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CN1246713C - Optical-fiber array - Google Patents

Optical-fiber array Download PDF

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Publication number
CN1246713C
CN1246713C CN02127749.4A CN02127749A CN1246713C CN 1246713 C CN1246713 C CN 1246713C CN 02127749 A CN02127749 A CN 02127749A CN 1246713 C CN1246713 C CN 1246713C
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fiber
optical fiber
array substrate
array
nuditing
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CN1438773A (en
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山田英一郎
斋藤和人
田村充章
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Sumitomo Electric Industries Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/3833Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3855Details of mounting fibres in ferrules; Assembly methods; Manufacture characterised by the method of anchoring or fixing the fibre within the ferrule
    • G02B6/3861Adhesive bonding
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3801Permanent connections, i.e. wherein fibres are kept aligned by mechanical means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/3833Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3834Means for centering or aligning the light guide within the ferrule
    • G02B6/3838Means for centering or aligning the light guide within the ferrule using grooves for light guides
    • G02B6/3839Means for centering or aligning the light guide within the ferrule using grooves for light guides for a plurality of light guides
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/3833Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3846Details of mounting fibres in ferrules; Assembly methods; Manufacture with fibre stubs
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/255Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2558Reinforcement of splice joint
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/26Optical coupling means
    • G02B6/30Optical coupling means for use between fibre and thin-film device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/38Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807Dismountable connectors, i.e. comprising plugs
    • G02B6/3833Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3834Means for centering or aligning the light guide within the ferrule
    • G02B6/3838Means for centering or aligning the light guide within the ferrule using grooves for light guides
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Coupling Of Light Guides (AREA)

Abstract

In an optical fiber array, an optical fiber, a bundle of optical fibers or an optical fiber ribbon is mounted on an array substrate with a V-groove or V-grooves. A bare fiber portion in which a fiber coating is removed is placed in the V-groove, pressed by a presser member 6 and bonded by adhesives. At the front end, the fiber(s) is/are accurately positioned to connect to optical components or PLCs. The bare fiber portion contains a spliced portion of the dissimilar optical fibers having different mode field diameters and a mode field converting portion. The spliced portion of the dissimilar optical fibers is mounted on the array substrate. A flexible protection member is provided in the fiber coating portion extending over a rear edge of the array substrate. The optical fiber is bonded onto the array substrate, employing three kinds of adhesives that are different in the Young's modulus after hardening and the viscosity before hardening.

Description

光纤阵列Fiber Array

技术领域technical field

本发明涉及一种光纤阵列,其中一条光纤、一束光纤或者一条光纤带被附着和固定到一个阵列基片上,并且该阵列基片用于把一条光纤或一条光纤带连接到光学元件或者平面光波电路(planar light wavecircuit)(PLC)。The present invention relates to an optical fiber array, wherein an optical fiber, a bundle of optical fibers or an optical fiber ribbon is attached and fixed to an array substrate, and the array substrate is used to connect an optical fiber or an optical fiber ribbon to an optical element or a planar light wave Circuit (planar light wave circuit) (PLC).

背景技术Background technique

在一种光纤通信系统中,光纤阵列被用于把一条光纤连接到光学部件或PLC。该光纤阵列通常包括具有V形槽的阵列基片,每个V形槽用于放置一条光纤的端部,以及包括用于把该光纤的端部压在V形槽中的盖子。该光纤包括一条光纤和一条光纤带,其中多条光纤用带子或树脂整体固定在一起。该光纤阵列是通过把光纤的端部放置在V形槽中,把光纤的端部用盖子压在V形槽中,使用粘合剂把该光纤固定在阵列基片上,然后抛光曝露出该光纤的端面的阵列基片的前端部而制成的。In an optical fiber communication system, an array of optical fibers is used to connect an optical fiber to an optical component or PLC. The optical fiber array generally includes an array substrate having V-shaped grooves, each V-shaped groove for receiving an end of an optical fiber, and a cap for pressing the end of the optical fiber into the V-shaped groove. The optical fiber includes an optical fiber and an optical fiber ribbon, wherein a plurality of optical fibers are integrally fixed together with a ribbon or resin. The optical fiber array is made by placing the end of the optical fiber in the V-shaped groove, pressing the end of the optical fiber into the V-shaped groove with a cover, using an adhesive to fix the optical fiber on the array substrate, and then polishing to expose the optical fiber. made of the front end of the array substrate.

在最近几年,光纤需要连接到具有与标准的单模光纤不同的模场直径(mode field diameter)(比ITU-T标准尺寸更小的模场直径)的PLC。在这种情况中,具有较小的模场直径的光纤被用于与PLC相连接,以及具有标准的模场直径的光纤被用于与光缆侧相连接。在用于与PLC相连接的光纤阵列中,具有较小的模场直径的光纤在具有标准模场直径的光纤的顶端处熔化接合,这造成较大的接合损耗。In recent years, an optical fiber needs to be connected to a PLC having a different mode field diameter (mode field diameter smaller than the ITU-T standard size) from a standard single-mode optical fiber. In this case, an optical fiber with a smaller mode field diameter is used to connect to the PLC, and an optical fiber with a standard mode field diameter is used to connect to the cable side. In an optical fiber array for connection with a PLC, an optical fiber with a small mode field diameter is fusion-spliced at the tip of an optical fiber with a standard mode field diameter, which causes a large splice loss.

在接合多个不同模场直径的非标准光纤和标准单模光纤时,难以仅仅通过通常的熔化接合技术获得实用的接合损耗。通常,一种已有的方法是把光纤熔化接合并且把光纤的接合部分进行额外的加热(热膨胀芯线,在下文中称为TEC或TEC处理)以减小接合损耗(例如,参见JP2618500和JP-A-2000-275470)。通过这种额外的加热,添加到光纤的芯部的掺杂剂被热扩散到光纤的包层部,使得该模场直径局部扩大。因此,该光纤的模场直径在接合部相互一致。When splicing a number of non-standard fibers with different mode field diameters and standard single-mode fibers, it is difficult to obtain practical splice loss only by the usual fusion splicing technique. Generally, an existing method is to melt and splice the optical fiber and additionally heat the spliced portion of the optical fiber (thermal expansion core, hereinafter referred to as TEC or TEC treatment) to reduce the splicing loss (for example, see JP2618500 and JP- A-2000-275470). By this additional heating, the dopant added to the core of the fiber is thermally diffused into the cladding of the fiber, so that the mode field diameter is locally enlarged. Therefore, the mode field diameters of the optical fibers coincide with each other at the junction.

发明内容Contents of the invention

本发明的一个目的是提供一种光纤阵列,其能够减小尺寸,可以防止当光纤被弯曲或被施加拉力时断裂,并且可以防止由于温度改变而造成传输损耗的增加。An object of the present invention is to provide an optical fiber array that can be reduced in size, can prevent breakage when the optical fiber is bent or is applied with tension, and can prevent an increase in transmission loss due to temperature change.

根据本发明,在此提供一种光纤阵列,包括:通过接合具有不同模场直径的不同光纤形成一条光纤,该光纤具有施加光纤涂层的光纤涂层部分以及除去光纤涂层的裸露光纤部分,该裸露光纤部分的中央具有不同光纤的接合部分;用于在其上安装光纤的阵列基片,该阵列基片具有光纤对齐部分和基座部分,该光纤对齐部分具有用于放置光纤的裸露光纤部分的V形槽;加压器部件,用于把该裸露光纤部分压在阵列基片的V形槽上;以及第一粘合剂,用于把该裸露光纤部分固定到阵列基片的V形槽上,其特征在于不同光纤的接合部分被置于该阵列基片上;其中该光纤阵列进一步包括:第二粘合剂,用于把光纤的光纤涂层部分固定在阵列基片的基座部分上;以及第三粘合剂,用于覆盖和固定没有置于V形槽中的裸露光纤部分,其中第一粘合剂在硬化之后具有500Mpa或更大的杨氏模量以及在硬化之前具有10Pa.s或更小的粘滞度,第二粘合剂在硬化之前具有比第一粘合剂的粘滞度更大的粘滞度,以及第三粘合剂在硬化之后具有比第一粘合剂的杨氏模量更小的杨氏模量。最好,一个柔软保护部件被提供在光纤涂层部分,其在阵列基片的后边沿上延伸。另外,该光纤可以用三种粘合剂接合到阵列基片上,这些粘合剂在硬化之后的杨氏模量和硬化之前的粘滞性互不相同。According to the present invention, there is provided an optical fiber array comprising: forming an optical fiber by splicing different optical fibers having different mode field diameters, the optical fiber having a fiber coating portion to which a fiber coating is applied and a bare fiber portion from which the fiber coating is removed, The center of the bare fiber portion has a splicing portion of different fibers; an array substrate for mounting fibers thereon, the array substrate has a fiber alignment portion and a base portion, the fiber alignment portion has a bare fiber for placing the fiber The V-shaped groove of part; Presser part, is used for this bare optical fiber part is pressed on the V-shaped groove of array substrate; And first adhesive, is used for this bare optical fiber part is fixed to the V-shaped groove of array substrate. On the shape groove, it is characterized in that the bonding part of different optical fibers is placed on the array substrate; wherein the optical fiber array further includes: a second adhesive, used to fix the optical fiber coating part of the optical fiber on the base of the array substrate and a third adhesive for covering and fixing the bare optical fiber portion not placed in the V-groove, wherein the first adhesive has a Young's modulus of 500Mpa or more after hardening and before hardening Having a viscosity of 10 Pa.s or less, the second adhesive has a viscosity greater than that of the first adhesive before hardening, and the third adhesive has a higher viscosity than the first adhesive after hardening The Young's modulus of an adhesive is smaller than the Young's modulus. Preferably, a flexible protective member is provided on the optical fiber coating portion extending over the rear edge of the array substrate. In addition, the optical fiber can be bonded to the array substrate with three types of adhesives that differ from each other in Young's modulus after hardening and viscosity before hardening.

本发明还提供一种光纤阵列,包括:通过接合具有不同模场直径的不同光纤形成一条光纤,该光纤具有施加光纤涂层的光纤涂层部分以及除去光纤涂层的裸露光纤部分,该裸露光纤部分的中央具有不同光纤的接合部分;用于在其上安装光纤的阵列基片,该阵列基片具有光纤对齐部分和基座部分,该光纤对齐部分具有用于放置光纤的裸露光纤部分的V形槽;加压器部件,用于把该裸露光纤部分压在阵列基片的V形槽上;以及第一粘合剂,用于把该裸露光纤部分固定到阵列基片的V形槽上,其特征在于不同光纤的接合部分被置于该阵列基片上;其中该阵列基片具有锥形或弧形的后端部分。The present invention also provides an optical fiber array, comprising: forming an optical fiber by splicing different optical fibers having different mode field diameters, the optical fiber has an optical fiber coating portion to which the optical fiber coating is applied and a bare optical fiber portion from which the optical fiber coating is removed, the bare optical fiber The center of the part has a splicing portion of different optical fibers; an array substrate for mounting optical fibers thereon, the array substrate has a fiber alignment portion and a base portion, the fiber alignment portion has a V for placing the bare fiber portion of the optical fiber Shaped groove; Presser part, is used for this bare optical fiber part is pressed on the V-shaped groove of array substrate; And first adhesive, is used for this bare optical fiber part is fixed on the V-shaped groove of array substrate , which is characterized in that splicing portions of different optical fibers are placed on the array substrate; wherein the array substrate has a tapered or arc-shaped rear end portion.

本发明还提供一种光纤阵列,包括:通过接合具有不同模场直径的不同光纤形成一条光纤,该光纤具有施加光纤涂层的光纤涂层部分以及除去光纤涂层的裸露光纤部分,该裸露光纤部分的中央具有不同光纤的接合部分;用于在其上安装光纤的阵列基片,该阵列基片具有光纤对齐部分和基座部分,该光纤对齐部分具有用于放置光纤的裸露光纤部分的V形槽;加压器部件,用于把该裸露光纤部分压在阵列基片的V形槽上;以及第一粘合剂,用于把该裸露光纤部分固定到阵列基片的V形槽上,其特征在于不同光纤的接合部分被置于该阵列基片上;其中该光纤阵列进一步包括:用于保护在阵列基片的后边缘延伸的光纤的保护部件。The present invention also provides an optical fiber array, comprising: forming an optical fiber by splicing different optical fibers having different mode field diameters, the optical fiber has an optical fiber coating portion to which the optical fiber coating is applied and a bare optical fiber portion from which the optical fiber coating is removed, the bare optical fiber The center of the part has a splicing portion of different optical fibers; an array substrate for mounting optical fibers thereon, the array substrate has a fiber alignment portion and a base portion, the fiber alignment portion has a V for placing the bare fiber portion of the optical fiber Shaped groove; Presser part, is used for this bare optical fiber part is pressed on the V-shaped groove of array substrate; And first adhesive, is used for this bare optical fiber part is fixed on the V-shaped groove of array substrate , characterized in that splicing parts of different optical fibers are placed on the array substrate; wherein the optical fiber array further includes: a protective component for protecting the optical fibers extending at the rear edge of the array substrate.

图6为示出用于使用结合TEC光纤技术和光纤阵列技术的光纤阵列接合具有不同模场直径的PLC和标准单模光纤的一个例子的示意图。在图6中,参考标号1、1a和1b表示光纤,2表示光纤涂层部分,3表示裸露光纤部分,4表示光纤阵列,5表示阵列基片,6表示加压器部件,7表示V形槽,8和9表示粘合剂,10表示接合部分,以及16表示加强部件。6 is a schematic diagram showing an example for splicing PLC and standard single-mode fibers with different mode field diameters using a fiber array combining TEC fiber technology and fiber array technology. In Fig. 6, reference numerals 1, 1a, and 1b denote optical fibers, 2 denotes a fiber coating portion, 3 denotes a bare fiber portion, 4 denotes an optical fiber array, 5 denotes an array substrate, 6 denotes a presser part, and 7 denotes a V-shaped Grooves, 8 and 9 represent adhesives, 10 represents a joint portion, and 16 represents a reinforcing member.

光纤1具有较小模场直径的光纤1b和较大模场直径的光纤1a(标准单模光纤)。光纤1b被熔化接合在光纤1a的顶端部。光纤1a、1b的接合部分10被增强部件16所保护。为了减小接合损耗,接合部分10受到TEC处理,这涉及在熔化接合之后进行额外的加热。光纤1b使用粘合剂接合到阵列基片5。接合部分10被增强部分16所保护,并且置于光纤阵列4的外部。The optical fiber 1 has an optical fiber 1b with a smaller mode field diameter and an optical fiber 1a with a larger mode field diameter (standard single-mode fiber). The optical fiber 1b is fusion spliced to the tip of the optical fiber 1a. The joint portion 10 of the optical fibers 1a, 1b is protected by a reinforcing member 16 . In order to reduce bonding loss, the bonded portion 10 is subjected to a TEC treatment, which involves additional heating after melting the bond. The optical fiber 1b is bonded to the array substrate 5 using an adhesive. The splicing portion 10 is protected by a reinforcing portion 16 and placed outside the optical fiber array 4 .

被熔化接合的接合部分10的增强部件16需要具有与光学元件的外部形状相同大小的尺寸,以及具有用于引导该光纤的相对较大的空间。因此,一个问题是由于该增强部件16的存在使得该光纤通信单元难以小型化,并且不容易装卸。The reinforcing member 16 of the splice portion 10 to be fusion spliced needs to have the same size as the outer shape of the optical element, and have a relatively large space for guiding the optical fiber. Therefore, there is a problem that it is difficult to miniaturize the optical fiber communication unit due to the presence of the reinforcing member 16, and it is not easy to attach and detach.

光纤阵列4包括阵列基片5和加压器部件6。阵列基片5包括在前部具有V形槽7的光纤对齐部分5a以及在其后部的底座部分5b。在把粘合剂8施加到光纤对齐部分5a的V形槽7上之后,在除去光纤涂层的裸露光纤部分3的前端部,把光纤1b插入到V形槽7,通过加压器部件6加压到位,通过粘合剂8进行粘合。The optical fiber array 4 includes an array substrate 5 and a presser part 6 . The array substrate 5 includes an optical fiber alignment portion 5a having a V-groove 7 at the front and a base portion 5b at the rear thereof. After the adhesive 8 is applied to the V-groove 7 of the fiber alignment portion 5a, the optical fiber 1b is inserted into the V-groove 7 at the front end of the bare fiber portion 3 where the fiber coating has been removed, passed through the presser member 6 Press into place and bond via adhesive 8.

在V形槽中的一部分粘合剂8流出到底座部分5b,并且覆盖从V形槽的后端凸起的裸露光纤部分3的后端部。另外,一部分粘合剂8在光纤覆盖部分2与底座部分5b之间流动,以在底座部分5b上接合裸露光纤部分3的后端部与光纤涂层部分2的前端部。另外,为了限制光纤1b在光纤阵列的后端自由移动,使用比粘合剂8更软的一种粘合剂把光纤覆盖部分2接合到底座部分5b的后端部。A portion of the adhesive 8 in the V-groove flows out to the base portion 5b, and covers the rear end portion of the bare optical fiber portion 3 protruding from the rear end of the V-groove. In addition, a portion of adhesive 8 flows between the fiber covering portion 2 and the base portion 5b to join the rear end portion of the bare fiber portion 3 and the front end portion of the fiber coating portion 2 on the base portion 5b. In addition, in order to restrict the free movement of the optical fiber 1b at the rear end of the optical fiber array, an adhesive softer than the adhesive 8 is used to bond the optical fiber covering portion 2 to the rear end portion of the base portion 5b.

通过上述光纤阵列的结构,光纤1与阵列基片5的后边缘5c相接触。因此,光纤1可能由于在阵列基片5的后边缘5c处被弯折而造成断开,或者由于温度改变而造成接合损耗的增加。With the structure of the optical fiber array described above, the optical fiber 1 is in contact with the rear edge 5c of the array substrate 5 . Therefore, the optical fiber 1 may be disconnected by being bent at the rear edge 5c of the array substrate 5, or the splice loss may increase due to a temperature change.

但是,由于阵列基片5由例如硅、硼硅酸玻璃、氧化锆或陶瓷这样的各种晶片所制成,因此通过精确地研磨例如切割而形成锥形表面。在该研磨中,使用专用的精确刀片并且需要较高的工作精度。目前已知一种用于通过研磨形成锥形表面的方法,但是这需要相当多的工作时间和人力。另外,可以考虑通过注模形成锥形表面的方法,但是其存在一个问题是由于该阵列基片的材料使得注模困难。However, since the array substrate 5 is made of various wafers such as silicon, borosilicate glass, zirconia or ceramics, the tapered surface is formed by precisely grinding such as cutting. In this grinding, special precision blades are used and high working precision is required. A method is currently known for forming a conical surface by grinding, but this requires considerable work time and manpower. In addition, a method of forming the tapered surface by injection molding can be considered, but there is a problem in that injection molding is difficult due to the material of the array substrate.

并且还已知,如果在接合光纤1时采用具有相对较大的杨氏模量的硬粘合树脂作为涂在整个裸露光纤部分3上的粘合剂8,这增加在低温下光纤的传输损耗。因此,考虑到粘合树脂在低温下收缩,从而光纤被粘合树脂的热收缩而拉到阵列基片的上表面上。另外,施加在光纤覆盖部分2上的粘合剂9是比粘合剂8更软的一种粘合树脂。由于粘合剂8很少施加在光纤覆盖部分2的部分上,因此拉力被施加在抵抗拉力较弱的除去光纤涂层的裸露光纤部分3上。因此,当把拉力沿着纵向方向施加在光纤1上或者光纤被在后端弯折时,光纤1容易在裸露光纤部分3处断裂。And it is also known that if a hard adhesive resin having a relatively large Young's modulus is used as the adhesive 8 coated on the entire bare optical fiber portion 3 when splicing the optical fiber 1, this increases the transmission loss of the optical fiber at low temperature . Therefore, it is considered that the adhesive resin shrinks at a low temperature, so that the optical fiber is pulled onto the upper surface of the array substrate by the thermal contraction of the adhesive resin. In addition, the adhesive 9 applied to the optical fiber covering portion 2 is an adhesive resin which is softer than the adhesive 8 . Since the adhesive 8 is rarely applied to the portion of the fiber covering portion 2, a pulling force is applied to the bare fiber portion 3 from which the fiber coating is removed which is weaker against the pulling force. Therefore, when a pulling force is applied to the optical fiber 1 in the longitudinal direction or the optical fiber is bent at the rear end, the optical fiber 1 is easily broken at the bare fiber portion 3 .

并且,如果具有相对较小的杨氏模量的软的粘合树脂被采用作为涂在裸露光纤部分3上的粘合剂8,则即使把粘合剂9施加在光纤涂层部分上,光纤整体上对拉力的抵抗力较弱。也就是说,在通过一种或两种粘合树脂把光纤1粘合到光纤阵列4的结构中,如图6中所示难以避免由于温度改变而造成传输损耗的增加,以及难以满足在特定张力下的要求。And, if a soft adhesive resin having a relatively small Young's modulus is adopted as the adhesive 8 coated on the bare optical fiber portion 3, even if the adhesive 9 is applied to the optical fiber coating portion, the optical fiber The overall resistance to pulling force is weak. That is, in a structure in which the optical fiber 1 is bonded to the optical fiber array 4 by one or two kinds of bonding resins, it is difficult to avoid an increase in transmission loss due to temperature change as shown in FIG. requirements under tension.

附图说明Description of drawings

图1为用于说明根据本发明的一个实施例的一种光纤阵列的示意图;FIG. 1 is a schematic diagram illustrating an optical fiber array according to an embodiment of the present invention;

图2A-2C为用于说明本发明中所用的接合具有不同模场直径的光纤的形式的示意图;2A-2C are schematic diagrams illustrating forms of splicing optical fibers with different mode field diameters used in the present invention;

图3A-3C为示出通过熔化而形成的光纤接合部具有一个膨胀部分的一个例子的示意图;3A-3C are schematic diagrams showing an example in which an optical fiber splice formed by melting has an expanded portion;

图4为示出在本发明中所用的管状保护部件的一个例子的示意图;FIG. 4 is a schematic view showing an example of a tubular protective member used in the present invention;

图5A和5B为示出在本发明中所用的模制保护部件的一个例子的示意图;以及5A and 5B are schematic diagrams showing an example of a molded protection member used in the present invention; and

图6为用于说明现有的光纤阵列的结构的示意图。FIG. 6 is a schematic diagram for explaining the structure of a conventional optical fiber array.

具体实施方式Detailed ways

现在参照图1和2A-2C描述本发明的优选实施例。图1示出本发明的光纤阵列的一个基本实施例。图2A-2C示出用于接合具有不同的模场直径的光纤的各种形式。在这些图中,参考标号1表示光纤,2表示光纤涂层部分,3表示裸露光纤部分,3a和3b表示裸露光纤,4表示光纤阵列,5表示阵列基片,5a表示光纤对齐部分,5b表示基座部分,6表示加压器部件,7表示V形槽,10表示接合部分,10a表示膨胀部分,11表示第一粘合剂,12表示第二粘合剂,13表示第三粘合剂,20a和20b表示包层部分,21a和21b表示芯线部分,以及22a和22b表示模场转换部分。A preferred embodiment of the present invention will now be described with reference to Figures 1 and 2A-2C. Figure 1 shows a basic embodiment of an optical fiber array of the present invention. 2A-2C illustrate various forms for splicing optical fibers having different mode field diameters. In these figures, reference numeral 1 denotes an optical fiber, 2 denotes an optical fiber coating portion, 3 denotes a bare fiber portion, 3a and 3b denote bare optical fibers, 4 denotes an optical fiber array, 5 denotes an array substrate, 5a denotes a fiber alignment portion, 5b denotes Base part, 6 denotes the presser part, 7 denotes the V-shaped groove, 10 denotes the engaging part, 10a denotes the expansion part, 11 denotes the first adhesive, 12 denotes the second adhesive, 13 denotes the third adhesive , 20a and 20b represent the cladding portion, 21a and 21b represent the core wire portion, and 22a and 22b represent the mode field conversion portion.

如图1中所示的光纤阵列4的形状与图6中所示的相类似。但是,光纤阵列4包括阵列基片5和加压器部件6。阵列基片5包括在其前部的光纤对齐部分5a以及在其后部的具有平坦向上表面的基座部分5b。光纤对齐部分5a具有V形槽7,用于放置除去光纤涂层的裸露光纤部分3。The shape of the optical fiber array 4 shown in FIG. 1 is similar to that shown in FIG. 6 . However, the optical fiber array 4 includes an array substrate 5 and a presser member 6 . The array substrate 5 includes an optical fiber alignment portion 5a at its front and a base portion 5b having a flat upward surface at its rear. The fiber alignment portion 5a has a V-groove 7 for placing the bare fiber portion 3 from which the fiber coating has been removed.

在阵列基片5上的裸露光纤部分3具有除去光纤涂层的裸露光纤,以及与裸露光纤3a不同种类的裸露光纤3b,如图2A-2C所示。裸露光纤3b接合到裸露光纤3a的顶端部。裸露光纤3a例如是一种标准单模光纤,并且具有包层部分20a和芯线部分21a。芯线部分21a的模场直径大约为10微米。裸露光纤3b例如是具有高密度添加在芯线部分21b中的掺杂剂的一种非标准光纤,并且具有包围芯线部分21b的包层部分20b。芯线部分21b的模场直径大约为5微米。The bare fiber portion 3 on the array substrate 5 has a bare fiber from which the coating of the fiber has been removed, and a bare fiber 3b of a different kind from the bare fiber 3a, as shown in FIGS. 2A-2C. A bare optical fiber 3b is spliced to the tip end portion of the bare optical fiber 3a. The bare optical fiber 3a is, for example, a standard single-mode optical fiber, and has a cladding portion 20a and a core portion 21a. The mode field diameter of the core wire portion 21a is about 10 micrometers. The bare optical fiber 3b is, for example, a non-standard optical fiber having a dopant added at a high density in the core portion 21b, and has a cladding portion 20b surrounding the core portion 21b. The mode field diameter of the core wire portion 21b is about 5 micrometers.

裸露光纤3a和裸露光纤3b之间的接合部10通过把裸露光纤3a与裸露光纤3b实际相接而形成,或者通过熔化该裸露光纤3a和3b而形成。为了防止由于在接合部处的模场直径不同而造成接合损耗,通过额外加热使该接合部10受到TEC处理。通过TEC处理,在裸露光纤3a、3b的芯线部分21a、21b中的掺杂剂被热扩散到包层部分20a、20b,以形成模场转换部分22a、22b,从而使得这两个模场直径相一致或接近相等。The junction 10 between the bare optical fiber 3a and the bare optical fiber 3b is formed by actually joining the bare optical fiber 3a to the bare optical fiber 3b, or by melting the bare optical fibers 3a and 3b. In order to prevent joint loss due to the difference in mode field diameter at the joint, the joint 10 is subjected to TEC treatment by additional heating. Through TEC treatment, the dopant in the core part 21a, 21b of the bare optical fiber 3a, 3b is thermally diffused into the cladding part 20a, 20b to form the mode field conversion part 22a, 22b, so that the two mode fields The diameters are the same or nearly equal.

图2A示出裸露光纤3a和3b相邻并接合的情况。在这种情况中,裸露光纤3b的中间部分预先受到TEC处理,然后TEC部分的中部被清理和/或抛光,从而使裸露光纤3b的接合端与裸露光纤3a的模场直径相一致。图2B和2C示出裸露光纤3a和裸露光纤3b被熔化接合的情况,并且在熔化接合之后通过额外的加热使该接合部10受到TEC处理。TEC处理在日本专利No.2618500中公开。在熔化接合中,存在一种情况,其中接合部10的外径没有裸露光纤外径那样的膨胀部分,如图2B中所示。还存在一种情况,其中接合部10的外径具有裸露光纤外径的膨胀部分10a,如图2C中所示。Fig. 2A shows a situation where bare optical fibers 3a and 3b are adjacent and spliced. In this case, the middle portion of the bare fiber 3b is previously subjected to TEC treatment, and then the middle portion of the TEC portion is cleaned and/or polished so that the spliced end of the bare fiber 3b matches the mode field diameter of the bare fiber 3a. 2B and 2C show the case where the bare optical fiber 3a and the bare optical fiber 3b are fusion spliced, and the splice portion 10 is subjected to TEC treatment by additional heating after the fusion splicing. TEC treatment is disclosed in Japanese Patent No. 2618500. In fusion splicing, there is a case where the outer diameter of the splicing portion 10 does not have a swollen portion like the outer diameter of the bare optical fiber, as shown in FIG. 2B . There is also a case in which the outer diameter of the splice 10 has an expanded portion 10a of the outer diameter of the bare optical fiber, as shown in FIG. 2C.

回到图1,下面将描述用于把光纤1接合到阵列基片5上的结构。在图1中,光纤1的裸露光纤部分3具有裸露光纤3a和裸露光纤3b,其中接合部没有膨胀部分,如图2A或2B中所示。在本例中,裸露光纤部分3安装在光纤对齐部分5a上,从而接合部10被置于阵列基片5的V形槽7中,并且被加压器部件6所压住和定位。接合部10被接合在V形槽7中,由粘合剂所增强和保护。光纤覆盖部分2的顶端部安装在阵列基片5的底座部分5B上,并且V形槽7和光纤覆盖部分2的后端之间的裸露光纤部分悬置在阵列基片5上。接合部10不被加压器部件6压在V形槽中。Referring back to Fig. 1, the structure for splicing the optical fiber 1 to the array substrate 5 will be described below. In FIG. 1, the bare fiber portion 3 of the optical fiber 1 has a bare fiber 3a and a bare fiber 3b in which the splicing portion has no expanded portion, as shown in FIG. 2A or 2B. In this example, the bare fiber portion 3 is mounted on the fiber alignment portion 5 a so that the joint 10 is placed in the V-shaped groove 7 of the array substrate 5 and pressed and positioned by the presser member 6 . The engagement portion 10 is engaged in the V-groove 7, reinforced and protected by an adhesive. The top end portion of the fiber covering portion 2 is mounted on the base portion 5B of the array substrate 5 , and the bare fiber portion between the V-groove 7 and the rear end of the fiber covering portion 2 is suspended on the array substrate 5 . The engagement portion 10 is not pressed into the V-shaped groove by the presser member 6 .

由V形槽7和加压器部件6所定位的裸露光纤部分3被第一粘合剂11所粘合。光纤覆盖部分2的顶端部分被第二粘合剂12接合在底座部分5b上。在第一和第二粘合剂之间的裸露光纤部分3被第三粘合剂13所接合。第一粘合剂11是在硬化之后具有500Mpa(兆帕)或更大的杨氏模量以及在硬化之前具有10Pa.s(帕.秒)或更小的粘滞度的相对较硬的粘合剂。第二粘合剂12与第一粘合剂11相类似,是在硬化之后具有500Mpa或更大的杨氏模量以及在硬化之前具有大于10Pa.s的粘滞度的相对较硬的粘合剂。并且,第三粘合剂13是在硬化之后具有小于500Mpa的杨氏模量的比第一粘合剂11更软的相对较软的粘合树脂。The bare fiber portion 3 positioned by the V-groove 7 and the presser member 6 is bonded by the first adhesive 11 . The top end portion of the optical fiber covering portion 2 is bonded to the base portion 5b by the second adhesive 12 . The bare fiber portion 3 between the first and second adhesive is bonded by the third adhesive 13 . The first adhesive 11 is a relatively hard adhesive having a Young's modulus of 500 MPa (megapascal) or more after hardening and a viscosity of 10 Pa.s (Pa. seconds) or less before hardening. mixture. The second adhesive 12 is similar to the first adhesive 11 and is a relatively hard bond having a Young's modulus of 500 Mpa or more after hardening and a viscosity greater than 10 Pa.s before hardening agent. And, the third adhesive 13 is a relatively soft adhesive resin softer than the first adhesive 11 having a Young's modulus of less than 500 MPa after hardening.

第一粘合剂11具有相对较小的粘滞度,从而裸露光纤部分3容易在V形槽中对齐并且可以由加压器部件6正确定位,它将连接到PLC。由于它在变硬之后的杨氏模量较大,因此裸露光纤部分3可以被粘合剂固牢地接合。如果第二粘合剂12具有太小的粘滞度,则当把它施加在光纤覆盖部分2的上端部时会流走,因此它具有比要牢固施加在光纤覆盖部分2上的第一粘合剂11更大的粘滞度。由于它在变硬之后的杨氏模量大于第一粘合剂11,因此光纤覆盖部分2的顶端部分可以牢固地接合到阵列基片5的后端部分。The first adhesive 11 has a relatively low viscosity so that the bare fiber portion 3 is easily aligned in the V-groove and can be correctly positioned by the presser part 6, which will be connected to the PLC. Since its Young's modulus after being hardened is large, the bare optical fiber portion 3 can be firmly bonded by the adhesive. If the second adhesive 12 has too little viscosity, it will flow away when it is applied to the upper end of the optical fiber covering part 2, so it has a higher viscosity than the first adhesive that will be firmly applied on the optical fiber covering part 2. Mixture 11 has a greater viscosity. Since its Young's modulus after hardening is larger than that of the first adhesive 11, the top end portion of the optical fiber covering portion 2 can be firmly bonded to the rear end portion of the array substrate 5.

相应地,在由第一粘合剂11接合裸露光纤部分3过程中,可以避免应力集中在光纤覆盖部分2的粘合部分上,以对抗在光纤1的纵向方向上的拉力。并且,在由第二粘合剂12接合光纤覆盖部分2过程中,光纤1的移动受到限制,并且没有应力集中在裸露光纤部分3的粘合部分上。因此第一粘合剂11和第二粘合剂12可以提供足够的承受力,足以对抗在光纤1的纵向方向上的拉力。Accordingly, during the bonding of the bare fiber portion 3 by the first adhesive 11, stress concentration on the bonded portion of the fiber covering portion 2 against the pulling force in the longitudinal direction of the fiber 1 can be avoided. Also, during bonding of the optical fiber covering portion 2 by the second adhesive 12, the movement of the optical fiber 1 is restricted, and no stress is concentrated on the bonded portion of the bare optical fiber portion 3. Therefore, the first adhesive 11 and the second adhesive 12 can provide sufficient bearing force, enough to resist the pulling force in the longitudinal direction of the optical fiber 1 .

第三粘合剂13被施加在第一粘合剂和第二粘合剂之间的裸露光纤部分3上,以保护和接合该裸露光纤部分,但是它具有比第一和第二粘合剂更小的杨氏模量。相应地,在较低温度下,第三粘合剂13的热收缩减小,在裸露光纤部分3中造成较小的变形,并且防止传输损耗的增加。A third adhesive 13 is applied on the bare fiber portion 3 between the first adhesive and the second adhesive to protect and bond the bare fiber portion, but it has a higher smaller Young's modulus. Accordingly, at lower temperatures, thermal shrinkage of the third adhesive 13 is reduced, causing less deformation in the bare fiber portion 3, and preventing an increase in transmission loss.

图3A至3C为示出图2C中所示的膨胀部分10a出现在裸露光纤3a和裸露光纤3b的接合部分上的示意图。在图3A至3B中,与图1中相同或类似的部件由相同的标号所表示,并且不进行描述。3A to 3C are schematic diagrams showing that the swollen portion 10a shown in FIG. 2C appears on the joint portion of the bare optical fiber 3a and the bare optical fiber 3b. In FIGS. 3A to 3B , the same or similar components as those in FIG. 1 are denoted by the same reference numerals and will not be described.

在图3A的例子中,接合部分10悬置在V形槽7外部的基座5b上,被施加有第三粘合剂13,并且接合基座部分5b上。裸露光纤3b仅仅安装在V形槽7中被第一粘合剂11所定位和接合。接合部分10被更软的第三粘合剂13所保护和增强。In the example of FIG. 3A , the engaging portion 10 is suspended on the base 5 b outside the V-shaped groove 7 , is applied with a third adhesive 13 , and engages on the base portion 5 b. The bare optical fiber 3b is only installed in the V-groove 7 to be positioned and bonded by the first adhesive 11 . The joining portion 10 is protected and reinforced by a third, softer adhesive 13 .

在图3B的例子中,阵列基片5具有形成在V形槽7的中部的凹陷部分7a。接合部分10被置于凹陷部分7a中。凹陷部分7a的上部不被加压器部件6所压住。接合部分10的两侧被支承在V形槽中。接合部分10被第三粘合剂13所保护和增强。与图3A的例子相反,在本例中,接合部分10在V形槽中保持得更直,并且由粘合剂粘合的更牢固。In the example of FIG. 3B, the array substrate 5 has a concave portion 7a formed in the middle of the V-shaped groove 7. As shown in FIG. The engaging portion 10 is placed in the recessed portion 7a. The upper portion of the recessed portion 7a is not pressed by the presser member 6. As shown in FIG. Both sides of the engagement portion 10 are supported in the V-shaped grooves. The joining portion 10 is protected and reinforced by a third adhesive 13 . Contrary to the example of FIG. 3A , in this example the engaging portion 10 is kept straighter in the V-groove and is more firmly bonded by the adhesive.

在图3C的例子中,阵列基片5具有形成在V形槽7的中部的凹陷部分7a。加压器部件6具有凹陷部分6a,其形成在加压器部件6上与凹陷部分7a相对的位置处。因此,接合部分10被置于凹陷部分6a和7a之间的间隙中。接合部分10被凹陷部分6a和7a支承在该间隙中,由施加在V形槽7中的第一粘合剂11所保护和增强。与图3A和3B的例子相反,在本例中,接合部分10被V形槽7和加压器部件6定位在两侧上,并且被第一粘合剂11所接合,具有较大的抵抗拉力的强度。In the example of FIG. 3C, the array substrate 5 has a concave portion 7a formed in the middle of the V-shaped groove 7. As shown in FIG. The presser member 6 has a recessed portion 6a formed on the presser member 6 at a position opposite to the recessed portion 7a. Therefore, the engagement portion 10 is placed in the gap between the recessed portions 6a and 7a. The joint portion 10 is supported in this gap by the recessed portions 6 a and 7 a , protected and reinforced by the first adhesive 11 applied in the V-groove 7 . Contrary to the example of FIGS. 3A and 3B , in this example the joining portion 10 is positioned on both sides by the V-groove 7 and the presser part 6 and is joined by the first adhesive 11 with greater resistance. The strength of the pull.

如图3A至3C的例子所示,阵列基片5的后边缘部分可以形成为锥形或弧形的平滑表面5e(由虚线所表示),改善光纤1与阵列基片5的后边缘之间的接触状态。因此,光纤1不容易受到阵列基片5后边缘的破坏,或者不容易在光纤阵列4下过度弯折,减少断裂或防止传输损耗增加。无论是否悬置在基座5a上和/或由粘合剂所增强,最好不把该接合点与底座部分相接触,因为该接合点通常在拉伸强度上较弱。3A to 3C example shown, the rear edge portion of the array substrate 5 can be formed as a tapered or arc-shaped smooth surface 5e (represented by dashed lines), to improve the distance between the optical fiber 1 and the rear edge of the array substrate 5. contact status. Therefore, the optical fiber 1 is not easily damaged by the rear edge of the array substrate 5, or is not easily bent excessively under the optical fiber array 4, reducing breakage or preventing increased transmission loss. Regardless of whether it is suspended from the base 5a and/or reinforced by adhesive, it is preferable not to contact the joint with the base part, since the joint is generally weak in tensile strength.

图4和5A-5B为示出通过使用保护部件来增强光纤与阵列基片的后边缘的接触的例子的示意图。图4示出采用管子作为保护部件的一个例子。图5A示出通过对光纤涂层部分和裸露光纤部分注模而形成保护部件的一个例子。图5B示出通过对光纤涂层部分注模而形成保护部件的一个例子。在这些图中,参考标号14和15表示保护部件。其它部件由与图1中所用相同的参考标号所表示,并且不进行描述。4 and 5A-5B are diagrams showing examples of enhancing the contact of optical fibers with the rear edge of the array substrate by using a protective member. Fig. 4 shows an example of using a pipe as a protective member. FIG. 5A shows an example of forming a protective member by injection molding a coated portion of an optical fiber and a portion of a bare optical fiber. FIG. 5B shows an example of forming a protective member by injection molding a coating portion of an optical fiber. In these figures, reference numerals 14 and 15 denote protective members. Other components are denoted by the same reference numerals as used in FIG. 1 and will not be described.

与图3A中所示相同,在图4和5A-5B中,裸露光纤3a和裸露光纤3b之间的接合部分10被悬置在V形槽7后方的基座部分5b上,被第三粘合剂13所覆盖,并且由粘合剂13固定在基座部分5b上。但是,如图1、3B和3C中所示的结构或形式也可以应用于本实施例。Same as shown in FIG. 3A, in FIGS. 4 and 5A-5B, the joint portion 10 between the bare optical fiber 3a and the bare optical fiber 3b is suspended on the base portion 5b behind the V-groove 7, and is glued by a third adhesive. The compound 13 is covered and fixed on the base portion 5b by the adhesive 13. However, the structures or forms shown in FIGS. 1, 3B and 3C can also be applied to this embodiment.

在图4中,管状保护部件14被提供在阵列基片5的后边缘5c上延伸的光纤涂层部分上,从而防止光纤1直接与阵列基片5的后边缘5c相接触。形成管状保护部分14,然后插入光纤1,由粘合剂固定到光纤覆盖部分2上,并且安装在阵列基片5上。但是,该处理可以反向:在把管状保护部件14通过粘合剂固定在阵列基片5的后端部分之后,然后可以通过保护部件14的管子插入该光纤。In FIG. 4 , a tubular protective member 14 is provided on the fiber coating portion extending on the rear edge 5 c of the array substrate 5 , thereby preventing the optical fiber 1 from directly contacting the rear edge 5 c of the array substrate 5 . The tubular protective portion 14 is formed, then the optical fiber 1 is inserted, fixed to the optical fiber covering portion 2 by an adhesive, and mounted on the array substrate 5 . However, the process can be reversed: after the tubular protective member 14 is fixed to the rear end portion of the array substrate 5 by adhesive, the optical fiber can then be inserted through the tube of the protective member 14 .

管状保护部件14由例如橡胶、硅酮或者尼龙这样的聚合物的柔软、可弯折材料所形成。保护部件14与光纤覆盖部分2的顶端相距微小的距离(例如,大约0.5毫米至2.0毫米),从而不被保护部件14所覆盖的光纤覆盖部分2可以附着到阵列基片5上。保护部分14具有从阵列基片5的后端延伸的一定长度(例如,最好为3毫米至5毫米)。该保护部件14被放置用于通过把其顶端置于与阵列基片5的基底部分5b上的台阶部分5d的肩部相邻而固定。The tubular protective member 14 is formed of a soft, bendable material such as a polymer such as rubber, silicone or nylon. The protective member 14 is spaced a slight distance (for example, about 0.5 mm to 2.0 mm) from the top of the fiber covering portion 2 so that the fiber covering portion 2 not covered by the protecting member 14 can be attached to the array substrate 5 . The protective portion 14 has a certain length (for example, preferably 3 mm to 5 mm) extending from the rear end of the array substrate 5 . The protective member 14 is placed for fixation by placing its top end adjacent to the shoulder of the stepped portion 5d on the base portion 5b of the array substrate 5 .

通过施加粘合剂而填充保护部件14和光纤覆盖部分2之间的部分或整个间隙部分而把保护部件14与光纤1整体接合。该粘合剂可以与第二粘合剂相同或不同。保护部件14可以分别附加到每个光纤上或者整体附加到所有光纤上,或者附加到光纤带上。The protective member 14 is integrally bonded to the optical fiber 1 by applying an adhesive to fill a part or the entire gap portion between the protective member 14 and the optical fiber covering part 2 . The binder can be the same as or different from the second binder. The protective member 14 may be attached to each optical fiber individually or collectively to all optical fibers, or to a fiber optic ribbon.

在图4的结构中,与图1的情况相类似,由V形槽7所定位的裸露光纤部分3被第一粘合剂11所固定。光纤覆盖部分2的上端部由第二粘合剂12固定到基座部分5b上。第一和第二粘合剂之间的裸露光纤部分3由第三粘合剂13所固定。第一粘合剂11是在硬化之后具有大于500Mpa的杨氏模量以及在硬化之前具有10Pa.s或更小的粘滞度的相对较硬的粘合剂。第二粘合剂12与第一粘合剂11相类似,是在硬化之后具有大于500Mpa的杨氏模量以及在硬化之前具有10Pa.s或大于第一粘合剂11的粘滞度的更大粘滞度的相对较硬的粘合剂。并且,第三粘合剂13是在具有小于500Mpa的杨氏模量的比第一粘合剂11更软的相对较软的粘合树脂。In the structure of FIG. 4 , the bare optical fiber portion 3 positioned by the V-groove 7 is fixed by the first adhesive 11 similarly to the case of FIG. 1 . The upper end portion of the optical fiber covering portion 2 is fixed to the base portion 5b by the second adhesive 12 . The bare fiber portion 3 between the first and second adhesive is fixed by the third adhesive 13 . The first adhesive 11 is a relatively hard adhesive having a Young's modulus greater than 500 MPa after hardening and a viscosity of 10 Pa.s or less before hardening. The second adhesive 12 is similar to the first adhesive 11, and has a Young's modulus greater than 500 Mpa after hardening and has a viscosity of 10 Pa.s or greater than the first adhesive 11 before hardening. Relatively hard adhesive with high viscosity. And, the third adhesive 13 is a relatively soft adhesive resin softer than the first adhesive 11 having a Young's modulus of less than 500 MPa.

用于把光纤覆盖部分2接合在阵列基片5上的第二粘合剂12被施加覆盖在从保护部件14的顶端部凸起的光纤覆盖部分2的一部分上以及安装在阵列基片5上的保护部件14上的一部分上。因此,防止在光纤1的纵向方向上的拉力直接施加在接合于V形槽7中的裸露光纤部分3上,如图1的情况所示。The second adhesive 12 for bonding the optical fiber covering portion 2 on the array substrate 5 is applied to cover a part of the optical fiber covering portion 2 protruding from the top end portion of the protective member 14 and mounted on the array substrate 5 On a part of the protection part 14. Therefore, a pulling force in the longitudinal direction of the optical fiber 1 is prevented from being directly applied to the bare optical fiber portion 3 engaged in the V-shaped groove 7, as shown in the case of FIG. 1 .

保护部件14被设置为在阵列基片5的后边缘5c上延伸,并且作为防止光纤1与阵列基片5直接接触的衬垫。并且,光纤1不容易受到阵列基片5的后边缘的破坏,或者不容易在光纤阵列4下过度弯折,减少断裂或者减小传输损耗,而不需要把阵列基片5的后边缘制作为一个平滑的表面,如图3A-3C中所示。The protective member 14 is provided to extend on the rear edge 5 c of the array substrate 5 and serves as a spacer that prevents the optical fiber 1 from coming into direct contact with the array substrate 5 . Moreover, the optical fiber 1 is not easily damaged by the rear edge of the array substrate 5, or is not easy to be excessively bent under the optical fiber array 4, so as to reduce breakage or reduce transmission loss, without making the rear edge of the array substrate 5 as A smooth surface, as shown in Figures 3A-3C.

在图5A的一个例子中,使用模子来形成保护部件15,以覆盖光纤1的光纤覆盖部分2的端部以及裸露光纤部分3的一部分。提供保护部件15以在阵列基片5的后边缘5c上延伸,防止光纤1直接与阵列基片5的后边缘5c相接触。In an example of FIG. 5A , a mold is used to form the protective member 15 to cover the end of the fiber covering portion 2 of the optical fiber 1 and a part of the bare fiber portion 3 . The protection member 15 is provided to extend over the rear edge 5c of the array substrate 5, preventing the optical fiber 1 from coming into direct contact with the rear edge 5c of the array substrate 5.

在图5B的一个例子中,使用模子来形成保护部件15,以覆盖用于光纤1的光纤覆盖部分2的端部的外围,从而光纤涂层部分的顶端从保护部件15上略微凸起(例如,大约为0.5毫米至2毫米的高度)。保护部件15在阵列基片5的后边缘5c上延伸,以防止光纤1与阵列基片5的后边缘5c直接接触。In an example of FIG. 5B, a mold is used to form the protective member 15 to cover the periphery of the end of the fiber covering portion 2 for the optical fiber 1, so that the top end of the fiber coating portion protrudes slightly from the protective member 15 (e.g. , about 0.5 mm to 2 mm in height). The protection member 15 extends on the rear edge 5c of the array substrate 5 to prevent the optical fiber 1 from being in direct contact with the rear edge 5c of the array substrate 5 .

保护部件15由例如橡胶、硅酮或尼龙这样的柔软、可弯折材料所制成。保护部件15与光纤覆盖部分2之间最好具有良好的粘性和较大的断裂伸长率。该保护部件15被形成为具有从阵列基片5的后端延伸的特定长度(例如,最好约为3毫米至5毫米)。该凸起部分15a最好为锥形,以防止弯折的应力施加在光纤上。并且,保护部件15被定位,用于通过把其顶端设置为与阵列基片5的底座部分5b上的台阶部分5d的肩部相邻而固定。The protective member 15 is made of a soft, bendable material such as rubber, silicone or nylon. Preferably, the protective member 15 and the optical fiber covering part 2 have good adhesion and a relatively large elongation at break. The protective member 15 is formed to have a certain length (for example, preferably about 3 mm to 5 mm) extending from the rear end of the array substrate 5 . The raised portion 15a is preferably tapered to prevent bending stress from being applied to the optical fiber. Also, the protection member 15 is positioned for fixation by disposing its top end adjacent to the shoulder of the step portion 5d on the base portion 5b of the array substrate 5 .

在图5A和5B的结构中,与图1的情况相类似,由V形槽7所定位的裸露光纤部分3被第一粘合剂11所接合。光纤覆盖部分2的顶端部由第二粘合剂12接合在底座部分5b上。第一和第二粘合剂之间的裸露光纤部分3由第三粘合剂所接合。第一粘合剂11是在硬化之后具有大于500Mpa的杨氏模量以及在硬化之前具有10Pa.s或更小的粘滞度的相对较硬的粘合剂。第二粘合剂12与第一粘合剂11相类似,是在硬化之后具有大于500Mpa的杨氏模量以及在硬化之前具有10Pa.s或大于第一粘合剂11的粘滞度的更大粘滞度的相对较硬的粘合剂。并且,第三粘合剂13是在具有小于500Mpa的杨氏模量的比第一粘合剂11更软的相对较软的粘合树脂。In the structures of FIGS. 5A and 5B , the bare optical fiber portion 3 positioned by the V-groove 7 is bonded by the first adhesive 11 similarly to the case of FIG. 1 . The top end portion of the optical fiber covering portion 2 is bonded to the base portion 5 b by the second adhesive 12 . The bare fiber portion 3 between the first and second adhesive is bonded by the third adhesive. The first adhesive 11 is a relatively hard adhesive having a Young's modulus greater than 500 MPa after hardening and a viscosity of 10 Pa·s or less before hardening. The second adhesive 12 is similar to the first adhesive 11, and is a higher material having a Young's modulus greater than 500Mpa after hardening and a viscosity of 10 Pa.s or greater than the first adhesive 11 before hardening. Relatively hard adhesive with high viscosity. And, the third adhesive 13 is a relatively soft adhesive resin softer than the first adhesive 11 having a Young's modulus of less than 500 MPa.

用于把光纤覆盖部分2接合在阵列基片5上的第二粘合剂12被施加覆盖安装在图5A中的阵列基片5上的保护部件15。并且,第二粘合剂12被施加覆盖从保护部件15的顶端部凸起的光纤覆盖部分2的一部分上以及安装在图5B中的阵列基片5上的保护部件15上的一部分上。因此,防止在光纤1的纵向方向上的拉力直接施加在接合于V形槽7中的裸露光纤部分3上,如图1的情况所示。The second adhesive 12 for bonding the optical fiber covering portion 2 to the array substrate 5 is applied to cover the protective member 15 mounted on the array substrate 5 in FIG. 5A. Also, the second adhesive 12 is applied to cover a portion of the fiber covering portion 2 protruding from the top end of the protective member 15 and a portion of the protective member 15 mounted on the array substrate 5 in FIG. 5B. Therefore, a pulling force in the longitudinal direction of the optical fiber 1 is prevented from being directly applied to the bare optical fiber portion 3 engaged in the V-shaped groove 7, as shown in the case of FIG. 1 .

保护部件15被设置为在阵列基片5的后边缘5c上延伸,并且作为防止光纤1与阵列基片5直接接触的衬垫。并且,光纤1不容易受到阵列基片5的后边缘的破坏,或者不容易在光纤阵列4下过度弯折,减少断裂或者减小传输损耗,而不需要把阵列基片5的后边缘制作为一个平滑的表面,如图3A-3C中所示。但是,即使当采用保护部件14或15时,阵列基片5的后边缘可以由锥状或弧状的平滑表面所形成,与图3A-3C的情况相同。从图1至图5A,示出一种光纤,但是本发明不限于光纤。即,光纤可以固定到基片上以形成本发明中的光纤阵列。The protective member 15 is provided to extend on the rear edge 5 c of the array substrate 5 and serves as a spacer that prevents the optical fiber 1 from coming into direct contact with the array substrate 5 . Moreover, the optical fiber 1 is not easily damaged by the rear edge of the array substrate 5, or is not easy to be excessively bent under the optical fiber array 4, so as to reduce breakage or reduce transmission loss, without making the rear edge of the array substrate 5 as A smooth surface, as shown in Figures 3A-3C. However, even when the protective member 14 or 15 is used, the rear edge of the array substrate 5 may be formed by a tapered or arc-shaped smooth surface, as in the case of FIGS. 3A-3C. From Figures 1 to 5A, an optical fiber is shown, but the present invention is not limited to optical fibers. That is, optical fibers can be fixed to a substrate to form an optical fiber array in the present invention.

从上文描述可以看出,利用本发明,可以在光纤阵列中包含具有不同模场直径的不同光纤的接合部分。因此,光纤容易导入光通信单元内的小空间中,从而可以使该单元小型化。并且,提供保护部件以防止光纤与光纤阵列的后边缘相接触,从而减少断裂或防止传输损耗增加。另外,采用在硬化之后的杨氏模量不同或者在硬化之前的粘滞度不同的三种粘合剂把光纤接合到光纤阵列上,从而该光纤足够坚固以对抗拉力,并且可以防止由于温度改变而造成传输损耗的增加。As can be seen from the above description, with the present invention, it is possible to include spliced portions of different optical fibers having different mode field diameters in an optical fiber array. Therefore, the optical fiber is easily introduced into a small space inside the optical communication unit, so that the unit can be miniaturized. Also, a protective member is provided to prevent the optical fiber from contacting the rear edge of the optical fiber array, thereby reducing breakage or preventing an increase in transmission loss. In addition, the optical fiber is spliced to the optical fiber array using three types of adhesives that differ in Young's modulus after hardening or in viscosity before hardening, so that the optical fiber is strong enough to resist pulling force and can prevent damage caused by temperature changes. resulting in increased transmission loss.

Claims (13)

1. fiber array comprises:
The different fiber that has different mode field diameters by joint forms an optical fiber, and this optical fiber has fibre coating part that applies fibre coating and the nuditing fiber part of removing fibre coating, the bonding part that the central authorities of this nuditing fiber part have different fiber;
Be used for installing the array substrate of optical fiber thereon, this array substrate has fiber alignment part and base part, and this fiber alignment partly has the nuditing fiber V-shaped groove partly that is used to place optical fiber;
The pressurizer parts are used for this nuditing fiber partly is pressed in the V-shaped groove of array substrate; And
First bonding agent is used for this nuditing fiber is fixed to the V-shaped groove of array substrate,
The bonding part that it is characterized in that different fiber is placed on this array substrate;
Wherein this fiber array further comprises:
Second bonding agent is used for the base part of the fibre coating partial fixing of optical fiber at array substrate; And
The 3rd bonding agent is used for covering and fixing the nuditing fiber part that does not place V-shaped groove,
Wherein first bonding agent has 500Mpa or bigger Young modulus and had 10Pa.s or littler viscosity before hardening after sclerosis, second bonding agent had the viscosity bigger than the viscosity of first bonding agent before sclerosis, and the 3rd bonding agent has the Young modulus littler than the Young modulus of first bonding agent after sclerosis.
2. fiber array according to claim 1, wherein different fiber is melted joint in the bonding part.
3. fiber array according to claim 2, wherein nuditing fiber partly has a mould field conversion portion that forms by the bonding part heating to different fiber.
4. fiber array according to claim 1, wherein this bonding part is placed on the base part of array substrate.
5. fiber array according to claim 1, wherein this bonding part is placed in the V-shaped groove.
6. fiber array according to claim 5, wherein this V-shaped groove has sunk part, and wherein this bonding part is placed in the sunk part of V-shaped groove.
7. fiber array comprises:
The different fiber that has different mode field diameters by joint forms an optical fiber, and this optical fiber has fibre coating part that applies fibre coating and the nuditing fiber part of removing fibre coating, the bonding part that the central authorities of this nuditing fiber part have different fiber;
Be used for installing the array substrate of optical fiber thereon, this array substrate has fiber alignment part and base part, and this fiber alignment partly has the nuditing fiber V-shaped groove partly that is used to place optical fiber;
The pressurizer parts are used for this nuditing fiber partly is pressed in the V-shaped groove of array substrate; And
First bonding agent is used for this nuditing fiber is fixed to the V-shaped groove of array substrate,
The bonding part that it is characterized in that different fiber is placed on this array substrate;
Wherein this array substrate has the rear end part of taper or arc.
8. fiber array comprises:
The different fiber that has different mode field diameters by joint forms an optical fiber, and this optical fiber has fibre coating part that applies fibre coating and the nuditing fiber part of removing fibre coating, the bonding part that the central authorities of this nuditing fiber part have different fiber;
Be used for installing the array substrate of optical fiber thereon, this array substrate has fiber alignment part and base part, and this fiber alignment partly has the nuditing fiber V-shaped groove partly that is used to place optical fiber;
The pressurizer parts are used for this nuditing fiber partly is pressed in the V-shaped groove of array substrate; And
First bonding agent is used for this nuditing fiber is fixed to the V-shaped groove of array substrate,
The bonding part that it is characterized in that different fiber is placed on this array substrate;
Wherein this fiber array further comprises:
Be used to protect the guard block of the optical fiber that extends in the back edge of array substrate.
9. fiber array according to claim 8, wherein this guard block has and is used for the tube shape of receiving optical fiber within it.
10. fiber array according to claim 8, wherein this guard block forms by a mould.
11. fiber array according to claim 8, wherein this guard block part of extending on array substrate is a taper.
12. fiber array according to claim 8, wherein this guard block covers the fibre coating part.
13. fiber array according to claim 8, wherein this array substrate has the step part that is used for installing guard block thereon.
CN02127749.4A 2002-02-14 2002-08-08 Optical-fiber array Expired - Fee Related CN1246713C (en)

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CA2394258A1 (en) 2003-08-14
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JP3748065B2 (en) 2006-02-22
EP1336882A3 (en) 2004-11-17
CA2394258C (en) 2006-11-21
EP1336882A2 (en) 2003-08-20
JP2003241020A (en) 2003-08-27
CN1438773A (en) 2003-08-27
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US20030152343A1 (en) 2003-08-14
DE60212562D1 (en) 2006-08-03

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