CN1299546C - Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production - Google Patents
Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production Download PDFInfo
- Publication number
- CN1299546C CN1299546C CNB018213170A CN01821317A CN1299546C CN 1299546 C CN1299546 C CN 1299546C CN B018213170 A CNB018213170 A CN B018213170A CN 01821317 A CN01821317 A CN 01821317A CN 1299546 C CN1299546 C CN 1299546C
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- metal level
- printed circuit
- layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 39
- 239000011889 copper foil Substances 0.000 title claims description 17
- 238000011282 treatment Methods 0.000 title abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 79
- 239000002184 metal Substances 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims description 47
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 36
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 18
- 238000003384 imaging method Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 9
- 239000011135 tin Substances 0.000 claims description 9
- 229910052718 tin Inorganic materials 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 238000005868 electrolysis reaction Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229910001369 Brass Inorganic materials 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010951 brass Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005234 chemical deposition Methods 0.000 claims description 3
- 238000011161 development Methods 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 230000008020 evaporation Effects 0.000 claims 2
- 238000001704 evaporation Methods 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 229920002844 BT-Epoxy Polymers 0.000 claims 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 claims 1
- 239000003351 stiffener Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 55
- 239000000243 solution Substances 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 210000004027 cell Anatomy 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- WOAHJDHKFWSLKE-UHFFFAOYSA-N 1,2-benzoquinone Chemical compound O=C1C=CC=CC1=O WOAHJDHKFWSLKE-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005469 granulation Methods 0.000 description 2
- 230000003179 granulation Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 231100000489 sensitizer Toxicity 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 235000008645 Chenopodium bonus henricus Nutrition 0.000 description 1
- 244000138502 Chenopodium bonus henricus Species 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 241000519996 Teucrium chamaedrys Species 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- -1 hydrogen sodium hydroxide Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical group [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229940072033 potash Drugs 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 229910052717 sulfur Chemical group 0.000 description 1
- 239000011593 sulfur Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
The invention relates to the manufacture of printed circuit boards having enhanced etch uniformity and resolution. The process eliminates the need for a black oxide treatment to improve adhesion and improves the ability to optically inspect the printed circuit boards. The process is performed by conducting steps (a) and (b) in either order: (a) depositing a first surface of an electrically conductive layer onto a substrate, which electrically conductive layer has a roughened second surface opposite to the first surface; (b) depositing a thin metal layer onto the roughened second surface of the electrically conductive layer, which metal layer comprises a material having a different etch resistance property than that of the electrically conductive layer. Thereafter one deposits a photoresist onto the metal layer; imagewise exposes and develops the photoresist, thereby revealing underlying portions of the metal layer. The one removes the revealed underlying portions of the metal layer, thereby revealing underlying portions of the conductive layer and removes the revealed underlying portions of the conductive layer, to thereby produce a printed circuit layer.
Description
Background of invention
Invention field
The present invention relates to have the manufacturing of the printed circuit board (PCB) of higher etching homogeneity and resolution.Method of the present invention does not need to make to improve close-burning blackout oxidation processes and improve the ability that printed circuit board (PCB) is carried out optical detection.
Description of related art
Printed circuit board (PCB) is in field of electronic devices extensive use.They both had been used for the large-scale plant of picture guided missile and industrial control equipment and so on, also were used for midget plants such as picture phone, broadcast receiver and personal computer.The very important point is during application of printed circuit, to hachure and interval width (100 micron dimensions or littler) very high accuracy and resolution will be arranged, to guarantee the high-quality of circuit.
In the production of small-sized and main equipment, the accurate figure that produces small-sized (100 micron dimensions or littler) is very important.Along with circuitous pattern is more and more littler, the accuracy of etching technics is also important all the more.This area knows that all the existing photoetching technique of employing produces high-precision hachure printed circuit board (PCB).Normally earlier a conductive foil is deposited on the substrate, then photoresist is deposited on this paper tinsel.By the imaging method photoresist is exposed then and develop forming hachure and figure at interval, and they are etched in the conductive foil go subsequently.
Generally be to allow the exasperate of paper tinsel be laminated on the substrate, this mainly is because exasperate is more coarse, so it is better than light face with the bonding of substrate.But find once that if the light of paper tinsel faced down leaned against on the substrate then the precision that reaches of etching is much higher because near the copper particle exasperate be elongation and also be vertical orientated, so the etching of side direction and horizontal direction is less.In addition, also not too need to remove dentalation and processing on the substrate, can obtain etching homogeneity preferably like this with overetch.
If the light surface layer of paper tinsel is laminated on the substrate, then need its surface is done rough so that enough caking property to be provided.It is to plate the knot grain on the light face of Copper Foil that a kind of method is arranged for this reason.There is a kind of copper products (being called MLS) of this type to have bought from the Oak-Mitsui company of New York Hoosick Falls.The another kind of method that has adopted is that deposit rough layer (as the knot grain) to each face of paper tinsel, forms " dual processing " paper tinsel.The bonding of resist is good especially after handling like this, nor need be through oxidation processes.But industrially also be reluctant to adopt this method, because the plane of exposure of paper tinsel may have a rough layer that is damaged in processing procedure.
When exasperate faces toward lamination, there is another known with the rough processing method in light face lane, promptly use chemical micro etch method (adopt sodium peroxydisulfate or sulfuric acid/hydrogen peroxide, they can have been bought from the MacDanmid company of Kang Wen Dick state Watubwag or the Shipley Konel company of Massachusetts Marborough) or float stone polishing method (the Isioki company of gondola I.S company and Japan provides this class machine) that Copper Foil is done rough in advance.Use this surface of chemical treatment with deposit one deck cupric oxide (also can buy) then, can on circuit, form another layer dielectric substrate like this from MacDarmid company and Shiplay Ronel company.But people do not wish to carry out such chemical treating process, because not only bothered but also the problem of used chemicals being carried out the waste product cleaning arranged.Therefore, this area needs a kind of method, and it had not both made the problem of dual processing to conductive foil, also need be in the oxidation processes of turning black in etching lines and the process at interval on multilayer circuit board with high accuracy and high-resolution.
This area is devoted to improve the manufacturing technology and the pattern precision thereof of circuit board just continuously.For example, United States Patent (USP) 5,240,807 have instructed a kind of photoresist, with the etching mask of setting up of a light unanimity, can be used to strengthen the contrast of elephant and reappear small-sized part.The a part of conductive foil that is positioned at below the photoresist forms the circuit line figure through selective etch.United States Patent (USP) 6,042,711 have introduced another kind of method, and it provides a metal forming that peel strength is higher, and this metal forming has a Powdered dendrite type metals deposited layer and a flash metal luster layer.In addition, international publication WO 00/03568 has disclosed a kind of method that forms circuit line on substrate, its adopt Copper Foil carrier add one do rough conductive metal layer.
In other a kind of approach, United States Patent (USP) 5,679,230 provide a kind of Copper Foil that is used to make printed circuit board (PCB).This Copper Foil can be used to make multilayer circuit board and does not need common for improving close-burning blackout oxidation processes.
The invention provides in-problem approach in a kind of solution prior art, it is deposited to a thin metal layer on the conductive layer on the substrate.This metal level is used as the etching mask in the conductive layer etching process, and can improve etching precision and resolution.After etching, this thin metal layer is stayed on the conductive layer, thereby no longer needs an oxide layer.
The still highly all even reflectivity of metal level used in this flow process is good, makes the printed circuit ratio circuit and the automated optical detection equipment in the past of made more mate.In addition, used here metal level has high mechanical strength, and has very high anti-mechanical damage ability (for galled spots and scuffing etc.).
Brief summary of the invention
The invention provides a method of producing layer printed circuit board, it can carry out step (a) and (b) by any order:
A) deposit first conductive layer surface is to substrate, and this conductive layer has a coarse second surface opposite with this first surface;
B) thin metal layer of deposit is to the coarse second surface of conductive layer, and this metal level comprises a kind of material that has with the anti-anti-characteristic of conductive layer different etching; Then
C) deposit one deck photoresist is to metal level;
D) by the imaging method photoresist is exposed and development, so that the lower part of metal level is exposed;
E) remove the lower part that metal level exposes, so that the lower part of conductive layer is exposed;
F) remove the lower part that conductive layer exposes, to produce layer printed circuit board.
The present invention also provides one by carrying out step a) and b by any order) the layer printed circuit board that produces of flow process:
A) deposit first conductive layer surface is to substrate, and this conductive layer has a coarse second surface opposite with this first surface;
B) thin metal layer of deposit is to the coarse second surface of conductive layer, and this metal level comprises a kind of material that has with the anti-anti-characteristic of conductive layer different etching; Then
C) deposit one deck photoresist is to metal level;
D) by the imaging method photoresist is exposed and development, so that the lower part of metal level is exposed;
E) remove the lower part that metal level exposes, so that the lower part of conductive layer is exposed;
F) remove the lower part that conductive layer exposes.
The detailed description of preferred device for carrying out said
The present invention is from broadly providing a kind of method that produces layer printed circuit board and printed circuit board (PCB).
The first step of implementing method of the present invention is that the deposit layer of conductive material is to suitable substrate.Typical substrate is those substrates that are suitable for being processed into printed circuit or other microelectronic component.Be suitable for substrate of the present invention and generally comprise the polymer of strengthening with following material: glass fibre, aramid paper (Kevlan), aramid paper (Themount), polybenzoxazoles (polybenzoxolate) paper, and their combination.Be the substrate of the best wherein with the epoxy resin of strengthening with glass fibre.Also have, resemble GaAs (GaAs), silicon and siliceous composition (as monocrystalline silicon, polysilicon, amorphous silicon, epitaxial silicon, silicon dioxide, and composition thereof) etc. semi-conducting material also be suitable substrate.About from 10 to 200 microns of the optimum thicknesses of substrate, preferably about 10 to 50 microns.
Preferably adopt following material to do conductive layer: red copper, zinc, brass, chromium, nickel, aluminium, stainless steel, iron, gold, silver, titanium, and combination and alloy.Conductive layer is preferably used red copper foil.
Red copper foil is the most handy to be made the copper solution electrolytic deposition to the method on the rotating metallic drum.Usually a Copper Foil against drum is smooth or shinny, and another side is then more coarse, is also referred to as exasperate.Drum is generally with stainless steel or titanium manufacturing, and it plays negative electrode, absorbs the red copper of getting off from solution deposition.Anode is generally made of aluminium alloy.Make under the red copper deposit at the cell voltage that adds 5 to 10 volts between anode and the negative electrode, emit oxygen from anode simultaneously.Then Copper Foil is taken off from drum, be cut into required size, and be stacked on the substrate.Stacked process preferably continues about 30 minutes with certain pressure under the temperature more than 175 ℃.Suggestion is stacked under the vacuum of 28 Inches Of Mercuries at least to be carried out, and maintains the pressure about 150psi.Suggestion (but be not must) best stacked before (but be not must) is carried out electrolytic treatments forming coarse copper deposit at the light face of conductive foil, and the while carries out electrolytic treatments at exasperate and ties with the fine metal or alloy of deposit.These knot grains are copper or copper alloy preferably, and can not increase the roughness on surface, but really can increase and the caking ability of substrate.The surface micro-structure of paper tinsel can be measured with contourgraph (for example Ohio Xin Xinna carries the M4P or the S5P type Perthometer of city Mahr Feinpruef company supply).The profile of the peak valley grain structure on surface is measured to save by interconnected and industrial standard IPC-TM-650 2.2.17 encapsulated circuit research institute (Illinois 60062 for 2115 Sandone Road, Nothbrook) and is carried out.In measuring process, on sample surfaces, choose one and measure length Im.If Rz measures the height of the maximum average peak of five continuous sampling length Io (Io=Im/5) in the length Im to paddy; Rt is maximum roughness depth, just measures the maximum normal distance between interior top of length Im and the lowest trough; Rp is the maximum homogenizing degree of depth, promptly measures the height at top in the length Im; Ra is a mean roughness, i.e. the arithmetic mean of all coarse profile decentre line absolute distances in measuring length Im.
For important parameter of the present invention is Rz and Ra.The surface treatment done produces the surface texture that peak and paddy are arranged, in roughness parameter, the scope of Ra from about 1 micron to about 10 microns, and Rz is from about 2 microns to about 10 microns.
Through producing a surface texture at bright after the surface treatment with peak and paddy, in the roughness parameter that its forms Ra from about 1 to 4 micron, better about 2 to 4 microns, preferably about 3 to 4 microns.About from 2 to 4.5 microns of the values of Rz, better about 2.5 to 4.5 microns, preferably about 3 to 4.5 microns.
Through producing the surface texture with peak and paddy at exasperate after the surface treatment, Ra is about from 4 to 10 microns in the surface roughness parameter that it forms, and is better about 4.5 to 8 microns, preferably 5 to 7.5 microns.About from 4 to 10 microns of the values of Rz, 4 to 9 microns better, preferably 4 to 7.5 microns.
Wish that it is 2 to 4.5 microns copper illuvium that bright face has a thickness, to produce the mean roughness (Rz) more than 2 microns.Wish that exasperate has the roughness Rz about 4 to 7.5 microns.The size of the micro-knot grain of metal or alloy is about 0.5 micron.If required, can deposit other metal (as zinc, indium, tin, cobalt, brass, bronze etc.) as the knot grain.This technology is at United States Patent (USP) 5,679, done comprehensive description in 230, and we refer to here as a reference.Bright peel strength scope is approximately from about 0.7 kilograms per centimeter straight length to the 1.6 kilograms per centimeter straight length, preferably from about 0.9 kilograms per centimeter straight length to the 1.6 kilograms per centimeter straight length.The peel strength of exasperate from about 0.9 kilograms per centimeter straight length to the 2 kilograms per centimeter straight lengths, preferably about 1.1 kilograms per centimeter straight length to 2 kilograms per centimeter straight lengths.Peel strength according to industrial standard IPC-TM-650 2.4.8 joint modification item C is measured.
The thickness of conductive layer is wished about the 0.5-200 micron, and is better at the 9-70 micron.Apply conductive layer and can also adopt any metal deposition methods that other is known, as chemical deposition, apply, sputter is evaporated or is laminated on the substrate, or the like.
Suggestion (but not necessarily) simultaneously is before lamination, and best (but be not must) carries out electrolytic treatments to the thin metal layer of the either side of paper tinsel.Suggestion this metal level electrolytic deposition to conductive layer.Also can adopt coating, sputter is evaporated or is stacked to the first-class method of conductive layer metal level is deposited to (after on being stacked to substrate) on the conductive layer.Advise that this metal level is one deck thin foil, and by nickel, tin, palladium, platinum, chromium, titanium, molybdenum, or material such as its alloy is made.Best metal level is nickel or tin.Metal layer thickness wishes to be preferably between about 0.2 to 3 micron between about 0.01 to 10 micron.This metal level is used as an etching mask, to determine to be etched into circuit line and the interval figure in the conductive layer.
In case metal level is deposited on the conductive layer, next step is that the metal level each several part is etched away selectively, to form the etching figure in metal level.Corrosion figure shape is to utilize photoresist to form by the photoetching technique that everybody knows this moment.At first, photoresist directly is deposited on the thin metal layer.The photoresist composition can be positivity or negativity, and all on sale in the general city.Resist can very thin (5 to 20 microns), because of its major function is just determined thin metal layer, and do not need to bear very harsh etching condition.So higher resolution can be arranged.This area knows that all which positive photoresist is suitable, and they may contain a kind of o-quinone diammine irradiation sensitizer.This based sensitisers comprises United States Patent (USP) 2,797,213; 3,106,465; 3,148,983; 3,130,047; 3,201,329; In 3,787,825 and 3,802,885 disclosed o-quinone-4-or-5-sulfonyl-diammine.When adopting the o-quinone diammine, the binding resin of recommendation comprises a kind of water-fast alkaline water soluble resin or expandable binding resin (preferably phenolic resins).Suitable positive light dielectric resin can have been bought (its commodity are called AZ-P4620) from the Claziant company of New Jersey Somesville, also can use the I linear light resist of Shipley company.The negativity photoresist is easy to buy too.
After this, photoresist is exposed under the actinic radiation (as visible light, ultraviolet light or infrared spectral region) by a mask by the imaging mode, or uses electron beam, ion beam or neutron beam scan or x-ray bombardment.Actinic radiation can be the form of incoherent light or coherent light (as the light that is produced by laser).By the imaging mode photoresist is developed with appropriate solvent (as alkaline aqueous solution) more below, thereby allow following metal level partly expose.
Then the lithographic technique of knowing by everybody removes the metal level lower part that exposes to the open air outside, and the part below remaining photoresist is still kept.Suitable etching agent can be an acid solution, as copper chloride (being applicable to etching nickel) or nitric acid (etching to tin is more suitable).The peroxide of iron chloride or sulfur-bearing (hydrogen peroxide of band sulfuric acid) is also good.In this step, be in the following that part of conductive layer of metal level part that is etched away and be exposed.This metal level with figure can make the fabulous etching mask of quality, is used for high accuracy and high accuracy etching conductive layer.
Again, the following conductive layer part of having exposed is removed by etching, is in the following that part of conductive layer of metal level part that does not remove and then still keeps.Be fit to be used for to remove in the etching agent of conductive layer and comprise alkaline solution, for example ammonium chloride/ammonium hydroxide.Then circuit board is cleaned and drying.Resulting printed circuit board (PCB) has splendid resolution and uniformity, and performance is very good.
In another concrete device for carrying out said, metal level comprises nickel, can carry out disposable etching process.In this device for carrying out said, after the photoresist imaging and developing, each part of the metal level that is exposed and following conductive layer can be in the copper chloride etching agent etching.For other metal level (comprising tin) of etching, corresponding etching agent is the conductive layer below the etching fully, thereby still needs second etch step.This single etch step is preferably used in above lines of 3 mils or etching at interval.When adopting single etch step, may also need be increased in the time of staying (approximately 10-25% is different according to etching system) in the etching agent.Adopt higher expulsion pressure and temperature also can reach same effect.
At circuit line with after being etched to through metal level and conductive layer at interval, if required, can polish by the polishing method that adopts appropriate solvent to clean or to adopt everybody to know, and remaining photoresist is removed from layer on surface of metal.Also can be after etching sheet metal but before the etching conductive paper tinsel photoresist is removed.
In a kind of preferred ashing method, produce plasma at the microwave plasma-generator that is arranged in the stripping cell upstream, and strip gas is by this generator, so the reactant that gas produces will enter stripping cell in plasma.The ion of plasma can be with such as disposing from methods such as plasma-based filtrations.So-called " base " here is the uncharged particle that expression resembles atom or molecular moiety one class, and they are that plasma generator by the upstream produces.This plasma generator can be general any plasma generator in the industry.The plasma generator that can produce the Ji Yuan that is substantially free of ion or electronics is described in 856 and 5,200,031 grade to some extent at United States Patent (USP) 5,174, and we refer to here as a reference.Though can adopt the plasma of the common generation of any type in the present invention, preferably adopting the model that resembles the production of San Jose, California Gasonic company is the plasma that microwave plasma, generator produced of AURA plasma generator.Another kind can produce the upstream plasma generator that does not have electronics and/or ion radical source basically, is the generator that is named as " the senior passivation chamber (ASP) of peeling off " of the Applied Materials company supply of material.Plasma asher (asher) also can be bought to the Mattson of California Fremont technology company.Podzolic process also can carry out according to anisotropic approaches by adopting original position ashing in etching chamber (as the TELDRM 85 of Tokyo Electronics Inc.'s supply).
At this moment can be stacked to another dielectric substrate on the circuit, and not need the rough step in other lane and the exasperate of the paper tinsel oxidation processes of turning black.Thin metal needn't remove after etching but be used as the substitute of oxide, thereby to provide enough caking property to form a sandwich construction.In addition, metal level is more even than independent conductive foil, and reflectivity is stronger, and detects (AOI) equipment with common automated optical easily and detect.
Some following non-limitative examples are as the present invention will be described.
Example 1
Utilize copper knot grain and add that a Zn-Cr barrier layer handles the bright face of Copper Foil.Exasperate also is to handle with the knot grain, but carries out subsequent treatment with nickel.This paper tinsel is stacked on the glass fibre of epoxy resin-impregnated (bright facing to material) to form substrate.Liquid photoresist is added on the substrate until reaching 12 micron thickness, and sees through mask exposure with ultraviolet light and resemble to form one.With potash photoresist is developed to expose nickel surface.By the copper chloride etching nickel is removed, following copper is exposed.Utilize amino system that copper is carried out etching to define lead.Photoresist available hydrogen sodium hydroxide solution is removed.Go out some apertures according to the imaging figure at the periphery of substrate.These apertures will be as the usefulness of aligning.Figure detects with automatic optical detector, and the words that need can be repaired.The substrate of the band etching figure (core) that has performed is stacked between the epoxy resin fiberglass with other core (if required) of wearing Copper Foil outward.Go up boring at this printed circuit board (PCB) (blank) then, make external circuit, and in the end put weldering system film and scolder, the circuit board that test is finished assembles then.
Example 2
This example is identical with example 1, and only the exasperate of overlapped layers faces toward substrate and is to handle with Zn-Cr.Bright with example 1 the same plating on knot grain, but be to handle with nickel.
Example 3
This example is identical with example 2, and is only by micro etch that bright lane is rough before handling with nickel.
Example 4
This example is identical with example 2, does rough with float stone to wiping for only bright before nickel is handled.
Example 5
This example is identical with example 1, but photoresist has permanent character, and does not remove after etching.
Example 6
This example is identical with example 1, but etching is to finish with one step of copper chloride.
Example 7
This example is identical with example 1, but photoresist is to expose with directed laser imaging system.
Example 8
This example is identical with example 1, only not nickel plating and zinc-plated, and be employing nitric acid etching.
Example 9
According to United States Patent (USP) 3,293, the example 1 in 109, Copper Foil is deposited to a rotating metallic drum with copper from the electrolysis of solutions and goes up and make.Behind the copper vitriolization, under 40-60 ℃, electrolysis in the free sulfuric acid of the copper solution (copper sulphate) of 70-105 grams per liter and 80-160 grams per liter.Solution and rotating metallic drum (being made of titanium usually) contacts, and this heaves the effect of negative electrode, and receives the copper that comes out from the electrolysis of solutions.Anode is made with aluminium alloy.Adding between anode and the negative electrode that the cell voltage about 5 to 10 volts makes the copper deposit, oxygen is then separated out on anode.Copper forms the continuous film of from 18 to 70 microns of thickness on drum, be cut into required width after taking off, last coiled volume.Paper tinsel is smooth (" bright face ") by the one side of drum, another side then more coarse (" exasperate ").
According to United States Patent (USP) 5,679,230 can form surface knot grain after treatment with bright of some samples of Copper Foil or exasperate.Other samples then carry out micro etch to bright or exasperate in copper chloride.We have carried out the test of surface roughness and peel strength to the sample of copper.Surface roughness is pressed the test of IPC-TM-650 2.2.17 joint, and peel strength is tested by IPC-TM-650 2.4.8 joint modification item C.The gained result is as follows:
| Copper-clad surface | Processing mode | Surface roughness (Ra, μ m) | Peel strength *(kilograms per centimeter straight length) |
| Bright | Do not have | 0.25 | ＜0.18 |
| Bright | Micro etch | 1.20 | 0.39 |
| Bright | The knot granulation | 3.56 | 1.52 |
| Exasperate | Do not have | 5.08 | 0.63 |
| Exasperate | Micro etch | 5.72 | 0.93 |
| Exasperate | The knot granulation | 7.60 | 1.91 |
Peel strength is determined by copper is stacked on the epoxy polyester prepreg.This can simulate the peel strength in the circuit board that has performed.
Though the present invention comes concrete manifestation and description with reference to some preferred device for carrying out said, those skilled in the art are easy to find out, can do various changes and modification and do not exceed thinking of the present invention and scope.Following claims comprise embodiment above-mentioned and various alternative plan and equivalents.
Claims (43)
1. a method of making layer printed circuit board may further comprise the steps, wherein step (a) and (b) can be undertaken by any order:
A) first surface with a conductive layer is deposited on the substrate, and this conductive layer has the coarse second surface opposite with first surface;
B) thin metal layer is deposited on the coarse second surface of conductive layer, this metal level comprises the material that has the anti-anti-characteristic of different etchings with conductive layer;
C) photoresist is deposited on the metal level;
D) photoresist is exposed by the imaging mode and develop, thereby the metal level part below exposing;
E) remove the following metal level part that exposes, following conductive layer is partly exposed;
F) remove the following conductive layer part that exposes, thereby produce a layer printed circuit board.
2. the method for claim 1 is wherein carried out step a) earlier, carries out step b) then.
3. the method for claim 1 is wherein carried out step b) earlier, carries out step a) then.
4. the method for claim 1 when wherein carrying out step a), does rough to the second surface of conductive layer earlier, handles with second metal then, the first surface of conductive layer is deposited on the substrate again.
5. the method for claim 1 when wherein carrying out step a), does rough to the second surface of conductive layer earlier, then the first surface of conductive layer is deposited on the substrate.
6. the method for claim 1 when wherein carrying out step a), is deposited on the conductive layer first surface on the substrate earlier, again the second surface of conductive layer is done rough.
7. the method for claim 1 is wherein done the mean roughness of rough conductive layer second surface, and the Ra value is in 1 to 10 micron scope.
8. the method for claim 1 is wherein had some by the rough conductive layer second surface in lane and is on the second surface of being done rough or the little knot grain of the metal or metal alloy of the inside.
9. the method for claim 1 is wherein done rough conductive layer second surface process micro etch.
10. method that produces a composite members, comprise and repeat the step a) in the claim 1 at least) to f, to form a plurality of layer printed circuit boards, by at least one intermediate layer each layer printed circuit board is connected together each other then, thereby form a printed circuit board.
11. the method for claim 1 also is included in the step of removing any residual light resist after the step e).
12. the method for claim 1 also is included in the step of removing any residual light resist after the step f).
13. the method for claim 1, wherein conductive layer comprises a conductive foil.
14. the method for claim 1, wherein metal level comprises a metal forming.
15. the method for claim 1, wherein conductive layer comprises the material of choosing from following group: red copper, brass, stainless steel, aluminium, nickel, and their alloy and combination.
16. the method for claim 1, wherein conductive layer comprises a Copper Foil.
17. the method for claim 1, wherein conductive layer is stacked on the substrate.
18. the method for claim 1, wherein conductive layer is to be deposited on the substrate by electrolysis or chemical deposition.
19. the method for claim 1, wherein conductive layer is by applying, sputter or evaporation and be deposited on the substrate.
20. the method for claim 1, wherein metal level comprises the material that selects from following group: nickel, tin, palladium, platinum, chromium, molybdenum, titanium, and alloy and composition.
21. the method for claim 1, wherein metal level comprises nickel.
22. the method for claim 1, wherein metal level comprises tin.
23. the method for claim 1, wherein metal level is stacked on the conductive layer.
24. the method for claim 1, wherein metal level is to be deposited on the conductive layer by electrolysis or chemical deposition method.
25. the method for claim 1, wherein metal level is by applying, sputter or evaporation and be deposited on the conductive layer.
26. the method for claim 1, wherein the exposed parts of metal level is removed by acid etching.
27. the method for claim 1, the exposed parts of conductive layer is removed by alkaline etching.
28. the method for claim 1, wherein the lower part of the exposed parts of metal level and conductive layer is removed by acid etching simultaneously.
29. the method for claim 1, wherein substrate comprises a polymer film.
30. the method for claim 1, wherein substrate comprises a polyimides, polyester, or liquid crystalline polymer film.
31. the method for claim 1, wherein substrate comprises that one adds strength polymer.
32. the method for claim 1, wherein substrate comprises by what following material constituted and adds strength polymer: epoxy resin, polyimides, cyanate, BT-epoxy resin, or their combination.
33. the method for claim 1, wherein substrate comprises a kind of strength polymer that adds, and wherein stiffener comprises glass fibre or organic paper.
34. a layer printed circuit board of making according to following method, step a) and b in the described method) can be undertaken by any order:
A) first surface with conductive layer is deposited on the substrate, and this conductive layer has a coarse second surface opposite with first surface;
B) thin metal layer is deposited on the coarse second surface of conductive layer, the material of this metal level has the anti-anti-characteristic of the etching different with conductive layer;
C) the deposit photoresist is to metal level;
D) make photoresist exposure and development by the imaging mode, so that the lower part of metal level exposes;
E) remove the lower part that metal level has exposed, so that the lower part of conductive layer exposes;
F) remove the lower part that conductive layer has exposed.
35. layer printed circuit board as claimed in claim 34, wherein conductive layer comprises a conductive foil.
36. layer printed circuit board as claimed in claim 34, wherein metal level comprises a metal forming.
37. layer printed circuit board as claimed in claim 34, wherein conductive layer comprises the material of choosing from following group: red copper, brass, stainless steel, aluminium, nickel, and their alloy and combination.
38. layer printed circuit board as claimed in claim 34, wherein conductive layer comprises a Copper Foil.
39. layer printed circuit board as claimed in claim 34, wherein metal level comprises the material of choosing from following group: nickel, tin, palladium, platinum, chromium, molybdenum, titanium, and their alloy and combination.
40. layer printed circuit board as claimed in claim 34, wherein metal level comprises nickel.
41. layer printed circuit board as claimed in claim 34, wherein metal level comprises tin.
42. layer printed circuit board as claimed in claim 34, wherein substrate comprises semiconductor.
43. layer printed circuit board as claimed in claim 34, wherein substrate comprises GaAs, silicon, siliceous composition and combination thereof.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69761400A | 2000-10-26 | 2000-10-26 | |
| US09/697,614 | 2000-10-26 |
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| CN1299546C true CN1299546C (en) | 2007-02-07 |
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| CNB018213170A Expired - Fee Related CN1299546C (en) | 2000-10-26 | 2001-10-17 | Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
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| EP (1) | EP1332653A1 (en) |
| JP (1) | JP2004512698A (en) |
| KR (1) | KR100899588B1 (en) |
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| AU (1) | AU2002211790A1 (en) |
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| US6703252B2 (en) * | 2002-01-31 | 2004-03-09 | Hewlett-Packard Development Company, L.P. | Method of manufacturing an emitter |
| JP2005285946A (en) * | 2004-03-29 | 2005-10-13 | Nippon Mektron Ltd | Manufacturing method of circuit board |
| CN100446640C (en) * | 2004-09-09 | 2008-12-24 | 广东东硕科技有限公司 | An after-treatment fluid for copper surface black oxidation |
| KR101229617B1 (en) | 2008-12-26 | 2013-02-04 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Method for forming electronic circuit |
| CN102265711B (en) | 2008-12-26 | 2014-11-05 | 吉坤日矿日石金属株式会社 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil |
| CN102265710B (en) * | 2008-12-26 | 2014-04-30 | 吉坤日矿日石金属株式会社 | Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using rolled copper foil or electrolytic copper foil |
| JP5935163B2 (en) * | 2012-03-30 | 2016-06-15 | ナガセケムテックス株式会社 | Resist adhesion improver and copper wiring manufacturing method |
| JP7055049B2 (en) * | 2017-03-31 | 2022-04-15 | Ｊｘ金属株式会社 | Surface-treated copper foil and laminated boards using it, copper foil with carriers, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards. |
| CN109693080B (en) * | 2018-12-24 | 2020-12-29 | 江苏弘信华印电路科技有限公司 | Burr-free milling process for rigid-flex printed circuit board |
| TWI781818B (en) | 2021-11-05 | 2022-10-21 | 長春石油化學股份有限公司 | Surface-treated copper foil and copper clad laminate |
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| US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
| US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
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| DE2009018B1 (en) * | 1970-02-26 | 1971-04-15 | Krause W | Process for the production of printed circuit boards |
| DE2511189C2 (en) * | 1975-03-14 | 1976-10-21 | Heinz Bungard | METHOD FOR MANUFACTURING SURFACE-CLAD BASE MATERIAL FOR MANUFACTURING PRINTED CIRCUITS |
| US4971894A (en) * | 1989-02-13 | 1990-11-20 | International Business Machines Corporation | Method and structure for preventing wet etchant penetration at the interface between a resist mask and an underlying metal layer |
| JPH0728115B2 (en) * | 1989-03-17 | 1995-03-29 | 株式会社日立製作所 | Printed board and manufacturing method thereof |
| JPH0787270B2 (en) * | 1992-02-19 | 1995-09-20 | 日鉱グールド・フォイル株式会社 | Copper foil for printed circuit and manufacturing method thereof |
| JPH0681172A (en) * | 1992-09-01 | 1994-03-22 | Hitachi Cable Ltd | Formation of fine pattern |
| US5989727A (en) * | 1998-03-04 | 1999-11-23 | Circuit Foil U.S.A., Inc. | Electrolytic copper foil having a modified shiny side |
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2001
- 2001-10-17 CN CNB018213170A patent/CN1299546C/en not_active Expired - Fee Related
- 2001-10-17 KR KR1020037005804A patent/KR100899588B1/en not_active IP Right Cessation
- 2001-10-17 CA CA002426124A patent/CA2426124A1/en not_active Abandoned
- 2001-10-17 JP JP2002538728A patent/JP2004512698A/en active Pending
- 2001-10-17 AU AU2002211790A patent/AU2002211790A1/en not_active Abandoned
- 2001-10-17 WO PCT/US2001/032400 patent/WO2002035897A1/en active Application Filing
- 2001-10-17 EP EP01979868A patent/EP1332653A1/en not_active Withdrawn
- 2001-10-25 MY MYPI20014947A patent/MY156961A/en unknown
- 2001-10-25 TW TW090126408A patent/TW592009B/en not_active IP Right Cessation
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| US4756795A (en) * | 1986-10-31 | 1988-07-12 | International Business Machines Corporation | Raw card fabrication process with nickel overplate |
| US5437914A (en) * | 1993-03-19 | 1995-08-01 | Mitsui Mining & Smelting Co., Ltd. | Copper-clad laminate and printed wiring board |
| CN1146848A (en) * | 1995-02-16 | 1997-04-02 | 三井金属矿业株式会社 | Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| US6132887A (en) * | 1995-06-16 | 2000-10-17 | Gould Electronics Inc. | High fatigue ductility electrodeposited copper foil |
| US5679230A (en) * | 1995-08-21 | 1997-10-21 | Oak-Mitsui, Inc. | Copper foil for printed circuit boards |
| US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
| US5895581A (en) * | 1997-04-03 | 1999-04-20 | J.G. Systems Inc. | Laser imaging of printed circuit patterns without using phototools |
| US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002035897A9 (en) | 2003-02-20 |
| AU2002211790A1 (en) | 2002-05-06 |
| CA2426124A1 (en) | 2002-05-02 |
| EP1332653A1 (en) | 2003-08-06 |
| KR100899588B1 (en) | 2009-05-27 |
| KR20030044046A (en) | 2003-06-02 |
| MY156961A (en) | 2016-04-15 |
| CN1483303A (en) | 2004-03-17 |
| WO2002035897A1 (en) | 2002-05-02 |
| TW592009B (en) | 2004-06-11 |
| JP2004512698A (en) | 2004-04-22 |
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