CN1262638A - Leadless solder - Google Patents
Leadless solder Download PDFInfo
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- CN1262638A CN1262638A CN 99800339 CN99800339A CN1262638A CN 1262638 A CN1262638 A CN 1262638A CN 99800339 CN99800339 CN 99800339 CN 99800339 A CN99800339 A CN 99800339A CN 1262638 A CN1262638 A CN 1262638A
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- solder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 30
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 71
- 239000000956 alloy Substances 0.000 claims abstract description 71
- 229910052802 copper Inorganic materials 0.000 claims abstract description 40
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 28
- 229910020888 Sn-Cu Inorganic materials 0.000 claims abstract description 12
- 229910019204 Sn—Cu Inorganic materials 0.000 claims abstract description 12
- 229910020938 Sn-Ni Inorganic materials 0.000 claims abstract description 7
- 229910008937 Sn—Ni Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 40
- 238000005476 soldering Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 abstract description 9
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 53
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 19
- 238000005219 brazing Methods 0.000 description 19
- 238000012360 testing method Methods 0.000 description 16
- 230000005496 eutectics Effects 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 12
- 238000002386 leaching Methods 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 230000004907 flux Effects 0.000 description 7
- 229910000765 intermetallic Inorganic materials 0.000 description 7
- 238000009736 wetting Methods 0.000 description 6
- 229910052732 germanium Inorganic materials 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Abstract
A lead-free solder which is comprised of three elements Sn-Cu-Ni. Cu and Ni are 0.1 - 2 wt% and 0.002 - 1 wt% respectively. Preferable weight percentage of Cu and Ni are 0.3 to 0.7 percent and 0.04 to 0.1 percent respectively. Both methods of additive Ni to a base alloy of Sn-Cu and additive Cu to a base alloy of Sn-Ni are applicable.
Description
Invention field
The present invention relates to the composition of new leadless solder.
Background of invention
In soft soldering alloy, lead generally is to be used to dilute tin to improve liquidity and the important meals of wettability.But lead is a kind of deleterious heavy metal, consider carry out the soldering Working environment in when operation, when the environment for use when using the product of soldering and scolder go out of use to the influence of global environment, preferably avoid using plumbous.Thereby avoiding using lead in soft soldering alloy is a noticeable practice.
When forming leadless solder, require this alloy to have wettability for the metal that is soldered.Tin with this wettability is the requisite metal as mother metal.When forming leadless solder, importantly give full play to the characteristic of tin, and be identified for giving the content of leadless solder with the interpolation metal of the same intensity of general eutectic tin-lead alloy and flexible this purpose.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of is the leadless solder of matrix metal with tin, and it also contains the same easy other interpolation material that obtains with conventional eutectic tin-lead alloy, and can form stable, reliable brazed joint.
In order to reach purpose of the present invention, soft soldering alloy should be made of following three kinds of metals: 0.1-2 weight percentage (following note is made wt%) Cu, and 0.002-1wt%Ni, surplus is Sn.The fusing point of tin is about 232 ℃ in these elements, is to give the wettability requisite metal of alloy to the metal that is soldered.The tin-based alloy that does not contain the bigger lead of proportion is low weight under molten state, can not obtain to be fit to enough flowabilities of jet flow soldering operation.The crystal structure of this soft soldering alloy is too soft, can not obtain enough physical strengths.By adding copper, alloy is strengthened greatly.When Xiang Xizhong adds about 0.7% copper, form fusing point when more independent than Sn low about 5 ℃ of fusing points be about 227 ℃ eutectic alloy.After adding copper, can in the soldering operating process, suppress this typical lead mother metal of copper and leach into conductive line surfaces.For example, under 260 ℃ brazing temperature, the copper leaching rate that adds the alloy of copper only is half of copper leaching rate of the plumbous eutectic solder of tin.Suppress copper and leach the copper concentration difference that can reduce to be present in the brazing area, thereby make brittle compound layer slow down growth.
Add copper for when using pickling process for a long time, preventing that the rapid change that alloy itself is formed from being effective.
The scope of the preferred addition of copper is 0.3-0.7wt%, if add copper more, then the temperature of fusion of soft soldering alloy raises.Fusing point is high more, and the brazing temperature that then needs is high more.And high brazing temperature is undesirable for the relatively poor electronic component of thermotolerance.The typical brazing temperature upper limit is considered to about 300 ℃.The addition of copper is about 2wt% for 300 ℃ liquidus temperature.Preferred value and boundary value as above set.
In the present invention, not only in as the tin of matrix metal, add a spot of copper, but also add 0.002-1wt% nickel.Nickel control is because intermetallic compound such as the Cu that the result that tin and copper react forms
6Sn
5And Cu
3Sn, it makes these compound dissolutions.Because these intermetallic compounds have high fusing point, they hinder the flowability of fusion welding, and make the function reduction of scolder.Therefore,, just become the so-called bridge circuit that causes the conductor short circuit when brazing operation, that is to say, when spinning off in by fusion welding, can stay acicular projection if these intermetallic compounds are retained on the printed wiring.For avoiding such problem to add nickel.Though nickel itself and tin form intermetallic compound, what copper and mickel always can be with any ratio solid solution.Thereby the formation of nickel and Sn-Cu intermetallic compound cooperatively interacts.Help alloy to improve its characteristic owing in tin, add copper in the present invention as braze.Therefore, do not wish to generate a large amount of Sn-Cu intermetallic compounds.Reason with the nickel that copper infinitely dissolves each other, is used to suppress the reaction of copper and tin for this reason.
Because the fusing point height of nickel, so if add nickel then the liquidus temperature rising.Consider general admissible upper temperature limit, the addition of nickel is limited to 1wt%.The inventor found out already, and the addition of nickel is low to moderate 0.002wt% or during greater than this value, can keeps good flowability, and keep making brazed joint to show the weldability of sufficient intensity.Thereby, the following 0.002wt% that is limited to of nickel addition among the present invention.
In above method, Ni is added in the Sn-Cu alloy.As a kind of alternate method, also copper can be joined in the Sn-Ni alloy.When slowly adding nickel in the tin separately, rise corresponding to fusing point, owing to produce intermetallic compound, in its molten state current downflow decline.By adding copper, along with the improvement of flowability, alloy has stable performance, but some viscosity a little.In above-mentioned any method, the interaction of copper and mickel makes and produce a kind of preferable state in alloy.Thereby not only by Ni being joined in the Sn-Cu base alloy, and all produce same soft soldering alloy by copper being added in the Sn-Ni base alloy.
With reference to Fig. 1, the Cu of the nickel of 0.002-1wt% scope and 0.1-2wt% scope causes good brazed joint.When mother alloy is Sn-Cu, be limited at steady state value in the 0.1-2wt% scope by the copper content of X-axis representative.If nickel content then can access good soft soldering alloy along with the copper content that is limited at the 0.1-2wt% scope changes in the scope of 0.002-1wt%.When mother alloy is Sn-Ni, be limited at steady state value in the 0.002-1wt% scope by the nickel content of Y-axis representative.If copper content changes, then also can obtain good soft soldering alloy in the scope of 0.1-2wt%.Even hinder the unavoidable impurities of nickel function to be mixed in this alloy, these scopes also remain unchanged.
The fusing point of gallium is 936 ℃, and only dissolves in the Sn-Cu alloy with trace.Germanium makes grain refining when alloy graining.Germanium appears on the crystal boundary, prevents that crystal grain from becoming thick.Add germanium and can prevent oxide compound development in the alloy dissolution process.But when adding germanium above 1wt%, not only expense is bigger, but also causes hypersaturated state, hinders molten alloy evenly to expand.Excessive germanium on this limit does more harm than good.Therefore determined the upper limit of above-mentioned ge content.
The accompanying drawing summary
Fig. 1 is the figure that shows the optimum range that adds metal.
Preferred embodiment
Physicals with soft soldering alloy of the present invention's composition is listed in the subordinate list.Prepared the alloy that the inventor thinks to have one of suitable soft soldering alloy of forming, it consists of 0.6wt%Cu, 0.1wt%Ni, and all the other are Sn.
Fusing point: its liquidus temperature is about 227 ℃, and solidus temperature is about 227 ℃.Under the condition of 20 ℃/min of temperature rate-of-rise, use differential thermal analyzer to test.
Proportion: the proportion of this alloy uses specific gravity hydrometer to measure, and is about 7.4.
Tension test under 25 ℃, atmosphere at room temperature:
Tensile strength of alloys is 3.3kgf/mm
2, extend and be about 48%.The conventional Sn-Pb eutectic brazing material alloy of testing under similarity condition almost presents 4-5kgf/mm
2Intensity.Tensile strength of alloys of the present invention is lower than the tensile strength of conventional soft soldering alloy.But, consider soft soldering alloy of the present invention be mainly used in the electronic component soldering that weight is lighter print the brush wiring board on, so as long as its application be limited to this field, soft soldering alloy of the present invention just can satisfy strength demand.
Expanding test
Measure according to IJS (Japanese Industrial Standards) Z 3197 touchstones, this alloy is shown as 77.6% in 240 ℃, is shown as 81.6% in 260 ℃, is shown as 83.0% in 280 ℃.Compare with the tin-plumbous eutectic brazing material of routine, though soft soldering alloy of the present invention has less spreading coefficient, but be suitable for fully.
Wettability test
The copper strips of 7 * 20 * 0.3mm is carried out pickling with the hydrochloric acid of 2% dilution, and use the wettability test device under the following conditions its wettability to be tested: impregnating speed 15mm/ second, impregnating depth 4mm, dipping time 5 seconds.The zero crossings time of alloy and maximum wetting power are 1.51 seconds and 0.27N/m in the time of 240 ℃, are 0.93 second and 0.3N/m in the time of 250 ℃, are 0.58 second and 0.33N/m in the time of 260 ℃, are 0.43 second and 0.33N/m in the time of 270 ℃.By these results as can be known, compare with the eutectic solder, when fusing point was higher, wetting beginning was slower, but wetting speed increases with the temperature rising.Owing in fact generally had low thermal capacity by brazing metal, the wetting beginning postpones not have problems.
Stripping test:
The test of QFP wire stripping shows that stripping strength is about the 0.9kgf/ pin.Check peeling off the position with eyes, show that all peeling off occurs between base plate and the brazing district.This shows that brazed joint has enough intensity.
Resistance test
Use four termination measuring methods to measure 0.8mm diameter and 1 meter long welding wire.Its resistance is 0.13 μ Ω.The resistance of welding wire is near the resistance of tin.Low resistance has improved electron-propagation speed, thereby has improved high frequency characteristics and changed acoustic characteristics.Under same measuring condition, tin-plumbous eutectic brazing material alloy has the resistance of 0.17 μ Ω, and the tin-silver-copper solder has the resistance of 0.15 μ Ω.
The creep strength test:
Tin-plated brass pin with the square cross section of 0.8 * 0.8mm is soldered on the welding zone of the 3mm diameter that has the 1mm diametric hole that forms on the paper shape resol base plate with flow pattern.In temperature control tank, use Stainless Steel Wire that the weight of 1kg is hung on the pin, break away from brazed joint up to pin.Under 145 ℃ of groove temperature, pin keeps the tie-time above 300 hours.Under 180 ℃, do not come off yet through pin after 300 hours.Under same condition, the pin that is connected by tin-plumbous eutectic braze joint promptly comes off in to several hours at several minutes.Different with solder containing pb, though welding flux alloy tensile strength of the present invention is low, have creep resistance, and the reliability of welding flux alloy of the present invention under high-temperature atmosphere is good especially.
Thermal shock test
Under-40 ℃ to+80 ℃, this soft soldering alloy is carried out 1 hour thermal shocking.This soft soldering alloy has withstood impact cycle 1000 times.And conventional tin-plumbous eutectic brazing material alloy only withstands 500-600 circulation.
Migration test
Use the II type pectination test piece of RMA solder flux dip brazing JIS standard code.Remove flux residue, use the wire clamp measured resistance value that is connected on the lead.This measuring result is regarded as initial value.Controlled thermohygrostat is put in test piece, applied the nominal galvanic current 1000 hours,, use 20 times magnifying glass to observe test piece simultaneously with preset time interval measurement resistance.When applying the 50VDC electric current when under 40 ℃ and 95% humidity, applying the 100VDC electric current and under 85 ℃ and 85% humidity, all do not observe unusual change.This performance that shows alloy of the present invention is the same good with conventional tin-plumbous eutectic brazing material.
Leaching test
The copper wire that will have the diameter 0.18mm of RA type solder flux is immersed in the solder bath of the fusion solder that is filled with 260 ± 2 ℃.Shake copper wire and disappear because of leaching, use stopwatch to measure the time of leaching fully until it.Copper wire leached need about 2 minutes fully in solder of the present invention, and same copper wire leached need about 1 minute in tin-plumbous eutectic brazing material.Obviously, long extraction time is owing to the copper that has added q.s.Specifically, the copper of the initial stripping of adding has caused lower copper leaching rate, and irrelevant with big tin content.Leaching rate another possible reason slowly is that the fusing point of this solder is higher about 40 ℃ than eutectic brazing material.
Fusing point and intensity with alloy of other composition are also listed in the subordinate list.
Study above-mentioned test-results and compare as can be known with comparative example, whole embodiment of the present invention all obtain gratifying result.The conventional tin of measuring under similarity condition-plumbous eutectic brazing material alloy presents 4-5kgf/mm
2Intensity.Though the intensity level that all embodiment show is lower than conventional tin-plumbous eutectic brazing material alloy, but as having narrated, soft soldering alloy of the present invention mainly is intended to be used for the relative lighter electronic component of weight is soldered to printed circuit board (PCB), as long as be confined to this Application Areas, soft soldering alloy of the present invention just can satisfy requirement of strength.
Extendability about sample does not obtain special data.Adding nickel gives alloy itself level and smooth surface tissue.Owing to after solidifying, kept level and smooth surface, therefore thought that extendability is good.
Fusing point is represented that by two temperature wherein lower one is solidus temperature, and higher one is liquidus temperature.Temperature head between these two is more little, and is just more little by moving of weldering element before then scolder solidifies in the soldering operating process, and welding joint is just firm more.It also is the same that this tin for routine-plumbous soldering connects.But which kind of scolder is superior can not generally be determined.According to the purposes of scolder, can use soft soldering alloy with proper temperature difference.
As one of key property of solder, with RMA type solder flux the time, be good for the wettability of copper.Thereby use RMA type solder flux to guarantee good wettability.
Sn-Cu-Ni ternary scolder of the present invention can pass through preparation Sn-Ni mother alloy earlier, fused Sn-Cu scolder is mixed with this mother alloy to make it evenly diffusion and progressively formation again.Such just as has been described, the fusing point of nickel is higher.When pure nickel was introduced into the Sn-Cu alloy, nickel was difficult to dissolve equably and spread.In order to prepare alloy of the present invention, under higher temperature, melt mother alloy in advance, make nickel and tin thorough mixing, then this mother alloy is incorporated in the fused Sn-Cu bath.Nickel is diffused in the tin at a lower temperature and obtain unleaded soft soldering alloy.
Prepare the Sn-Ni mother alloy in advance and help to prevent that other undesirable metal from sneaking into.The present invention has utilized such fact, and promptly the alloy of the relation that can infinitely dissolve each other of nickel and copper and copper and mickel can suppress the formation of bridge circuit.It is undesirable having the metal of any obstruction nickel function in alloy.In other words, do not wish to add being easy to and the interactional metal of nickel beyond any copper among the present invention.
Though no-lead soft soldering of the present invention makes wetting beginning slower because of fusing point is higher than conventional tin-plumbous eutectic brazing material, but in case wetting beginning, no-lead soft soldering of the present invention can adapt to various surface-treateds interface alloy layer with regard to forming rapidly and reliably.Leadless solder of the present invention has high to the creep strength that enough supports large volume and heavy element and Heating element.Obtain relaxing owing in the soft soldering alloy of routine, be considered to the leaching of the copper of significant problem, so the weather resistance of lead significantly improves.
No-lead soft soldering of the present invention can be given electric device high speed performance and high heat dispersion, and improve the acoustic characteristics of electric device owing to have high electroconductibility and thermal conductivity.
Because no-lead soft soldering of the present invention not bismuth-containing, zinc and indium in it is formed, therefore can not produce unusual reaction with containing by the coating of the lead of stripping in the terminal material or with other no-lead soft soldering coating such as Sn-Ag scolder, Sn-Bi scolder and Sn-Cu scolder.This means with the tin of routine-when plumbous solder changes leadless solder of the present invention into, can continue to use solder bath, and use can be compatible with lead rich plumbous lead also without any problem.
Subordinate list
| Sample | Compound | Fusing point ℃ | Intensity kgf/mm 2 | Elongation % | ||||
| ???Sn | ???Cu | ???Ni | ???Ga | ???Ge | ||||
| ????1 | All the other | ??0.5 | ??0.05 | ??227/232 | ????3.4 | ????36 | ||
| ????2 | All the other | ??0.5 | ??0.1 | ??227/232 | ????3.4 | ????42 | ||
| ????3 | All the other | ??0.5 | ????1 | ??229/233 | ????3.5 | ????33 | ||
| ????4 | All the other | ??0.6 | ??0.05 | ??227/231 | ????3.3 | ????48 | ||
| ????5 | All the other | ??0.7 | ??0.4 | ??227/231 | ????3.4 | ????40 | ||
| ????6 | All the other | ????2 | ??0.02 | ??227/245 | ????3.4 | ????24 | ||
| ????7 | All the other | ??0.5 | ??0.05 | ??0.01 | ??0.02 | ??227/235 | ????3.3 | ????46 |
| ????8 | All the other | ??0.5 | ??0.05 | ??0.1 | ??227/236 | ????3.2 | ????38 | |
| ????9 | All the other | ??0.5 | ??0.05 | ??0.3 | ??227/236 | ????3.3 | ????35 | |
| Comparative example | ||||||||
| Sample A | All the other | ??0.5 | ??227/232 | ????3 | ????23 | |||
| ??????B | All the other | ??0.7 | ??227/231 | ????3.1 | ????20 | |||
Claims (6)
1. unleaded soft soldering alloy is characterized in that, contains 0.1-2wt%Cu, 0.002-1wt%Ni, and all the other are Sn.
2. the described leadless solder of claim 1 is characterized in that, wherein the weight percentage of copper is in the scope of 0.3-0.7%.
3. the described leadless solder of claim 2 is characterized in that, wherein the weight percentage of copper is in the scope of 0.3-0.7%, and the weight percentage of Ni is in the scope of 0.04-0.1%.
4. each described leadless solder in the claim 1 to 3 is characterized in that, wherein Ni is added in the dissolved Sn-Cu mother alloy.
5. each described leadless solder in the claim 1 to 3 is characterized in that, wherein Cu is added in the dissolved Sn-Ni mother alloy.
6. each described leadless solder in the claim 1 to 3 is characterized in that, wherein further adds the Ge of 0.001-1wt%.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP100141/1998 | 1998-03-26 | ||
| JP10014198 | 1998-03-26 | ||
| JP324482/1998 | 1998-10-28 | ||
| JP32448298 | 1998-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1262638A true CN1262638A (en) | 2000-08-09 |
| CN1168571C CN1168571C (en) | 2004-09-29 |
Family
ID=34196313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB998003395A Ceased CN1168571C (en) | 1998-03-26 | 1999-03-15 | Leadless solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1168571C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100534699C (en) * | 2001-06-28 | 2009-09-02 | 千住金属工业株式会社 | Lead-free welding flux alloy |
| CN103608951A (en) * | 2011-06-17 | 2014-02-26 | 株式会社Lg化学 | Soldering connector, battery module having soldering connector and battery pack including battery module |
| CN104405763A (en) * | 2014-11-03 | 2015-03-11 | 烟台大丰轴瓦有限责任公司 | Alloy material CuNi9Sn6 of antifriction alloy layer of connecting rod bushing |
| CN108453414A (en) * | 2018-03-28 | 2018-08-28 | 武汉理工大学 | A kind of preparation method of Sn bases Combined Welding tablet |
| CN112440028A (en) * | 2019-08-27 | 2021-03-05 | 纳普拉有限公司 | Metal particles |
| CN113056348A (en) * | 2018-12-03 | 2021-06-29 | 千住金属工业株式会社 | Flux, solder alloy, joined body, and method for producing joined body |
-
1999
- 1999-03-15 CN CNB998003395A patent/CN1168571C/en not_active Ceased
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100534699C (en) * | 2001-06-28 | 2009-09-02 | 千住金属工业株式会社 | Lead-free welding flux alloy |
| CN103608951A (en) * | 2011-06-17 | 2014-02-26 | 株式会社Lg化学 | Soldering connector, battery module having soldering connector and battery pack including battery module |
| CN103608951B (en) * | 2011-06-17 | 2017-03-08 | 株式会社Lg 化学 | Soldering connection device, there is the battery module of this soldering connection device and include the set of cells of this battery module |
| CN104405763A (en) * | 2014-11-03 | 2015-03-11 | 烟台大丰轴瓦有限责任公司 | Alloy material CuNi9Sn6 of antifriction alloy layer of connecting rod bushing |
| CN108453414A (en) * | 2018-03-28 | 2018-08-28 | 武汉理工大学 | A kind of preparation method of Sn bases Combined Welding tablet |
| CN113056348A (en) * | 2018-12-03 | 2021-06-29 | 千住金属工业株式会社 | Flux, solder alloy, joined body, and method for producing joined body |
| CN112440028A (en) * | 2019-08-27 | 2021-03-05 | 纳普拉有限公司 | Metal particles |
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