CN1266492A

CN1266492A - Test socket lattice

Info

Publication number: CN1266492A
Application number: CN99800672A
Authority: CN
Inventors: 山本勇; 中野智宏; 金重祥
Original assignee: Molex LLC
Current assignee: Molex LLC
Priority date: 1998-04-01
Filing date: 1999-03-31
Publication date: 2000-09-13
Anticipated expiration: 2019-03-31
Also published as: JPH11297443A; WO1999050676A1; TW411060U; JP3020030B2; CN1266491A; TW399814U; MY124410A; CN1178065C; KR20010013205A; KR100581237B1; KR20010013206A; MY123246A; WO1999050677A1; CN1178066C; KR100581240B1

Abstract

A socket is provided for burn-in testing of an integrated circuit package having electrical leads. The socket includes a socket body having an array of columns and rows of generally rectangular terminal-receiving cavities therein, each of the generally rectangular terminal-receiving cavities having a longitudinal direction corresponding to its longer dimension and a plurality of terminals disposed in the terminal-receiving cavities for contacting the leads of the integrated circuit package. Each column and row of the array includes a sequence of at least three adjacent cavities wherein for each cavity of the sequence other than the first and last, the longitudinal direction of the cavity is substantially perpendicular to the longitudinal direction of the two cavities in the sequence adjacent the cavity on either side.

Description

The grid setting of testing socket

Background of invention

The present invention relates to electrical cnnector on the whole, is specifically related to be applicable to the aging test socket of integrated circuit (" IC ") assembly.

Traditional aging test socket typically comprises several terminals, and this terminal is allocated corresponding several terminals container cavity into.Terminal generally includes: contact site, in order to the angular contact of drawing of IC assembly; Afterbody is in order to be electrically connected with another electronic component; Elastic is arranged between contact site and the afterbody, and is in order to contact pressure to be provided, reliable to guarantee through the circuit of terminal.

Prevailing terminal receiving cavity is a rectangle, and folk prescription is to alignment.Although the rectangular cavity oblique alignment is arranged or be provided with arbitrarily and the example that do not line up, the typical setting is that consistent the alignment is parallel to or perpendicular to the direction of socket side.

Yet, alignment in any case because growing electrical equipment miniaturization demand and growing more at a high speed and the demand of parallel channel, wish the terminal density of increase usually by socket.Therefore, one of the object of the invention is to provide a kind of aging test socket, and this socket allows to increase the density of socket unit area upper terminal, and still keeps enough intensity, with the pulsating stress that stands to insert repeatedly and extract at test I C assembly in succession.

The factor that another relates to as integrated circuit package aging test socket quality is that available its test the efficient of these assemblies.Therefore, importantly guarantee to insert the integrated circuit package of aging test socket, the jack assemblies of correctly aiming at the insertion aging test socket is to test.Particularly, out-of-alignment assembly may provide wrong test reading, this be since integrated circuit package draw the angle may and electric testing equipment for example do not have the cause of reliable circuit between burn-in board.Traditional aging test socket comprise in order to integrated circuit package is descended and with the device of its termination contact, this socket device does not have gratifying measure usually to guarantee the lateral attitude of assembly, therefore, may cause not satisfied test result and testing efficiency.

Therefore, one of purpose of the present invention is to provide a kind of aging test socket, and this socket can allow to increase solid strength and the performance that resides in the terminal density on the socket and do not damage socket.Another object of the present invention is to guarantee that each terminal reliably contacts with the corresponding angle of drawing of integrated circuit package, to guarantee more effectively integrated circuit package to be carried out aging test.

Summary of the invention

For achieving the above object, provide a kind of being used for to carry out the socket of aging test to having the electric integrated circuit package that draws the angle.In one embodiment of this invention, socket comprises: outer socket; The interpolation pedestal can slide between limes superiors position and smallest limit position with respect to outer socket, and the interpolation block body is used to support integrated circuit package, and has terminal receiving cavity.Socket also comprises: several terminals, be arranged in the interpolation pedestal terminal receiving cavity, and be used for the angular contact of drawing with integrated circuit package; Cam gear is used to make the interpolation pedestal with respect to the lifting between limes superiors position and smallest limit position of outer socket; Sincere sub-device, in order to respect to the clamping of interpolation pedestal with discharge integrated circuit package.

On the other hand, socket of the present invention comprises: opening is used to insert integrated circuit package; Outer socket; With the interpolation pedestal, can between limes superiors position and smallest limit position, slide with respect to outer socket.The interpolation pedestal has: the several terminals container cavity; Several terminals is arranged in the interpolation pedestal terminal receiving cavity; Cam gear has an actuator; With sincere sub-device, have the actuator identical with cam gear.At least have a skew resetting means one of in cam gear and the sincere sub-device, sincere sub-device comprises sincere sub-arm.

The unique terminal receiving cavity and the grid type setting of terminal increase terminal density effectively and do not damage the intensity and the physical characteristics of aging test socket.In addition, cam gear and sincere sub-device, insert/unload the interaction of uniqueness of the selection on opportunity with respect to integrated circuit package, and the interaction of relative mild and precipitous relatively rake between cam face and driven member surface, reliable socket and method are provided, to carry out aging of integrated circuit test, wherein, integrated circuit package comes off and wrong risk minimum of putting.

To brief description of drawings

Fig. 1 is the plan view of an aging test socket of making according to the principle of the invention;

Fig. 2 is the aging test socket shown in Figure 1 side view that direction shown in the arrow P is observed from Fig. 1;

Fig. 3 is the aging test socket shown in Figure 1 side view that direction shown in the arrow Q is observed from Fig. 1;

The sectional view that Fig. 4 dissects along 4-4 line among Fig. 1 for aging test socket shown in Figure 1 shows when the IC assembly stands aging test the aging test socket relative positions;

Fig. 5 is the partial sectional view that is similar to Fig. 4, shows integrated circuit package other element of aging test socket when in place;

Fig. 6 is the partial sectional view of aging test socket shown in Figure 1, dissects along 6-6 line among Fig. 1, also shows other element of aging test socket when the IC assembly is in place;

Fig. 7 is the partial sectional view of aging test socket shown in Figure 1, dissects along 4-4 line among Fig. 1, shows before the IC assembly inserts fully the element of aging test socket when mediating state;

Fig. 8 is the partial sectional view of aging test socket shown in Figure 1, dissects along 6-6 line among Fig. 1, shows when aging test socket to be under the state same as shown in Figure 7, and how the element of aging test socket is provided with;

Fig. 9 is the partial sectional view of aging test socket shown in Figure 1, dissects along 4-4 line among Fig. 1, show after IC assembly aging test to be released, or the particular element of IC assembly when beginning to put into aging test socket;

Figure 10 is the partial sectional view of aging test socket shown in Figure 1, dissects along 6-6 line among Fig. 1, show with Fig. 9 equal state under the element of aging test socket;

Figure 11 is a floor map, represents that the terminal receiving cavity grid type plane of aging test socket shown in Figure 1 is provided with;

Figure 12 is the more detailed zoomed-in view of grid portion among Figure 11, and this enlarging section is arrow A indication place among Fig. 1;

Figure 13 is the side view according to the terminal of principle of the invention manufacturing;

Figure 14 is the end-view of terminal shown in Figure 13;

Figure 15 is the local enlarged detailed of Fig. 4 along arrow B indication place, and how the contact site of the selected terminal of graphic extension contacts with the soldered ball (solder ball) of IC assembly;

Figure 16 is the plan view of the used sincere son that pivots of aging test socket shown in Figure 1;

Figure 17 is the side view of sincere son shown in Figure 16;

Figure 18 is the side view of the used top cover band of aging test socket shown in Figure 1 partial cutaway;

Figure 19 is the side view of another partial cutaway of top cover.

Detailed description of the preferred embodiment

Referring to Fig. 1, as seen, aging test socket 1 comprises socket 2, and this socket comprises: outer socket 3, and it has mount pin 3a, and this mount pin 3a makes one with the bottom of outer socket; With an interpolation pedestal 4, it is installed in the outer socket 3.Particularly, interpolation pedestal 4 installations in the socket 3 outside are by with corresponding connections pawl 5 scarves on the connection pawl 6 of interpolation pedestal 4 and the outer socket 3, and preventing interpolation block body 4 from outer socket 3 separation, but 4 declines of permission interpolation pedestal enter outer socket 3.

Interpolation pedestal 4 has: groove 4b, and it is arranged on top 4a; With several terminals container cavity 7, its top 4c from interpolation pedestal 4 extends to bottom 4d.

As in Figure 11 and 12, knowing finding, terminal receiving cavity 7 is a rectangle, and be set to form a kind of comb mesh pattern, wherein, each container cavity 7 is arranged to make long limit 8 that rectangular cavity faces mutually perpendicular to the minor face in the face of two adjacent rectangular cavity, and makes two minor faces of facing mutually 9 perpendicular to the long limit in the face of two adjacent rectangular cavity.This set between each limit of rectangular cavity 7 and the limit faced around rectangular cavity, forms the predetermined space zone 10 of consistent size.In the embodiment shown, the long limit 8 of each of rectangular cavity 7 approximately doubles the length of minor face 9.

This grid setting in the groove 4c of interpolation pedestal 4 allows terminal receiving cavity 7 with bigger density setting, and guarantees that still interpolation pedestal 4 has and the identical solid strength of socket that evenly distributes and be provided with.On the contrary, manyly make the settings of container cavity alignment by traditional approach, have be parallel to or perpendicular to alignment direction on reduce the trend of solid strength.Therefore, compare with the setting that tradition is alignd container cavity, the present invention can increase the number of rectangle container cavity on the unit area and can not reduce intensity.Outer socket 3 has corresponding several terminals pawl container cavity 11, and this container cavity 11 is vertically aimed at the container cavity 7 that above-mentioned lattice-shaped is provided with.

Referring to Figure 13,14 and 15, as seen each terminal 12 comprises contact site 13, elastic 14 and afterbody 15.These parts all and the elastic 14 that is arranged between contact site 13 and the afterbody 15 fuse.Contact site 13 comprises in one embodiment and contacts a butt contact 13b and the 13c that substrate 13a fuses.

Contact head

13b and 13c are provided with the forming V-shape surface of contact symmetrically, and this surface of contact is limited by inclination surface in contact 16b, 16c and narrow concave bottom 13d.

The elastic 14 of each terminal 12 in one embodiment, comprises some 14b of U-shaped portion that oppositely alternately link together, and extends to afterbody 15 from contact site 13.As shown in figure 13, U-shaped portion can be connected by line part 14a.In addition, these line parts 14a can cancel and is connected to each other directly by U-shaped portion.

Afterbody 15 in one embodiment, comprises substrate 15a and is connected in the tail contact site 15b of one with substrate 15a.Tail contact site 15b is used for and the electronic component on the ageing test plate (not shown) is electrically connected.In one embodiment, substrate 15a has the connection pawl 15c that makes in both sides.

Terminal 12, from contact site 13 to afterbody 15 elastic 14 with the plane that illustrates snakelike extension in broad, and narrower in plane perpendicular to elastic 14 snakelike extension planes.Terminal 12 can directly be pressed into along the direction perpendicular to wider part 17 by sheet metal.Accurate snakelike can be suppressed by a foil.Also can at first suppress elastic 14, then that it is alternately crooked in opposite direction to form plurality of U-shaped portion, as shown in figure 13.

For terminal 12 being inserted on the interpolation pedestals 4 selected terminal receiving cavity 7 and afterbody container cavity 11 accordingly on the socket 3 outside, terminal 12 and selected terminal receiving cavity 7 are aimed at corresponding long limit 8 and minor face 9 that broadside and narrow limit 17 and 18 are parallel to rectangular cavity 7 respectively.Then, the contact site 13 of terminal 12 inserts rectangular cavity from the bottom of interpolation pedestal 4, appear at groove 4b place until contact site 13, thereby allow two shoulders 19 of contact substrate 13a on the contact site 13 to abut in the stopper protrusion of facing mutually 20 that selected terminal receiving cavity 7 openends are made.At last, the terminal receiving cavity 7 of interpolation pedestal 4 is filled by terminal 12, and interpolation pedestal 4 is mounted on the outer socket 3, and therefore, the substrate 15a of permission terminal 12 afterbodys 15 enters the afterbody container cavity 11 of outer socket 3.On each terminal 12 substrate 15a back to connection pawl 15c contact with the wall of afterbody container cavity 11, this is to realize by pulling out the afterbody 15 that protrudes in socket 2 bottom surfaces.Like this, each terminal 12 can remain in the socket 2 reliably.

When terminal 12 be installed in interpolation pedestal 4 and outside in the socket 3, each terminal by four be with it 90 ° terminals of adjacent around the center of these four terminals (or be in).Therefore.Submit for (seeing Figure 11,12 and 15) occurring with row or column at the interpolation pedestal on the broadside of substrate 17 and narrow limit on the contact site 13.

The size of best snakelike elastic 14 and U-shaped ingredient 14b thereof is designed to like this with respect to rectangle container cavity 7, terminal 12 can be pressed into, and be placed in when contacting with the soldered ball of IC assembly when the contact site 13 of terminal 12, the 14b of U-shaped portion does not contact with wall around the rectangular cavity.

Aging test socket preferably has annular top cover 21, top cover have by 22 of square-shaped frame around opening 23.Therefore, the upper shed of aging test socket top allows automatic assembling and removing device that IC assembly 24 is contained on the interpolation pedestal 4 of aging test socket in essence, and unload the IC assembly after off-test.

Top cover 21 can move up and down with respect to outer socket and socket 2, socket 2 also comprises a cam gear, preferably has pair of cams 27, this cam can rotate by the pivot on the socket 3 outside being fixed on, cam returning spring 26 makes cam deflect to upright position with cam 27 coordinations, forms cam follower surface 33 in top cover 21 lower surfaces.By means of this device, when discharging top cover 21 when removing the outside following thrust that applies, top cover 21 and interpolation pedestal 4 allow to rise to the limes superiors position, as shown in Figure 5.Otherwise when top cover 21 was pushed away under the external force, top cover 21 and interpolation pedestal 4 dropped to the smallest limit position, as shown in Figure 9.The centre position that these elements are relative to each other, i.e. crossover position, as shown in Figure 7.

Each cam returning spring 26 in the illustrated embodiment, is arranged between outer socket 3 and the spring base 29 corresponding to cam 27, therefore, when not having the external force resistance, can force cam 27 to go to stand up position around its pivot.Cam 27 has the cam face 32 that forms at the top, in order to cam follower surface 33 sliding contacts of annular top cover 22.In the illustrated embodiment, cam follower surface 33 comprises 33a of low dip portion and the 33b of orientated at steep inclinations portion.In the limes superiors position, as shown in Figure 5, the 33a of low dip portion on the cam face 32 supporting cam follower surfaces 33 of each cam 27.The decline of top cover 21 (under external force effect downwards) is moved the cam face 32 of each cam 27 on the 33a of low dip portion, thereby makes cam 27 perks, as shown in Figure 7.Lid 21 further descends, and will make cam face 32 move to the 33b of orientated at steep inclinations portion from the 33a of low dip portion, and therefore, cam 27 further outside perks are until its smallest limit position, as shown in Figure 9.Subsequently, remove institute's ejection that applies down and cover 21 power, the restitution owing to back-moving spring 26 allows each cam to return its limes superiors position as shown in Figure 5 by way of crossover position shown in Figure 7.

The rotation of cam 37, not only corresponding to the moving up and down of top cover 21, also moving up and down corresponding to interpolation pedestal 4.Interpolation pedestal 4 has a pair of lateral projection of making at two opposite sides 30, transverse groove 31 loose fits of this lateral projection and the cam of facing mutually 27.When cam 27 in the upright position (limes superiors position--see Fig. 5), when applying on it without any downward power, lateral projection 30 is engaged in the transverse groove 31 of the cam of being faced 27, the connection pawl 6 of interpolation pedestal 4 is connected pawl 5 by the correspondence of outer socket 3 to be blocked.This position is considered to " lid returns, the limes superiors position ".Before next aging test, top cover 21 is pushed downwards, forcing each cam 27 outward-dipping, thus the cam face 32 that allows each cam 27 from low dip portion to the transition of orientated at steep inclinations portion, and allow each lateral projection 30 of interpolation pedestal 4 to begin to leave the transverse groove 31 of cam 27.Therefore the lateral projection 30 of interpolation pedestal 4 and necessary interpolation pedestal 4 itself drops to that to enter crossover position shown in Figure 7 be the centre position.This position is considered to " lid descends, the centre position ".

Then, along with the cam face 32 of each cam 27 moves along the 33b of orientated at steep inclinations portion, arrive the position that tilts fully until cam 27, top cover 21 drops to the smallest limit position.Therefore, interpolation pedestal 4 drops to the extreme lower position (see figure 9).This position is " lid descends, the smallest limit position ".The geomery of cam 27, lid 21 and interpolation pedestal 4 is designed to realize above-mentioned coordination.

At " lid returns, the limes superiors position " (Fig. 5 and 6), IC assembly 24 can stand to be called the aging test of (" aging test is carried out the phase ").At " lid descend, centre position " (Fig. 7 and 8), aging test is finished, and IC assembly 24 or soon remove from socket perhaps is about to carry out an aging test (" transitional period ").At " lid descends; the smallest limit position " (Fig. 9 and 10), aging test is finished, the IC assembly can be from aging test socket 1 takes out through the central opening 23 of top cover 21, and the IC assembly that perhaps will prepare aging test is placed on the interpolation pedestal 4 to carry out aging test (" unloading or the loading phase ") from the central opening 23 of top cover 21.

At " aging test is carried out the phase " (Fig. 5 and 6), IC assembly 24 must firm grip.For this purpose, aging test socket has a sincere sub-device, is arranged on below the top cover 21.In the illustrated embodiment, sincere sub-device comprises: the sincere sub-arm 34 of pair of L-shaped, and it can rotate by the pivot on the socket 3 outside being fixed on; Sincere sub-back-moving spring 35, itself and L shaped sincere sub-arm 34 coordinations make the angle bar 34a deflection IC assembly of sincere sub-arm 34; With sincere sub-actuator 38, itself and L shaped sincere sub-arm 34 coordinations tilt and the trend off-position sincere sub-arm 34 to revolt sincere sub-spring 35.Utilize this device, IC assembly 24 can be clamped in the top (referring to Fig. 6) of interpolation pedestal " aging test is carried out the phase ", also can by following detailed description it be discharged after aging test finishes subsequently.

Each L shaped sincere sub-arm 34 (Figure 16 and 17) has a rake 36, and it can turn over 90 ° from each cam 27 by the pivot on the socket 3 outside being fixed on.This just allows sincere sub-arm 34 that each L shaped sincere sub-arm 34 faces around axle pivot steering with clamping IC assembly 24, or leaves the sincere sub-arm 34 faced to discharge the IC assembly.Under the normal condition, the sincere sub-arm of facing 34 keeps clip position under the effect of back-moving spring 35." aging test carry out in " (top cover 21 does not push), the L shaped sincere sub-arm of facing 34 utilizes its sincere sub-surface 34a to be pressed in the end face of IC assembly 24 and clamping IC assembly 24 (seeing Fig. 5 and 6).Referring to Figure 18 and 19, top cover 21 has four no sincere sub bars 38 to be made in the bottom of top cover, to be close to the sincere sub-rake of facing mutually 36, plays sincere sub-actuator.Top cover 21 has connecting link 22a, and this connecting link 22a makes in the bottom of top cover, to block socket 2.

" transitional period " (top cover 21 is in the process that pushes away down), there is not sincere sub bar 38 near rake 36 (seeing Fig. 7 and 8), and at " in unloading or the loading ", top cover 21 is to be in extreme lower position (seeing Fig. 9 and 10) before this, do not have sincere sub bar 38 and force L shaped sincere sub-arm 34 outward-dipping from the end face of IC assembly, thus allow one automatically fast charging crane IC assembly 24 is shed (or put into aging test socket 1 with an IC assembly 24) from aging test socket 1.

The L shaped sincere sub-arm of facing mutually 34 is at " transitional period " upright (seeing Fig. 7 and 8), with respect to interpolation pedestal 4 clamping IC assemblies 24, avoids IC assembly 24 to come off or transversal displacement thereon from interpolation pedestal 4.L shaped sincere sub-arm 34 is just opened before in " unloading or loading phase ".For this purpose, the cam face 32 of cam 27 is designed to move on the 33a of low dip portion on cam follower surface 33, so, top cover 21 and interpolation pedestal 4 can correspondingly allow the end from " aging test is carried out the phase " to " transitional period ", slowly descend, and descend fast from end to " the loading or unloading phase " of " transitional period ".

If IC assembly 24 came off or at the interpolation pedestal certain displacement (referring to Fig. 7 and 8) arranged from interpolation pedestal 4 in " transitional period ", aging test can not realize satisfactory results.For avoiding this shortcoming, L shaped sincere sub-arm 34 is upright in " transitional period ", with clamping IC assembly (see figure 8), and just opens (see figure 10) before in " unloading or loading phase ".Come off or displacement for before clamping, stoping, the end from " aging test is carried out the phase " to " transitional period " of top cover 21 and interpolation pedestal 4 slowly descends, and this is that cam face 32 by cam 27 during this period moves along the 33a of low dip portion on cam follower surface 33 and realizes.Then, " transitional period " afterwards until " unloading or loading phase ", top cover 21 and interpolation pedestal 4 descend fast, this is the result who moves along the 33b of orientated at steep inclinations portion on cam follower surface 33 owing to cam face 32.Like this, IC assembly 24 just is clamped on the interpolation pedestal 4 by means of L shaped sincere sub-arm 34 before reliably in " unloading or loading phase ", thereby aging test can realize satisfactory results.The mode of carrying out aging test with aging test socket 1 is described as follows.

Referring now to Fig. 5 and 6,, in the aging test process, there is not downward masterpiece to be used on the top cover 21, therefore, allow cam 27 upright, the reference position of cam face 32 is arranged on the 33a of low dip portion on cam follower surface 33.Top cover 21 rests on its limes superiors position, and the projection of facing mutually on the interpolation pedestal 4 30 is loose fit with the groove 31 of cam 27.Connection pawl 6 on the interpolation pedestal 4 is connected pawl 5 by the correspondence of outer socket 3 to be blocked.The L shaped sincere sub-arm of facing mutually 34 is upright, by sincere sub-surface 34a being placed on the end face of IC assembly 24, with clamping IC assembly 24.Like this, the soldered ball 25 of IC assembly 24 is placed on contact site 13 contact positions with terminal 12, thereby aging test can be carried out.

Referring now to Figure 15,, interpolation pedestal 4 rests on the limes superiors position, and IC assembly 24 is clamped on the interpolation pedestal 4 by L shaped sincere sub-arm 34.When the soldered ball 25 of IC assembly 24 contacted with the contact site 13 of the terminal 12 of interpolation pedestal 4, terminal 12 was compressed, and stored force of compression makes the 14b of U-shaped portion generation converge and make to each other apart from reducing.But, absorb force of compression by this way, the transverse curvature minimum, therefore, snakelike 13 wall that can not be forced into residing terminal receiving cavity 7 of the elasticity of terminal 12.On the contrary, the elastic of each terminal evenly reduces on its length.This allows each terminal 12 to produce a stable elastic force, and this resilient force is on the respective solder ball of the aging test of at every turn carrying out, and no matter whether the side of terminal reduces because of attempting to increase terminal density.So the elastic 13 of terminal 12 helps the design and the layout of small size terminal when increasing density, and the good entity of assurance and respective solder ball contacts with electric.

As mentioned above, each terminal 12 can produce stable resilient force on chosen soldered ball.More particularly, soldered ball 25 contacts with 13c with a pair of contact site 13b, and this contact site is to push soldered ball 25 under the effect of the stored elastic force of the elastic 14 of terminal 12.The a pair of contact site 13b and the 13c that face mutually are close to soldered ball 25 securely, therefore, do not have error at the interface of 25 of a pair of contact site 13b that faces mutually and 13c and soldered balls.The big resistance on the interface has been avoided in the elimination of error.Even selected size of solder ball is in predetermined tolerance, a pair of contact site that the V-arrangement surface of contact limits will guarantee good electric contact.

As previously mentioned, terminal receiving cavity 7 is set to form a kind of comb mesh pattern of uniqueness, and wherein, each container cavity is a specific angle with respect to each adjacent container cavity.Shown in Fig. 1 and 11, each container cavity 7 is rectangular on the whole, has the limit 8 that a pair of first (long) faced mutually, and the limit 8 that this is a pair of first (long) faces mutually is continuous with the limit 9 that a pair of second (short) faced mutually.In this comb mesh pattern, one of them of the long limit 8 that at least one of each container cavity faced mutually and the minor face 9 of two adjacent container cavities is corresponding.Similarly, the minor face 9 faced mutually of at least one of each container cavity is corresponding with the long limit 8 of adjacent container cavity (two such container cavities have been shown in the accompanying drawing).By this set, between the corresponding limit of the limit of a selected container cavity and adjacent around other container cavity, form an interval region 10.

Each terminal receiving cavity 7 holds a terminal 12, and the broadside 17 of this terminal and narrow limit 18 are parallel to the long limit 8 and the minor face 9 of terminal receiving cavity 7 respectively.The soldered ball 25 of IC assembly 24 is arranged to corresponding to each terminal, and this terminal is installed in the terminal receiving cavity that is provided with described specific pattern.Described comb mesh pattern allows whole terminals 12 to be arranged on the zone 10 that equates between container cavity and container cavity, so just allows the density of terminal 12 to increase.

From as can be known above-mentioned, socket that this is creative and method than traditional aging test socket and method, are providing significant advantage aspect the aging test of integrated circuit.Unique terminal receiving cavity grid setting and terminal wherein allow to increase terminal density and the physical property feature that do not injure testing socket.In addition, cam gear and sincere sub-device are with respect to insert/get mutual coordination choose opportunities between of integrated circuit package at socket, and between cam face and cam follower surface than low dip portion with than the mutual coordination of orientated at steep inclinations portion, for the aging of integrated circuit test provides a kind of reliable socket and method, integrated circuit package is come off and wrong risk minimum of putting.

The present invention is not limited to said embodiment or any specific embodiment.All alternative embodiments all are considered to field of the present invention, comprise such embodiment: be different from the cam gear of top cover and the common actuating unit of sincere sub-device; The deflection reset force of cam and sincere son is not to produce by spring; Between cam face and cam follower surface, be not limited at single element for interactional inconsistent degree of tilt; And each one of the vertical edges of terminal receiving cavity unlike said or shown in.Also can carry out other modification within the scope of the present invention to described embodiment.The present invention is limited by following claim.

Claims

1. a socket is used for integrated circuit (" IC ") assembly is carried out aging test, and this IC assembly has several conductions and draws the angle, and described socket has:

One socket, it holds at least a portion of IC assembly at least in process of the test, and this socket comprises a base member, and this base member can contact with the angle of drawing of described IC assembly, is provided with the array of terminal cavities on this base member;

Several conducting terminals, each terminal are contained in the terminal cavities, and when described IC assembly was contained in the described socket, each terminal contacted with the described angle of drawing of described IC assembly;

Each described terminal cavities has at least four limits, comprises a pair of first limit of facing mutually and a pair of second limit of facing mutually, and the length on described first limit of facing mutually is greater than the length on described second limit of facing mutually;

Described terminal cavities is provided with in the grid mode on described base member, wherein, has three adjacent terminal cavities at least around each terminal cavities, and like this, at least one described first limit of described terminal cavities is corresponding with second limit of described adjacent terminal cavities.

2. socket as claimed in claim 1, wherein, drawing of described IC assembly comprises soldered ball on the angle, the contact site of each terminal comprises contact portion, this contact portion has formed the V-arrangement surface of contact, this V-arrangement surface of contact has two surface in contacts at least, and when described IC assembly placed on the described socket, described surface in contact contacted with corresponding described soldered ball.

3. socket as claimed in claim 1, wherein, described terminal cavities is provided with in described grid mode, is divided into the row and the row of discrete terminal cavities.

4. socket as claimed in claim 1, wherein, described terminal cavities is rectangular on the whole.

5. socket as claimed in claim 1, wherein, described terminal cavities is provided with in described grid mode, and like this, each terminal cavities is extended perpendicular to adjacent terminal cavities.

6. socket as claimed in claim 1, wherein, per two adjacent terminal cavities are by the unified interval region space of size.

7. socket, be used for the IC assembly is carried out aging test, this IC assembly has conduction and draws the angle, described socket comprises a socket, it has several terminals, these terminals place respectively in the several terminals container cavity, described terminal receiving cavity is rectangular on the whole, be provided with in the grid mode, wherein, each terminal receiving cavity is provided with a pair of long limit of facing mutually and a pair of minor face of facing mutually, and each long limit is corresponding with the minor face of an adjacent terminal receiving cavity, and each minor face is corresponding with the long limit of an adjacent terminal receiving cavity.

8. socket as claimed in claim 7 wherein, between a limit of rectangular on the whole described terminal receiving cavity and the adjacent corresponding limit, is provided with the unified interval region of size.

9. socket as claimed in claim 7, wherein, the described angle of drawing of described IC assembly is a soldered ball spherical in shape on the whole, each terminal all comprises contact site, this contact site comprises a pair of contact portion, and this contact portion has formed the V-arrangement surface of contact symmetrically, and this V-arrangement surface of contact defines the surface in contact of inclination, when described integrated circuit package carried out aging test, described surface in contact contacted with corresponding soldered ball.