CN1309049C - Method of manufacturing flash memory devices - Google Patents
Method of manufacturing flash memory devices Download PDFInfo
- Publication number
- CN1309049C CN1309049C CNB2004100565681A CN200410056568A CN1309049C CN 1309049 C CN1309049 C CN 1309049C CN B2004100565681 A CNB2004100565681 A CN B2004100565681A CN 200410056568 A CN200410056568 A CN 200410056568A CN 1309049 C CN1309049 C CN 1309049C
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- CN
- China
- Prior art keywords
- film
- polysilicon
- polysilicon film
- oxidation
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 54
- 229920005591 polysilicon Polymers 0.000 claims abstract description 54
- 238000007667 floating Methods 0.000 claims abstract description 35
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 150000004767 nitrides Chemical class 0.000 claims abstract description 18
- 229910021426 porous silicon Inorganic materials 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000000059 patterning Methods 0.000 claims abstract description 5
- 230000003647 oxidation Effects 0.000 claims description 34
- 230000004888 barrier function Effects 0.000 claims description 19
- 238000011282 treatment Methods 0.000 claims description 12
- 230000000052 comparative effect Effects 0.000 claims description 5
- 238000009279 wet oxidation reaction Methods 0.000 claims description 3
- 239000008151 electrolyte solution Substances 0.000 claims description 2
- 238000002955 isolation Methods 0.000 abstract 4
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 description 3
- 229910021342 tungsten silicide Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
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- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Abstract
Disclosed is a method of manufacturing flash memory devices. According to the present invention, the method comprises the steps of sequentially forming a gate oxide film, a first polysilicon film for a floating gate electrode and a pad nitride film on a semiconductor substrate, patterning the gate oxide film, the first polysilicon film, the pad nitride film and the semiconductor substrate by a given thickness to form an isolation film pattern and a floating gate electrode pattern at the same time, filling the isolation film pattern with an insulating film to form an isolation film and then stripping the pad nitride film, sequentially forming a dielectric film, a second polysilicon film for a control gate electrode and a metal silicide film on the results, patterning the metal silicide film and the second polysilicon film to form a control gate electrode pattern, performing an electrochemical process for the results, whereby the first polysilicon film formed in regions other than the region where the second polysilicon film formed on the isolation film and the floating gate electrode pattern are formed becomes a porous silicon film, performing a thermal oxidization process for the results so that the porous silicon film becomes a first oxide film, and forming a second oxide film on the whole results.
Description
Technical field
The present invention relates to a kind of method of making semiconductor device, more particularly, relate to a kind of method of making flash memory device.
Background technology
A kind of method of gate electrode in flash memory device that form is categorized as, a kind of method and a kind of method that forms the control gate electrode that forms the floating grid electrode.For satisfying the coupling ratio of floating grid electrode, must increase the surf zone of first polysilicon film that becomes the floating grid electrode.At this moment, the method that increases the surf zone of first polysilicon film comprises, the method for a kind of method of width of increase by first polysilicon film and the thickness of a kind of increase by first polysilicon film.Traditionally, use the method for the width (" a " among Fig. 1) that increases by first polysilicon film usually.
Yet, must increase the interval between active region and the active region if the width of first polysilicon film increases.Therefore, have following problem: the width that is formed at the barrier film in the active region can increase, thereby increases cell size.
At this, need be in order to form the technology of first polysilicon film, to be used for the reducing floating grid electrode that cell size satisfies the coupling ratio of floating grid electrode simultaneously.
Summary of the invention
Therefore, consider above problem and implement the present invention, and the purpose of this invention is to provide a kind of method of making flash memory device, wherein form and can be used for reducing first polysilicon film of floating grid electrode that cell size satisfies the coupling ratio of floating grid electrode simultaneously.
For reaching above purpose, according to preferred specific embodiment of the present invention, a kind of method of making flash memory device is provided, and it may further comprise the steps: form first polysilicon film of oxidation film of grid, floating grid electrode and pad nitride film in order on semiconductor substrate; Patterning grid oxidation film, first polysilicon film, pad nitride film and semiconductor substrate reach a given thickness, to form barrier film pattern and floating grid electrode pattern simultaneously; Adopt dielectric film to fill the barrier film pattern to form barrier film and to follow the release liner nitride film; Form dielectric film, second polysilicon film of controlling gate electrode and metal silicide film in order on resulting structures; The pattern metal silicide film and second polysilicon film are to form control grid electrode pattern; Carry out electrochemical treatments at resulting structures, feasible second polysilicon film that is positioned on this barrier film, and first polysilicon film first polysilicon film in being formed at this floating grid electrode pattern becomes porous silicon film; Carry out thermal oxidation so that this porous silicon film becomes first oxidation film at resulting structures; And form second oxidation film on whole resulting structures.
First polysilicon film that wherein forms porous silicon film is preferably the film that is formed between the floating grid electrode pattern.
Second oxidation film is preferably the dielectric film between the control grid electrode pattern.
Be preferably in the state that the semiconductor substrate that will form the control gate electrode is installed among the operation unit and carry out electrochemical treatments down.
Operation unit preferably includes with semiconductor substrate and reaches reference electrode and comparative electrode to set a distance at interval; Be radiated at the ultraviolet light on the semiconductor substrate; And being filled in the operation unit, so that the electrolytic solution of the given area of submergence reference electrode and comparative electrode.
It is about 700 to 900 ℃ H that thermal oxidation preferably includes in temperature range
2And O
2Carrying out wet oxidation under the gas atmo condition handles.
First polysilicon film is preferably formed as the thickness into about 1350 .
Description of drawings
Fig. 1 is for showing the allocation plan of conventional flash memory device;
Fig. 2 is for showing the allocation plan according to flash memory device of the present invention;
Fig. 3 A to Fig. 7 A is the sectional drawing of the flash memory device got along the line A-A ' of Fig. 1, and it is in order to explain the method for making flash memory device; And
Fig. 3 B to Fig. 7 B is the sectional drawing of the flash memory device got along the line B-B ' of Fig. 1, and it is in order to explain the method for making flash memory device.
The simple symbol explanation
10 semiconductor substrates
12 oxidation film of grid
14 first polysilicon films
16 barrier films
18 ONO dielectric films
20 second polysilicon films
22 tungsten silicide films
24 nitride films
26 porous silicon films
28 first oxidation films
30 second oxidation films
Embodiment
With reference now to description of drawings foundation preferred specific embodiment of the present invention.Because provide preferred specific embodiment because of allowing those skilled in the art can understand purpose of the present invention, thus can adopt multiple mode to revise those preferred specific embodiments, and also category of the present invention is not limited to preferred specific embodiment described below.
Simultaneously, its be described as a film " " under the situation on another film or the semiconductor substrate, this film can directly contact another film or semiconductor substrate.Perhaps, tertiary membrane can be inserted between a film and another film or the semiconductor substrate.In addition, in the accompanying drawings, be the thickness and the size that conveniently explain orally and each layer amplified in clarification.With same reference numbers to discern identical or like parts.
Fig. 2 is for showing the allocation plan according to flash memory device of the present invention, Fig. 3 A to Fig. 7 A is the sectional drawing of the flash memory device got along the line A-A ' of Fig. 1, it is in order to explain the method for making flash memory device, and Fig. 3 B to Fig. 7 B is the sectional drawing of the flash memory device got along the line B-B ' of Fig. 1, and it is in order to explain the method for making flash memory device.
With reference to figure 3A and Fig. 3 B, form first polysilicon film 14 of oxidation film of grid 12, floating grid electrode and pad nitride film (not shown) in order on the semiconductor substrate 10 that is fabricated from a silicon.The photoresist pattern is formed in the presumptive area on the pad nitride film (not shown).Adopt the photoresist pattern as the etching photomask, each film or the substrate of pad nitride film (not shown), first polysilicon film 14, oxidation film of grid 12 and semiconductor substrate 10 are etched into given thickness, thereby form the barrier film pattern simultaneously in non-active region, and the floating grid electrode pattern is in active region.
Simultaneously, if the width (width in the non-active region, i.e. " b " among Fig. 1) of traditional barrier film pattern is 120nm, then the width of first polysilicon film of floating grid electrode pattern (width in the active region, i.e. " a " among Fig. 1) is 90nm.That is pitch size is 210nm.In the present invention, can make the width (" d " among Fig. 3 A) of barrier film pattern, and the width of first polysilicon film of floating grid electrode pattern (" c " among Fig. 3 A) is similarly 90nm.Because pitch size can be reduced to 180nm, so can reduce cell size.
In addition, the thickness that becomes first polysilicon film of floating grid electrode pattern is 1000 traditionally, and the thickness (" e " among Fig. 3 A) that becomes first polysilicon film 14 of floating grid electrode pattern in the present invention is 1350 .Though it is the width of prior art and first polysilicon film of the present invention is identical, thicker than first polysilicon of prior art according to first polysilicon of the present invention.As a result, the surf zone according to first polysilicon film of the present invention increases a lot of than prior art.Coupling ratio of the present invention is better than prior art.
Then, carry out oxidation processes, thereby form side wall oxide film (not shown), with the sidewall of protection barrier film pattern at resulting structures.Then adopt oxide material (for example HDP oxidation film) to fill the barrier film pattern, to form barrier film 16.Then peel off remaining pad nitride film (not shown).
With reference to figure 4A and Fig. 4 B, second polysilicon film 20, tungsten silicide film 22 and the pad nitride film 24 that form ONO dielectric film 18, control gate electrode in order are on the resulting structures that wherein forms barrier film 16.
With reference to figure 5A and Fig. 5 B, photoresist pattern (not shown) is formed in the presumptive area of nitride film 24.Adopt the photoresist pattern as the etching photomask, nitride etching film 24, tungsten silicide film 22 and second polysilicon film 20, thus form control grid electrode pattern.
With reference to figure 6A and Fig. 6 B, carry out electrochemical treatments at resulting structures, feasible second polysilicon film 20 that is positioned on the barrier film 16, and first polysilicon film 14 first polysilicon film in being formed at the floating grid electrode pattern becomes porous silicon film 26.
Simultaneously, optionally carry out electrochemical treatments at barrier film 16 and oxidation film of grid 12.Two films 12 and 16 stop layers as electrochemical treatments.
Simultaneously, electrochemical treatments makes polysilicon film become the processing of porous silicon film.Under being installed on state in the operation unit of carrying out electrochemical treatments, the semiconductor substrate that will form the control gate electrode carries out this processing.
Operation unit makes the palladium electrode and the hydrogen electrode of conduct with reference to electrode as comparative electrode, can be immersed in the electrolyte under the state of palladium electrode and hydrogen electrode and semiconductor substrate maintenance preset distance; And make voltage can put on the behind of semiconductor substrate.
Electrolyte comprises wherein with the solution to constant volume mixing HF and ethanol.Ultraviolet light is radiated on the operation unit.
Therefore, rely on the electrochemical electrochemical treatments of carrying out in the operation unit, polysilicon film can become porous silicon film.
With reference to figure 7A and Fig. 7 B,, carry out thermal oxidation, thereby make porous silicon film 26 become first oxidation film 28 at the porous silicon film 26 that forms by electrochemical treatments.It is about 700 to 900 ℃ H that thermal oxidation is included in temperature range
2And O
2Carrying out wet oxidation under the atmosphere handles.First oxidation film 28 becomes the dielectric film that insulate between the floating grid electrode pattern.Second oxidation film 30 be formed at whole resulting structures on, thereby finish processing thereafter.Second oxidation film 30 becomes the dielectric film that insulate between control grid electrode pattern.
Simultaneously, will control the grid electrode pattern and floating grid electrode pattern adequate relief is formed in the neighboring area, those zones are for being different from the zone that wherein forms the unit area of control grid electrode pattern and floating grid electrode pattern.Can further carry out following processing: return etching second oxidation film and first oxidation film, on the sidewall of electrode pattern, to form at interval.At this moment, when returning etch processes, when etching first oxidation film 28 and second oxidation film 30, can prevent that second oxidation film from suffering over etching because of nitride film 24 with the formation interval.
According to the present invention of above explanation, mat then increases the thickness of first polysilicon film of floating grid electrode, can increase the surf zone of floating grid electrode.Therefore can reduce cell size, satisfy the coupling ratio of floating grid electrode simultaneously.
In addition, see through electrochemical treatments and thermal oxidation, being formed at first polysilicon film between the floating grid electrode, that have increase thickness can become the insulation oxide film.Therefore can in the zone between the pattern of narrower floating grid electrode, prevent short circuit.It is hereby ensured the increase zone of floating grid electrode.Therefore the present invention has following effect: it can reduce cell size, reduces the coupling ratio of floating grid electrode simultaneously.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with accompanying Claim the person of being defined be as the criterion.
Claims (7)
1, a kind of method of making flash memory device, it may further comprise the steps:
On the semiconductor substrate, form an oxidation film of grid, one first polysilicon film and a pad nitride film as the floating grid electrode in order;
This grid oxidation film of patterning, this first polysilicon film, this pad nitride film and this semiconductor substrate reach a given thickness, to form a barrier film pattern and a floating grid electrode pattern simultaneously;
Adopt a dielectric film to fill this barrier film pattern forming a barrier film, and then peel off this pad nitride film;
On resulting structures, form a dielectric film, one second polysilicon film and a metal silicide film as the control gate electrode in order;
This metal silicide film of patterning and this second polysilicon film are to form a control grid electrode pattern;
Carry out an electrochemical treatments at resulting structures, feasible second polysilicon film that is positioned on this barrier film, and first polysilicon film first polysilicon film in being formed at this floating grid electrode pattern becomes porous silicon film;
Carry out a thermal oxidation at resulting structures, so that this porous silicon film becomes one first oxidation film; And
On whole resulting structures, form one second oxidation film.
2, method as claimed in claim 1, wherein, this first polysilicon film that becomes this porous silicon film is this first polysilicon film that is formed between those floating grid electrode patterns.
3, method as claimed in claim 1, wherein this second oxidation film is the dielectric film between those control grid electrode patterns.
4, method as claimed in claim 1 wherein is installed at this semiconductor substrate that will form this control gate electrode and carries out this electrochemical treatments under the state in the operation unit.
5, method as claimed in claim 4, wherein this operation unit comprises:
One reference electrode and a comparative electrode, itself and this semiconductor substrate reach one at interval and give set a distance;
Ultraviolet light, it is radiated on this semiconductor substrate; And
One electrolytic solution, it is filled in this operation unit so that the given area of this reference electrode of submergence and this comparative electrode.
6, method as claimed in claim 1, wherein to be included in a temperature range be 700 to 900 ℃ H to this thermal oxidation
2And O
2Carrying out a wet oxidation under the atmosphere handles.
7, method as claimed in claim 1, wherein this first polysilicon film thickness is about 1350 .
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0062073A KR100537278B1 (en) | 2003-09-05 | 2003-09-05 | Method of manufacturing in flash memory devices |
| KR62073/03 | 2003-09-05 | ||
| KR62073/2003 | 2003-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1591831A CN1591831A (en) | 2005-03-09 |
| CN1309049C true CN1309049C (en) | 2007-04-04 |
Family
ID=33516455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100565681A Expired - Fee Related CN1309049C (en) | 2003-09-05 | 2004-08-10 | Method of manufacturing flash memory devices |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6835620B1 (en) |
| JP (1) | JP4624014B2 (en) |
| KR (1) | KR100537278B1 (en) |
| CN (1) | CN1309049C (en) |
| DE (1) | DE102004031516A1 (en) |
| TW (1) | TWI255016B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006302950A (en) * | 2005-04-15 | 2006-11-02 | Renesas Technology Corp | Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device |
| KR100751687B1 (en) * | 2005-06-30 | 2007-08-23 | 주식회사 하이닉스반도체 | Manufacturing Method of Flash Memory Device |
| JP5526162B2 (en) * | 2012-01-16 | 2014-06-18 | ルネサスエレクトロニクス株式会社 | Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device |
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| CN1262998A (en) * | 1999-02-10 | 2000-08-16 | 李韫言 | Hot-air ink-jet printing head with high heat-transferring efficiency |
| US6180454B1 (en) * | 1999-10-29 | 2001-01-30 | Advanced Micro Devices, Inc. | Method for forming flash memory devices |
| US6437417B1 (en) * | 2000-08-16 | 2002-08-20 | Micron Technology, Inc. | Method for making shallow trenches for isolation |
| CN1428846A (en) * | 2001-12-22 | 2003-07-09 | 海力士半导体有限公司 | Method for making flashing storage element |
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| JPS5177079A (en) * | 1974-12-27 | 1976-07-03 | Fujitsu Ltd | HANDOTAISOCHINOSEIZOHOHO |
| JPS5389375A (en) * | 1977-01-17 | 1978-08-05 | Nec Corp | Production of semiconductor device |
| JPS5544725A (en) * | 1978-09-27 | 1980-03-29 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor device and its manufacture |
| JPS61176114A (en) * | 1985-01-31 | 1986-08-07 | Fujitsu Ltd | Manufacturing method of semiconductor device |
| JP3207505B2 (en) * | 1992-03-27 | 2001-09-10 | 株式会社半導体エネルギー研究所 | Manufacturing method of porous silicon member |
| JPH07235691A (en) * | 1994-02-24 | 1995-09-05 | Nippon Steel Corp | Light emitting element |
| JPH07288337A (en) * | 1994-04-15 | 1995-10-31 | Nippon Steel Corp | Light emitting element |
| US5510633A (en) * | 1994-06-08 | 1996-04-23 | Xerox Corporation | Porous silicon light emitting diode arrays and method of fabrication |
| US5599727A (en) * | 1994-12-15 | 1997-02-04 | Sharp Kabushiki Kaisha | Method for producing a floating gate memory device including implanting ions through an oxidized portion of the silicon film from which the floating gate is formed |
| JP3344162B2 (en) * | 1995-04-28 | 2002-11-11 | ソニー株式会社 | Method for manufacturing field effect semiconductor device |
| JP3490903B2 (en) * | 1997-09-11 | 2004-01-26 | Ｋｄｄｉ株式会社 | Semiconductor light emitting device and method of manufacturing the same |
| JP3867378B2 (en) * | 1997-12-09 | 2007-01-10 | ソニー株式会社 | Manufacturing method of semiconductor nonvolatile memory device |
| US6635914B2 (en) * | 2000-09-08 | 2003-10-21 | Axon Technologies Corp. | Microelectronic programmable device and methods of forming and programming the same |
| JP4423576B2 (en) * | 1998-12-10 | 2010-03-03 | 富士通マイクロエレクトロニクス株式会社 | Semiconductor memory device and manufacturing method thereof |
| JP2000223596A (en) * | 1999-02-03 | 2000-08-11 | Sony Corp | Semiconductor nonvolatile storage device and its manufacture |
| AU3263001A (en) * | 1999-11-17 | 2001-05-30 | Neah Power Systems, Inc. | Fuel cells having silicon substrates and/or sol-gel derived support structures |
| JP4109845B2 (en) * | 2001-08-10 | 2008-07-02 | 株式会社東芝 | Method for manufacturing nonvolatile semiconductor memory device |
| KR100436289B1 (en) * | 2002-07-18 | 2004-06-16 | 주식회사 하이닉스반도체 | Gate structure of flash memory cell and method of forming the same and method of forming dielectric layer |
-
2003
- 2003-09-05 KR KR10-2003-0062073A patent/KR100537278B1/en not_active IP Right Cessation
-
2004
- 2004-06-28 JP JP2004189668A patent/JP4624014B2/en not_active Expired - Fee Related
- 2004-06-29 DE DE102004031516A patent/DE102004031516A1/en not_active Withdrawn
- 2004-06-30 TW TW093119289A patent/TWI255016B/en not_active IP Right Cessation
- 2004-06-30 US US10/881,461 patent/US6835620B1/en not_active Expired - Lifetime
- 2004-08-10 CN CNB2004100565681A patent/CN1309049C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1262998A (en) * | 1999-02-10 | 2000-08-16 | 李韫言 | Hot-air ink-jet printing head with high heat-transferring efficiency |
| US6180454B1 (en) * | 1999-10-29 | 2001-01-30 | Advanced Micro Devices, Inc. | Method for forming flash memory devices |
| US6437417B1 (en) * | 2000-08-16 | 2002-08-20 | Micron Technology, Inc. | Method for making shallow trenches for isolation |
| CN1428846A (en) * | 2001-12-22 | 2003-07-09 | 海力士半导体有限公司 | Method for making flashing storage element |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102004031516A1 (en) | 2005-03-31 |
| KR20050024852A (en) | 2005-03-11 |
| CN1591831A (en) | 2005-03-09 |
| TW200516724A (en) | 2005-05-16 |
| KR100537278B1 (en) | 2005-12-19 |
| TWI255016B (en) | 2006-05-11 |
| JP2005086198A (en) | 2005-03-31 |
| JP4624014B2 (en) | 2011-02-02 |
| US6835620B1 (en) | 2004-12-28 |
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Granted publication date: 20070404 Termination date: 20130810 |