CN1302544C - Miniature refrigerating system for radiating computer chip - Google Patents
Miniature refrigerating system for radiating computer chip Download PDFInfo
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- CN1302544C CN1302544C CNB031375618A CN03137561A CN1302544C CN 1302544 C CN1302544 C CN 1302544C CN B031375618 A CNB031375618 A CN B031375618A CN 03137561 A CN03137561 A CN 03137561A CN 1302544 C CN1302544 C CN 1302544C
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- 238000001816 cooling Methods 0.000 claims abstract description 78
- 238000005057 refrigeration Methods 0.000 claims abstract description 70
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 230000006835 compression Effects 0.000 claims abstract description 22
- 238000007906 compression Methods 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 21
- 238000010521 absorption reaction Methods 0.000 claims abstract description 7
- 230000005855 radiation Effects 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 238000001914 filtration Methods 0.000 claims description 20
- 229910000831 Steel Inorganic materials 0.000 claims description 18
- 239000010959 steel Substances 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 7
- AHFMSNDOYCFEPH-UHFFFAOYSA-N 1,2-difluoroethane Chemical compound FCCF AHFMSNDOYCFEPH-UHFFFAOYSA-N 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 231100000252 nontoxic Toxicity 0.000 claims description 4
- 230000003000 nontoxic effect Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000010793 Steam injection (oil industry) Methods 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000002609 medium Substances 0.000 description 14
- 239000003570 air Substances 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 7
- 238000005265 energy consumption Methods 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000012595 freezing medium Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 240000004859 Gamochaeta purpurea Species 0.000 description 1
- 241000321453 Paranthias colonus Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004883 computer application Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses a micro refrigeration system for heat dissipation of a computer chip, which comprises the following components: the structure is as follows: the compressor is connected with the condenser, the condenser is connected with the capillary tube and the evaporator through the dry filter, and the evaporator is communicated with the compressor through the liquid separation cylinder to form a refrigeration loop; the evaporator is a single-stage or multi-stage evaporator which is connected in parallel/series or in series-parallel hybrid mode on a connecting pipeline between the drying filter and the liquid separating cylinder, and the capillary tube is connected on a preposed connecting pipeline of each evaporator; the compressor is a steam compression refrigerator, an absorption refrigerator, a steam injection refrigerator, a compressed gas refrigerator, a gas vortex refrigerator or a Stirling refrigerator, a Wihler Miller refrigerator or a GM refrigerator and the like, the refrigerating capacity is 10-2000W, the input power is 10-400W, and the compressor is suitable for the requirement of continuously upgrading a computer and actively cooling a plurality of heating parts in the computer simultaneously on the basis of mechanical refrigeration.
Description
Technical field
The present invention relates to a kind of mini-refrigerator system, particularly a kind ofly a plurality of die sites of computer are carried out the initiatively mini-refrigerator system of cooling based on mechanical refrigeration.
Background technology
In recent years, because the enhancing of microprocessor computing capability and the significantly reduction of price, computer application is quite general.It is to be undertaken by the master computer in the computer floor that is placed on isolation that previous calculation is handled, and personal computer has been equipped by now increasing office.Major issue of the thing followed is how the high heat that produces in these systems to be loose rapidly and effectively.Some computer chip manufacturers such as Intel, AMD etc. are integrated increasing transistor in chip constantly.For example, in the space big unlike stamp, Pentium 4 chips are an integrated forty-two million transistor.So high integration can produce a large amount of heats unavoidably, is equivalent to 50 watts of bulb caloric values in the time of many.Temperature is too high can damage meticulous assembly, makes loss of data, therefore, how heat in time and is effectively distributed and is perplexing engineers always.Yet human pursuit is endless, though the volume of computer diminishes gradually, performance, speed are in continuous lifting.Processing speed is fast more, element and device in the computer, and as CPU, graphics card and like, the heat of generation is just many more, surpasses certain limit, and operation even out of service may or lead to errors.
At present, for cooling off all kinds of heater elements or device, adopt conventional cooling device mostly.With CPU is example, and cooling fin component and cooling fan are installed on CPU.Operation by cooling fan makes around the airflow passes fin, with heat transferred computer ambient air.Computer also has a cooling fan that is fixed on the cabinet rear portion.The operation of this fan is drawn into the cabinet outside with the air in the cabinet.And meanwhile, surrounding air then enters in the cabinet by the slit, strengthens the heat radiation to some widgets.Some have appearred thereupon to air cooled improvement technology (Zhang Qianshan, patent: computer CPU radiator, application number: 01130819.2), further strengthen the fluid interchange that is forced to air.To cool off the heat dissipation capacity of scheme of heater members limited but this employing is forced to cross-ventilation, and cooling effectiveness is directly proportional with fan speed, thereby can cause obvious noise; In case and the micro element heat generation density is when too high, air cooling will be difficult to be competent at.Growth at full speed along with the computer chip integrated level, desired heat transfer intensity is also more and more higher, adopt water-cooled (Zhu Yuru, patent: cpu chip water-filled radiator, 99253842.4) or phase-change heat-exchange (Li Mujiong etc. the patent No.:, patent: be used for the system of cooling device in computer, application number: mode 99804075.4) puts on the agenda gradually, and corresponding product also sporadicly appears on the market.Adopt phase-change heat transfer to compare with single-phase heat transfer or heat conduction, required working medium is few, and the heat transfer amount is big, but thereby weight reduction.In this class heat dissipating method, most typical no more than hot pipe technique, it as the main mode of conducting heat, has characteristics such as heat-transfer capability is big, temperature control capability is strong, heat transfer efficiency height with phase transformation (evaporate with condense) heat exchange, draws attention in the application aspect the heat radiation of computer components and parts.But the preparation of heat pipe manufacture technology such as core material, working medium encapsulation, maintenance etc. are quite complicated, and this is very limited its application.Analyze according to the people in the industry, water-cooled may become a main flow.Yet, though water-cooled efficient is higher, be in operation because evaporation etc. can cause device aging, corrosion, to having relatively high expectations of water quality and flow duct, exist and reveal, reliability still has much room for improvement, and it is reported, adopts the chip of water-cooled to be easy to burn at present, reason is that water-cooling system is still unreliable, in case because some fault causes current to stop, the chip temperature that then loses cooling will rise rapidly, until burning.
On this basis, constantly there is new technology to be applied in the cooling of CPU in the computer industry.U.S.'s Sandia National Labs and Georgia Institute of Technology have developed jointly a kind of be intended to " intelligent heat pipe " that radar and portable field computer are cooled off.It is a simple flat copper coin, and very small sunk passage is arranged above, and the depth is about 7 microns---similar with people's fingerprint, these grooves are used to transport liquid methanol.When being fixed on together with chip, methyl alcohol flows to the higher zone of temperature under capillary driving, and heat can make the methyl alcohol vaporization, thereby takes away heat.Methanol gas can be directed into the lower place of temperature, just the side in addition of copper coin.Because temperature is lower, methyl alcohol can become liquid again, restarts another heat radiation process.A kind of wafer cooler is arranged according to another report, and it is by the synthetic integrated circuit of making of silicon, germanium and material with carbon element, utilize electronics to transmit the heat energy of superheat section and heat is dispersed into around environment in.The advantage of this technology is that it can directly take away heat from the heat generating spot of chip.The temperature of chip heat generating spot can reach 80 to 100 degrees centigrade.The thin slice cooler then can make temperature decline 7 or 8 degree of heat generating spot, even 30 to 40 degree.The researcher of Hewlett-Packard also considers to adopt a brand-new thinking, and promptly to the chip water spray, the moisture absorption heat changes steam into, effectively lowers the temperature for chip.
Existing C PU cooling technology can reduce the temperature of CPU to a certain extent, prevents chip overheating and phenomenons such as deadlock occur.Present trend is: as if the application of liquid cooling method is more and more important, and air-cooling has reached the limit.And along with the growth at full speed of computer chip integrated level, desired heat transfer intensity is also more and more higher, and these technology all can not satisfy this requirement.What more emerging technology had can address the above problem on agreed, but after the speed of CPU is brought up to a certain degree, will bring the significantly raising of computer parts caloric value, also not have to carry out these parts simultaneously at present the technology of cooling heat dissipation.Also just because of this, the invention provides a kind of can be simultaneously to cpu chip and other heat generating components refrigerating system of cooling off of parts such as graphics card, general supply and CD-ROM drive for example.Place integrated " micro refrigerator " in computer cabinet, similar domestic refrigerator is placed on several evaporator end respectively on the parts that need cooling, simultaneously they is cooled off.Utilize mechanical refrigeration to be easy to realize this goal, the mode of refrigeration can adopt both vapor compression, absorption refrigeration, steam-sprayed refrigeration, Compressed Gas refrigeration, air whirl refrigeration, stirling refrigeration, dimension to rein in multiple modes such as Mil (VM) refrigeration, GM refrigeration.In mechanical refrigeration, vapour compression refrigeration is most economical and most widely used refrigerating method (Su Qingrui and Li Huachun chief editor, Refrigeration ﹠ Air-Conditioning, Shenyang: Liaoning science tech publishing house, 1984), therefore can preferentially select this mode for use.For all heating powers of general personal computer also just about 100W, the about 20W of input power that utilizes vapour compression refrigeration to need, such vapour compression machine can be accomplished microminiaturization at present on the market.Therefore, simultaneously several different heat generating components are cooled off based on vapour compression refrigeration, can be good at reducing the heat of each parts, this has also just proposed brand-new " microcomputer special refrigerator " notion, refrigerating capacity that can be different according to the different selection of configuration of computer, even same computer also can add an evaporator more separately according to the parts that increase newly it is cooled off, thereby be fit to the constantly requirement of upgrading of computer.Also " miniature calculating special machine refrigerator " can be transformed into " computer central air-conditioning " for large-scale computer, satisfy the cooling requirement of mass computing.
As previously mentioned, utilize the technology of cooling cpu chips such as air-cooled, water-cooled and phase transformation to come out at present, but also do not utilize mini-refrigerator system particularly vapor compression refrigeration system the method that cpu chip carries out initiatively cooling is occurred, the system that can cool off a plurality of heat generating components does not simultaneously then more appear in the newspapers so far, so the present invention is expected to set up a kind of refrigerating system of cooling off a plurality of heat generating components abilities simultaneously that has of functional diversities, its compact conformation, easy to use is a kind of economy, better way refrigerating system.Be expected to become a kind of very wide device that aspect computer chip or high-power component heat radiation, is suitable for.
Summary of the invention
The purpose of this invention is to provide a kind of novel mini-refrigerator system that is used for the computer chip heat radiation, CPU, graphics card and like to computer cool off to reach the active heat removal purpose, the refrigerating capacity that they are can be according to the different choice of heat dissipation capacity different, even same computer also can add an evaporator more separately according to the parts that increase newly it is cooled off, be fit to the constantly requirement of upgrading of computer.
Technical scheme of the present invention is as follows:
The mini-refrigerator system that is used for the computer chip heat radiation provided by the invention comprises: compressor 1, condenser 2, device for drying and filtering 4, capillary and evaporator, liquid separatnig tube 13, control circuit 19; Compressor 1 is connected with condenser 2, condenser 2 is connected with capillary and evaporator by device for drying and filtering 4, and evaporator is connected with compressor 1 to form vapour compression refrigeration loop, absorption refrigeration loop, steam-sprayed refrigerating circuit, Compressed Gas refrigerating circuit, air whirl refrigerating circuit, stirling refrigeration loop, to tie up and rein in Mil's refrigerating circuit or GM refrigerating circuit by liquid separatnig tube 13; One cooling fan 3 is installed near the condenser 2, and a power supply links to each other with cooling fan 3 with compressor 1 respectively;
Described evaporator is that parallel/series or connection in series-parallel are connected single-stage or the multi-stage evaporator on the connecting tube between device for drying and filtering 4 and the liquid separatnig tube 13 with mixing, and capillary is connected on the preposition connecting tube of each evaporator;
Described compressor 1 is for providing the compressor of 10-2000W refrigerating capacity, and its input power is 10-400W;
The cold-producing medium that uses in the described refrigerating circuit is the fluid-mixing working medium of one or both or multiple working medium in nontoxic pollution-free and non-flammable HFC-123, HFC-22, HFC-152 and the HFC134a working medium;
Compressor 1, condenser 2, device for drying and filtering 4, capillary and evaporator, liquid separatnig tube 13, power supply and cooling fan 3 collect whole or in part and are contained in the refrigerator casing 16 that a stainless steel or aluminium sheet material make, refrigerator casing 16 is provided with and opens the door 15, and compressor outlet connector 17 links to each other with evaporator with condenser respectively with the sidewall that compressor inlet connector 18 passes refrigerator casing 16, and the size range of described refrigerator casing 16 is 5mm * 5mm * 5mm-500mm * 500mm * 500mm;
Described power supply is the main frame power supply, and a controller 19 that links to each other with the main frame power supply is connected cooling fan 3 and compressor 1 respectively, and the temperature-sensing element that is installed on the evaporator links to each other with controller 19; The buzzer of described computer links to each other with controller 19;
The ribbed pipe of condenser 2 is coiled in the side in the refrigerator casing 16, copper pipe, aluminum pipe or steel pipe that its ribbed pipe diameter is 1-20mm, the fin of condenser 2 be the continuous full wafer done of copper, aluminium or steel or spiral around sheet, the spacing of fin is 0.1-5mm;
Described evaporator is that diameter is the evaporator that copper pipe, seamless steel pipe or the aluminium tube material of 1-20mm made, and this evaporator is withheld on element to be dispelled the heat;
Described capillary is that diameter is 0.1-3.0mm, and length is the copper tube of 0.6-6m, or is expansion valve; Connect
Taking over the road is that diameter is copper pipe, seamless steel pipe or the aluminum pipe of 1-20mm; The coated heat-insulation layer that has foam class heat-insulating material to make on the described connecting tube.
The mini-refrigerator system of computer chip heat transmission of the present invention, be that multi-stage evaporator is dispersed on each cooling parts of need lowering the temperature, remaining part then is integrated in the little space, directly utilize refrigeration working medium to cool off as circulatory mediator, make full use of the remaining space of computer host box 20, whole refrigerating system can be accomplished microminiaturization, this initiatively to produce cold are completely new concepts to cool off a plurality of heat generating components simultaneously.
In sum, the mini-refrigerator system of computer chip heat transmission of the present invention, compact conformation has very high cost performance.And the existing refrigerating systems such as air-cooled, water-cooled and phase transformation that adopt more, the cooling heat dissipation effect that can reach is often more limited, cold can not initiatively be provided, be a kind of passive heat radiation device mostly, and the mechanical refrigeration mode of utilizing that the present invention proposes can produce cold as required, overcome said method and be difficult to realize simultaneously a plurality of heat generating components are carried out the initiatively defective of cooling, this also is one of key of proposing of the present invention.Central principle of the present invention is the heat generating components that utilizes the mechanical refrigeration cooling to be connected with evaporator to reach the purpose to its cooling.Device of the present invention can more effectively be because mechanical refrigeration can drop to lower temperature to the computer heat generating components, and can carry out series, parallel or mixing to evaporator not at the same level and connect together and simultaneously a plurality of heat generating components are cooled.Can be according to the different choice of the computer different refrigerating capacity of this cover refrigerating system, even same computer also can add an evaporator again according to the parts that increase newly oneself it is cooled off, be fit to the constantly requirement of upgrading of computer, whole system miniaturization, low energy consumption, cooling are big, compact conformation, reliability is high and operation is very simple.The range of application of device provided by the invention also not only is confined to personal computer, and it also can be used on the mainframe computer even on the supercomputer.But for the sake of simplicity, following is that example is set forth technology path of the present invention with the refrigerating system cooling PC of utilizing vapour compression refrigeration only.Before this, the notion of superminiature refrigerator is not suggested as yet, and the present invention is expected to play a significant role in more high power heat radiation occasions.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the kind of refrigeration cycle schematic diagram that is used for the mini-refrigerator system of computer chip heat radiation of the present invention;
Fig. 3 is refrigerator casing 16 structural representations of the present invention;
Fig. 4 is the outer surface front view of refrigerator casing 16 shown in Figure 3;
Fig. 5 is the outer surface end view of refrigerator casing 16 shown in Figure 3;
Fig. 6 is the structural representation of another embodiment of the present invention;
Fig. 7 is the structural representation of the third embodiment of the present invention;
Fig. 8 withholds the profile that is connected for evaporator shown in Figure 1 with computer CPU 21;
Fig. 9 is the circuit diagram of controller 19 shown in Figure 3;
Wherein: compressor 1 condenser 2 cooling fans 3
Device for drying and filtering 4 capillaries 5 capillaries 6
Capillary 10 evaporators 11 evaporators 12
14 15 of liquid separatnig tube 13 connecting ducts
Controller 19 computer host boxes 20 computer CPUs 21
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing and specific embodiments.
Fig. 1 is a structural representation of the present invention; Fig. 2 is the kind of refrigeration cycle schematic diagram that is used for the mini-refrigerator system of computer chip heat radiation of the present invention; As seen from the figure, the mini-refrigerator system that is used for the computer chip heat radiation of the present invention comprises: compressor 1, condenser 2, device for drying and filtering 4, capillary and evaporator, liquid separatnig tube 13, control circuit 19; Compressor 1 is connected with condenser 2, and condenser 2 is connected with capillary and evaporator by device for drying and filtering 4, and evaporator is connected with compressor 1 to form refrigerating circuit by liquid separatnig tube 13;
Described evaporator is that parallel/series or connection in series-parallel are connected single-stage or the multi-stage evaporator on the connecting tube between device for drying and filtering 4 and the liquid separatnig tube 13 with mixing, and capillary is connected on the preposition connecting tube of each evaporator; Above-mentioned evaporator can reach the 1-10 level, evaporating temperature is-100-100 ℃ between;
By Fig. 1 and Fig. 2 as can be known, in the present embodiment, capillary 5, evaporator 7, capillary 10 and evaporator 12 are connected between device for drying and filtering 4 and the liquid separatnig tube 13 on the connecting tube, to form first order throttling refrigeration successively; Capillary 6, evaporator 8, capillary 9 and evaporator 11 are connected between device for drying and filtering 4 and the liquid separatnig tube 13 on the connecting tube successively, to form second level throttling refrigeration; That is: in parallel first order throttling refrigeration and first order throttling refrigeration on the connecting tube between device for drying and filtering 4 and the liquid separatnig tube 13.
Compressor 1 starts the high pressure superheated steam of discharging the back and passes through condenser 2 condensations, after capillary 5 and capillary 6 throttlings, enter first evaporator 7 and evaporator 8 refrigeration respectively, then through capillary between the evaporator of the second level 9 and capillary 10 throttling once more, enter evaporator 11 and evaporator 12 cools off (temperature is lower than first evaporator), return compressor 1 at last.Because the caloric value difference of different heater elements in the computer, desired chilling temperature is also different, can adopt multi-stage evaporator repeatedly throttling reach a plurality of different evaporating temperatures, can adapt to different cooling requirements like this.Can only cool off cpu chip for PC, adopt single-stage evaporator, also can select the smaller compressor of refrigerating capacity 1; Just can adopt simple series connection or parallel connection when waiting other heater elements to cool off simultaneously to the CPU of PC and image card, mainly be the hobby selection according to space in the computer main tank and individual, the compressor 1 that corresponding selection refrigerating capacity is bigger; If just can adopt the mixing connection in series-parallel when heater element that cools off is many; Require just greatlyyer for simultaneously the heater element of computer cluster even mainframe computer being cooled off refrigerating capacity to compressor, and the evaporator ways of connecting just can be more flexible.
The afterbody evaporator outlet is equipped with liquid separatnig tube 13, enters the cylinder of compressor 1 to prevent refrigerant liquid.Condenser 2 outlets are equipped with device for drying and filtering 4, the cold-producing medium that enters each evaporator is carried out dry filter avoid icing each capillary of obstruction and evaporator tube wall metal is caused corrosion.
Fig. 3 is used for the structural representation of computer for the present invention; Fig. 4 is the outer surface front view of refrigerator casing 16 shown in Figure 3; Fig. 5 is the outer surface end view of refrigerator casing 16 shown in Figure 3; Fig. 6 and Fig. 7 are two other embodiment provided by the invention, and Fig. 8 has provided evaporator 12 and withheld the profile that is connected with computer CPU 21, and the connected mode of all the other evaporators at different levels and heat generating components is similar; Fig. 9 has provided the circuit diagram of controller 19, the supply socket of figure middle controller 19 is connected with the main frame power supply, controller 19 again be installed in evaporator on temperature-sensing element link to each other, simultaneously control connection is on the cooling fan 3 of controller 19 and the switch of compressor 1 and the warning of buzzer.
As seen from the figure, the mini-refrigerator system that is used for the computer chip heat radiation of the present invention, compressor 1 wherein can be according to the different refrigerating capacity of the required selection of computer, both can cool off PC, also can cool to mainframe computer, even same computer also can add an evaporator again according to the parts that increase newly it is cooled off, be fit to the constantly requirement of upgrading of computer.Select existing on the market at present refrigeration machine to make scheme simultaneously as far as possible, to reduce production costs.The mode of refrigeration can adopt both vapor compression, absorption refrigeration, steam-sprayed refrigeration, Compressed Gas refrigeration, air whirl refrigeration, stirling refrigeration, dimension to rein in multiple refrigeration modes such as Mil (VM) refrigeration, GM refrigeration.The present invention recommends preferentially to adopt vapour compression refrigeration, and energy consumption is low because it is present most economical and most widely used refrigerating method, and coefficient of refrigerating performance is bigger.Cold-producing medium in the whole refrigerating system is selected nontoxic pollution-free and non-flammable working medium for use, as HFC-123, HFC-22, HFC-152, HFC134a or other mixed working fluid etc.For simplicity's sake, following only is the procedure of processing of this device of example explanation explanation with the cooling PC refrigerating system that contains vapour compression refrigeration, remaining as the mainframe computer heat abstractor therewith roughly the same, only need to guarantee refrigeration demand selection proper compression machine and dispose suitable evaporator shape, big or small getting final product, these are numerous at this.The PC refrigerating system procedure of processing that has vapour compression refrigeration is (referring to Fig. 3):
(a) select suitable refrigerating capacity for use according to the heating power of computer, and calculate the caloric value of each heat generating components.Select compressor 1 by refrigerating capacity, compressor 1 can adopt both vapor compression, absorption refrigeration, steam-sprayed refrigeration, Compressed Gas refrigeration, air whirl refrigeration, stirling refrigeration, dimension to rein in the types that multiple refrigeration modes was equipped with such as Mil (VM) refrigeration, GM refrigeration.In order to reduce the compressor that noise can be selected for use does not have rotatable parts, take all factors into consideration factors such as noise and energy consumption and recommend the preferential vapour compression refrigeration of adopting, why adopt vapour compression refrigeration to be because it is present most economical and most widely used refrigerating method, the bigger energy consumption of coefficient of refrigerating performance is little, suitable vapour compression machine has been arranged on the market, can be for buying.
(b) selecting diameter for use is that the materials such as copper pipe, seamless steel pipe or aluminum pipe of 1-20mm are made multi-stage evaporator 7,8,11 and 12, the shape of every grade of evaporator and size as required cooling heater members for example CPU, graphics card and video card etc. determine, be fixed on the corresponding element by form such as withhold it carried out cooling heat dissipation.
(c) adopting diameter is 0.1-3.0mm, and length is that the copper tube that 0.6-6m carefully grows is made capillary 5,6,9 and 10, and capillary also can replace from buying ready-made expansion valve on the market.
(d) choose suitable liquid separatnig tube 13 and device for drying and filtering 4, wherein liquid separatnig tube 13 prevents that refrigerant liquid from entering the cylinder of compressor 1, the cold-producing medium that 4 pairs of devices for drying and filtering enter each evaporator carries out dry filter, avoids freezing and stops up each capillary and evaporator tube wall metal is caused corrosion.
(e) condenser 2 can be made the side that ribbed pipe is coiled in refrigerator casing 16 and dispels the heat by cooling fan 3, it is the copper tube aluminum of 1-20mm that ribbed pipe adopts diameter, also can adopt steel pipe steel disc or steel pipe copper sheet, fin can adopt continuous full wafer, make the fin group, also can adopt spiral around sheet, the spacing of fin is 1-5mm, wherein cooling fan 3 can be selected for example 120mm * 120mm for use, the fan that series of comparisons such as 100mm * 120mm are big, thereby reduce rotation speed of the fan by increasing blade dimensions, reduce noise.This type of cooling structure is compact, and cooling fan 3 also helps the cooling of compressor 1 and the air flows in the computer cabinet 20 when condenser 2 is cooled off.Condenser 2 can also directly utilize copper pipe, steel pipe or aluminum pipe etc. to be close to the coiling of computer main tank 20 walls in addition, can increase area of dissipation so greatly, can be without cooling fan 3 (as shown in Figure 6).This mode has reduced the source of noise, while space of relatively sealing of formation in computer cabinet 20 helps reducing the dust in the cabinet, but it needs the user to transform the shell of computer main tank 20, and simultaneous computer works long hours the skin temperature of computer-chronograph main tank 20 may be a little more than room temperature.But can consider to adopt certain low thermal conductivity material be connected, in order to avoid cause spin manifold temperature too high because of its heating at condenser 2 and computer main tank 20.
(f) control circuit 19 is one and has the circuit board of the chip of programmed, can be connected with computer by interface, ruuning situation from display screen monitors compressor 1 and cooling fan 3, and the temperature parameter of each evaporator end, and can regulate the operation conditions of refrigerating system by the computer display input parameter.When the heat radiation that can not satisfy heater element in evaporator end requires in time buzzer and the screen by computer provide warning prompt.
(g) compressor 1, condenser 2, cooling fan 3, device for drying and filtering 4, capillary 5, capillary 6, liquid separatnig tube 13, control circuit 19 elements such as grade are integrated in the refrigerator casing 16, can overhaul and adjust by door 15, compressor outlet connector 17 is used to be connected different evaporator end, 5mm * 5mm * 5mm ~ 50mm * 50mm * 50mm that refrigerator casing 16 is made by materials such as stainless steel or aluminium sheets with compressor inlet connector 18.Simultaneously also can these parts be installed in positions different in the computer main tank 20 flexibly according to the distribution of parts in the various computing machine main tank 20, or even do not want refrigerator casing 16, directly each parts with kind of refrigeration cycle are installed in position different in the computer main tank 20 (as shown in Figure 7).
(h) multi-stage evaporator of making 7,8,11 and 12 is linked closely for example press on the heater elements such as CPU, graphics card and video card (as shown in Figure 8).Multi-stage evaporator can expand as required, adapts to so very much the compatibility and the extendibility of modern computer, and being unlikely to an element to have occurred newly adding just can't be to its phenomenon of cooling off.Multi-stage evaporator also is not limited to simple series connection or is connected in parallel simultaneously, can mix connection as required easily.Joint between the evaporator not at the same level comprises that the joint of miscellaneous part can also can directly weld with being threaded and can also be that convenient and practical employing plastic flexible pipe connects.
(i) power supply with compressor 1 and cooling fan 3 is connected to main frame, allows their control by simultaneously controlled circuit 19.
(j) adopting diameter is that the materials such as copper pipe, seamless steel pipe or aluminum pipe of 1-20mm connect each parts, and it also can be to utilize to be threaded that each joint can be welded, and installs for convenience and also can utilize plastic flexible pipe as joint.
(k) check and to finish, charge nontoxic pollution-free and not flammable cold-producing medium, for example HFC-123, HFC-22, HFC-152, HFC134a or other mixed working fluid etc., the pipeline of last packaged whole system gets final product.
The mini-refrigerator system of computer chip heat radiation provided by the invention and the difference of normal domestic use refrigerator are: reduce for example cooling space such as refrigerating chamber and refrigerating chamber, multi-stage evaporator is dispersed on each cooling parts of need lowering the temperature, remaining part is integrated in the little space, the very similar central air conditioner system of directly utilizing refrigeration working medium as circulatory mediator.Reduce for example cooling space such as refrigerating chamber and refrigerating chamber, made full use of the remaining space of computer main tank 20 simultaneously, whole refrigerating system can have been accomplished microminiaturization.
Device provided by the invention can be applied on PC and mainframe computer etc.At present, utilizing methods such as air-cooled, water-cooled and phase-change heat-exchange to be applied in the patent that CPU goes up cooling heat dissipation has come out, the integrated micro refrigeration machine that utilizes vapour compression refrigeration to make is applied in and yet there are no report on the CPU, utilize it simultaneously to a plurality of heat generating components in the computer lower the temperature the cooling more rare.But utilize vapour compression refrigeration can be easy to it is installed in the computer main tank with regard to present technology, the refrigerating capacity according to a plurality of evaporators of heat regulation of each heat generating components reaches the cooling purpose of lowering the temperature simultaneously.This mechanism just of utilization of the present invention promptly utilizes vapour compression refrigeration to cool, and proposes the device of a brand-new cooling computer heat generating components.
The present invention has lot of advantages, it carries out active cooling cooling to a plurality of heat generating components of computer simultaneously by mechanical refrigeration, it can select different refrigerating capacitys according to the computer to dissipate heat demand, both can cool off the household personal computer, also can cool to mainframe computer, even same computer also can add an evaporator again according to the parts that increase newly it is cooled off, be fit to the constantly requirement of upgrading of computer, whole system miniaturization, low energy consumption, cooling are big, compact conformation, reliability is high and operation is very simple.Just because of these composite factors, make that method and apparatus provided by the invention is simple, compare and utilize the scheme of air-cooled, water-cooled and phase-change heat-exchange cooling computer heat generating components that very big advantage is arranged in the past, be expected to become general purpose computer chip heat radiator of new generation.
For the ease of being installed on the computer cabinet, compressor 1, condenser 2, cooling fan 3, device for drying and filtering 4, capillary 5, capillary 6, liquid separatnig tube 13, control circuit 19 grades can be integrated in the refrigerator casing 16, overhaul and adjust by door 15, compressor outlet connector 17 is used to be connected different evaporator end with compressor inlet connector 18.Simultaneously also can these parts be installed in positions different in the computer main tank 20 flexibly according to the distribution of parts in the various computing machine main tank 20, or even do not want refrigerator casing 16, directly each parts with kind of refrigeration cycle are installed in positions different in the computer main tank 20.But connecting tube is the certain insulation casing of external application as required.
Condenser 2 can be made the side that ribbed pipe is coiled in refrigerator casing 16 and dispel the heat by cooling fan 3, ribbed pipe adopts copper tube aluminum also can adopt steel pipe steel disc or steel pipe copper sheet, fin can adopt continuous full wafer, make the fin group, also can adopt spiral around sheet, the spacing of fin is 1 ~ 5mm, wherein cooling fan 3 can preferred dimension such as 120mm * 120mm, serial big fan such as 100mm * 120mm reduces rotation speed of the fan by increasing blade dimensions, reduces noise.This type of cooling structure is compact, and cooling fan 3 also helps the cooling of compressor 1 and the air flows in the computer cabinet 20 when condenser 2 is cooled off, but also can bring the disadvantage that increases noise so simultaneously.Condenser 2 also can directly utilize copper pipe, steel pipe or aluminum pipe etc. to be close to the coiling of computer main tank 20 walls in addition, and the remarkable like this area of dissipation that increased can be without cooling fan 3.This mode can reduce the noise source, while space of relatively sealing of formation in computer cabinet 20 helps reducing the dust in the cabinet, but it needs the user to transform the shell of computer main tank 20, and simultaneous computer works long hours the skin temperature of computer-chronograph main tank 20 may be a little more than room temperature.Can consider to adopt certain low thermal conductivity material to be connected between mini-refrigerator system but provided by the invention and the computer cabinet, in order to avoid cause spin manifold temperature too high because of its heating.
Compressor 1 and cooling fan 3 are powered by the main frame power supply in the refrigerating system, simultaneously controlled circuit 19 controls, wherein control circuit 19 can be connected with computer by interface, but ruuning situation from display screen monitors compressor 1 and cooling fan 3, and the temperature parameter of each evaporator end, and can regulate the operation conditions of refrigerating system by the computer display input parameter.When the heat radiation that can not satisfy heater element in evaporator end requires in time buzzer and the screen by computer provide warning prompt, and cut off the main frame power supply where necessary.Control circuit 19 can expand as required.
With regard to present existing technology, it is smaller and be placed in the computer main tank 20 of PC that whole device can be done.Existing on the market computer main tank 20 shape differences are big especially, can arrange each position component simultaneously flexibly according to the size and the shape of computer main tank 20 utilizable space decision refrigerator casings 16.On the other hand, this refrigerating system also not only is confined to PC, can be applied in the mainframe computer fully and go, and is similar to a heavy construction and is equipped with a cover central air conditioner system.A plurality of even mini refrigerating machines are worked simultaneously, also can provide big cold by a large scale refrigeration machine.
The use and the points for attention of apparatus of the present invention are as follows:
1. after installing the computing mechanism cooling system according to above-mentioned example explanation, checking has inerrancy or omission;
2. checking finishes opens computer, and whether observe each valve, Pressure gauge, temperature sensor and other instrument parameters by control circuit 19 on display normal;
3. confirm that normal back starts compressor, whether normal, if after correct, system can enter normal operation if observing operational factor, if finding has the part heat generating components not reach the chilling temperature or the other problems of requirement, in time adjust operational factor or do other repairing.
When 4. shutting down computer, can implement to close to the power supply of refrigerating system.
5. since cold-producing medium in 490 ~ 686kPa pressure limit of being everlasting, therefore, the joint in the pipeline all must not at will be opened, in order to avoid freezing medium leakage and cause other accidents.
6. the system that adopts cooling fan 3 cooler condensers 2 (about 3 months) at set intervals will remove dust on the condenser ribbed pipe.
Should be careful when 7. repairing the computer parts, note not damaging the connecting tube of refrigerating system, prevent freezing medium leakage.
When 8. refrigerating system itself being overhauled, note not starting computer, in order to avoid burn out the heat generating components in the computer.
Claims (12)
1, a kind of mini-refrigerator system that is used for the computer chip heat radiation comprises: compressor (1), condenser (2), device for drying and filtering (4), capillary and evaporator, liquid separatnig tube (13), control circuit (19); Compressor (1) is connected with condenser (2), condenser (2) is connected with capillary and evaporator by device for drying and filtering (4), and evaporator is connected with compressor (1) to form vapour compression refrigeration loop, absorption refrigeration loop, steam-sprayed refrigerating circuit, Compressed Gas refrigerating circuit, air whirl refrigerating circuit, stirling refrigeration loop, to tie up and rein in Mil's refrigerating circuit or GM refrigerating circuit by liquid separatnig tube (13); One cooling fan (3) is installed near the condenser (2), and a power supply links to each other with cooling fan (3) with compressor (1) respectively.
2, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 1, it is characterized in that: described evaporator is connected single-stage or the multi-stage evaporator on the connecting tube between device for drying and filtering (4) and the liquid separatnig tube (13) for parallel connection, series connection or connection in series-parallel with mixing, and capillary is connected on the preposition connecting tube of each evaporator.
3, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 1, it is characterized in that: described compressor (1) is for providing the compressor of 10-2000W refrigerating capacity, and its input power is 10-400W.
4, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 3, it is characterized in that: the cold-producing medium that uses in the described refrigerating circuit is a kind of fluid working substance in nontoxic pollution-free and non-flammable HFC-123, HFC-22, HFC-152 and the HFC134a working medium; Perhaps be the fluid-mixing working medium that two or more working medium in them are formed.
5, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 1, it is characterized in that: compressor (1), condenser (2), device for drying and filtering (4), capillary and evaporator, liquid separatnig tube (13), power supply and cooling fan (3) collect whole or in part and are contained in the refrigerator casing (16) that a stainless steel or aluminium sheet material make, refrigerator casing (16) is provided with open the door (15), compressor outlet connector (17) links to each other with evaporator with condenser respectively with the sidewall that compressor inlet connector (18) passes refrigerator casing (16), and the size range of described refrigerator casing (16) is 5mm * 5mm * 5mm-500mm * 500mm * 500mm.
6, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 1, it is characterized in that: described power supply is the main frame power supply, one controller (19) that links to each other with the main frame power supply is connected cooling fan (3) and compressor (1) respectively, and the temperature-sensing element that is installed on the evaporator links to each other with controller (19).
7, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 6, it is characterized in that: described controller (19) links to each other with the buzzer of computer.
8, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 1, it is characterized in that: the ribbed pipe of condenser (2) is coiled in the side in the refrigerator casing (16), copper pipe, aluminum pipe or steel pipe that its ribbed pipe diameter is 1-20mm, the fin of condenser (2) be the continuous full wafer done of copper, aluminium or steel or spiral around sheet, the spacing of fin is 1-5mm.
9, by claim 1 or the 2 described mini-refrigerator systems that are used for the computer chip heat radiation, it is characterized in that: described evaporator is that diameter is the evaporator that copper pipe, seamless steel pipe or the aluminium tube material of 1-20mm made, and this evaporator is withheld on element to be dispelled the heat.
10, by claim 1 or the 2 described mini-refrigerator systems that are used for the computer chip heat radiation, it is characterized in that: described capillary is that diameter is that 0.1-3.0mm, length are the copper tube of 0.6-6m, or is expansion valve.
11, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 1, it is characterized in that: connecting tube is that diameter is copper pipe, seamless steel pipe or the aluminum pipe of 1-20mm.
12, by the described mini-refrigerator system that is used for the computer chip heat radiation of claim 11, it is characterized in that: the coated heat-insulation layer that has foam class heat-insulating material to make on the described connecting tube.
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| CNB031375618A CN1302544C (en) | 2003-06-18 | 2003-06-18 | Miniature refrigerating system for radiating computer chip |
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| CNB031375618A CN1302544C (en) | 2003-06-18 | 2003-06-18 | Miniature refrigerating system for radiating computer chip |
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| CN1302544C true CN1302544C (en) | 2007-02-28 |
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| CNB031375618A Expired - Fee Related CN1302544C (en) | 2003-06-18 | 2003-06-18 | Miniature refrigerating system for radiating computer chip |
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| CN101452325B (en) * | 2007-11-30 | 2010-11-03 | 中国科学院理化技术研究所 | Actively cooled thermal management system with easy-to-swap heating elements |
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| CN100450336C (en) * | 2007-03-26 | 2009-01-07 | 山东省科学院能源研究所 | Single-phase ultra-high heat flow microcolumn heat exchanger |
| EP2302991B1 (en) * | 2008-05-30 | 2012-08-01 | NEC Display Solutions, Ltd. | Filter, cooling jetting member and cooling wind jetting method |
| CN202485267U (en) * | 2012-01-09 | 2012-10-10 | 齐力制冷系统(深圳)有限公司 | Refrigerating device |
| CN102609061A (en) * | 2012-01-13 | 2012-07-25 | 珠海佳一电子技术有限公司 | Miniature evaporation radiator for CPU (central processing unit) and GPU (graphics processing unit) of high-speed computer |
| CN102655130B (en) * | 2012-05-04 | 2016-10-05 | 深圳市康普科勒科技开发有限公司 | Compressor-type chip cooling system |
| CN102683306A (en) * | 2012-05-21 | 2012-09-19 | 孙正军 | Efficient microchannel evaporation cooling nozzle |
| CN102706211B (en) * | 2012-05-29 | 2015-02-25 | 浙江微智源能源技术有限公司 | Temperature control system |
| CN103218023B (en) * | 2013-04-18 | 2016-04-13 | 深圳市七彩虹科技发展有限公司 | Compressor cooling video card |
| CN103280434B (en) * | 2013-06-04 | 2016-01-27 | 江苏大学 | Based on the cycles, economized type micro-nano optoelectronic chip heat abstractor of Stirling engine |
| CN104851857B (en) * | 2015-04-28 | 2017-06-27 | 西安交通大学 | A chip cooling system |
| CN107977058A (en) * | 2017-07-10 | 2018-05-01 | 常州信息职业技术学院 | Computer cabinet |
| WO2019048950A1 (en) * | 2017-09-11 | 2019-03-14 | 旭品科技股份有限公司 | Heat exchange device and equipment having heat exchange device |
| CN111257042A (en) * | 2020-02-28 | 2020-06-09 | 中科鼎实环境工程有限公司 | Cooling device for soil heat sampling, soil heat sampling system and sampling method |
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