[go: up one dir, main page]

CN1341513A - Preparation method of surface tiling and veneering technology form - Google Patents

Preparation method of surface tiling and veneering technology form Download PDF

Info

Publication number
CN1341513A
CN1341513A CN 01126042 CN01126042A CN1341513A CN 1341513 A CN1341513 A CN 1341513A CN 01126042 CN01126042 CN 01126042 CN 01126042 A CN01126042 A CN 01126042A CN 1341513 A CN1341513 A CN 1341513A
Authority
CN
China
Prior art keywords
electroforming
surface mounting
making method
mounting technology
stainless steel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 01126042
Other languages
Chinese (zh)
Other versions
CN1122601C (en
Inventor
魏志凌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Power Stencil Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 01126042 priority Critical patent/CN1122601C/en
Publication of CN1341513A publication Critical patent/CN1341513A/en
Application granted granted Critical
Publication of CN1122601C publication Critical patent/CN1122601C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The production method of form for surface veneering technology, called electrocasting process for short, includes the following steps: 1). preparing electrocasting liquor; sticking film on the pretreated stainless steel base plate, exposing and developing; 2). placing the developed stainless steel base plate into the electrocasting liquor, electrocasting nickel layer; and 3). stripping the electrocasting layer from stainless steel base plate. By adopting this method the formation of form belongs to a deposition of metallic atomic level, so that it can form roughness-free opening.

Description

The making method of surface mounting technology template
Technical field:
The present invention relates to the making method of a kind of surface mounting technology (SMT) template, this template is mainly used in the assembling of surface mount elements.
Background technology:
Along with hyundai electronics package trade technology develops towards the subminiaturization direction, the components and parts size is more and more littler, and packing density is more and more higher.And the quality quality of printing stencil is the key that influences soldering reliability and product first-pass yield.According to statistics, the reason that caused because of the printing soldering paste during all SMT lost efficacy has accounted for about 90%.As seen solve the quality of SMT template, development is fit to the SMT template of continuous miniaturized device, is one of gordian technique of SMT technology.
The manufacturing of SMT template can be divided into method manufacturings such as chemical corrosion, laser cutting substantially.Chemical corrosion method is because problems such as sideetching can not produce high precision, highdensity template, and laser cutting makes its otch roughness reach the scope of 3 μ m because it belongs to the principle of heating power cutting, also is not suitable for the template of ultra-fine pitches.
Summary of the invention:
Purpose of the present invention is exactly in order to overcome the above problems, a kind of making method of surface mounting technology template is provided, solve the opening Burr Problem that the conventional template manufacturing process exists, make carrot-free SMT template, improve ultra-fine pitches device soldering paste bite rate and homogeneity.
For achieving the above object, the present invention proposes a kind of making method of surface mounting technology template, it is characterized in that may further comprise the steps: 1) preparation electroforming solution; Exposing, developing through pad pasting on the stainless steel substrate of pre-treatment; 2) stainless steel substrate after will developing is put into electroforming solution electroforming nickel dam; 3) electroformed layer is peeled off from stainless steel substrate.
Aforesaid method can be called for short electrocasting, owing to adopted this method, the shaping of template is the deposition that belongs to the atoms metal level, thereby can form the opening of no roughness, the precision that its roughness only is subject to exposure basically, develops, and expose, developing technique becomes visual roughness almost can ignore.
The specific embodiment:
The present invention is described in further detail below by specific embodiment.
Say that briefly the present invention mainly may further comprise the steps: 1) preparation electroforming solution; At the front place of process Pad pasting exposure, development on the stainless steel substrate of reason; 2) stainless steel substrate after will developing is put into electroforming Electroforming nickel dam in the liquid; 3) electroformed layer is peeled off from stainless steel substrate.
Wherein the prescription of electroforming solution is as follows:
Chemical formula Chinese name Content (g/l) Optimum value (g/l)
Ni(NH 2SO 3) 2·4H 2O Four hydration nickel sulfamic acids 340-390  70
 Nicl 2·6H 2O Nickel dichloride hexahydrate 10-20  15
 H 3BO 3 Boric acid 40-45  40
 C 6H 5COSO 2NH 4 Asccharin 1-3  1.8
 C 12H 25NaSO 4 Lauryl sodium sulfate 0.05-0.10  0.06
 HO-CH 2-C≡C-CH 2-OH Isosorbide-5-Nitrae-butynediols 0.40-0.50  0.4
 C 9H 6O 2 Cumarin 0.10-0.20  0.15
 H 2O Pure water Be supplemented to volume required
After the dissolving, the content of bivalent nickel ion is 65-75g/l (grams per liter), it be by nickel sulfamic acid, Nickel chloride provides jointly. The electroforming solution of this prescription is a kind of high dispersive power electroforming solution, can improve casting Layer equally distributed ability on large-area flat-plate; Simultaneously, it is again a kind of electroforming of low internal stress Formula of liquid can guarantee that the functional nickel of the high thickness of large tracts of land adds the low internal stress problem of layer technology.
Process conditions when electroforming will be noted following content
1) adjust pH value between 3.8-4.5, optimum value is 4.2.
2) temperature 50-60 ℃ (degree centigrade) between, adopt auto temperature controlled system to control,
And monitoring in per 4 hours once.
3) cathode-current density is 2-4A/dm2(ampere/square decimeter), anode is nickel anode. As
Adopt the period commutating pulse power electroforming, and the positive and negative burst length amplitude of power supply is adjustable,
Can further solve its homogeneity question and low internal stress problem. In addition, adopt auxiliary the moon
The utmost point and meshed anode baffle plate, for a change distribution of power line in the electroforming solution of people can make big face
Power line actively evenly distributes, and also has to utilize the uniformity that guarantees cast layer.
4) simultaneously, also need stir during electroforming, such as utilizing air stirring or solution directly to spray
Stir.
Electroforming solution is after use, and composition may change, or sneaks into impurity, therefore also need regularly to safeguard, Comprise: the 1) adjusting of pH value: the rising pH value is with analyzing soda ash formula nickelous carbonate, to 700 liters electricity Casting liquid, 0.1 pH value of every rising approximately needs 280g (gram); Reduce pH value with analyzing pure amino Sulfonic acid, to 700 liters electroforming solution, 0.1 pH value of every reduction approximately needs 280g. 2) electroforming Liquid filters: filters with circulating pump, and electroforming solution circulation 3~5 times/hour, filter core is with 5 μ m (micron) Cotton core; 4) the electrolysis removal of impurity: use 0.5-1A/dm2(ampere/square decimeter) weekly electrolysis of current density 1~3 time, each 4~10H (hour), electrolytic zinc-coated steel sheet corrugated sheet (big negative electrode, primary anode); 5) Regular replenishment additive: C6H 5COSO 2NH 4Magnitude of recruitment is that (milliliter/kilo-ampere is little for 250ml/KA.H The time); C12H 25NaSO 4Magnitude of recruitment is 25-50ml/KAH; HO-CH2-C≡C-CH 2-OH magnitude of recruitment is 25-50ml/KA.H; C9H 6O 2Magnitude of recruitment is 300ml/KAH. These additives can Adjust the drawing of electroformed layer, compression, both are just offset or within allowed band.
The electroforming required time is calculated by following formula: δ = D · t · ηK · K r · 1000
Wherein: δ is electroformed layer thickness, and unit is mm (millimeter); DKBe cathode-current density, unit is A/dm2(ampere/square decimeter); T is electroplating time, unit be H (hour); ηKBe negative electrode Current efficiency, it is a scale factor, no unit, value is generally about 9.5; K is the nickel electricity Chemical equivalent, its value is K=1.095, unit is g/AH (gram/ampere-hour); R is nickel density, Its value is g/cm for r=8.8 unit3(gram per centimeter3)。
Be a specific embodiment below, its whole implementation process is successively as described below:
One, preparation electroforming solution, materials are as follows:
a)Ni(NH 2SO 3) 2·4H 2O (four hydration nickel sulfamic acids) 134kg (kilogram)
b)Nicl 2·6H 2O (Nickel dichloride hexahydrate) 5.25kg (kilogram)
c)H 3BO 3(boric acid) 14kg (kilogram)
d)C 6H 5COSO 2NH 4(asccharin) 630g (gram)
e)C 12H 25NaSO 4(lauryl sodium sulfate) 21g (gram)
f)HO-CH 2-C≡C-CH 2-OH (Isosorbide-5-Nitrae-butynediols) 140g (gram)
g)C 9H 6O 2(cumarin) 52.5g (gram)
Add H2O (pure water) is to 3501 (liters), and adjusting pH value is 4.2, and the analysis and regulation solution composition is used 1A/dm2Current electroanalysis can use after (using electrolytic zinc-coated steel sheet) in 12 hours.
Wherein used electrotyping bath design is as follows:
A) length * wide * height is 1100mm * 440mm * 1000mm
B) material: PP plate liner channel-section steel
C) die opening: 35cm (centimetre)
D) solution circulation: 5 times/hour (using circulating pump)
E) filter: with 5 μ m (micron) cotton cores
F) stirring: solution directly sprays+movable cathode (10 beats/mins, stroke ± 150cm)
G) heating system: two 15KW (kilowatt) the stainless steel heat pump, and adopt auto temperature controlled system
H) nickel anode: button type electrolytic nickel anode
I) titanium indigo plant: the splendid attire nickel anode, and adopt anode
Technological parameter:
Temperature: 55 ℃ (degree centigrade)
Current density: 3A/dm2(ampere/square decimeter)
Time: 3 hours
PH value: 4.2
Two, electroforming
May further comprise the steps successively: stainless steel substrate pre-treatment, the exposure of substrate pad pasting, development, alive Change/passivation, washing, electroformed nickel, demoulding, electroforming nickel dam and substrate mechanical stripping. Be described below:
1, stainless steel substrate pre-treatment
Comprise successively following step: electrochemical deoiling, hot water wash, cold wash, neutralization, brush board, Oven dry.
(1) the electrochemical deoiling materials are as follows:
NaOH (sodium hydroxid) 60-100g/l (grams per liter)
Na 2CO 3(sodium carbonate) 20-40g/l (grams per liter)
NaPO 4(tertiary sodium phosphate) 50-70g/l (grams per liter)
Temperature 80-100 ℃ (degree centigrade)
Soak time 30min (minute)
(2) neutralization: with in 5% the hydrochloric acid with 30 seconds;
(3) with nylon bruss round brush substrate;
(4) oven dry: temperature 60-80 ℃ (degree centigrade)
2, substrate pad pasting exposure
(1) pad pasting: use photosensitive dry film. Dry film need be selected the slightly thick dry film of Thickness Ratio electroformed layer, Entirely be attached on the stainless steel substrate with laminator;
(2) exposure: the chromium plate of high precision is fixed on the dry film surface, and (the chromium plate medicine face need paste On dry film), transfer on the dry film figure on the chromium plate is complete with parallel exposing machine.
3, develop: figure the is come out fully (ground that does not need dry film of the sodium carbonate liquor with 1% The side rinses well).
More than adopt high-resolution chromium plate and high-power exposure machine in two steps, can guarantee high-accuracy figure Shape is shifted.
4, activation/passivation: be combined to such an extent that whether firmly decide and be with stainless steel substrate according to electroformed layer This step of no needs. If the adhesion difference easily comes off, then take activation, if mechanical stripping is difficult to, Then take passivation.
Activation: 10%HCl (hydrochloric acid) solution soaked 5-10 minute;
Passivation: 10%K2Cr 2O 7(potassium bichromate) solution soaked 2 minutes;
5, washing: necessarily need to rinse well before entering electrotyping bath, in order to avoid bring impurity into electroforming In the groove;
6, electroformed nickel: illustrate before the required condition of electroforming;
7, demoulding: with 50 ℃ of 5%NaOH (NaOH) solution (degree centigrade) soak (or Spray) till taking off totally to dry film;
8, mechanical stripping: electroformed layer is peeled off stainless steel substrate to form finished product with mechanical force;
9, electroforming nickel dam post processing: the chromic anhydride with 10% adds 1% sulfuric acid the electroforming nickel dam is carried out passivation, Form the oxide-film of one deck densification on nickel dam surface, make the durable in use and nondiscolouring of electroforming nickel dam.

Claims (10)

1, a kind of making method of surface mounting technology template is characterized in that may further comprise the steps: 1) preparation electroforming solution; Exposing, developing through pad pasting on the stainless steel substrate of pre-treatment; 2) stainless steel substrate after will developing is put into electroforming solution electroforming nickel dam; 3) electroformed layer is peeled off from stainless steel substrate.
2, the making method of surface mounting technology template as claimed in claim 1 is characterized in that the method for preparing electroforming solution is: behind following inventory and quantity obtain solution, dissolving is 65-75g/l:Ni (NH up to the content of bivalent nickel ion 2SO 3) 24H 2O 340-390g/l Nicl 26H 2O 10-20g/l H 3BO 340-45g/l C 6H 5COSO 2NH 41-3g/l C 12H 25NaSO 40.05-0.10g/l HO-CH 2-C ≡ C-CH 2-OH 0.40-0.50g/l C 9H 6O 20.10-0.20g/l H 2O is supplemented to volume required
3, the making method of surface mounting technology template as claimed in claim 1 or 2, the processing condition when it is characterized in that electroforming are: adjust pH value between 3.8-4.5, temperature is between 50-60 degree centigrade, and cathode current density is 2-4 A/dm 2, anode is a nickel anode.
4, the making method of surface mounting technology template as claimed in claim 1 or 2 is characterized in that the maintenance of electroforming solution comprises: the 1) adjusting of pH value: rising pH value analytical pure basic nickel carbonate, reduce pH value analytical pure thionamic acid; 2) electroforming solution is filtered: filter with recycle pump, and electroforming solution circulation 3~5 times/hour, filter core is with 5 μ m cotton cores; 4) the electrolysis removal of impurity: use 0.5-1A/dm 2Current density electrolysis 1~3 time weekly, each 4~10H, electrolytic zinc-coated steel sheet corrugated panel; 5) regular replenishment additive: C 6H 5COSO 2NH 4Magnitude of recruitment is 250ml/KAH; C 12H 25NaSO 4Magnitude of recruitment is 25-50ml/KAH; HO-CH 2-C ≡ C-CH 3-OH magnitude of recruitment is 25-50ml/KAH; C 9H 6O 2Magnitude of recruitment is 300ml/KAH.
5, the making method of surface mounting technology template as claimed in claim 1 or 2 is characterized in that: power supply adopts the reverse pulse power supply during electroforming.
6, the making method of surface mounting technology template as claimed in claim 1 or 2 is characterized in that the electroforming required time is calculated by following formula: δ = D · t · η x · K r · 1000 Wherein: δ is an electroformed layer thickness, and unit is mm; D KBe cathode current density, unit is A/dm 2T is an electroplating time, and unit is H; η KBe cathode efficiency, it is a scale factor, no unit; K is the nickel electro-chemistry equivalent, and its value is K=1.095, and unit is g/AH; R is a nickel density, and its value is g/cm for r=8.8 unit 3
7, the making method of surface mounting technology template as claimed in claim 1 or 2 is characterized in that: the pre-treatment of stainless steel substrate comprises electrochemical deoiling, washing, neutralization, brush board and oven dry successively.
8, the making method of surface mounting technology template as claimed in claim 1 or 2, it is characterized in that: whether it hardens and closes firmly according to the electroformed layer of final formation and stainless steel, if after development, stainless steel substrate is activated or passivation---the bonding force difference easily comes off, then take activation, if mechanically peel is difficult to, then take passivation; Wherein the activatory method is: use 10%HCl solution soaking 5-10 minute; The method of passivation is: use 10%K 2Cr 2O 7Solution soaking 1-3 minute.
9, the making method of surface mounting technology template as claimed in claim 1 or 2 is characterized in that: after electroformed layer forms, also carry out demoulding, promptly soak with 50 ℃ of 5%NaOH solution or spray to the residual photosensitive dry film take off clean till.
10, the making method of surface mounting technology template as claimed in claim 1 or 2, it is characterized in that: behind electroformed layer and strippable substrate, also carry out aftertreatment, promptly add 1% sulfuric acid the electroforming nickel dam is carried out passivation, form the oxide film of one deck densification on the nickel dam surface with 10% chromic anhydride.
CN 01126042 2001-08-22 2001-08-22 Preparation method of surface tiling and veneering technology form Expired - Fee Related CN1122601C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01126042 CN1122601C (en) 2001-08-22 2001-08-22 Preparation method of surface tiling and veneering technology form

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01126042 CN1122601C (en) 2001-08-22 2001-08-22 Preparation method of surface tiling and veneering technology form

Publications (2)

Publication Number Publication Date
CN1341513A true CN1341513A (en) 2002-03-27
CN1122601C CN1122601C (en) 2003-10-01

Family

ID=4666132

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01126042 Expired - Fee Related CN1122601C (en) 2001-08-22 2001-08-22 Preparation method of surface tiling and veneering technology form

Country Status (1)

Country Link
CN (1) CN1122601C (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100545320C (en) * 2005-11-14 2009-09-30 昆山允升吉电子有限公司 A kind of method that is used to make the electroformed nickel of plane electrotyping plate
CN102094221A (en) * 2010-12-20 2011-06-15 昆山美微电子科技有限公司 Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process
CN103203967A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for a step stencil by using an electroforming method
CN103209545A (en) * 2012-01-13 2013-07-17 昆山允升吉光电科技有限公司 Surface Mount Technology (SMT) mask development method and printed circuit board template production method
CN104760404A (en) * 2015-03-30 2015-07-08 桐城运城制版有限公司 Production process of SMT printing template
CN107116947A (en) * 2017-06-22 2017-09-01 中丰田光电科技(珠海)有限公司 A kind of new seamless material membrane manufacturing process of full width logic light line
CN108914166A (en) * 2018-06-29 2018-11-30 福州珂麦表业有限公司 A kind of electroforming manufacture craft of noble metal ebuche
CN109338419A (en) * 2018-12-03 2019-02-15 台州市黄岩圣发模具有限公司 A kind of PDCPD nickel mould and its electroforming manufacturing process
CN109680306A (en) * 2019-02-20 2019-04-26 合肥永淇智材科技有限公司 FMM electroforming motherboard production method based on mechanical punching
CN110519938A (en) * 2019-08-29 2019-11-29 光宏光电技术(深圳)有限公司 A kind of SMT steel mesh of Flip-Chip Using and preparation method thereof
CN110605900A (en) * 2019-08-27 2019-12-24 东莞光韵达光电科技有限公司 Application of a Laser Printing Stencil Based on Surface Mount Technology

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100545320C (en) * 2005-11-14 2009-09-30 昆山允升吉电子有限公司 A kind of method that is used to make the electroformed nickel of plane electrotyping plate
CN102094221A (en) * 2010-12-20 2011-06-15 昆山美微电子科技有限公司 Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process
CN102094221B (en) * 2010-12-20 2012-06-27 昆山美微电子科技有限公司 Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process
CN103209545A (en) * 2012-01-13 2013-07-17 昆山允升吉光电科技有限公司 Surface Mount Technology (SMT) mask development method and printed circuit board template production method
CN103203967A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for a step stencil by using an electroforming method
CN104760404A (en) * 2015-03-30 2015-07-08 桐城运城制版有限公司 Production process of SMT printing template
CN107116947A (en) * 2017-06-22 2017-09-01 中丰田光电科技(珠海)有限公司 A kind of new seamless material membrane manufacturing process of full width logic light line
CN108914166A (en) * 2018-06-29 2018-11-30 福州珂麦表业有限公司 A kind of electroforming manufacture craft of noble metal ebuche
CN109338419A (en) * 2018-12-03 2019-02-15 台州市黄岩圣发模具有限公司 A kind of PDCPD nickel mould and its electroforming manufacturing process
CN109680306A (en) * 2019-02-20 2019-04-26 合肥永淇智材科技有限公司 FMM electroforming motherboard production method based on mechanical punching
CN110605900A (en) * 2019-08-27 2019-12-24 东莞光韵达光电科技有限公司 Application of a Laser Printing Stencil Based on Surface Mount Technology
CN110519938A (en) * 2019-08-29 2019-11-29 光宏光电技术(深圳)有限公司 A kind of SMT steel mesh of Flip-Chip Using and preparation method thereof

Also Published As

Publication number Publication date
CN1122601C (en) 2003-10-01

Similar Documents

Publication Publication Date Title
CN1122601C (en) Preparation method of surface tiling and veneering technology form
CN101445946B (en) Anticorrosive wearable electrodeposit clad layer of Ni-W-P ternary alloy and manufacturing technique and electroplate liquid thereof
CN1191392C (en) Galvanic bath, method for producing structured hard chromium layers and use thereof
CN109750317B (en) A kind of preparation method of porous nickel-based copper-rhenium composite hydrogen evolution electrode
CN1804138A (en) Mask electro-forming method for vaporization coating of organic light-emitting display
CN108166023B (en) Electrochemical additive manufacturing method for metal piece
CN102732916A (en) Rapid electroforming process
CN1940147A (en) Formation method of gold bump or gold wiring
CN104357883A (en) Cyanide-free electroforming gold solution and gold electroforming method
CN104328432A (en) Plastic substrate electroplating method
CN104313652B (en) Preparation method of aluminum-based multiphase inert composite anode material
JP2660581B2 (en) Method for producing aluminum support for printing plate
CN117646261B (en) Limited domain electrodeposition method of metal grid line structure for photovoltaic power generation
CN1181570C (en) Surface-treated steel sheet for battery case, battery case comprising the same, methods for producing them, and battery
CN106757184A (en) A kind of production technology of printed nickel net
CN117936187A (en) Copper-carbon-copper structure composite copper foil and preparation method and application thereof
CN106757243A (en) The nickel plating process and nickel plating apparatus of a kind of zirconium alloy pipe
CN1058430A (en) Electroplating process for protective decorative coating
CN110592627B (en) Cyanide-free imitation gold electroplating solution and magnesium alloy electroplating process thereof
CN118932449B (en) Electrodeposition method of metal grid line and metal grid line
CN103215620A (en) Method for preparing electroforming nickel layer with high elongation rate
CN113235138A (en) Preparation method of ultrathin metal layer
CN113913908B (en) Preparation method of thick nickel-plated profiling anode for inner profile of saddle rotary body
CN101353807A (en) Method for producing nickel shaped charge liner using nickel sulfate electroforming solution
CN2888494Y (en) Original version of heat sensitive CTP

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: BEIJING YUNSHENGJI NEW TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: WEI ZHILING

Effective date: 20040310

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20040310

Address after: 102200, room 18, Fukang Road, Changping Park, Zhongguancun science and Technology Park, Beijing, Changping District 608, China

Patentee after: Beijing Yunshengji New Technology Co., Ltd.

Address before: 518128 Guangdong city of Shenzhen province Baoan District Xixiang Huang Guang Tian Hui Industrial Park building A5

Patentee before: Wei Zhiling

ASS Succession or assignment of patent right

Owner name: KUNSHAN YUNSHENGJI OPTOELECTRONIC TECHNOLOGY CO.,

Free format text: FORMER OWNER: BEIJING YUNSHENGJI NEW TECHNOLOGY CO., LTD.

Effective date: 20120606

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 102200 CHANGPING, BEIJING TO: 215311 SUZHOU, JIANGSU PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20120606

Address after: 215311 Jiangsu city of Kunshan province city red Yang Road

Patentee after: Kunshan Yunshengji Optoelectronic Technology Co., Ltd.

Address before: 102200, room 18, Fukang Road, Changping Park, Zhongguancun science and Technology Park, Beijing, Changping District 608, China

Patentee before: Beijing Yunshengji New Technology Co., Ltd.

PP01 Preservation of patent right

Effective date of registration: 20190808

Granted publication date: 20031001

PP01 Preservation of patent right
PD01 Discharge of preservation of patent

Date of cancellation: 20210822

Granted publication date: 20031001

PD01 Discharge of preservation of patent
DD01 Delivery of document by public notice

Addressee: Patent of Kunshan yunshengji Photoelectric Technology Co.,Ltd. The person in charge

Document name: Notice of termination of proceedings

Addressee: Patent of Kunshan yunshengji Photoelectric Technology Co.,Ltd. The person in charge

Document name: Notice of termination of patent right

DD01 Delivery of document by public notice
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20031001

Termination date: 20190822