CN1305404A - Method and device for cleaning printed circuit board mask or printed circuit board - Google Patents
Method and device for cleaning printed circuit board mask or printed circuit board Download PDFInfo
- Publication number
- CN1305404A CN1305404A CN99807159A CN99807159A CN1305404A CN 1305404 A CN1305404 A CN 1305404A CN 99807159 A CN99807159 A CN 99807159A CN 99807159 A CN99807159 A CN 99807159A CN 1305404 A CN1305404 A CN 1305404A
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- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- mask
- jet flow
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/02—Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other
- B24C3/04—Abrasive blasting machines or devices; Plants characterised by the arrangement of the component assemblies with respect to each other stationary
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/083—Evaporation or sublimation of a compound, e.g. gas bubble generating agent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning In General (AREA)
Abstract
A method and device are proposed for removing agents, in particular fluxes, adhesives or solder paste, which are adhering to a surface of a printed-circuit board mask or to a surface of a printed-circuit board in which the components may or may not have been inserted. The agents are removed by blasting at least one area of the surface of the printed-circuit board mask or of the printed-circuit board with at least one cleaning jet which contains carbon dioxide particles. The carbon dioxide particles are produced by shaving from a solid carbon dioxide body.
Description
The present invention relates to remove the method that sticks to adhesive agent on the printed circuit board (PCB) mask surface, relate to and remove the method that sticks to adhesive agent on the printed circuit board surface and relate to removing and stick on the printed circuit board (PCB) mask surface or the device of adhesive agent on the printed circuit board surface.
Electronics or electric circuit have the electric or electronic device that is electrically connected to each other.These cell configuration are on so-called printed circuit board (PCB).Printed circuit board (PCB) has the electrical cable that device is electrically connected mutually.These connecting lines are by printing formation at circuit board.Electrical cable is formed on a side of printed circuit board (PCB).And cell configuration is on a side opposite with printed wire of printed circuit board (PCB), and the connector lug of device passes the through hole on the printed circuit board (PCB).Then with the connector lug soldering on line suitable on the printed circuit board (PCB).
These devices automatically are welded on the printed circuit board (PCB) basically.For this reason, the welding operation that all connector lugs of these devices are welded on the printed circuit board (PCB) is carried out in the known manner basically simultaneously.This welding operation is also referred to as " wave soldering ".
For carrying out the wave soldering that has inserted the printed circuit board (PCB) of these devices on it, earlier all devices are inserted on the printed circuit board (PCB).Make the connector lug of device protrude from the downside of printed circuit board (PCB) partly, make the surface of this downside of the printed circuit board (PCB) that is inserted with device, make the suitable tie point on this scolder contact connector lug and the printed circuit board (PCB) near liquid solder.In the connection that just forms after the solder solidification between device and the printed circuit board (PCB) conductive path.
The prerequisite that adopts this method is that device will be configured on the printed circuit board (PCB) solid and reliablely, makes that when processing is inserted with the printed circuit board (PCB) of device they can not leave the position of its regulation.
With bonding agent device is bonded on the printed circuit board (PCB) and just can accomplishes this point.For this reason, bonding agent is coated in the appropriate section of printed circuit board (PCB).This bonding agent will solidify quite rapidly, to guarantee that above-mentioned device is just stiff after suitable device is inserted printed circuit board (PCB).Can automatically quite at high speed device be inserted printed circuit board (PCB) according to this mode.
As already explained, bonding agent only is coated in the appropriate location of printed circuit board (PCB).Utilize so-called printed circuit board (PCB) mask that bonding agent is coated on the printed circuit board (PCB).The printed circuit board (PCB) mask has perforate, and bonding agent can enter or enter printed circuit board (PCB) by this perforate.
After coating bonding agent on the printed circuit board (PCB), device is inserted printed circuit board (PCB).
Because bonding agent at a good pace solidifies, so there is such problem, promptly remaining bonding agent adheres on the perforated wall of printed circuit board (PCB) mask always, and the result is no longer to guarantee and bonding agent correctly can be coated on the printed circuit board (PCB).In addition, also have such problem, promptly bonding agent may be pulled away from printed circuit board (PCB) when removing the printed circuit board (PCB) mask.
With the solvent clean printed circuit board (PCB) mask that comprises hydrocarbon is well-known, particularly cleans with ethanol.Cleaning operation needs to carry out in specially designed place, because the danger of blast is arranged when cleaning with the solvent that comprises hydrocarbon.Therefore cleaning operation can not be incorporated in the production procedure of circuit.
And bonding agent is coated with to such an extent that incorrect printed circuit board (PCB) also needs to clean, and then turns back in the production procedure of circuit.Still adopt the solvent clean printed circuit board (PCB) that comprises hydrocarbon so far.And, do not wish to adopt the cleaning solvent that comprises hydrocarbon from the viewpoint of contaminated environment yet.
Except that above-mentioned wave soldering and, also adopt so-called Reflow Soldering connection that device is connected in printed circuit board (PCB).For this reason, need solder(ing) paste is coated on the tie point between device and the printed circuit board (PCB).Printed circuit board (PCB) is heat-treated with device and solder(ing) paste, and this solder(ing) paste dissolves in heat treatment.Also can utilize the printed circuit board (PCB) mask to smear solder(ing) paste.Therefore these printed circuit board (PCB) masks also must clean.This cleaning also be applicable on printed circuit board (PCB) solder(ing) paste be coated with the cleaning of incorrect those printed circuit board (PCB)s.
Being used to be coated with the printed circuit board (PCB) mask that adds solder(ing) paste still adopts the solvent of bag house hydrocarbon to clean so far.
Solder(ing) paste also comprises welding agent.Under the situation of welding agent that is corrosive, the printed circuit board (PCB) that also must cleaning have made, otherwise the danger of being corroded is arranged.
Based on above-mentioned situation, main purpose of the present invention provides a kind of adhesive agent of removing, specifically be the method for removing bonding agent, tinol, these adhesive agents stick on the surface printed circuit board (PCB) mask or printed circuit board (PCB), are intended to the solvent without hydrocarbon-containiproducts in this method.Another purpose of method is intended to design a kind of method, makes this method can be incorporated in the production procedure of circuit.Another object of the present invention provides a kind of device that sticks to the lip-deep adhesive agent printed circuit board (PCB) mask or printed circuit board (PCB) of removing, and this device can be safely and removed adhesive agent reliably.This device is predetermined can be incorporated on the production line of circuit.
Utilize a kind of method and apparatus can reach this purpose with claim 1,2 and 3 described features.Favourable structure and improvement form the theme of each appended claims item.
For removing the adhesive agent that sticks on the printed circuit board (PCB) mask surface such as tinol etc., a kind of method is proposed, in the method, clean jet flow with at least one and wash at least one surf zone.This cleaning jet flow comprises carbon dioxide particle.Beyond thought is to have been found that to adopt carbon dioxide particle can remove the adhesive agent on the printed circuit board (PCB) mask surface and can not damage printed circuit board (PCB) mask or printed circuit board (PCB) that this carbon dioxide particle forms by scraping drikold entity.This drikold entity is to be sizable entity that so-called dry ice constitutes by drikold.Owing to form carbon dioxide particle by the scraping entity, institute so that carbon dioxide particle have can gentleness cleaning printed circuit board (PCB) characteristic.Carbon dioxide particle has bigger quality than carbon dioxide snowflake, so they are with the surface of bigger kinetic energy Impact Printing circuit board.But the carbon dioxide particle of scraping is hard not as indivedual carbon granules of producing.As everyone knows, for example in US-A-520572, adopted the method for scraping drikold to produce carbon dioxide particle.
Because the impact of drikold, the surface of printed circuit board (PCB) mask is removed and don't damaged to adhesive agent.When carbon dioxide particle Impact Printing circuit board mask surface, carbon dioxide also distils, the result, and temperature reduces, and the adhesive agent that sticks on the printed circuit board (PCB) mask surface just becomes fragile, and has so just improved the cleaning action of cleaning jet flow.This principle of the inventive method makes can be without the solvent of hydrocarbon-containiproducts.Therefore also no longer need in the room of special protection, clean the printed circuit board (PCB) mask.
The method that this removing is adhered to adhesive agent on the printed circuit board (PCB) mask also provides the possibility that this method can be incorporated on the production line.Using the number that method of the present invention can also reduce the printed circuit board (PCB) mask that needs preparation, is quickish because carry out cleaning operation after this manner.
According to another innovation practice, a kind of method has been proposed, it is concrete as welding agent, bonding agent, tinol that this method can be used for removing the adhesive agent that adheres on the printed circuit board surface, this printed circuit board (PCB) can be the insertion device or also do not insert device.In this method, wash at least a portion surface of printed circuit board (PCB) with the cleaning jet flow.Clean jet flow and comprise carbon dioxide particle.This cleaning jet flow can be removed and is adhered to adhesive agent on the printed circuit board surface and can not injure printed circuit board (PCB) itself or be contained in electric or electronic device on the printed circuit board (PCB).Use carbon dioxide in this method to the environment advantageous particularly, because carbon dioxide is the constituent of atmosphere.The preferably about at the most 1mm of its average diameter of carbon dioxide particle.
Be at least 1 crust if the pressure of jet flow reaches, then can obtain fabulous cleaning performance printed circuit board (PCB) mask and printed circuit board (PCB).Higher pressure also is feasible, might not improve cleaning performance but increase pressure.The pressure that cleans jet flow preferably is set at 4 crust.
According to another favourable practice, when the method for the adhesive agent that is adhered to the surface is removed in application, recommend to clean the time of 10S at least, preferably clean 15S.The long like this time of flushing can obtain best cleaning performance when cleaning jet flow flushing at least a portion surface.Cleaning performance might not be improved in long-time flushing surface.And only can increase the consumption of carbon dioxide, this is uneconomic.
Clean preferably directive printed circuit board (PCB) mask at a certain angle of jet flow, specifically be about 45.Clean jet flow and move in this manner, make that cleaning jet flow longitudinally cleans the printed circuit board (PCB) mask gradually, make itself and the original direction of motion surface then into about 90 ° direction cleaning printed circuit board (PCB) mask.So just, the outer peripheral face that is formed on the hole on the printed circuit board (PCB) mask capable of washing.
According to another favourable practice, be recommended in and add carrier gas in the purge flow.This carrier gas is inert gas preferably.This helps to make method safer.In addition, also make between the adhesive agent that is adhered to printed circuit board (PCB) mask surface or printed circuit board surface and can not react.
According to another favourable practice of the inventive method, be recommended in and printed circuit board (PCB) mask or printed circuit board (PCB) carried out drying processing after cleaning with the cleaning jet flow.The advantage of this processing is to remove the water that coagulates from ambient atmosphere from printed circuit board (PCB) mask surface or printed circuit board surface.
The most handy air-flow particularly thermal air current comes dry printed circuit board (PCB) mask or printed circuit board (PCB).The temperature of air-flow or air stream should be suitable for carrying out the requirement of drying process.The advantage of using air-flow also has, and printed circuit board (PCB) mask or printed circuit board (PCB) can be dried quite equably.
According to another favourable practice of this method, during flushing operation, recommend to make that the regional ground connection that will clean at least of printed circuit board (PCB) mask or printed circuit board (PCB).This measure can guarantee that printed circuit board (PCB) mask or printed circuit board (PCB) can static electrifications during cleaning operation, and this is very important, and is particularly very important when cleaning the printed circuit board (PCB) of having plugged electric or electronic device.
The problem of printed circuit board (PCB) mask or printed circuit board (PCB) static electrification can also solve like this; promptly; that zone that printed circuit board (PCB) mask or printed circuit board (PCB) will be cleaned at least is connected at least one electrostatic charging device when carrying out cleaning operation; this device can discharge; but this discharge can not occur in the electronic device zone on the printed circuit board (PCB), thereby these electronic devices can not be damaged because of discharge.Specifically be fine wire to be connected in the zones of different of printed circuit board (PCB).
As a kind of alternative or append mode, be recommended in flushing printed circuit board (PCB) mask or printed circuit board (PCB) in the inert atmosphere.Is particularly advantageous in this situation with nitrogen/argon atmospher.
According to another favourable practice, be recommended in and carry out flushing operation in the deionization chamber, so also can avoid printed circuit board (PCB) mask or printed circuit board (PCB) generation electrostatic charge.
According to the favourable practice again, be recommended in the zone of cleaning the jet flow path at least one conductive component is set, these parts are the soft metal brush preferably, and concrete configuration is near the jet flow outlet.This also can be avoided printed circuit board (PCB) mask or printed circuit board (PCB) static electrification lotus.
According to another favourable practice of this method, be recommended in flushing printed circuit board (PCB) mask or printed circuit board (PCB) in the confined chamber, this printed circuit board (PCB) mask or printed circuit board (PCB) are configured in that this is indoor.The advantage of this practice is, if this chamber is a gas-tight design, then cleaning operation does not influence ambient atmosphere.
Printed circuit board (PCB) mask or printed circuit board (PCB) are preferably in the indoor cleaning of sound insulation, like this, can avoid or reduce the noise that sends during the cleaning operation.Owing to take this measure, the method is particularly suitable for incorporating into existing production line.
According to another innovation practice, a kind of device that is used to remove adhesive agent has been proposed, be used in particular for removing the bonding agent, tinol or the welding agent that adhere on printed circuit board (PCB) mask surface or the printed circuit board surface.The fixture of fixing at least one printed circuit board (PCB) mask or at least one printed circuit board (PCB) in this indoor configuration.Movable flusher also is configured in indoor, and this flusher has at least one and penetrates the Flushing nozzle that cleans jet flow, makes this at least one surf zone of cleaning jet flow directive.This device has the source unit that cleaning agent is provided in the outside of chamber, and this unit is connected in cleaning device through at least one carrier pipe.This chamber preferably is made of a housing, and this housing is a Design on thermal insulation.
According to another favourable practice, this housing is preferably local ventilative.Clean jet flow and comprise carbon dioxide particle and carrier gas.Carrier gas is compressed air preferably.If it is airtight basically that shielding is designed to, then indoor pressure will raise.Therefore for avoiding this point, recommending housing is local ventilative at least.This housing preferred design becomes not see through dust particles.Can prevent that so just the particle that forms during the cleaning operation from entering external environment condition, this is very important, when especially this device is placed on environment under the clean room condition.This housing preferably has at least one interchangeable particulate filter.This particulate filter can be arrested in the particle of emitting during cleaning in the filter, can avoid thus polluting outside atmosphere because of cleaning operation.The easy replaceability of particulate filter has increased the easiness of using this device.
According to another favourable structure of device, be recommended in this device and go up configuration CPU and at least one arm, this arm is connected in CPU, configuration flushing unit on it.CPU can be configured in the outside of housing, and arm passes the wall of housing.
Printed circuit board (PCB) mask and printed circuit board (PCB) have different shape and design.Especially, the through hole of printed circuit board (PCB) mask can have different numbers and different distributions.Therefore preferably make and clean such directive printed circuit board surface of jet flow or printed circuit board (PCB) mask surface, make this cleaning jet flow preferably can clean whole surface gradually.For reaching this point, this device has operating means, disposes flusher on this operating means, specifically is the one or more cleaning shower nozzles of configuration.This operating means can change from the position of the cleaning jet flow of cleaning the shower nozzle ejaculation, thereby can thoroughly clean the surface of printed circuit board (PCB) or the surface of printed circuit board mask with the cleaning jet flow that comprises carbon dioxide particle.If the structure of printed circuit board (PCB) or printed circuit board (PCB) mask and geometry are known, then can utilize the control corresponding unit controls to clean the sequence of motion of shower nozzle, this control module make clean shower nozzle can be with cleaning jet flow each zone of scanning of a surface continuously or sequentially.Also can be used for control and clean jet flow.But preferably clean printed circuit board (PCB) mask or printed circuit board (PCB) automatically, because controlled sequence of motion can be optimized the consumption of scavenging period, cleaning operation and carbon dioxide particle.
Below with reference to other details and the advantage of exemplary embodiments illustration method shown in the accompanying drawing and device, these figure are:
Fig. 1 is a signal partial section, and first exemplary embodiments of apparatus of the present invention is shown;
Fig. 2 is a schematic diagram, and second exemplary embodiments of apparatus of the present invention is shown.
Fig. 1 schematically illustrates first exemplary embodiments of device, and this device is used to remove the adhesive agent that adheres on printed circuit board (PCB) mask surface or the printed circuit board surface, specifically is used to remove adhesive, tinol, welding agent.When the following describes the printed circuit board (PCB) mask, these explanations are equally applicable to insert on it printed circuit board (PCB) of electric and/or electronic device.
Device has the housing 6 that forms chamber 5.Flusher 8 is configured in the chamber 5.This flusher 8 has at least one Flushing nozzle 18.Cleaning jet flow 4 penetrates from Flushing nozzle 18.This flushing jet flow 4 comprises carbon dioxide particle and carrier gas.Flusher 8 is connected in the source unit 12 of cleaning agent through the carrier pipe (not shown).This source unit 12 comprises device and the carrier gas source that produces carbon dioxide particle, and this carrier gas source can be a gas cylinder for example.Carrier gas is a Compressed Gas.The device that produces carbon dioxide particle can be the device that for example illustrates in US-A-5520572.The device that produces carbon dioxide particle comprises device for scraping, utilizes this device for scraping to go out carbon dioxide particle from scraping on the drikold entity.These carbon dioxide particles are with after carrier pipe is transported to flusher.
Flusher 8 is configured on the operating means 9.This operating means can be a multi-spindle machining hand for example.Operating means 9 has the arm 10 of CPU of being connected in 11.This CPU is configured in the outside of chamber 5.Arm 10 stretches into chamber 5.As shown in Figure 1, the connecting plate 15 that is connected in housing 6 flexible walls is connected in arm 10.The advantage of dress flexible wall 16 is that it allows arm 10 activities.
Housing 6 and protective sleeve 14 are designed to sound insulation.This flexible wall 16 preferably is that part is ventilative at least.Also particulate filter can be housed.Exhaust outlet in the chamber 5 is not shown, can the 5 interior discharges from the chamber by this exhaust outlet atmosphere.Exhaust makes not produce noise or only produce very little noise preferably through the shock absorber in the middle of being placed on.
The fixture preferred design becomes applicable to the printed circuit boards in different sizes mask.
Printed circuit board (PCB) mask 1 has adhesive agent 2, and this adhesive agent adheres on its surface 3, and it will be removed with cleaning jet flow 4.The adhesive agent 2 that adheres on the surface 3 also is present in passing through in the hole 7 of printed circuit board (PCB) mask 1.
The proper procedure operating means makes the surface 3 of cleaning jet flow 4 directive printed circuit board (PCB) masks, the best and about 45 ° angle of its formation.Just shock surface 3 and adhesive agent 2 of carbon dioxide particle like this, the result can remove adhesive agent 2 in surface 3 and through hole 7.Also available device shown in Figure 1 cleans the printed circuit board (PCB) (not shown) with the same manner.
Fig. 2 illustrates second exemplary embodiments of removing the adhesive agent device, specifically removes the adhesive agent, tinol or the welding agent that adhere to printed circuit board (PCB) mask surface or at least one printed circuit board surface.
This device has housing 6, and the design of preferably insulating against sound of this housing 6 makes not produce noise basically in the operating period of cleaning the printed circuit board (PCB) mask.Housing 6 forms chamber 5.Flusher 8 is configured in the chamber 5.Flusher 8 has at least one Flushing nozzle 18.This Flushing nozzle 18 is connected in source unit 12 and CPU 11 through carrier pipe 19.Source unit 12 preferably includes device and the compressed gas source that produces carbon dioxide particle.
Flusher 8 is configured on the operating means 9.This operating means is the multi-spindle machining hand preferably.This operating means 9 is designed to make cleaning jet flow 4 can clean whole surperficial 3 of printed circuit board (PCB) mask 1.Operating means 9 is connected in CPU 11 through carrier pipe 19.This CPU constitutes the control module of operating means 9.Operating means 9 is contained on the wall 20 of housing 6.
The fixture that is used for fixing the printed circuit board (PCB) mask is configured in the chamber 5.
Be adhered to printed circuit board (PCB) mask 1 lip-deep adhesive agent 2 for removing, will one clean jet flow 4 directive surfaces 3 at least.Utilize the carbon dioxide particle that cleans in the jet flow 4 can remove the adhesive agent 2 that is adhered to surface 3.
Fixture 17 is designed to make printed circuit board (PCB) mask 1 ground connection during cleaning operation.Can prevent that so just printed circuit board (PCB) mask 1 is because of the cleaning operation static electrification.This ground connection or to avoid static electrification be very important be not to clean the printed circuit board (PCB) mask but even more important when cleaning the printed circuit board (PCB) that is inserted with electric and/or electronic device on it especially.
Clean jet flow preferably at least with the 1 pressure directive surface of clinging to 3.Sedimentation exhalation is preferably 15 seconds in the time of clean surface.
For avoiding damaging printed circuit board (PCB) mask surface or printed circuit board surface, make drikold form grain shape, under granular situation, the quality of carbon dioxide particle should be quite little.Clean jet flow and preferably include the carbon dioxide particle that average diameter is about 1 millimeter at the most.
Claims (23)
1. method of removing adhesive agent (2), be specially the method that is adhered to adhesive, tinol or welding agent on printed circuit board (PCB) mask (1) surface (3) of removing, in the method, with one cleans at least one zone on jet flow (4) flushing surface (3) at least, this cleaning jet flow comprises carbon dioxide particle, and this carbon dioxide particle forms by scraping drikold entity.
2. method of removing adhesive agent (2), be specially the method for removing welding agent, bonding agent or tinol on the surface (3) that is adhered to the printed circuit board (PCB) that is inserted with or is not inserted with device, in the method, with one cleans at least one zone that jet flow (4) is washed this surface (3) at least, this cleaning jet flow (4) comprises carbon dioxide particle, and this carbon dioxide particle produces by scraping drikold entity.
3. method as claimed in claim 1 or 2 is characterized in that the average diameter of carbon dioxide particle is about 1mm at the most.
4. as claim 1,2 or 3 described methods, it is characterized in that the pressure that cleans jet flow (4) is at least 1 crust.
5. as each described method in the claim 1～4, it is characterized in that,, wash the time of 10S at least, preferably wash 15S with at least one zone on flushing jet flow (4) flushing surface (3).
6. as each described method in the claim 1～5, it is characterized in that, clean jet flow (4) and comprise carrier gas.
7. method as claimed in claim 6 is characterized in that carrier gas is an inert gas.
8. as each described method in the claim 1～7, it is characterized in that, after cleaning jet flow (4) flushing printed circuit board (PCB) mask (1) or printed circuit board (PCB), it is carried out drying handle.
9. method as claimed in claim 8 is characterized in that, utilizes pneumatic conveying drying printed circuit board (PCB) mask (1) or printed circuit board (PCB).
10. as each described method in the claim 1～9, it is characterized in that, during flushing operation, make flushing at least printed circuit board (PCB) mask (1) or printed circuit board (PCB) zone ground connection.
11. as each described method in the claim 1～10, it is characterized in that, during flushing operation, make flushing at least printed circuit board (PCB) mask (1) or printed circuit board (PCB) zone be connected at least one electrostatic charging device.
12. as each described method in the claim 1～11, it is characterized in that, in inert atmosphere, wash.
13. method as claimed in claim 12 is characterized in that, washes in nitrogen/argon atmospher.
14. as each described method in the claim 1～11, it is characterized in that, in deionization chamber (5), wash.
15., it is characterized in that at least one conductive component is configured on the zone, path of cleaning jet flow (4) as each described method in the claim 1～14.
16. as each described method in the claim 1～15, it is characterized in that, before flushing operation, printed circuit board (PCB) mask (1) or printed circuit board (PCB) be configured in the chamber (5).
17. method as claimed in claim 16 is characterized in that, printed circuit board (PCB) mask (1) or printed circuit board (PCB) are configured in the chamber (5) of sound insulation.
18. be used to remove the device of adhesive agent (2), be specially and remove the device that adheres to adhesive agent, tinol or welding agent on printed circuit board (PCB) mask (1) surface (3) or the printed circuit board surface (3), be specially as each described device in the claim 1～17 being characterized as of this device:
Chamber (5);
Fixture (17) is used at least one printed circuit board (PCB) mask (1) or at least one printed circuit board (PCB) are fixed in this chamber (5);
Movable flusher (8), this device is configured in the chamber (5), has at least one Flushing nozzle (18), penetrates from this shower nozzle and cleans jet flow (4), and this jet flow is preferably with at least one zone on about 45 directive surface (3);
Source unit (12), this source unit is connected in flusher (8) through at least one carrier pipe (19).
19. device as claimed in claim 18 is characterized in that, the local at least chamber (5) that forms of the housing of sound Insulation Design (6).
20. device as claimed in claim 19 is characterized in that, this housing (6) is local ventilative at least.
21. device as claimed in claim 20 is characterized in that, housing (6) has at least one particulate filter.
22., it is characterized in that flusher 8 is configured on the operating means (9) as each described device in the claim 18～21, concrete configuration is on manipulator.
23. device as claimed in claim 22, it is characterized in that, operating means 9 has CPU (11) and at least one arm (10), the latter is connected in CPU (11), and configuration flushing unit (8) on it, and the former is configured in the outside of housing (6), and arm 10 passes the wall (16) of housing (6).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19828987A DE19828987A1 (en) | 1998-06-29 | 1998-06-29 | Method and device for cleaning a circuit board template or a circuit board |
| DE19828987.1 | 1998-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1305404A true CN1305404A (en) | 2001-07-25 |
Family
ID=7872396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99807159A Pending CN1305404A (en) | 1998-06-29 | 1999-06-23 | Method and device for cleaning printed circuit board mask or printed circuit board |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1091830A1 (en) |
| JP (1) | JP2002519205A (en) |
| CN (1) | CN1305404A (en) |
| AU (1) | AU4907699A (en) |
| DE (1) | DE19828987A1 (en) |
| WO (1) | WO2000000326A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102198640A (en) * | 2011-05-17 | 2011-09-28 | 张家港玉成精机有限公司 | Cantilever water gun |
| CN112720266A (en) * | 2019-10-14 | 2021-04-30 | 费斯托股份两合公司 | Processing mechanism |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6468833B2 (en) | 2000-03-31 | 2002-10-22 | American Air Liquide, Inc. | Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
| DE10040335A1 (en) * | 2000-08-17 | 2002-03-14 | Messer Griesheim Gmbh | Cleaning method for electronic components such as circuit boards contaminated with solder paste or adhesive in production process, using dry ice particle beam |
| GB2451656A (en) * | 2007-08-07 | 2009-02-11 | Boc Group Plc | Method and apparatus for cleaning a printed circuit board |
| FR2932642B1 (en) * | 2008-06-16 | 2011-01-07 | Air Liquide | METHOD FOR BRAZING ELECTRONIC COMPONENTS INCORPORATING A COMBINED COOLING STEP AND CLEANING THE CARDS AFTER BRAZING |
| FR2956600B1 (en) * | 2010-02-22 | 2012-09-28 | Erick Canicas | PROCESS FOR THE ECOLOGICAL CLEANING OF A COOKING RACK |
| DE102010047275A1 (en) | 2010-10-01 | 2012-04-05 | Emitec Gesellschaft Für Emissionstechnologie Mbh | exhaust system |
| DE102015219429A1 (en) | 2015-10-07 | 2017-04-13 | Bayerische Motoren Werke Aktiengesellschaft | Process for cleaning with solid carbon dioxide |
| DE102015219430A1 (en) | 2015-10-07 | 2017-04-13 | Bayerische Motoren Werke Aktiengesellschaft | Device for cleaning adhesive surfaces |
| DE102015117558A1 (en) * | 2015-10-15 | 2017-04-20 | Lpkf Laser & Electronics Ag | Process for producing structured coatings on a molded part and apparatus for carrying out the process |
| GB201721176D0 (en) * | 2017-12-18 | 2018-01-31 | Semblant Ltd | Method and apparatus for removing a conformal coating from a circuit board |
| DE102018115026A1 (en) * | 2018-06-22 | 2019-12-24 | Ifm Electronic Gmbh | Cleaning process for an electronic board equipped with electronic components |
| DE102020133006B4 (en) | 2019-12-10 | 2024-10-24 | Ifm Electronic Gmbh | Cleaning process for a flexible conductor film equipped with electronic components |
| WO2021259424A1 (en) * | 2020-06-22 | 2021-12-30 | Mycon Gmbh | Method for cooling and/or separating adhesively bonded components and/or removing adhesive residues from surfaces and jet apparatus herefor |
| CN112566384B (en) * | 2020-12-03 | 2022-08-19 | 江西威尔高电子股份有限公司 | PCB prevents surface oxidation equipment |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5409418A (en) * | 1992-09-28 | 1995-04-25 | Hughes Aircraft Company | Electrostatic discharge control during jet spray |
| US5545073A (en) * | 1993-04-05 | 1996-08-13 | Ford Motor Company | Silicon micromachined CO2 cleaning nozzle and method |
| US5366156A (en) * | 1993-06-14 | 1994-11-22 | International Business Machines Corporation | Nozzle apparatus for producing aerosol |
| US5364472A (en) * | 1993-07-21 | 1994-11-15 | At&T Bell Laboratories | Probemat cleaning system using CO2 pellets |
| US5390450A (en) * | 1993-11-08 | 1995-02-21 | Ford Motor Company | Supersonic exhaust nozzle having reduced noise levels for CO2 cleaning system |
| US5520572A (en) * | 1994-07-01 | 1996-05-28 | Alpheus Cleaning Technologies Corp. | Apparatus for producing and blasting sublimable granules on demand |
| DE19535557B4 (en) * | 1995-09-25 | 2005-06-09 | Air Liquide Gmbh | Method and device for cleaning an inner wall of a mold by means of dry ice |
| US5616067A (en) * | 1996-01-16 | 1997-04-01 | Ford Motor Company | CO2 nozzle and method for cleaning pressure-sensitive surfaces |
| DE19636304A1 (en) * | 1996-09-06 | 1998-03-12 | Linde Ag | Method for finishing paint=covered wooden surfaces |
| DE29723141U1 (en) * | 1997-03-25 | 1998-04-16 | Air Liquide Gmbh | Device for cleaning an inner wall of a mold using dry ice |
-
1998
- 1998-06-29 DE DE19828987A patent/DE19828987A1/en not_active Ceased
-
1999
- 1999-06-23 WO PCT/EP1999/004697 patent/WO2000000326A1/en not_active Application Discontinuation
- 1999-06-23 EP EP99932830A patent/EP1091830A1/en not_active Withdrawn
- 1999-06-23 AU AU49076/99A patent/AU4907699A/en not_active Abandoned
- 1999-06-23 CN CN99807159A patent/CN1305404A/en active Pending
- 1999-06-23 JP JP2000556907A patent/JP2002519205A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102198640A (en) * | 2011-05-17 | 2011-09-28 | 张家港玉成精机有限公司 | Cantilever water gun |
| CN112720266A (en) * | 2019-10-14 | 2021-04-30 | 费斯托股份两合公司 | Processing mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2000000326A1 (en) | 2000-01-06 |
| AU4907699A (en) | 2000-01-17 |
| JP2002519205A (en) | 2002-07-02 |
| DE19828987A1 (en) | 2000-01-05 |
| EP1091830A1 (en) | 2001-04-18 |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |