CN1344002A

CN1344002A - plasma display

Info

Publication number: CN1344002A
Application number: CN00128643A
Authority: CN
Inventors: 吴俊翰; 陈柏丞; 李建兴
Original assignee: Acer Display Technology Inc
Current assignee: AUO Corp
Priority date: 2000-09-18
Filing date: 2000-09-18
Publication date: 2002-04-10
Anticipated expiration: 2020-09-18
Also published as: CN1174461C

Abstract

A plasma display comprises a substrate and a circuit board, wherein the substrate is provided with a substrate edge, a plurality of bonding electrodes which are not electrically connected with each other are arranged on the substrate, and each bonding electrode is spaced from the substrate edge by a certain distance. The circuit board electrodes are arranged on the circuit board in a non-electric connection mode, the positions of the circuit board electrodes correspond to the positions of the bonding electrodes, and an auxiliary bonding pad is arranged on the substrate and arranged between the bonding electrodes and the edge of the substrate, so that when the substrate and the circuit board are sealed, the auxiliary bonding pad can reduce the gap between the front end of the bonding electrode on the substrate and the conductive adhesive, prevent air bubbles and tightly fix and seal the substrate and the circuit board.

Description

plasma display

本发明涉及一种等离子体显示器(Plasma Display Panel，PDP)，特别是涉及一种具有辅助接合垫的等离子体显示器。The invention relates to a plasma display (Plasma Display Panel, PDP), in particular to a plasma display with auxiliary bonding pads.

随着电子信息产业的发展，平面显示器(flat panel display，FPD)的应用以及需求不断扩大，等离子体显示器(PDP)是各平面显示器中相当具有发展潜力的一种。一般等离子体显示器是在将前面基板与背面基板封合(sealing)形成封闭的放电单元(discharge cell)后，再将多个电路板连接至前面或背面基板上。由于电路板用来对外形成电连接，因此电路板与各基板接合的强度与可靠度将影响等离子体显示器的品质。With the development of the electronic information industry, the application and demand of flat panel display (FPD) continue to expand, and the plasma display (PDP) is a kind of flat panel display with considerable development potential. In general plasma displays, after the front substrate and the back substrate are sealed to form a closed discharge cell, a plurality of circuit boards are connected to the front or back substrate. Since the circuit board is used to form electrical connections to the outside, the strength and reliability of the connection between the circuit board and the substrates will affect the quality of the plasma display.

请参考图1与图2，图1为现有等离子体显示器10的背面基板12的接合区域16示意图。图2为现有等离子体显示器10的背面基板12与电路板22封合方法的示意图。如图1所示，现有等离子体显示器10包括有一前面基板(未显示)，以及一背面基板12，平行地设于前面基板的下方。背面基板12与前面基板封合的区域外设有一接合区域16，该接合区域用于与一电路板22连接。接合区域16内设有多个接合电极14，用来与电路板22形成电连接。如图2所示，电路板22上设置有多个彼此不相电连接的电路板电极24，且每一个电路板电极24相对应于一个接合电极14而设置。其中，背面基板12与电路板22之间设置一含有导电粒子成分的各向异性的导电胶(Anisotropic Conductive Film，ACF)26加以填充，除了保持背面基板12与电路板22的电连接之外，更用于连接背面基板12与电路板22。Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a schematic diagram of the bonding area 16 of the back substrate 12 of the conventional plasma display 10 . FIG. 2 is a schematic diagram of a sealing method of the back substrate 12 and the circuit board 22 of the conventional plasma display 10 . As shown in FIG. 1 , a conventional plasma display 10 includes a front substrate (not shown) and a back substrate 12 disposed parallelly below the front substrate. A bonding area 16 is provided outside the sealing area of the back substrate 12 and the front substrate, and the bonding area is used for connecting with a circuit board 22 . A plurality of bonding electrodes 14 are disposed in the bonding area 16 for forming an electrical connection with the circuit board 22 . As shown in FIG. 2 , the circuit board 22 is provided with a plurality of circuit board electrodes 24 that are not electrically connected to each other, and each circuit board electrode 24 is disposed corresponding to one bonding electrode 14 . Wherein, an anisotropic conductive glue (Anisotropic Conductive Film, ACF) 26 containing conductive particle components is arranged between the back substrate 12 and the circuit board 22 to fill, in addition to maintaining the electrical connection between the back substrate 12 and the circuit board 22, It is further used for connecting the back substrate 12 and the circuit board 22 .

请再参考图3，图3为现有等离子体显示器10的背面基板12与电路板22连接完成的示意图。在连接过程的最后，在背面基板12与电路板22之间还会涂覆一层硅胶29，以保护并隔离导电胶26与大气接触，且加强背面基板12与电路板22的连接。但由于现有制作的等离子体显示器10中，接合电极14前端与导电胶26之间将存在有一空隙区域27，内侧硅胶291不与电路板电极24或基板12接触，而无法达成粘着电路板22与基板12的功效，因此封合的强度不甚良好。此外现有在封合完成后填入硅胶29时，在接合电极14前端的空隙区域27内含空气，而空气中的水分会破坏导电胶26的材料特性，使导电胶26由接合电极14或电路板电极24上脱落，或使接合电极14与电路板电极24之间无法电连接，或者破坏硅胶29封合的效果，而影响产品的可靠度。Please refer to FIG. 3 again. FIG. 3 is a schematic view showing the connection between the back substrate 12 and the circuit board 22 of the conventional plasma display 10 . At the end of the connection process, a layer of silica gel 29 is coated between the back substrate 12 and the circuit board 22 to protect and isolate the conductive glue 26 from the atmosphere and strengthen the connection between the back substrate 12 and the circuit board 22 . However, in the existing plasma display 10, there will be a gap area 27 between the front end of the bonding electrode 14 and the conductive adhesive 26, and the inner silica gel 291 is not in contact with the circuit board electrode 24 or the substrate 12, so the adhesion of the circuit board 22 cannot be achieved. The effectiveness of the substrate 12, therefore, the strength of the seal is not very good. In addition, when filling the silica gel 29 after the sealing is completed, air is contained in the gap area 27 at the front end of the bonding electrode 14, and the moisture in the air will destroy the material properties of the conductive adhesive 26, so that the conductive adhesive 26 is formed by the bonding electrode 14 or The circuit board electrodes 24 fall off, or make the electrical connection between the bonding electrodes 14 and the circuit board electrodes 24 impossible, or destroy the sealing effect of the silica gel 29 , thereby affecting the reliability of the product.

本发明的目的在于提供一种具有辅助接合垫的等离子体显示器，以解决上述现有问题。An object of the present invention is to provide a plasma display with auxiliary bonding pads to solve the above existing problems.

本发明的目的是这样实现的，即提供一种等离子体显示器(PlasmaDisplay Panel)，其包括有：一基板，该基板具有一基板边缘；多个接合电极(bonding pad)，以彼此不相电连接的方式设置在该基板上，且该各接合电极距离该基板边缘一间距；一辅助接合垫，设置于该接合电极与该基板边缘之间；一电路板；多个电路板电极，以彼此不相电连接的方式设置在该电路板上，该多个电路板电极的位置与该多个接合电极的位置相对应；一导电粘结层，置于该接合电极与该电路板电极之间，用以粘结该基板与该电路板，并使该接合电极与该电路板电极保持电连接；以及一保护粘结层，设置在该基板边缘上，介于该基板与该电路板之间，该保护粘结层还与该导电粘结层连接，以保护该导电粘结层，使该导电粘结层不与外界空气接触。The purpose of the present invention is achieved by providing a plasma display (PlasmaDisplay Panel), which includes: a substrate, the substrate has a substrate edge; a plurality of bonding electrodes (bonding pad), to be electrically disconnected The method is arranged on the substrate, and each bonding electrode is spaced from the edge of the substrate; an auxiliary bonding pad is arranged between the bonding electrode and the edge of the substrate; a circuit board; a plurality of circuit board electrodes are separated from each other The electrical connection is arranged on the circuit board, the positions of the plurality of circuit board electrodes correspond to the positions of the plurality of bonding electrodes; a conductive adhesive layer is placed between the bonding electrodes and the circuit board electrodes, for bonding the substrate and the circuit board, and maintaining electrical connection between the bonding electrode and the circuit board electrode; and a protective adhesive layer disposed on the edge of the substrate, between the substrate and the circuit board, The protective adhesive layer is also connected with the conductive adhesive layer to protect the conductive adhesive layer so that the conductive adhesive layer does not come into contact with the outside air.

下面结合附图，详细说明本发明的实施例，其中：Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:

图1为现有等离子体显示器的背面基板的接合区域示意图；1 is a schematic diagram of a bonding area of a back substrate of a conventional plasma display;

图2为现有等离子体显示器的背面基板与电路板封合方法的示意图；FIG. 2 is a schematic diagram of a method for sealing a back substrate and a circuit board of an existing plasma display;

图3为现有等离子体显示器的背面基板与电路板连接完成的示意图；FIG. 3 is a schematic diagram of the completion of the connection between the back substrate and the circuit board of the existing plasma display;

图4为本发明等离子体显示器的背面基板的接合区域的示意图；4 is a schematic diagram of the bonding area of the back substrate of the plasma display of the present invention;

图5为本发明等离子体显示器的背面基板与电路板封合方法的示意图；5 is a schematic diagram of a method for sealing the back substrate and the circuit board of the plasma display of the present invention;

图6为本发明等离子体显示器的背面基板与电路板连接完成的示意图。FIG. 6 is a schematic diagram of the connection between the back substrate and the circuit board of the plasma display of the present invention.

请参考图4，图4为本发明等离子体显示器于基板上设计的接合区域的示意图。以背面基板为例，如图4所示，本发明等离子体显示器30包括有一前面基板(未显示)，以及一背面基板32平行地设于前面基板的下方。背面基板32与前面基板封合的区域(未显示)外设有一接合区域36，接合区域36内设有多个彼此平行且不相电连接的接合电极34，各接合电极34的形状大约呈长条形，且该各接合电极34距离基板边缘31一间距。背面基板32上另设置有一辅助接合垫38，位于接合电极34与基板边缘31之间。多个接合电极34分成数组，在此实施例中以三个接合电极34为一组，辅助接合垫38的形状大约成呈冂形，环绕于一组接合电极34的周围三边，如图4所示。Please refer to FIG. 4 . FIG. 4 is a schematic diagram of the bonding area designed on the substrate of the plasma display of the present invention. Taking the back substrate as an example, as shown in FIG. 4 , the plasma display 30 of the present invention includes a front substrate (not shown), and a back substrate 32 disposed parallelly below the front substrate. A joint area 36 is provided outside the area (not shown) where the back substrate 32 and the front substrate are sealed. The joint area 36 is provided with a plurality of joint electrodes 34 parallel to each other and not electrically connected to each other. The shape of each joint electrode 34 is approximately elongated. The bonding electrodes 34 are strip-shaped, and each bonding electrode 34 is spaced apart from the edge 31 of the substrate. An auxiliary bonding pad 38 is further disposed on the back substrate 32 , located between the bonding electrode 34 and the edge 31 of the substrate. A plurality of bonding electrodes 34 are divided into groups. In this embodiment, three bonding electrodes 34 are used as a group. The auxiliary bonding pads 38 are approximately in the shape of a square and surround three sides of a group of bonding electrodes 34, as shown in FIG. 4 shown.

请参考图5及图6，图5为本发明等离子体显示器30的背面基板32与电路板42封合方法的示意图，图6为本发明等离子体显示器30的背面基板32与电路板42连接完成的示意图。如图5所示，电路板42为一软性电路板(Flexible Printed Circuit，FPC)，在电路板42上也设置有多个彼此平行且不相电连接的电路板电极44，每一个接合电极34与一个电路板电极44设置于相对应的位置。背面基板32与电路板42间还包括一导电粘结层46，其为一层含有导电粒子成分的各向异性导电胶(ACF)46，用以粘结背面基板32与电路板42，并保持电连接。使用时，各向异性导电胶46的导电粒子在加热加压后会嵌入背面基板的接合电极34与电路板电极44中。因此，在本发明的实施例中使用的导电粒子为金属粒子表面镀上镍/金(Ni/Au)金属导电粒子，镀上金属可增加导电粒子的延展性，镀上镍可增加导电粒子的硬度，使导电粒子的硬度需强于辅助接合垫38的硬度，以利于背面基板32与电路板42的封合。Please refer to FIG. 5 and FIG. 6, FIG. 5 is a schematic diagram of the sealing method of the back substrate 32 and the circuit board 42 of the plasma display 30 of the present invention, and FIG. 6 shows that the connection between the back substrate 32 and the circuit board 42 of the plasma display 30 of the present invention is completed schematic diagram. As shown in Figure 5, the circuit board 42 is a flexible circuit board (Flexible Printed Circuit, FPC), on the circuit board 42 is also provided with a plurality of circuit board electrodes 44 that are parallel to each other and not electrically connected, each joint electrode 34 and a circuit board electrode 44 are arranged at corresponding positions. There is also a conductive adhesive layer 46 between the back substrate 32 and the circuit board 42, which is an anisotropic conductive glue (ACF) 46 containing conductive particles, used to bond the back substrate 32 and the circuit board 42, and maintain electrical connection. During use, the conductive particles of the anisotropic conductive adhesive 46 will be embedded in the bonding electrodes 34 and the circuit board electrodes 44 of the back substrate after being heated and pressed. Therefore, the conductive particles used in the embodiments of the present invention are nickel/gold (Ni/Au) metal conductive particles plated on the surface of the metal particles, the metal can increase the ductility of the conductive particles, and the nickel can increase the ductility of the conductive particles. Hardness, the hardness of the conductive particles needs to be stronger than that of the auxiliary bonding pad 38 to facilitate the sealing of the back substrate 32 and the circuit board 42 .

在本发明的最佳实施例中，辅助接合垫38使用与接合电极34相同的导电材料制成，如此可以在同一道制作过程中，同时制作接合电极34与辅助接合垫38，从而节省制作过程的成本。由于辅助接合垫38利用与接合电极34相同的导电性材料制作过程，因此电路板42上的电路板电极44表面另需设置一绝缘层48，以防止封合时电路板电极44与辅助接合垫38之间发生短路。此外，辅助接合垫38也可使用绝缘材料加以制作，如此便不需制作电路板电极44上的绝缘层48。In a preferred embodiment of the present invention, the auxiliary bonding pad 38 is made of the same conductive material as the bonding electrode 34, so that the bonding electrode 34 and the auxiliary bonding pad 38 can be manufactured simultaneously in the same manufacturing process, thereby saving the manufacturing process. the cost of. Since the auxiliary bonding pad 38 utilizes the same conductive material manufacturing process as the bonding electrode 34, an insulating layer 48 needs to be provided on the surface of the circuit board electrode 44 on the circuit board 42 to prevent the circuit board electrode 44 from contacting the auxiliary bonding pad during sealing. A short circuit occurs between 38. In addition, the auxiliary bonding pad 38 can also be made of insulating material, so that the insulating layer 48 on the electrode 44 of the circuit board does not need to be made.

如图6所示，在利用导电胶46使背面基板32与电路板42粘着后，接着利用一保护粘结层50隔离导电胶与外界空气，并协助密合。该保护粘结层50为一硅胶(silicon paste)50，可将背面基板32与电路板42两端的间隙加以密合，以提高等离子体显示器30封合的耐湿性、耐水性与密合性。由于辅助接合垫38可缩减背面基板32上的接合电极34前端与导电胶46之间的空隙，甚至能完全使该二者完全紧密接合，因此能有效防止封合的硅胶50与接合电极34前端以及导电胶46之间残存气泡，并使背面基板32紧密地与电路板42固定密合。As shown in FIG. 6 , after using the conductive adhesive 46 to adhere the back substrate 32 and the circuit board 42 , a protective adhesive layer 50 is used to isolate the conductive adhesive from the outside air and assist in sealing. The protective adhesive layer 50 is a silicon paste 50, which can seal the gap between the back substrate 32 and the two ends of the circuit board 42, so as to improve the moisture resistance, water resistance and adhesion of the plasma display 30. Since the auxiliary bonding pad 38 can reduce the gap between the front end of the bonding electrode 34 on the back substrate 32 and the conductive glue 46, and even completely make the two completely tightly bonded, it can effectively prevent the sealed silica gel 50 from contacting the front end of the bonding electrode 34. And air bubbles remain between the conductive glue 46 , so that the back substrate 32 and the circuit board 42 are tightly fixed and sealed.

本发明主要利用环绕于接合电极34周围的辅助接合垫38来减少基板与电路板封合时残存的气泡，并增强封合的强度与可靠度。本发明的等离子体显示器30具有下列两项优点：The present invention mainly utilizes the auxiliary bonding pads 38 surrounding the bonding electrodes 34 to reduce residual air bubbles when the substrate and the circuit board are sealed, and enhance the strength and reliability of the sealing. The plasma display 30 of the present invention has the following two advantages:

(1)提高封合强度(bonding strength)：如图6所示，辅助接合垫38位于接合电极34前端与导电胶46之间的空隙区域。在现有方法中，导电胶46用以粘着基板32与电路板42的表面积仅有导电胶46与接合电极34间的接触面积，本发明粘着的接触面积还包括导电胶46与辅助接合垫38间的接触面积，因此可以提高基板32与电路板42间封合的强度。(1) Improving the bonding strength: As shown in FIG. 6 , the auxiliary bonding pad 38 is located in the gap area between the front end of the bonding electrode 34 and the conductive adhesive 46 . In the existing method, the surface area of the conductive glue 46 used to adhere the substrate 32 and the circuit board 42 is only the contact area between the conductive glue 46 and the bonding electrode 34, and the bonding contact area of the present invention also includes the conductive glue 46 and the auxiliary bonding pad 38. Therefore, the sealing strength between the substrate 32 and the circuit board 42 can be improved.

(2)提高封合的可靠度：现有在利用导电胶26封合完成后填入硅胶时，在接合电极14前端的空隙区域27常易潜藏气泡，破坏硅胶29的封合效果，并使导电胶26与外界空气接触，而影响产品的可靠度。本发明在前述易生成气泡的区域内填入辅助接合垫38，使导电胶46、辅助接合垫38与硅胶50间呈现密合的状态，不易有空气或水气渗入，因此可以提高产品的可靠度。(2) Improve the reliability of sealing: when using the conductive glue 26 to fill in the silica gel after the sealing is completed, air bubbles are often hidden in the gap area 27 at the front end of the bonding electrode 14, which will destroy the sealing effect of the silica gel 29 and make The conductive glue 26 is in contact with the outside air, which affects the reliability of the product. The present invention fills the auxiliary bonding pad 38 in the area where air bubbles are easily generated, so that the conductive adhesive 46, the auxiliary bonding pad 38 and the silica gel 50 are in a tight state, and it is difficult for air or moisture to infiltrate, so the reliability of the product can be improved. Spend.

本发明装置的优点在于，与现有制作的等离子体显示器10相比，本发明主要利用位于接合电极34周围的辅助接合垫38来减少封合时残存的气泡，以增强封合的强度与产品的可靠度。The advantage of the device of the present invention is that, compared with the existing plasma display 10, the present invention mainly utilizes the auxiliary bonding pad 38 positioned around the bonding electrode 34 to reduce the remaining air bubbles during sealing, so as to enhance the sealing strength and product quality. reliability.

以上所述仅本发明的较佳实施例，凡依本发明权利要求所做的均等变化与修饰，皆应属本发明专利的涵盖范围。The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the claims of the present invention shall fall within the scope of the patent of the present invention.

Claims

1. A plasma display (Plasma Display Panel), which includes:

a substrate having a substrate edge;

A plurality of bonding electrodes (bonding pads) are arranged on the substrate in a manner not electrically connected to each other, and each bonding electrode is spaced from the edge of the substrate by a distance;

an auxiliary bonding pad disposed between the bonding electrode and the edge of the substrate;

a circuit board;

A plurality of circuit board electrodes are arranged on the circuit board in a manner that is not electrically connected to each other, and the positions of the plurality of circuit board electrodes correspond to the positions of the plurality of bonding electrodes;

a conductive adhesive layer, placed between the bonding electrode and the circuit board electrode, for bonding the substrate and the circuit board, and maintaining electrical connection between the bonding electrode and the circuit board electrode; and

A protective adhesive layer is arranged on the edge of the substrate, between the substrate and the circuit board, and the protective adhesive layer is also connected with the conductive adhesive layer to protect the conductive adhesive layer and make the conductive adhesive layer The knot layer is not in contact with the outside air.

2. The plasma display as claimed in claim 1, wherein the conductive bonding layer is an anisotropic conductive glue (Anisotropic Conductive Flim, ACF), and the anisotropic conductive glue contains conductive particle components, so that the bonding electrode and The circuit board electrodes make electrical connections.

3. The plasma display as claimed in claim 2, wherein the protective adhesive layer is a silicon paste (silicon paste), used to bond the substrate and the circuit board, and tightly seal the substrate and the circuit board gap.

4. The plasma display as claimed in claim 3 , wherein the auxiliary bonding pad is located between the bonding electrode and the silica gel, so as to prevent the silica gel from forming between the silica gel and the anisotropic conductive adhesive during the process of coating the silica gel. Bubbles are generated to destroy the material properties of the anisotropic conductive adhesive.

5. The plasma display as claimed in claim 1, wherein the auxiliary bonding pad is made of the same material as the bonding electrode.

6. The plasma display as claimed in claim 5, wherein the circuit board further comprises an insulating layer disposed on the circuit board electrode for preventing short circuit between the circuit board electrode and the auxiliary bonding pad.

7. The plasma display as claimed in claim 1, wherein the auxiliary bonding pad is made of insulating material.

8. The plasma display as claimed in claim 1, wherein the shape of each of the plurality of circuit board electrodes and each of the plurality of bonding electrodes is approximately elongated, and the shape of the auxiliary bonding pad is approximately rectangular.

9. The plasma display as claimed in claim 1, wherein the circuit board is a flexible printed circuit (FPC).