CN1314252A - 具有多个单元的喷墨头及其制造方法 - Google Patents
具有多个单元的喷墨头及其制造方法 Download PDFInfo
- Publication number
- CN1314252A CN1314252A CN01103686A CN01103686A CN1314252A CN 1314252 A CN1314252 A CN 1314252A CN 01103686 A CN01103686 A CN 01103686A CN 01103686 A CN01103686 A CN 01103686A CN 1314252 A CN1314252 A CN 1314252A
- Authority
- CN
- China
- Prior art keywords
- adjacent part
- unit
- stretches out
- ink
- prepared chinese
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- 239000000976 ink Substances 0.000 claims description 79
- 235000014676 Phragmites communis Nutrition 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000001259 photo etching Methods 0.000 claims description 7
- 102000001999 Transcription Factor Pit-1 Human genes 0.000 claims description 4
- 108010040742 Transcription Factor Pit-1 Proteins 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 16
- 239000013078 crystal Substances 0.000 description 7
- 241000736199 Paeonia Species 0.000 description 4
- 235000006484 Paeonia officinalis Nutrition 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14459—Matrix arrangement of the pressure chambers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
一种喷墨头,由多个互相结合的单元构成,其中每个单元包括:伸出的邻接部分(51,53,54)和凹入的邻接部分(52);一个单元的凹入邻接部分(52)和伸出的邻接部分(54)分别与另一个单元的伸出的邻接部分(51,53)相抵邻接。每个单元还包括硅基板(71),其中形成喷嘴(1)、压力室2、墨汁通道3和墨池4;固定到硅基板上的振动片(5),以及固定到振动片上的致动器(6)。本喷墨头能够降低制造成本。制造本喷墨头的方法可使喷墨头的制成率被提高。
Description
本发明涉及一种喷墨头及其制造方法。
现有技术的喷墨头由单独一个单元构成,包括诸如单晶硅基板和玻璃基板的叠层基板(见JP-A-6-218932)。这将在后面予以详细描述。
然而,在上述现有技术的喷墨头中,当为了在提高打印速度的同时提高打印质量而增加喷嘴的密度时,即使一个单元中的一个喷嘴有故障,也不得不去掉这个单元,致使各单元的制成率降低,因而增大了喷墨头的制造成本。
本发明的目的在于提出一种能够降低制造成本的喷墨头及其制造方法。
按照本发明,一种喷墨头由多个组合的单元组成。
另外,按照一种喷墨头的制造方法,在一个基板上形成多个单元。继而使这些单元互相分开。最后,提高组合两个以上这种单元形成一个喷墨头。
从以下参照附图并与现有技术比较,将使本发明得到更为清楚的理解,其中:
图1是表示其上形成现有技术各喷墨单元之半导体晶片的平面图;
图2是图1所示喷墨单元之一的平面图;
图3是一个图2所示喷嘴周围情况的剖面图;
图4是说明其上形成本发明多个喷墨单元之半导体基板的平面图;
图5是图4所示喷墨单元之一的平面图;
图6是图5单元的局部放大示意图;
图7A,7B,7C和7D是沿图6的Ⅶ-Ⅶ线所取的断面视图;
图8A和8B分别是各单元分开前后的图4半导体晶片的平面图;
图9是说明两个图8A和8B的无损毁单元组合的平面图;
图10是图9无损毁单元邻接部分的剖面图。
在描述优选实施例之前,将参照图1、2和3说明现有技术的喷墨头。
如图1所示,现有技术喷墨头由单独一个单元101a形成,包括叠层基板,如单晶硅基板和玻璃基板(见JP-A-6-218932)。譬如,若每个单元101a的尺寸约为27mm×27mm,则用切刀(未示出)从直径大约10cm的单晶硅晶片102切割7个单元101a,如图1所示。
在作为图1每个单元101a的详细平面视图的图2中,设置4列喷嘴11,12,13和14,各喷嘴1紧密排列成矩阵形式。在这种情况下,各列喷嘴11,12,13和14分别被用来喷射黑色墨汁、黄色墨汁、深蓝色墨汁和深红色墨汁。各列喷嘴11,12,13和14分别与供墨孔21,22,23和24相连。
如图3所示,它是图2的一个喷嘴周围情况的剖面图,一个与喷嘴1连接的压力室2、墨汁通道3和墨池(容器)4为多个由单晶硅和玻璃制成的基板31、32和33所隔开,形成一个薄振动片5,其上有由插入多个金属电极压之电材料制成的致动器6。应予说明的是,每列喷嘴11,12,13和14的墨池(容器)4呈梳状,如图2所示。
另外,图3中的参考标号D表示墨滴。
然而,在由单独一个单元101a形成的这种喷墨头中,当增加喷嘴的密度,以便在提高打印速度的同时提高打印质量时,即使一个喷嘴被阻塞或受到损坏,即一个单元101a有故障,则不得不去掉这个单元,致使单元101a的制成率降低,因而增加了这种喷墨头的制造成本。
譬如,如果喷嘴1的直径大约为25至40μm,则一个单晶硅晶片102中有故障喷嘴1的平均数预期为4。在这种情况下,可能有4个单元101a有故障,以致一个单晶硅晶片102中单元101a的制成率可为3/7(=43%)。
本发明喷墨头的一种具体实施例由多个单元101b形成,比如包含一个单晶硅基板的图4所示的2个单元101b。譬如,若每个单元101b的尺寸大约为27mm×13mm,则用切刀从直径约为10cm的单晶硅晶片102上切割出14个单元101b。
图5是每个图4单元101b的详细平面视图,图中给出2列喷嘴11和12,其中各喷嘴1紧密地排列成矩阵形式。在这种情况下,两列喷嘴11和12分别用于喷射黑色墨汁(或深蓝色墨汁)和黄色墨汁(或深红色墨汁)。两列喷嘴11和12分别与供墨孔21和22相连。
如图5所示,每个单元102b中形成伸出的邻接部分51、凹入的邻接部分52、伸出的邻接部分53和伸出的邻接部分54。于是,在伸出的邻接部分51和53之间形成一个起伏(凹入)55,在邻接部分52和54之间形成一个起伏(凹入)56。应予说明的是,伸出的邻接部分51具有与凹入的邻接部分52相同的形状。
在这种由两个单元101b形成的喷墨头中,如果喷嘴9的直径是大约25至40μm,在一个单晶硅晶片102中间同样可以预期有故障喷嘴1的数目为4,以致在一个单晶硅晶片102中间单元101b的制成率可为3/14(=22%)。因而,与现有技术的单元101a相比,可使所述制成率明显地提高。
以下参照图6,7A,7B,7C,7D,8A,8B,9和10说明制造本发明喷墨头的方法。图6是图5单元101b的局部放大示意图;图7A,7B,7C和7D是沿图6的Ⅶ-Ⅶ线所取的断面视图。另外,图8A和8B分别是各单元分开前后的图4半导体晶片的平面图。再有,图9是说明两个图8A和8B的无损毁单元组合的平面图;图10是图9无损毁单元邻接部分的剖面图。
首先,参照图7A以及图6,通过光刻过程,在单晶硅基板71的前表面上形成光刻图样72。
继而,参照图7B以及图6,利用所述光刻图样72为掩膜,通过反应离子蚀刻(RIE)干法过程蚀刻所述单晶硅基板71。结果,在单晶硅基板71内穿出喷嘴1,同时,对于邻接部分51,52,53和54以及凹入的起伏55和56贯穿边界50。然后,去掉光刻图样层72。
接下去参照图7C以及图6,通过在所述单晶硅基板71的后表面的光刻过程形成光刻层(未示出)。然后,利用所述光刻图样层为掩膜,通过各异性向湿法蚀刻过程蚀刻所述单晶硅基板71。结果,在单晶硅基板71内穿出压力室2、墨汁通道3和墨池(容器)4,同时,使邻接部分51,52,53和54以及凹入的起伏55和56的边界50完全贯穿通过单晶硅基板71。继而,去掉所述光刻图样层。
在这种情况下,确定是否在喷嘴1、压力室2、墨汁通道3和墨池(容器)4中观察到阻塞的情况(损坏情况)。
以下参照图7D以及图6,通过接触结合过程使一个晶片型的薄振动片5粘附到所述单晶硅基板71的后表面上,所述薄振动片5预先贯穿适合于所述边界50。然后,通过接触结合过程,按与每个喷嘴1对应的方式,将一个由插入多个金属电极之压电材料制成的致动器6粘附到所述薄振动片5上。
应予说明的是,在图7D中,可在把晶片型薄振动片5粘附到所述单晶硅基板71的后表面之前,给晶片型薄振动片5粘附致动器6。
接下去参照图8A和8B说明多个单元101b的分开。
在图7D所示的过程之后,利用边界50沿Y方向将单晶硅基板71分成多列单元101b,如图8A所示。
继而,如图8B所示,用切刀(未示出)沿X方向切割单晶硅基板71。结果,就使每个单元101b彼此分开。
在这种情况下,再次确定在每个单元101b内是否观察到阻塞情况(损坏情况)。然后去掉呈阻塞情况(损毁情况)的损毁单元101b。
以下参照图9,通过结合无损毁单元101b-1和101b-2构成一个喷墨头。也就是使无损毁单元101b-1的凹入邻接部分52与无损毁单元101b-2的伸出邻接部分51相抵邻接,同时使使无损毁单元101b-1的伸出邻接部分54与无损毁单元101b-2伸出邻接部分53相抵邻接。在这种情况下,由于其间存在凹入起伏55和56,可改善无损毁单元101b-1与无损毁单元101b-2之间的接触特性。然后,如图10所示那样,使图9中箭号X指示的无损毁单元101b-1和101b-2的邻接部分填充粘结剂73。
最后,在已结合的无损毁单元101b-1和101b-2的后表面上形成电连接,同时使它们的供墨孔21和22分别连接到各个黑色墨汁、黄色墨汁、深蓝色墨汁和深红色墨汁的墨池。
无需昂贵的对准设备即可实现无损毁单元101b-1和101b-2的结合,这降低了制造成本。
另外,由于通过光刻和蚀刻过程形成邻接部分51,52,53和54,而不用切刀,所以己结合的每个无损毁单元101b-1和101b-2的邻接部分51,52,53和54的边界50与喷嘴1之间距离的精度可以是较高的,也即约为±1μm。于是,可使已经结合的无损毁单元101b-1和101b-2之间喷嘴1的对准精度较高,也即约为±5μm。应予说明的是,如果利用切刀形成所述邻接部分51,52,53和54,则上述距离精度可达±6μm,而上述对准精度可达±10μm。
因此,可减少黑色墨汁、黄色墨汁、深蓝色墨汁和深红色墨汁之间墨滴的漂移,这就可以不致降低打印的质量。
上述实施例中,一个喷墨头由两个结合的单元101b-1和101b-2构成一个喷墨头;不过,也可由三个或者更多个结合的单元构成一个喷墨头。例如。如果由一列喷嘴形成一个单元,则可由四个结合的单元构成一个喷墨头。
另外,上述实施例中的基板71是由单晶硅制成的,但也可由其它晶体或金属制成所述基板71。如果基板71由金属制成,则可对其实行进行加压过程或电成型过程,以致可形成各喷嘴1等。
进而在上述实施例中,将每列喷嘴11和12中的各喷嘴1排列成矩阵形式,但也可使每列喷嘴11和12中的喷嘴1交错排列。
如上所述,按照本发明,由于一个喷墨头由多个结合的单元构成,,所以使每个单元的制成率得以提高,以致可使喷墨头的制成率被提高,这将降低制造成本。
Claims (15)
1.一种喷墨头,其特征在于,它由多个结合的单元(101b-1、101b-2)构成。
2.如权利要求1所述的喷墨头,其特征在于,所述每个单元包括:
第一伸出的邻接部分(51);
凹入的邻接部分(52),它定位于所述第一伸出的邻接部分的相对侧,并与所述第一伸出的邻接部分相适应;
第二伸出的邻接部分(53),在所述第一伸出的邻接部分的同侧;
第三伸出的邻接部分(54),它定位于所述第二伸出的邻接部分的相对侧,并与所述第二伸出的邻接部分相适应。
3.如权利要求2所述的喷墨头,其特征在于,所述单元之一的凹入邻接部分和第三伸出的邻接部分分别与另一个所述单元的第一和第二伸出的邻接部分相抵邻接。
4.如权利要求1所述的喷墨头,其特征在于,所述各单元包括:
硅基板(71),其中形成喷嘴(1)、压力室2、墨汁通道3和墨池4;
振动片(5),它固定到所述硅基板上,以分割所述压力室、墨汁通道和墨池;
致动器(6),它固定到所述振动片上,每个致动器用于振动所述振动片与一个所述喷嘴对应的部分。
5.一种制造喷墨头的方法,其特征在于,包括以下步骤:
在基板(102)上形成多个单元;
使所述各单元互相分开;
通过结合至少两个所述单元,形成一个喷墨头。
6.如权利要求5所述的方法,其特征在于,形成所述单元的步骤包括以下各步:
在所述基板(71)内形成沿第一方向的边界部分(50)和喷嘴(1),所述边界将所述各单元分开;
在所述基板内形成压力室(2)、墨汁通道(3)和墨池(4);
将一振动片(5)粘附于所述基板上,以分割所述压力室、墨汁通道和墨池;
把致动器(6)粘附到所述振动片上。
7.如权利要求6所述的方法,其特征在于,形成所述边界和喷嘴的步骤采用光刻和干法蚀刻过程。
8.如权利要求6所述的方法,其特征在于,形成所述压力室、墨汁通道和墨池的步骤采用光刻和各向异性蚀刻过程。
9.如权利要求6所述的方法,其特征在于,所述分开步骤包括用切刀沿与所述第一方向垂直的第二方向切割所述基板的步骤。
10.如权利要求5所述的方法,其特征在于,所述单元形成步骤包含以下各步:
在所述基板(71)内形成沿第一方向的边界部分(50)和喷嘴(1),所述边界将所述各单元分开;
在所述基板内形成压力室(2)、墨汁通道(3)和墨池(4);
准备一个振动片(5),预先将致动器(6)粘附于其上;
将所述振动片(5)粘附于所述基板上,以分割所述压力室、墨汁通道和墨池。
11.如权利要求10所述的方法,其特征在于,形成所述边界和喷嘴的步骤采用光刻和干法蚀刻过程。
12.如权利要求10所述的方法,其特征在于,形成所述压力室、墨汁通道和墨池的步骤采用光刻和各向异性蚀刻过程。
13.如权利要求10所述的方法,其特征在于,所述分开步骤包括用切刀沿与所述第一方向垂直的第二方向切割所述基板的步骤。
14.如权利要求5所述的方法,其特征在于,所述每个单元包括:
第一伸出的邻接部分(51);
凹入的邻接部分(52),它定位于所述第一伸出的邻接部分的相对侧,并与所述第一伸出的邻接部分相适应;
第二伸出的邻接部分(53),在所述第一伸出的邻接部分的同侧;
第三伸出的邻接部分(54),它定位于所述第二伸出的邻接部分的相对侧,并与所述第二伸出的邻接部分相适应。
15.如权利要求14所述的方法,其特征在于,所述喷墨头形成步骤将所述各单元之一的凹入邻接部分和第三伸出邻接部分与另一个所述单元的第一和第二伸出邻接部分相抵邻接。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP078898/2000 | 2000-03-21 | ||
JP2000078898A JP2001260366A (ja) | 2000-03-21 | 2000-03-21 | インクジェット記録ヘッドおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1314252A true CN1314252A (zh) | 2001-09-26 |
CN1224512C CN1224512C (zh) | 2005-10-26 |
Family
ID=18596240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011036869A Expired - Fee Related CN1224512C (zh) | 2000-03-21 | 2001-02-09 | 具有多个单元的喷墨头及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6502921B2 (zh) |
EP (1) | EP1136269A3 (zh) |
JP (1) | JP2001260366A (zh) |
CN (1) | CN1224512C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100396491C (zh) * | 2002-10-31 | 2008-06-25 | 惠普开发有限公司 | 通过复式槽的流体循环系统 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AUPQ455999A0 (en) * | 1999-12-09 | 2000-01-06 | Silverbrook Research Pty Ltd | Memjet four color modular print head packaging |
US7152945B2 (en) * | 2000-12-07 | 2006-12-26 | Silverbrook Research Pty Ltd | Printhead system having closely arranged printhead modules |
AUPR224300A0 (en) * | 2000-12-21 | 2001-01-25 | Silverbrook Research Pty. Ltd. | An apparatus (mj72) |
US6824083B2 (en) * | 2001-06-12 | 2004-11-30 | Fuji Xerox Co., Ltd. | Fluid jetting device, fluid jetting head, and fluid jetting apparatus |
EP1423282B1 (en) * | 2001-09-06 | 2011-02-09 | Ricoh Company, Ltd. | Method of manufacturing a liquid drop discharge head |
US6953241B2 (en) | 2001-11-30 | 2005-10-11 | Brother Kogyo Kabushiki Kaisha | Ink-jet head having passage unit and actuator units attached to the passage unit, and ink-jet printer having the ink-jet head |
US6926382B2 (en) | 2002-04-25 | 2005-08-09 | Brother Kogyo Kabushiki Kaisha | Ink-jet head and ink-jet printer |
US6994428B2 (en) | 2002-05-21 | 2006-02-07 | Brother Kogyo Kabushiki Kaisha | Ink-jet printing head having a plurality of actuator units and/or a plurality of manifold chambers |
KR100428793B1 (ko) * | 2002-06-26 | 2004-04-28 | 삼성전자주식회사 | 잉크젯 프린터 헤드 및 그 제조 방법 |
JP2004337734A (ja) * | 2003-05-15 | 2004-12-02 | Seiko Epson Corp | 液体吐出ヘッド及びその製造方法 |
US6799830B1 (en) * | 2004-01-10 | 2004-10-05 | Xerox Corporation | Drop generating apparatus |
US6857722B1 (en) * | 2004-01-10 | 2005-02-22 | Xerox Corporation | Drop generating apparatus |
US7222937B2 (en) * | 2004-01-10 | 2007-05-29 | Xerox Corporation | Drop generating apparatus |
US6969146B2 (en) * | 2004-01-10 | 2005-11-29 | Xerox Corporation | Drop generating apparatus |
US20050151785A1 (en) * | 2004-01-10 | 2005-07-14 | Xerox Corporation. | Drop generating apparatus |
KR101224011B1 (ko) * | 2004-04-30 | 2013-01-21 | 후지필름 디마틱스, 인크. | 드롭렛 방출 장치 정렬 |
US7585423B2 (en) * | 2005-05-23 | 2009-09-08 | Canon Kabushiki Kaisha | Liquid discharge head and producing method therefor |
DE602006021236D1 (de) | 2006-04-28 | 2011-05-19 | Telecom Italia Spa | Tintenstrahldruckkopfplatte und herstellungsverfahren dafür |
US8118405B2 (en) * | 2008-12-18 | 2012-02-21 | Eastman Kodak Company | Buttable printhead module and pagewide printhead |
USD653284S1 (en) | 2009-07-02 | 2012-01-31 | Fujifilm Dimatix, Inc. | Printhead frame |
USD652446S1 (en) | 2009-07-02 | 2012-01-17 | Fujifilm Dimatix, Inc. | Printhead assembly |
US8517508B2 (en) | 2009-07-02 | 2013-08-27 | Fujifilm Dimatix, Inc. | Positioning jetting assemblies |
JP2013193265A (ja) | 2012-03-16 | 2013-09-30 | Fuji Xerox Co Ltd | 液滴吐出ヘッド及び液滴吐出ヘッドの製造方法 |
US10336074B1 (en) | 2018-01-18 | 2019-07-02 | Rf Printing Technologies | Inkjet printhead with hierarchically aligned printhead units |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4822755A (en) | 1988-04-25 | 1989-04-18 | Xerox Corporation | Method of fabricating large area semiconductor arrays |
US4878992A (en) | 1988-11-25 | 1989-11-07 | Xerox Corporation | Method of fabricating thermal ink jet printheads |
US5469199A (en) | 1990-08-16 | 1995-11-21 | Hewlett-Packard Company | Wide inkjet printhead |
JPH04251750A (ja) | 1991-01-28 | 1992-09-08 | Fuji Electric Co Ltd | インクジェット記録ヘッド |
US5160403A (en) | 1991-08-09 | 1992-11-03 | Xerox Corporation | Precision diced aligning surfaces for devices such as ink jet printheads |
JP3316597B2 (ja) | 1993-01-22 | 2002-08-19 | 富士通株式会社 | インクジェットヘッドの製造方法 |
US5956058A (en) | 1993-11-05 | 1999-09-21 | Seiko Epson Corporation | Ink jet print head with improved spacer made from silicon single-crystal substrate |
US5565900A (en) | 1994-02-04 | 1996-10-15 | Hewlett-Packard Company | Unit print head assembly for ink-jet printing |
US5572244A (en) | 1994-07-27 | 1996-11-05 | Xerox Corporation | Adhesive-free edge butting for printhead elements |
US5521125A (en) | 1994-10-28 | 1996-05-28 | Xerox Corporation | Precision dicing of silicon chips from a wafer |
DE4443254C1 (de) | 1994-11-25 | 1995-12-21 | Francotyp Postalia Gmbh | Anordnung für einen Tintendruckkopf aus einzelnen Tintendruckmodulen |
AUPN623795A0 (en) | 1995-10-30 | 1995-11-23 | Eastman Kodak Company | A modular lift print head |
US5719605A (en) | 1996-11-20 | 1998-02-17 | Lexmark International, Inc. | Large array heater chips for thermal ink jet printheads |
DE19743804A1 (de) | 1997-10-02 | 1999-04-08 | Politrust Ag | Druckvorrichtung |
-
2000
- 2000-03-21 JP JP2000078898A patent/JP2001260366A/ja active Pending
-
2001
- 2001-02-07 US US09/778,443 patent/US6502921B2/en not_active Expired - Lifetime
- 2001-02-09 CN CNB011036869A patent/CN1224512C/zh not_active Expired - Fee Related
- 2001-02-20 EP EP01104029A patent/EP1136269A3/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100396491C (zh) * | 2002-10-31 | 2008-06-25 | 惠普开发有限公司 | 通过复式槽的流体循环系统 |
Also Published As
Publication number | Publication date |
---|---|
EP1136269A3 (en) | 2001-10-04 |
US20010024217A1 (en) | 2001-09-27 |
JP2001260366A (ja) | 2001-09-25 |
US6502921B2 (en) | 2003-01-07 |
EP1136269A2 (en) | 2001-09-26 |
CN1224512C (zh) | 2005-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1314252A (zh) | 具有多个单元的喷墨头及其制造方法 | |
KR100671758B1 (ko) | 장치를 패턴화 하기 위한 방법 | |
CN1135168C (zh) | 喷墨打印头用喷嘴板构造及喷嘴板的制造方法 | |
CN1167126C (zh) | 散热器和用它的半导体激光装置及半导体激光叠层装置 | |
US20020175975A1 (en) | Inkjet recording head and method for manufacturing the same | |
CN1397093A (zh) | 柔性电子器件 | |
JP5694984B2 (ja) | 湾曲形状部分を有する薄膜の製造方法 | |
US20100156990A1 (en) | Liquid discharge head and method of manufacturing the liquid discharge head | |
CN1853257A (zh) | 在有机树脂材料中形成开口的改进方法 | |
US20110102516A1 (en) | Printhead unit | |
US20120001986A1 (en) | Nozzle plate and method for manufacturing the nozzle plate, and inkjet printer head with the nozzle plate | |
CN1294975A (zh) | 静电吸附式喷墨装置以及制造该装置的方法 | |
CN1294016C (zh) | 液体喷射器件用的基底及制造穿通基底的开口的方法 | |
US5512117A (en) | Charge plate fabrication process | |
CN111152559A (zh) | 喷墨打印喷嘴、喷墨打印头、喷墨打印装置及显示面板的制备方法 | |
CN1276523C (zh) | 发光二极管阵列 | |
CN1724258A (zh) | 包括与基板一体形成的过滤构件的喷墨头及其制造方法 | |
US20060000081A1 (en) | Manufacturing method for electronic device with functional thin film | |
WO2017172646A1 (en) | Gripper for semiconductor devices | |
CN1262014A (zh) | 包括由具有相同晶体结构和成长方向的材料制成的引晶部件和电显示部件的薄膜致动反射镜 | |
US20100134568A1 (en) | MEMS Device with Uniform Membrane | |
CN1625482A (zh) | 喷墨打印头的喷嘴防护装置 | |
CN1189319C (zh) | 静电机械驱动液体测微装置 | |
CN1787153A (zh) | 等离子体显示面板及其制造方法 | |
US7581825B2 (en) | Inkjet head and a method of manufacturing thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: FUJI XEROX CO., LTD. Free format text: FORMER OWNER: NIPPON ELECTRIC CO., LTD. Effective date: 20020530 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20020530 Address after: Tokyo, Japan Applicant after: Fuji Xerox Corp. Address before: Tokyo, Japan Applicant before: NEC Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051026 Termination date: 20150209 |
|
EXPY | Termination of patent right or utility model |