CN1312709C - Method for fixing a wire on a substrate and products made thereby - Google Patents
Method for fixing a wire on a substrate and products made thereby Download PDFInfo
- Publication number
- CN1312709C CN1312709C CNB2004100988027A CN200410098802A CN1312709C CN 1312709 C CN1312709 C CN 1312709C CN B2004100988027 A CNB2004100988027 A CN B2004100988027A CN 200410098802 A CN200410098802 A CN 200410098802A CN 1312709 C CN1312709 C CN 1312709C
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- substrate
- induction coil
- heating head
- control unit
- lead
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Abstract
The present invention discloses a method for fixing a conducting wire to a basal plate and a produce made in the method. In the method, the conducting wire is positioned on a heating head and a pattern for the arrangement of the conducting wire is drawn on the basal plate; a control unit is utilized to control the heating head or the basal plate to move according to the shape of the drawn pattern, and the temperature of the heating head can cause a high-temperature melting phenomenon on surface contacting points of the basal plate when the heating head contacts the basal plate; thereby, the conducting wire is melted and attached to a contacting position on the basal plate to further fix the conducting wire to the basal plate for sequentially forming devices, such as an induction coil, a mouse pad applying the induction coil, a hand-writing board, etc.
Description
Technical field
The present invention relates to a kind ofly, be specially adapted to make equipment such as induction coil, mouse pad, flexible circuit board and handwriting pad the method for lead fixed on substrate and the product made according to this.
Background technology
As shown in Figure 1, general traditional inductive circular loop A must cooperate tool to use during fabrication, and copper conductor is wound on the tool in regular turn layer by layer, makes closely contact between every layer the copper conductor, and then it is adhesively fixed, and then constitutes inductive circular loop.
Because this traditional inductive circular loop A, utilize the mode that tool twines to make, therefore, its shape is subjected to the restriction of tool, only can be wound in shapes such as circle, ellipse or rectangle, the induction coil that can't use becomes to have the space formula, thereby cause waste on the material, and make the effectiveness of inductive circular loop can't perform to maximum, can't promote competitiveness of product simultaneously.
In addition, also have another kind to utilize the formed signal transmission line of flexible circuit board in the market, such transmission line is applied on the electronics mostly, for example copying machines, foldable type mobile phone etc. need on the winding displacement of bending motion, its key is to utilize printing technology on a flexible circuit board, printed circuit on flexible circuit board; That is to say, this flexible circuit board is on making, must make egative film earlier, again egative film is exposed on the flexible circuit board, again via the step of printing copper material, can on flexible circuit board, form circuit, thereby in the process of negative film making and exposure, cause exposure not exclusively easily, or print phenomenon improperly, cause circuit breaker or short circuit, and influence the usefulness of flexible circuit board.
Summary of the invention
In view of above reason, the inventor is in view of above-mentioned problem such as all, so plentiful and substantial experiences such as the long-pending research of being engaged in this product for many years, design, manufacturing actively drop into a large amount of painstaking effort and energy and are ground wound, successfully develop a kind of with the manufacture method of lead fixed on substrate finally.
Main purpose of the present invention is: directly combine with substrate by lead, so just can produce frivolous and various shape, this lead also can be shaped according to the figure of being drawn on substrate simultaneously, therefore can generate irregular shape on substrate.
Another purpose of the present invention is: manufacture method makes on its mouse pad that is applied to exempt from the battery wireless mouse, handwriting pad, induction power supply, signal, luminous plaque and the flexible circuit board thus, and then the increase product competitiveness, also can create the next and replacement flexible circuit board of the product that newly goes out.
Another object of the present invention is: this lead fusion is fixed on the substrate, can have suitable gap between its lead, so not only can save material and usefulness can also be performed to maximum.
The invention provides a kind ofly with the method for lead fixed on substrate based on above-mentioned purpose, this method may further comprise the steps: lead is placed on the heating head, and draw out required line pattern on substrate; Utilize control unit control heating head to move or control basal plate moves, make heating head or substrate according under the line pattern of being drawn and the situation that substrate or heating head contact and move; The heating of heating head makes substrate produce fusing in the contact site; Route and substrate fusion that lead on the heating head is advanced according to heating head are fixing, and then make lead fixed in narrating on the substrate.
Control unit can also further be connected with drafting system or line design, after figure is completed in graphic plotting system or line design system, graphical information transfers to control unit, this moment, control unit was controlled moving of heating head according to graphical information, so that figure is drawn with lead.
Control unit can also further have drafting system or line design system, and control unit moves according to graphical information control heating head after graphic plotting is finished, so that design configuration is drawn with lead.
Adopt the made induction coil of method of the present invention, this induction coil adopts lead fixed is formed on organic plates.
Adopt the mouse pad of above-mentioned induction coil, wherein this mouse pad is the mouse pad of no battery mouse, and mouse pad is mid-induction coil.
Adopt the handwriting pad of above-mentioned induction coil, in this handwriting pad, be provided with induction coil and as the power induction element.
Adopt the luminous plaque of above-mentioned induction coil, wherein inductive circular loop places luminous plaque and as sensing element.
Adopt the made flexible circuit board of method of the present invention, wherein wire-bonds forms flexible circuit board on substrate.
Adopt the made signal line of method of the present invention, wherein wire-bonds forms signal line on substrate.
Description of drawings
Figure 1 shows that the schematic diagram of habitual induction coil;
Figure 2 shows that schematic flow sheet of the present invention;
Figure 3 shows that the schematic diagram of the first embodiment of the present invention;
Figure 4 shows that the schematic diagram of the second embodiment of the present invention;
Figure 5 shows that the schematic diagram of the third embodiment of the present invention;
Figure 6 shows that second flow process signal circle of the present invention.
Embodiment
In order to further specify and implement content of the present invention, and realize the effect that the present invention can reach, provide in conjunction with the accompanying drawings at this and be described in detail as follows:
Of the present invention with the manufacture method of lead fixed on substrate.According to Figure of description Fig. 2 and shown in Figure 3, its manufacture process is earlier lead 10 to be placed on the heating head, lead 10 is heated, while is also drawn the figure that a lead 10 is arranged, control heating head utilizing a control unit, make this heating head contact and move with substrate 20 according to the route of institute's graphing, heating through heating head, make its substrate 20 produce the effect of fusing with the contact site of heating head, and the route and substrate 20 fusions that make lead 10 advance according to heating head are fixed, and then lead 10 is combined on the substrate 20, and it is identical with the shape of formed figure on the substrate 20, and then constitute an inductive circular loop 30 or a flexible circuit board, be embodiment with inductive circular loop 30 in this application.
Yet, substrate 20 in the present invention mainly is that employing is embodiment with the plastic plate, therefore on substrate 20, contact and carry out when mobile when heating head, make substrate 20 produce the phenomenon of fusing at the position of contact, it is fixing to make that lead 10 is able to substrate 20 fusions, therefore the thickness of this substrate 20 can significantly reduce, and then reduction inductive circular loop 30 thicknesss after forming, replacing traditional inductive circular loop and flexible circuit board, and be applied to not have on the equipment such as mouse pad, handwriting pad, induction power supply, signal, luminous plaque and flexible circuit board of wireless mouse of battery.
In addition, because the motion of this heating head is controlled its direction of motion by control unit, this control unit then is to drive according to the figure of being drawn, therefore, when the figure of being drawn be irregular or between during the shape in tool space, can make form on the substrate 20 have irregular or between have the lead 10 in space.So the difference of visual use occasion, and carry out the drafting of figure, and so create the electronic product that makes new advances, and it is meticulousr that electronic product is able to, can also save material and improve device efficiency.
Again as shown in Figure 4 and Figure 5, be to be applied to not have this inductive circular loop 30 in the mouse pad 40 of battery wireless mouse, or make heart, make its this substrate 20 be able to be shaped along with the difference of product, and make lead 10 on substrate 20, produce various variations according to the variation of product, can be applicable on the different products, and make the pattern of product innovate novelty more.
Moreover as shown in Figure 6, also may command substrate of this control unit wherein, and make substrate move according to the figure of being drawn, and make lead utilize heating head on substrate, to be shaped, and reach the moulding of finished product.And this control unit further is connected with graphic plotting system or line design system, after the graphic plotting system finishes graphic plotting, graphical information can be sent to control unit, and control unit is according to the direction of motion of graphical information and then control heating head or substrate; Also can, directly utilize control unit control heating head and substrate to move after external drawing software is finished its graphic designs.
Mentioned above sets for conveniently describing technology contents of the present invention, but not in order to limit interest field of the present invention; Be with, the equivalence element conversion of being done according to the invention spirit of this case such as, substitute, all be encompassed in the protection range of this case.
Claims (18)
1, a kind of with the method for lead fixed on substrate, this method may further comprise the steps:
A, lead is placed on the heating head, on substrate, draw out required line pattern in advance;
B, utilize control unit control heating head to move, make heating head according under the situation of line pattern of being drawn and substrate contacts and move;
The heating of c, heating head makes substrate produce fusing in the contact site;
Lead on d, the heating head will be fixing according to route and substrate fusion that heating head is advanced, and then make lead fixed on described substrate.
2, method according to claim 1, wherein control unit further is connected with drafting system or line design system, after figure is completed in graphic plotting system or line design system, graphical information is transferred to control unit, this moment, control unit was controlled moving of heating head according to graphical information, so that figure is drawn with lead.
3, method according to claim 1, wherein control unit further has drafting system or line design system, and control unit moves according to graphical information control heating head after graphic plotting is finished, so that design configuration is drawn with lead.
4, a kind ofly adopt the made induction coil of any one method in the claim 1 to 3, this induction coil adopts lead fixed is formed on organic plates.
5, a kind ofly adopt the induction coil described in the claim 4, wherein this mouse pad is the mouse pad of no battery mouse, and mouse pad is mid-described induction coil.
6, a kind ofly adopt the induction coil described in the claim 4, in this handwriting pad, be provided with described induction coil and as the power induction element.
7, a kind ofly adopt the induction coil described in the claim 4, wherein said induction coil places luminous plaque and as sensing element.
8, a kind ofly adopt the made flexible circuit board of any one method in the claim 1 to 3, wherein wire-bonds forms flexible circuit board on substrate.
9, a kind ofly adopt the made signal line of any one method in the claim 1 to 3, wherein wire-bonds forms signal line on substrate.
10, a kind of with the method for lead fixed on substrate, this method may further comprise the steps:
Aa, lead is placed on the heating head, and on substrate, draw out required line pattern;
Bb, utilize control unit to control the substrate that is painted with figure on it to move, make substrate according to the line pattern of being drawn and with situation that heating head contacts under move;
The heating of cc, heating head makes substrate produce fusing in the contact site;
Route and substrate fusion that the lead of dd, heating head is advanced according to substrate are fixing, and then make lead fixed on described substrate.
11, method according to claim 10, wherein control unit further is connected with drafting system or line design system, after figure is completed in graphic plotting system or line design system, graphical information transfers to control unit, this moment, control unit was according to the moving of graphical information control basal plate, so that figure is drawn out with lead.
12, method according to claim 10, wherein control unit further has drafting system or line design system, and control unit moves according to the graphical information control basal plate after graphic plotting is finished, so that the figure of design is drawn with lead.
13, a kind ofly adopt the made induction coil of any one method in the claim 10 to 12, this induction coil adopts lead fixed is formed on organic plates.
14, a kind ofly adopt the induction coil described in the claim 13, wherein this mouse pad is the mouse pad of no battery mouse, and mouse pad is mid-described induction coil.
15, a kind ofly adopt the induction coil described in the claim 13, in this handwriting pad, be provided with described induction coil and as the power induction element.
16, a kind ofly adopt the induction coil described in the claim 13, wherein said induction coil places luminous plaque and as sensing element.
17, a kind ofly adopt the made flexible circuit board of any one method in the claim 10 to 12, wherein wire-bonds forms flexible circuit board on substrate.
18, a kind ofly adopt the made signal line of any one method in the claim 10 to 12, wherein wire-bonds forms signal line on substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100988027A CN1312709C (en) | 2004-12-16 | 2004-12-16 | Method for fixing a wire on a substrate and products made thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100988027A CN1312709C (en) | 2004-12-16 | 2004-12-16 | Method for fixing a wire on a substrate and products made thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1622238A CN1622238A (en) | 2005-06-01 |
| CN1312709C true CN1312709C (en) | 2007-04-25 |
Family
ID=34766676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100988027A Expired - Fee Related CN1312709C (en) | 2004-12-16 | 2004-12-16 | Method for fixing a wire on a substrate and products made thereby |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1312709C (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4696096A (en) * | 1986-02-21 | 1987-09-29 | Micro Electronic Systems, Inc. | Reworking methods and apparatus for surface mounted technology circuit boards |
| US4864723A (en) * | 1986-07-01 | 1989-09-12 | Preleg, Inc. | Electrical circuit modification method |
| CN1362852A (en) * | 2002-02-05 | 2002-08-07 | 威盛电子股份有限公司 | Method for forming conductor post |
| JP2003105522A (en) * | 2001-10-02 | 2003-04-09 | Yazaki Corp | Method and device for plating |
| JP2004266045A (en) * | 2003-02-28 | 2004-09-24 | Mitsubishi Electric Corp | Lamination lay-up device, method and heating head for printed circuit board |
-
2004
- 2004-12-16 CN CNB2004100988027A patent/CN1312709C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4696096A (en) * | 1986-02-21 | 1987-09-29 | Micro Electronic Systems, Inc. | Reworking methods and apparatus for surface mounted technology circuit boards |
| US4864723A (en) * | 1986-07-01 | 1989-09-12 | Preleg, Inc. | Electrical circuit modification method |
| JP2003105522A (en) * | 2001-10-02 | 2003-04-09 | Yazaki Corp | Method and device for plating |
| CN1362852A (en) * | 2002-02-05 | 2002-08-07 | 威盛电子股份有限公司 | Method for forming conductor post |
| JP2004266045A (en) * | 2003-02-28 | 2004-09-24 | Mitsubishi Electric Corp | Lamination lay-up device, method and heating head for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1622238A (en) | 2005-06-01 |
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Granted publication date: 20070425 Termination date: 20101216 |