CN1301860C - Inkjet head structure, inkjet head ink supply channel packaging structure and packaging method thereof - Google Patents
Inkjet head structure, inkjet head ink supply channel packaging structure and packaging method thereof Download PDFInfo
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- CN1301860C CN1301860C CNB031593674A CN03159367A CN1301860C CN 1301860 C CN1301860 C CN 1301860C CN B031593674 A CNB031593674 A CN B031593674A CN 03159367 A CN03159367 A CN 03159367A CN 1301860 C CN1301860 C CN 1301860C
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- 238000000034 method Methods 0.000 title claims description 35
- 238000004806 packaging method and process Methods 0.000 title abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 102
- 239000007921 spray Substances 0.000 claims description 89
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000004888 barrier function Effects 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 238000007373 indentation Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 22
- 238000012856 packing Methods 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- 238000005304 joining Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 101100518972 Caenorhabditis elegans pat-6 gene Proteins 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
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Abstract
The invention is a packaging structure of ink supply channel of ink jet head, which comprises: the ink cartridge is used for containing ink and is provided with a bearing seat, the bearing seat is composed of a first bearing area and a second bearing area, and the second bearing area is provided with a first inner side wall and a second inner side wall; the heating chip is rectangular and is directly borne on the first bearing area of the bearing seat, the heating chip is provided with a first outer side wall and a second outer side wall along the length direction, and the first outer side wall and the second outer side wall respectively form a first ink supply flow channel and a second ink supply flow channel with the first inner side wall and the second inner side wall of the second bearing area; the nozzle plate at least covers the outer surface of the heating chip part and extends to the second bearing area, and the nozzle plate is directly combined and sealed with the second bearing area so as to encapsulate the first ink supply flow channel and the second ink supply flow channel; and a flexible circuit board covering the outer surface of the ink box and having an opening, the periphery of the opening is separated from the first and second bearing areas, wherein the nozzle plate has a first and a second gap, so that when the nozzle plate is combined with the heating chip, the welding pad is exposed from the first and second gaps.
Description
(1) technical field
The ink gun structure of the relevant a kind of ink cartridges of the present invention refers to a kind of ink gun structure that dwindles the heating chip size that has especially.The present invention also combines with ink cartridges about a kind of spray nozzle sheet that only uses, with the structure and the method for encapsulation ink gun.
(2) background technology
Along with PC develops gradually, ink-jet printer (ink jet printer) has become very general interface equipment, is widely used in family, personal work chamber or even all trades and professions.The major advantage of ink-jet printer is cheap, the low and good print quality of when operation noise, and printable in various medium, for example general paper, special inkjet printing paper, photo paper and special-purpose transparency etc.
Control ink gun (printhead) disengages one of key factor that ink droplet need consider for the design ink cartridges to the mechanism of ink-jet medium.Generally speaking, the mode of ink gun ejection ink droplet mainly contains two kinds of hot bubble type (thermal bubbletype) and piezoelectric types (micro piezo type).With the hot bubble type ink jet head is example, and its operating principle is to utilize heating resistor (heater resistor) heating to make it to produce bubble and then ink is squeezed, and makes it to be sprayed onto on the ink-jet medium by a plurality of spray orifices.
Please see Figure 1, known ink gun structure mainly is made up of a heating chip 11, a barrier layer (barrierlayer) 12 and 13 of spray nozzle sheets (nozzle plate).Heating chip 11 is for generally haveing the knack of known to this technical staff, and it is for having the chip of resistance heater (resistor heater), for ease of describing, hereinafter to be referred as heating chip (heater IC).Heating chip 11 comprises 110, the one groups of weld pads (contactpad) 111 that center on the heating resistor (not shown) of ink supply port and be positioned at the heating chip both sides of ink supply port (ink slot) that are arranged at central authorities.Form a plurality of inking chambers (ink chamber) 121 in the barrier layer 12, and barrier layer 12 is to form ink supply runner (ink channel) (not shown) on heating chip 11.A plurality of spray orifices 131 corresponding to inking chamber 121 are then arranged on the spray nozzle sheet 13.
Please see Figure 2, it is as follows to make above-mentioned ink gun be packaged in the method for ink cartridges (ink cartridge).At first make spray nozzle sheet (nozzle plate) 13 precisions to being positioned at heating chip 11, to form a chip assembly (ICassembly); After the flexible circuit board that then makes chip assembly and supply output to go into signal is finished and is electrically connected; At last, utilize adhesive agent with the chip assembly gluing on the ink gun load bearing seat 21 of ink cartridges body 2 bottoms, finish the ink gun encapsulation work immediately.Please cooperate and see Fig. 1 and Fig. 2, when using this ink cartridges, the ink that is stored in the ink cartridges body 2 interior ink ducts (ink reservoir) (not shown) at first flow to bottom outlet 22 from ink duct, then only can flow into the ink supply port 110 of heating chip 11 central authorities, enter barrier layer 12 formed ink supply runner on heating chip 11, because of except that central ink supply aperture 110, other is all packaged by the load bearing seat 21 of chip assembly and ink cartridges body 2 bottoms; Ink is unlikely to leak outside, and then flow to inking chamber 121 again, then utilizes heating resistor heating to make it to produce bubble at last and then ink is squeezed, and make it to be sprayed onto on the ink-jet medium by the spray orifice on the spray nozzle sheet 13 131.
Adopt the structure and the method for above-mentioned encapsulation ink gun to face following problem:
(1) heating chip 11 with central ink supply port 110 has the structural strength that weakens, thereby the fracture chance improves, and causes yield to reduce; In addition, in order to reserve the cause of central ink supply port 110, so heating chip 11 need have sizable size inevitably, and this has improved the cost of making heating chip greatly.
(2) please see Figure 3, because ink gun load bearing seat 21 is substantially a smooth surface, therefore, for guarantee the effective gluing of IC assembly in ink gun load bearing seat 21 so that excellent sealing to be provided, must be coated with adhesive agent 23 quite on a large scale on the ink gun load bearing seat 21, this improves the packaging cost of ink gun.
In addition, also there is known techniques that one carrier (carrier) (not icon) is set on the ink gun load bearing seat 21 of ink cartridges body 2, with adhesive agent chip assembly attached on the carrier then, to finish the ink gun encapsulation work.Yet such structure is the same with packaged type can to produce above-mentioned problem, and the increase carrier not only makes the problem on the manufacturing cost raising and the processing procedure of deriving easily.
The structure of another kind of encapsulation ink gun and method be the automatic joining technique of employing winding (Tape AutomatedBonding, TAB).At first in a winding (tape) 30, make circuit (conductive traces) to form flexible circuit board; Precalculated position on flexible circuit board utilizes the laser beam perforation mode to form spray orifice 311 again; Then make the heating resistor (not shown) of heating chip corresponding one by one, make it to be incorporated on the flexible circuit board, to form a TAB assembly (TAB assembly) with spray orifice 311 in accurate contraposition mode; At last, utilize adhesive agent with TAB assembly gluing on the ink gun load bearing seat of ink cartridges body 32, finish ink gun encapsulation work as shown in Figure 4 immediately.
Though utilize the automatic joining technique encapsulation of winding ink gun can reach increasingly automated packaging effect, yet face many shortcomings on the practice.For instance, when utilizing the TAB component package, the flexible circuit board of TAB will bind in load bearing seat with spray nozzle sheet simultaneously; Why not easy will cause bond area out-of-flatness and glutinous phenomenon, cause ink leak, be the defective of known techniques.Secondly, make when bad, must scrap together with the flexible circuit board of combination, so cost is quite high when spray orifice; In addition, this method needs higher contraposition precision (needing simultaneously spray orifice and the contraposition of heating chip resistor and the weld pad 111 and the contraposition of flexible circuit board circuit that make the heating chip two ends), bit errors is had relatively high expectations, so process technique difficulty height, so generally speaking, utilize this known techniques that considerable defective is arranged.
In U.S. Pat 6, disclosed a kind of ink jet-print head in 322,200, its encapsulation process be earlier with substrate package in spray nozzle sheet, flexible circuit board is adhered on the spray nozzle sheet, the unit package that heating chip, spray nozzle sheet and flexible circuit board are formed is positioned on the ink supply casket at last again.But design from spray nozzle sheet and flexible circuit board structure, it all is to be provided with the closed rectangle that exposes for the heating chip weld pad to window, the closed rectangle like this design of windowing, when being packaged in heating chip on the spray nozzle sheet, need the weld pad at heating chip two ends to implement with the contraposition of doing than high accurancy and precision of windowing, and needing both to window when adhering to flexible circuit board on the spray nozzle sheet aligns mutually, bit errors is had relatively high expectations, therefore the process technique difficulty improves, so generally speaking, management and control cost and production cost are all quite high.
(3) summary of the invention
Main purpose of the present invention provides a kind of ink gun structure and method for packing thereof, is meant the technology of only utilizing spray nozzle sheet encapsulation ink especially, has the black nozzle structure encapsulation of commonly using of the large-area chips problem that ink faced and solve.
Another object of the present invention provides a kind of ink gun structure and method for packing thereof, to solve the automatic joining technique encapsulation of the winding problem that ink gun was faced.
Another purpose of the present invention provides a kind of ink gun ink supply runner encapsulating structure and method for packing thereof, to increase the tolerance in the assembling and to reduce the product fraction defective.
Ink gun ink supply runner encapsulating structure according to an aspect of the present invention, it comprises: an ink cartridges, in order to hold ink and to have a load bearing seat, this load bearing seat is to be made of first supporting region and second supporting region, and wherein this second supporting region has one first madial wall and one second madial wall;
One heating chip, rectangular and directly be set up on this first supporting region of this load bearing seat, wherein this heating chip has first and second lateral wall along its length, this first with this second lateral wall respectively with this second supporting region this first and this second madial wall form first and second ink supply runner;
One spray nozzle sheet covers partly outer surface of this heating chip at least, extend on this second supporting region, this spray nozzle sheet and the direct combination seal of this second supporting region, with encapsulate this first and this second ink supply runner; And
One flexible circuit board is covered in this ink cartridges outer surface and has an opening, this opening peripheral with this first and this second supporting region separate mutually,
It is characterized in that this spray nozzle sheet has one first and one second breach, with when this spray nozzle sheet combines with this heating chip, this first and second indentation, there is exposed this weld pad certainly.
According to conception of the present invention, wherein this spray nozzle sheet is this opening that is positioned at this flexible circuit board.
According to conception of the present invention, wherein this spray nozzle sheet be mat coating adhesive agent and directly combination seal on this second supporting region.
According to conception of the present invention, wherein the both sides of the edge of this heating chip broad ways further are provided with weld pad.
According to conception of the present invention, wherein the weld pad on this heating chip be with this flexible circuit board on preinstalled circuit form and to be electrically connected.
According to conception of the present invention, wherein the length of this heating chip is length than the length of this spray nozzle sheet, and exposes this weld pad when this spray nozzle sheet combines with this heating chip.
According to conception of the present invention, the equal in length of the length of this heating chip and this spray nozzle sheet wherein.
According to conception of the present invention, wherein this spray nozzle sheet is to be " H " shape.
According to conception of the present invention, wherein this first supporting region and this second supporting region are to be positioned on the different level.
According to conception of the present invention, wherein this first or this second supporting region be platform for a standing shape.
According to conception of the present invention, wherein this first or this second supporting region be the platform that has a groove for.
A kind of ink gun structure according to a further aspect of the invention, it comprises: an ink cartridges, in order to hold ink and to have a load bearing seat, this load bearing seat is to be made of first supporting region and second supporting region, and wherein this second supporting region has one first madial wall and one second madial wall; One heating chip, rectangular and directly be carried on this first supporting region of this load bearing seat, wherein this heating chip has first and second lateral wall along its length, this first with this second lateral wall respectively with this second supporting region this first and this second madial wall form first and second ink supply runner; One barrier layer is formed on this heating chip, and in the exposed at both sides of this heating chip this heating chip of part and form a plurality of inking chambers; And a spray nozzle sheet, be to be covered on this barrier layer, and a plurality of spray orifices be set with respect to this a plurality of inking chambers place, this spray nozzle sheet extends on this second supporting region, and by the coating adhesive agent make this spray nozzle sheet only with this second supporting region combination seal; An and flexible circuit board, be covered in this ink cartridges outer surface and have an opening, this opening is peripheral first to be separated with this second supporting region with this, wherein, this spray nozzle sheet has one first and one second breach, with when this spray nozzle sheet combines with this heating chip, this first and second indentation, there is exposed this weld pad certainly.
The method of encapsulation ink gun ink supply runner according to a further aspect of the invention, it comprises the following step: an ink cartridges is provided, in order to hold ink and to have a load bearing seat, this load bearing seat is to be made of first supporting region and second supporting region, and this second supporting region has one first madial wall and one second madial wall; One chip assembly is provided, the spray nozzle sheet that this chip assembly has a prefabricated spray orifice by a barrier layer, a heating chip and is formed and is formed ink supply port and a plurality of inking chamber jointly, and wherein this heating chip has one first lateral wall and second lateral wall along its length; On this first supporting region of this load bearing seat and this second supporting region, be coated with adhesive agent; And with this chip assembly gluing on this load bearing seat, make this first madial wall of this second supporting region and this second madial wall form one first ink supply runner and one second ink supply runner with this first lateral wall and this second lateral wall of this heating chip respectively, and make this heating chip and this spray nozzle sheet respectively and directly combination seal on this first supporting region and this second supporting region, and provide a flexible circuit board with an opening, be covered in this ink cartridges outer surface, this opening is peripheral to be separated mutually with this first and second supporting region, using the pressing apparatus is positioned on the ink gun flexible circuit board joint, wherein, make this spray nozzle sheet have one first and one second breach, with when this spray nozzle sheet combines with this heating chip, this first and second indentation, there is exposed this weld pad certainly.
The present invention can obtain clearer understanding by the detailed description of following accompanying drawing and embodiment.
(4) description of drawings
Fig. 1 is the ink gun structure of prior art.
Fig. 2 is the situation that ink gun is assembled in ink cartridges in the prior art.
Fig. 3 is the situation of the method coating adhesive agent of prior art encapsulation ink gun.
Fig. 4 is the structure and the method for another kind of encapsulation ink gun in the prior art.
Fig. 5 is the ink gun structure of first preferred embodiment according to the present invention.
Fig. 6 is the situation that ink gun according to the present invention is packaged in ink cartridges.
Fig. 7 is the partial enlarged drawing according to ink-box structure shown in Figure 6.
Fig. 8 is the situation of coating adhesive agent when encapsulating ink gun according to the present invention.
Fig. 9 is according to ink gun encapsulation three-dimensional exploded view of the present invention.
Figure 10 is the flexible circuit board and the ink gun relativeness schematic diagram of the invention according to the present invention.
Figure 11 is the ink gun structure schematic diagram of second preferred embodiment according to the present invention.
(5) specific embodiment
Please see Figure 5, the ink gun structure of first preferred embodiment mainly is made up of 53 of a heating chip (heater IC) 51, one barrier layer (barrier layer) 52 and one spray nozzle sheets (nozzle plate) according to the present invention.Heating chip 51 is rectangular, and it has weld pad 511 in both sides of the edge up and down.Barrier layer 52 is to be formed on the heating chip 51, and forms ink supply runner and a plurality of inking chamber 521 jointly on heating chip 51.Heating chip 51 is provided with a heating resistor (not shown) with respect to each inking chamber 521 place.Spray nozzle sheet 53 is " H " font, and its top is provided with a plurality of spray orifices 531 corresponding to inking chamber 521.In the present embodiment, the equal in length of the length of heating chip 51 and spray nozzle sheet 53 is electrically connected with spray nozzle sheet 53 generations for fear of heating chip 51, and spray nozzle sheet 53 has first breach 532 and second breach 533, with when spray nozzle sheet 53 combines with heating chip 51, can expose weld pad 511.
The characteristics that are shown in the ink gun structure of Fig. 5 are: can expose left and right sides part heating chip 513 and 514 (meaning barrier layer 52 is " I " font) when barrier layer 52 is formed on the heating chip 51, and the width of spray nozzle sheet 53 is big than heating chip 53, therefore when spray nozzle sheet 53 combines with heating chip 51, but heating chip 513 and 514 ink supply water that spray nozzle sheet 53 and the left and right sides part that do not covered by barrier layer 52 are exposed pass through.
In addition, as Figure 6 and Figure 7, for cooperating the special ink gun structure of the present invention, the ink gun load bearing seat 61 of ink cartridges body 6 also is designed to have respectively in order to carry first supporting region 611 and second supporting region 612 of heating chip and spray nozzle sheet.
Below will further specify the method for the preferred embodiment encapsulation ink gun according to the present invention, it comprises following steps:
(a) as shown in Figure 5, provide and have prefabricated spray orifice 531 spray nozzle sheet 53 of (for example utilizing electroforming or laser mode to form), and provide and have and the barrier layer 52 common heating chips 51 that form ink supply runners and a plurality of inking chamber 521;
(b) as shown in Figure 6, make spray nozzle sheet 53 precisions to being positioned at heating chip 51, to form a chip assembly (IC assembly) 50;
(c) provide as shown in Figure 6 ink gun load bearing seat 61, and on first supporting region 611 and second supporting region 612, be coated with adhesive agent;
(d) with the chip assembly gluing on ink gun load bearing seat 61, make heating chip 51 and spray nozzle sheet 53 be positioned first supporting region 611 and second supporting region 612 respectively and directly, and heating chip 51 and spray nozzle sheet 53 are only combined with first supporting region 611 and second supporting region 612 respectively.Certainly, this step also can cooperate suitable frock appliance pressing chip assembly, to improve sealing, makes ink be unlikely and leaks outside.
Please see Figure 6 to 8, because first supporting region 611 and second supporting region 612 of ink gun load bearing seat 61 are to be positioned on the different level, not only can effectively support heating chip 51 and spray nozzle sheet 53, and the coating scope of adhesive agent 63 can reduce moderately, reduce packaging cost by this.In addition, can find that heating chip 51 has one first lateral wall 515 and one second lateral wall 516 along its length, and second supporting region 612 also have one first madial wall 6121 and second madial wall 6122 by Fig. 8.Wherein, first lateral wall 515 of heating chip 516 and second lateral wall 516 first madial wall 6121 and second madial wall 6122 with second supporting region 612 respectively are relative, to form the first ink supply runner 621 and the second ink supply runner 622 respectively.
Please see Figure 9, the first supporting regions 611 again and second supporting region, 612 peripheries can have groove 613,, certainly also can be platform, and groove can hold adhesive agent 63 with groove for adhesive agent overflow or distribution.
Please cooperate and see Fig. 5,6 and 8, when using the ink gun of mat the present invention encapsulation, the ink that is stored in the ink cartridges body 6 interior ink ducts (not shown) at first flow to bottom outlet 62 from ink duct, then flow into first lateral wall 515 of heating chip 51 and first madial wall 6121 and 6122 the formed first ink supply runners 621 of second madial wall and the second ink supply runner 622 of second lateral wall 516 and second supporting region 612, enter 51 formed ink supply runners of barrier layer 52 and heating chip again, and then flow to inking chamber 521, then utilize the heating resistor heating ink so that ink gasifies rapidly at last, and then be sprayed onto on the ink-jet medium by the spray orifice on the spray nozzle sheet 53 531.
Except that above-mentioned steps (a) and (b), (c) reached (d), the structure of encapsulation ink gun of the present invention and method also can further comprise:
As shown in figure 10, adopt the automatic joining technique of winding to make circuit to form a flexible circuit board 7 in a winding, wherein this flexible circuit board 7 has a default opening 70, and chip assembly 50 is to be positioned at this default opening 70.In this embodiment, the weld pad 511 on the heating chip 51 of chip assembly 50 is electrically connected with the corresponding circuit 71 of flexible circuit board 7 edge of opening, and the opening 70 of the size of spray nozzle sheet 53 and flexible circuit board 7 is measure-alike in addition.When chip assembly 50 and flexible circuit board 7 are arranged at ink cartridges 6, default opening 70 edges of flexible circuit board 7 can be separated with first supporting region 611 and second supporting region 612, therefore can make the spray nozzle sheet 53 of chip assembly 50 only engage sealing by the coating adhesive agent, just can finish the encapsulation work of ink gun by this with second supporting region 612.
Figure 11 shows the ink gun structure of second preferred embodiment according to the present invention, except the length of heating chip 51 than the length of spray nozzle sheet 53 for long, with outside avoiding heating chip 51 and spray nozzle sheet 53 to produce being electrically connected, all the other are identical with Fig. 5 structure, and method for packing is also identical with above-mentioned steps, does not give unnecessary details at this.
In sum, ink gun provided by the invention and method for packing thereof make the advantage of heating chip encapsulation ink gun of apparatus central authorities jet orifice as follows compared to prior art:
(1) need not utilize the sealing of heating chip and ink cartridges body load bearing seat, then middle section can be used to make the IC circuit, thus can significantly reduce the heating chip size, and then reduce the cost of heating chip.
(2) the adhesive agent scope that is coated with on the ink gun load bearing seat reduces, and also can guarantee good sealing property, so packaging cost is relatively low.
(3) on the ink load bearing seat of ink cartridges body carrier need not be set in addition, therefore the heating chip on the chip assembly can be directly and first supporting region gluing mutually, and spray nozzle sheet can directly be connected with second supporting region, and then can save many costs and reduce the problem that may derive on the processing procedure.
Compared to utilizing TAB flexible circuit board and spray nozzle sheet encapsulation technology, the method that the present invention encapsulates ink gun also has the following advantages:
(1) spray nozzle sheet is that encapsulation is made separately, and complete and smooth bond area can be arranged, and does not have TAB layer and spray nozzle sheet ply seam, thereby avoids causing the increase of ink leak probability.
(2) the present invention is to use the TAB flexible circuit board to separate with spray nozzle sheet, can implement the two-stage contraposition (is spray nozzle sheet and heating chip contraposition, and the contraposition of the weld pad 511 of heating chip and flexible circuit board), therefore can increase the tolerance in the assembling, and the fraction defective of can the automatic joining technique of a more traditional winding required contraposition is lower, thereby can improve quality greatly.
Therefore, ink gun ink supply runner encapsulating structure provided by the invention and method for packing thereof have makes the characteristic simple, that the product yield is good, size is dwindled and cost is low, and can exempt the shortcoming that runs in the prior art.
Claims (9)
1. ink gun ink supply runner encapsulating structure, it comprises:
One ink cartridges, in order to hold ink and to have a load bearing seat, this load bearing seat is to be made of first supporting region and second supporting region, wherein this second supporting region has one first madial wall and one second madial wall;
One heating chip, rectangular and directly be set up on this first supporting region of this load bearing seat, wherein this heating chip has first and second lateral wall along its length, this first with this second lateral wall respectively with this second supporting region this first and this second madial wall form first and second ink supply runner;
One spray nozzle sheet covers partly outer surface of this heating chip at least, extend on this second supporting region, this spray nozzle sheet and the direct combination seal of this second supporting region, with encapsulate this first and this second ink supply runner; And
One flexible circuit board is covered in this ink cartridges outer surface and has an opening, this opening peripheral with this first and this second supporting region separate mutually,
It is characterized in that this spray nozzle sheet has one first and one second breach, with when this spray nozzle sheet combines with this heating chip, this first and second indentation, there is exposed this weld pad certainly.
2. ink gun ink supply runner encapsulating structure as claimed in claim 1 is characterized in that this spray nozzle sheet is this opening that is positioned at this flexible circuit board.
3. ink gun ink supply runner encapsulating structure as claimed in claim 1, it is characterized in that this spray nozzle sheet be with the coating adhesive agent and directly combination seal on this second supporting region.
4. ink gun ink supply runner encapsulating structure as claimed in claim 1 is characterized in that the length of this heating chip and the equal in length of this spray nozzle sheet.
5. ink gun ink supply runner encapsulating structure as claimed in claim 1 is characterized in that this spray nozzle sheet is to be " H " shape.
6. ink gun ink supply runner encapsulating structure as claimed in claim 1 is characterized in that this first supporting region and this second supporting region are to be positioned on the different level.
7. ink gun ink supply runner encapsulating structure as claimed in claim 1, it is characterized in that this first or this second supporting region be the platform that has a groove for.
8. ink gun structure, it comprises:
One ink cartridges, in order to hold ink and to have a load bearing seat, this load bearing seat is to be made of first supporting region and second supporting region, wherein this second supporting region has one first madial wall and one second madial wall;
One heating chip, rectangular and directly be carried on this first supporting region of this load bearing seat, wherein this heating chip has first and second lateral wall along its length, this first with this second lateral wall respectively with this second supporting region this first and this second madial wall form first and second ink supply runner;
One barrier layer is formed on this heating chip, and in the exposed at both sides of this heating chip this heating chip of part and form a plurality of inking chambers; And
One spray nozzle sheet is to be covered on this barrier layer, and with respect to this a plurality of inking chambers place a plurality of spray orifices is set, and this spray nozzle sheet extends on this second supporting region, and by the coating adhesive agent make this spray nozzle sheet only with this second supporting region combination seal; And
One flexible circuit board is covered in this ink cartridges outer surface and has an opening, and this opening is peripheral first to be separated with this second supporting region with this,
It is characterized in that this spray nozzle sheet has one first and one second breach, with when this spray nozzle sheet combines with this heating chip, this first and second indentation, there is exposed this weld pad certainly.
9. method that encapsulates ink gun ink supply runner, it comprises the following step:
One ink cartridges is provided, and in order to hold ink and to have a load bearing seat, this load bearing seat is to be made of first supporting region and second supporting region, and this second supporting region has one first madial wall and one second madial wall;
One chip assembly is provided, the spray nozzle sheet that this chip assembly has a prefabricated spray orifice by a barrier layer, a heating chip and is formed and is formed ink supply port and a plurality of inking chamber jointly, and wherein this heating chip has one first lateral wall and second lateral wall along its length;
On this first supporting region of this load bearing seat and this second supporting region, be coated with adhesive agent;
With this chip assembly gluing on this load bearing seat, make this first madial wall of this second supporting region and this second madial wall form one first ink supply runner and one second ink supply runner with this first lateral wall and this second lateral wall of this heating chip respectively, and make this heating chip and this spray nozzle sheet respectively and directly combination seal on this first supporting region and this second supporting region, and
One flexible circuit board with an opening is provided, is covered in this ink cartridges outer surface, this opening is peripheral to be separated mutually with this first and second supporting region, and use the pressing apparatus flexible circuit board joint is positioned on the ink gun,
Wherein, make this spray nozzle sheet have one first and one second breach, with when this spray nozzle sheet combines with this heating chip, this first and second indentation, there is exposed this weld pad certainly.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031593674A CN1301860C (en) | 2003-09-10 | 2003-09-10 | Inkjet head structure, inkjet head ink supply channel packaging structure and packaging method thereof |
| BRPI0401976A BRPI0401976B1 (en) | 2003-04-22 | 2004-04-22 | mounting frame for a printhead |
| EP04009584A EP1473161B1 (en) | 2003-04-22 | 2004-04-22 | Assembling structure of printhead |
| DE602004026002T DE602004026002D1 (en) | 2003-04-22 | 2004-04-22 | Assembly structure of a printhead |
| AT04009584T ATE461044T1 (en) | 2003-04-22 | 2004-04-22 | ASSEMBLY STRUCTURE OF A PRINT HEAD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031593674A CN1301860C (en) | 2003-09-10 | 2003-09-10 | Inkjet head structure, inkjet head ink supply channel packaging structure and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1593927A CN1593927A (en) | 2005-03-16 |
| CN1301860C true CN1301860C (en) | 2007-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031593674A Expired - Lifetime CN1301860C (en) | 2003-04-22 | 2003-09-10 | Inkjet head structure, inkjet head ink supply channel packaging structure and packaging method thereof |
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| CN (1) | CN1301860C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100569521C (en) * | 2005-09-30 | 2009-12-16 | 研能科技股份有限公司 | Printing chip and ink jet head using the same |
| CN100569522C (en) * | 2005-09-30 | 2009-12-16 | 研能科技股份有限公司 | printing chip and ink-jet head structure |
| CN100569523C (en) * | 2005-09-30 | 2009-12-16 | 研能科技股份有限公司 | Ink-jet head packaging structure and packaging method thereof |
| CN100537243C (en) * | 2005-12-29 | 2009-09-09 | 研能科技股份有限公司 | Ink box with convex column structure |
| CN101939170B (en) * | 2007-12-07 | 2012-08-29 | 惠普开发有限公司 | Print cartridge |
| JP5373588B2 (en) * | 2009-12-25 | 2013-12-18 | エスアイアイ・プリンテック株式会社 | Liquid ejecting head and liquid ejecting apparatus |
| CN106608103A (en) * | 2015-10-24 | 2017-05-03 | 周利平 | Ink supply runner structure in ink jet head chip |
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|---|---|---|---|---|
| US6322200B1 (en) * | 1999-10-29 | 2001-11-27 | Hewlett-Packard Company | Decoupled nozzle plate and electrical flexible circuit for an inkjet print cartridge |
| US6332677B1 (en) * | 1992-04-02 | 2001-12-25 | Hewlett-Packard Company | Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer |
| US6378984B1 (en) * | 1998-07-31 | 2002-04-30 | Hewlett-Packard Company | Reinforcing features in flex circuit to provide improved performance in a thermal inkjet printhead |
| CN2626721Y (en) * | 2003-06-09 | 2004-07-21 | 研能科技股份有限公司 | Inkjet Head Structure and Inkjet Printing System |
| CN1539641A (en) * | 2003-04-22 | 2004-10-27 | 研能科技股份有限公司 | Method for packaging ink-jet head |
-
2003
- 2003-09-10 CN CNB031593674A patent/CN1301860C/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6332677B1 (en) * | 1992-04-02 | 2001-12-25 | Hewlett-Packard Company | Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer |
| US6378984B1 (en) * | 1998-07-31 | 2002-04-30 | Hewlett-Packard Company | Reinforcing features in flex circuit to provide improved performance in a thermal inkjet printhead |
| US6322200B1 (en) * | 1999-10-29 | 2001-11-27 | Hewlett-Packard Company | Decoupled nozzle plate and electrical flexible circuit for an inkjet print cartridge |
| CN1539641A (en) * | 2003-04-22 | 2004-10-27 | 研能科技股份有限公司 | Method for packaging ink-jet head |
| CN2626721Y (en) * | 2003-06-09 | 2004-07-21 | 研能科技股份有限公司 | Inkjet Head Structure and Inkjet Printing System |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1593927A (en) | 2005-03-16 |
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