zone.
6, the integrated circuit socket with contact mat as claimed in claim 3 is characterized in that: this strip region distributes to comprise and exposes a contact mat strip region.
7, the integrated circuit socket with contact mat as claimed in claim 1 is characterized in that: these each contact mat patterns are to be selected from one of a ring-like contact mat, a convex contact mat or a bulge loop type contact mat group mould assembly formula.
8, the integrated circuit socket with contact mat as claimed in claim 7 is characterized in that: this ring-like contact mat has a contact circular arc, in order to produce the contact of line style circular arc.
9, the integrated circuit socket with contact mat as claimed in claim 7 is characterized in that: this convex contact mat has one or several cusps, in order to puncture tin ball surface oxidation layer electric current is passed through smoothly.
10, the integrated circuit socket with contact mat as claimed in claim 7 is characterized in that: this bulge loop type contact mat has a contact circular arc.
11, the integrated circuit socket with contact mat as claimed in claim 10 is characterized in that: this bulge loop type contact mat more comprises one or several cusps, with this pin surface oxide layer that punctures, makes measuring current pass through easily.
12, the integrated circuit socket with contact mat as claimed in claim 1 is characterized in that: these contact mat patterns comprise a central perforation or a plurality of cusp, have the structure of automatic import feature in order to formation.
13, the integrated circuit socket with contact mat as claimed in claim 1 is characterized in that: this contact mat pattern more comprises this central authorities' perforation and both combinations of these cusps, has the structure of automatic import feature in order to formation.
14, the integrated circuit socket with contact mat as claimed in claim 1 is characterized in that: the contact mat that this first contact mat of this insertion plate is a concave shape, and the pin that can guide this integrated circuit component enters.
15, the integrated circuit socket with contact mat as claimed in claim 1 is characterized in that: this first contact mat of this insertion plate, can be directly and the pin of this integrated circuit component contact with each other conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00124625 CN1129982C (en) | 2000-09-26 | 2000-09-26 | Integrated circuit socket with contact pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00124625 CN1129982C (en) | 2000-09-26 | 2000-09-26 | Integrated circuit socket with contact pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1346164A true CN1346164A (en) | 2002-04-24 |
| CN1129982C CN1129982C (en) | 2003-12-03 |
Family
ID=4590553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00124625 Expired - Fee Related CN1129982C (en) | 2000-09-26 | 2000-09-26 | Integrated circuit socket with contact pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1129982C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104884964A (en) * | 2012-12-28 | 2015-09-02 | 株式会社Isc | Test socket and socket body |
-
2000
- 2000-09-26 CN CN 00124625 patent/CN1129982C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104884964A (en) * | 2012-12-28 | 2015-09-02 | 株式会社Isc | Test socket and socket body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1129982C (en) | 2003-12-03 |
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