CN1246713C - Optical-fiber array - Google Patents
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 232
- 239000000835 fiber Substances 0.000 claims abstract description 144
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 239000011248 coating agent Substances 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000007767 bonding agent Substances 0.000 claims 10
- 208000034189 Sclerosis Diseases 0.000 claims 3
- 239000000853 adhesive Substances 0.000 abstract description 97
- 230000001070 adhesive effect Effects 0.000 abstract description 97
- 230000003287 optical effect Effects 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 description 33
- 230000005540 biological transmission Effects 0.000 description 9
- 239000004840 adhesive resin Substances 0.000 description 8
- 229920006223 adhesive resin Polymers 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000005253 cladding Methods 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000007526 fusion splicing Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- UNILWMWFPHPYOR-KXEYIPSPSA-M 1-[6-[2-[3-[3-[3-[2-[2-[3-[[2-[2-[[(2r)-1-[[2-[[(2r)-1-[3-[2-[2-[3-[[2-(2-amino-2-oxoethoxy)acetyl]amino]propoxy]ethoxy]ethoxy]propylamino]-3-hydroxy-1-oxopropan-2-yl]amino]-2-oxoethyl]amino]-3-[(2r)-2,3-di(hexadecanoyloxy)propyl]sulfanyl-1-oxopropan-2-yl Chemical compound O=C1C(SCCC(=O)NCCCOCCOCCOCCCNC(=O)COCC(=O)N[C@@H](CSC[C@@H](COC(=O)CCCCCCCCCCCCCCC)OC(=O)CCCCCCCCCCCCCCC)C(=O)NCC(=O)N[C@H](CO)C(=O)NCCCOCCOCCOCCCNC(=O)COCC(N)=O)CC(=O)N1CCNC(=O)CCCCCN\1C2=CC=C(S([O-])(=O)=O)C=C2CC/1=C/C=C/C=C/C1=[N+](CC)C2=CC=C(S([O-])(=O)=O)C=C2C1 UNILWMWFPHPYOR-KXEYIPSPSA-M 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3855—Details of mounting fibres in ferrules; Assembly methods; Manufacture characterised by the method of anchoring or fixing the fibre within the ferrule
- G02B6/3861—Adhesive bonding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3801—Permanent connections, i.e. wherein fibres are kept aligned by mechanical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3834—Means for centering or aligning the light guide within the ferrule
- G02B6/3838—Means for centering or aligning the light guide within the ferrule using grooves for light guides
- G02B6/3839—Means for centering or aligning the light guide within the ferrule using grooves for light guides for a plurality of light guides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3846—Details of mounting fibres in ferrules; Assembly methods; Manufacture with fibre stubs
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/255—Splicing of light guides, e.g. by fusion or bonding
- G02B6/2558—Reinforcement of splice joint
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3834—Means for centering or aligning the light guide within the ferrule
- G02B6/3838—Means for centering or aligning the light guide within the ferrule using grooves for light guides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种光纤阵列,其中一条光纤、一束光纤或者一条光纤带被附着和固定到一个阵列基片上,并且该阵列基片用于把一条光纤或一条光纤带连接到光学元件或者平面光波电路(planar light wavecircuit)(PLC)。The present invention relates to an optical fiber array, wherein an optical fiber, a bundle of optical fibers or an optical fiber ribbon is attached and fixed to an array substrate, and the array substrate is used to connect an optical fiber or an optical fiber ribbon to an optical element or a planar light wave Circuit (planar light wave circuit) (PLC).
背景技术Background technique
在一种光纤通信系统中,光纤阵列被用于把一条光纤连接到光学部件或PLC。该光纤阵列通常包括具有V形槽的阵列基片,每个V形槽用于放置一条光纤的端部,以及包括用于把该光纤的端部压在V形槽中的盖子。该光纤包括一条光纤和一条光纤带,其中多条光纤用带子或树脂整体固定在一起。该光纤阵列是通过把光纤的端部放置在V形槽中,把光纤的端部用盖子压在V形槽中,使用粘合剂把该光纤固定在阵列基片上,然后抛光曝露出该光纤的端面的阵列基片的前端部而制成的。In an optical fiber communication system, an array of optical fibers is used to connect an optical fiber to an optical component or PLC. The optical fiber array generally includes an array substrate having V-shaped grooves, each V-shaped groove for receiving an end of an optical fiber, and a cap for pressing the end of the optical fiber into the V-shaped groove. The optical fiber includes an optical fiber and an optical fiber ribbon, wherein a plurality of optical fibers are integrally fixed together with a ribbon or resin. The optical fiber array is made by placing the end of the optical fiber in the V-shaped groove, pressing the end of the optical fiber into the V-shaped groove with a cover, using an adhesive to fix the optical fiber on the array substrate, and then polishing to expose the optical fiber. made of the front end of the array substrate.
在最近几年,光纤需要连接到具有与标准的单模光纤不同的模场直径(mode field diameter)(比ITU-T标准尺寸更小的模场直径)的PLC。在这种情况中,具有较小的模场直径的光纤被用于与PLC相连接,以及具有标准的模场直径的光纤被用于与光缆侧相连接。在用于与PLC相连接的光纤阵列中,具有较小的模场直径的光纤在具有标准模场直径的光纤的顶端处熔化接合,这造成较大的接合损耗。In recent years, an optical fiber needs to be connected to a PLC having a different mode field diameter (mode field diameter smaller than the ITU-T standard size) from a standard single-mode optical fiber. In this case, an optical fiber with a smaller mode field diameter is used to connect to the PLC, and an optical fiber with a standard mode field diameter is used to connect to the cable side. In an optical fiber array for connection with a PLC, an optical fiber with a small mode field diameter is fusion-spliced at the tip of an optical fiber with a standard mode field diameter, which causes a large splice loss.
在接合多个不同模场直径的非标准光纤和标准单模光纤时,难以仅仅通过通常的熔化接合技术获得实用的接合损耗。通常,一种已有的方法是把光纤熔化接合并且把光纤的接合部分进行额外的加热(热膨胀芯线,在下文中称为TEC或TEC处理)以减小接合损耗(例如,参见JP2618500和JP-A-2000-275470)。通过这种额外的加热,添加到光纤的芯部的掺杂剂被热扩散到光纤的包层部,使得该模场直径局部扩大。因此,该光纤的模场直径在接合部相互一致。When splicing a number of non-standard fibers with different mode field diameters and standard single-mode fibers, it is difficult to obtain practical splice loss only by the usual fusion splicing technique. Generally, an existing method is to melt and splice the optical fiber and additionally heat the spliced portion of the optical fiber (thermal expansion core, hereinafter referred to as TEC or TEC treatment) to reduce the splicing loss (for example, see JP2618500 and JP- A-2000-275470). By this additional heating, the dopant added to the core of the fiber is thermally diffused into the cladding of the fiber, so that the mode field diameter is locally enlarged. Therefore, the mode field diameters of the optical fibers coincide with each other at the junction.
发明内容Contents of the invention
本发明的一个目的是提供一种光纤阵列,其能够减小尺寸,可以防止当光纤被弯曲或被施加拉力时断裂,并且可以防止由于温度改变而造成传输损耗的增加。An object of the present invention is to provide an optical fiber array that can be reduced in size, can prevent breakage when the optical fiber is bent or is applied with tension, and can prevent an increase in transmission loss due to temperature change.
根据本发明,在此提供一种光纤阵列,包括:通过接合具有不同模场直径的不同光纤形成一条光纤,该光纤具有施加光纤涂层的光纤涂层部分以及除去光纤涂层的裸露光纤部分,该裸露光纤部分的中央具有不同光纤的接合部分;用于在其上安装光纤的阵列基片,该阵列基片具有光纤对齐部分和基座部分,该光纤对齐部分具有用于放置光纤的裸露光纤部分的V形槽;加压器部件,用于把该裸露光纤部分压在阵列基片的V形槽上;以及第一粘合剂,用于把该裸露光纤部分固定到阵列基片的V形槽上,其特征在于不同光纤的接合部分被置于该阵列基片上;其中该光纤阵列进一步包括:第二粘合剂,用于把光纤的光纤涂层部分固定在阵列基片的基座部分上;以及第三粘合剂,用于覆盖和固定没有置于V形槽中的裸露光纤部分,其中第一粘合剂在硬化之后具有500Mpa或更大的杨氏模量以及在硬化之前具有10Pa.s或更小的粘滞度,第二粘合剂在硬化之前具有比第一粘合剂的粘滞度更大的粘滞度,以及第三粘合剂在硬化之后具有比第一粘合剂的杨氏模量更小的杨氏模量。最好,一个柔软保护部件被提供在光纤涂层部分,其在阵列基片的后边沿上延伸。另外,该光纤可以用三种粘合剂接合到阵列基片上,这些粘合剂在硬化之后的杨氏模量和硬化之前的粘滞性互不相同。According to the present invention, there is provided an optical fiber array comprising: forming an optical fiber by splicing different optical fibers having different mode field diameters, the optical fiber having a fiber coating portion to which a fiber coating is applied and a bare fiber portion from which the fiber coating is removed, The center of the bare fiber portion has a splicing portion of different fibers; an array substrate for mounting fibers thereon, the array substrate has a fiber alignment portion and a base portion, the fiber alignment portion has a bare fiber for placing the fiber The V-shaped groove of part; Presser part, is used for this bare optical fiber part is pressed on the V-shaped groove of array substrate; And first adhesive, is used for this bare optical fiber part is fixed to the V-shaped groove of array substrate. On the shape groove, it is characterized in that the bonding part of different optical fibers is placed on the array substrate; wherein the optical fiber array further includes: a second adhesive, used to fix the optical fiber coating part of the optical fiber on the base of the array substrate and a third adhesive for covering and fixing the bare optical fiber portion not placed in the V-groove, wherein the first adhesive has a Young's modulus of 500Mpa or more after hardening and before hardening Having a viscosity of 10 Pa.s or less, the second adhesive has a viscosity greater than that of the first adhesive before hardening, and the third adhesive has a higher viscosity than the first adhesive after hardening The Young's modulus of an adhesive is smaller than the Young's modulus. Preferably, a flexible protective member is provided on the optical fiber coating portion extending over the rear edge of the array substrate. In addition, the optical fiber can be bonded to the array substrate with three types of adhesives that differ from each other in Young's modulus after hardening and viscosity before hardening.
本发明还提供一种光纤阵列,包括:通过接合具有不同模场直径的不同光纤形成一条光纤,该光纤具有施加光纤涂层的光纤涂层部分以及除去光纤涂层的裸露光纤部分,该裸露光纤部分的中央具有不同光纤的接合部分;用于在其上安装光纤的阵列基片,该阵列基片具有光纤对齐部分和基座部分,该光纤对齐部分具有用于放置光纤的裸露光纤部分的V形槽;加压器部件,用于把该裸露光纤部分压在阵列基片的V形槽上;以及第一粘合剂,用于把该裸露光纤部分固定到阵列基片的V形槽上,其特征在于不同光纤的接合部分被置于该阵列基片上;其中该阵列基片具有锥形或弧形的后端部分。The present invention also provides an optical fiber array, comprising: forming an optical fiber by splicing different optical fibers having different mode field diameters, the optical fiber has an optical fiber coating portion to which the optical fiber coating is applied and a bare optical fiber portion from which the optical fiber coating is removed, the bare optical fiber The center of the part has a splicing portion of different optical fibers; an array substrate for mounting optical fibers thereon, the array substrate has a fiber alignment portion and a base portion, the fiber alignment portion has a V for placing the bare fiber portion of the optical fiber Shaped groove; Presser part, is used for this bare optical fiber part is pressed on the V-shaped groove of array substrate; And first adhesive, is used for this bare optical fiber part is fixed on the V-shaped groove of array substrate , which is characterized in that splicing portions of different optical fibers are placed on the array substrate; wherein the array substrate has a tapered or arc-shaped rear end portion.
本发明还提供一种光纤阵列,包括:通过接合具有不同模场直径的不同光纤形成一条光纤,该光纤具有施加光纤涂层的光纤涂层部分以及除去光纤涂层的裸露光纤部分,该裸露光纤部分的中央具有不同光纤的接合部分;用于在其上安装光纤的阵列基片,该阵列基片具有光纤对齐部分和基座部分,该光纤对齐部分具有用于放置光纤的裸露光纤部分的V形槽;加压器部件,用于把该裸露光纤部分压在阵列基片的V形槽上;以及第一粘合剂,用于把该裸露光纤部分固定到阵列基片的V形槽上,其特征在于不同光纤的接合部分被置于该阵列基片上;其中该光纤阵列进一步包括:用于保护在阵列基片的后边缘延伸的光纤的保护部件。The present invention also provides an optical fiber array, comprising: forming an optical fiber by splicing different optical fibers having different mode field diameters, the optical fiber has an optical fiber coating portion to which the optical fiber coating is applied and a bare optical fiber portion from which the optical fiber coating is removed, the bare optical fiber The center of the part has a splicing portion of different optical fibers; an array substrate for mounting optical fibers thereon, the array substrate has a fiber alignment portion and a base portion, the fiber alignment portion has a V for placing the bare fiber portion of the optical fiber Shaped groove; Presser part, is used for this bare optical fiber part is pressed on the V-shaped groove of array substrate; And first adhesive, is used for this bare optical fiber part is fixed on the V-shaped groove of array substrate , characterized in that splicing parts of different optical fibers are placed on the array substrate; wherein the optical fiber array further includes: a protective component for protecting the optical fibers extending at the rear edge of the array substrate.
图6为示出用于使用结合TEC光纤技术和光纤阵列技术的光纤阵列接合具有不同模场直径的PLC和标准单模光纤的一个例子的示意图。在图6中,参考标号1、1a和1b表示光纤,2表示光纤涂层部分,3表示裸露光纤部分,4表示光纤阵列,5表示阵列基片,6表示加压器部件,7表示V形槽,8和9表示粘合剂,10表示接合部分,以及16表示加强部件。6 is a schematic diagram showing an example for splicing PLC and standard single-mode fibers with different mode field diameters using a fiber array combining TEC fiber technology and fiber array technology. In Fig. 6,
光纤1具有较小模场直径的光纤1b和较大模场直径的光纤1a(标准单模光纤)。光纤1b被熔化接合在光纤1a的顶端部。光纤1a、1b的接合部分10被增强部件16所保护。为了减小接合损耗,接合部分10受到TEC处理,这涉及在熔化接合之后进行额外的加热。光纤1b使用粘合剂接合到阵列基片5。接合部分10被增强部分16所保护,并且置于光纤阵列4的外部。The
被熔化接合的接合部分10的增强部件16需要具有与光学元件的外部形状相同大小的尺寸,以及具有用于引导该光纤的相对较大的空间。因此,一个问题是由于该增强部件16的存在使得该光纤通信单元难以小型化,并且不容易装卸。The reinforcing
光纤阵列4包括阵列基片5和加压器部件6。阵列基片5包括在前部具有V形槽7的光纤对齐部分5a以及在其后部的底座部分5b。在把粘合剂8施加到光纤对齐部分5a的V形槽7上之后,在除去光纤涂层的裸露光纤部分3的前端部,把光纤1b插入到V形槽7,通过加压器部件6加压到位,通过粘合剂8进行粘合。The
在V形槽中的一部分粘合剂8流出到底座部分5b,并且覆盖从V形槽的后端凸起的裸露光纤部分3的后端部。另外,一部分粘合剂8在光纤覆盖部分2与底座部分5b之间流动,以在底座部分5b上接合裸露光纤部分3的后端部与光纤涂层部分2的前端部。另外,为了限制光纤1b在光纤阵列的后端自由移动,使用比粘合剂8更软的一种粘合剂把光纤覆盖部分2接合到底座部分5b的后端部。A portion of the
通过上述光纤阵列的结构,光纤1与阵列基片5的后边缘5c相接触。因此,光纤1可能由于在阵列基片5的后边缘5c处被弯折而造成断开,或者由于温度改变而造成接合损耗的增加。With the structure of the optical fiber array described above, the
但是,由于阵列基片5由例如硅、硼硅酸玻璃、氧化锆或陶瓷这样的各种晶片所制成,因此通过精确地研磨例如切割而形成锥形表面。在该研磨中,使用专用的精确刀片并且需要较高的工作精度。目前已知一种用于通过研磨形成锥形表面的方法,但是这需要相当多的工作时间和人力。另外,可以考虑通过注模形成锥形表面的方法,但是其存在一个问题是由于该阵列基片的材料使得注模困难。However, since the
并且还已知,如果在接合光纤1时采用具有相对较大的杨氏模量的硬粘合树脂作为涂在整个裸露光纤部分3上的粘合剂8,这增加在低温下光纤的传输损耗。因此,考虑到粘合树脂在低温下收缩,从而光纤被粘合树脂的热收缩而拉到阵列基片的上表面上。另外,施加在光纤覆盖部分2上的粘合剂9是比粘合剂8更软的一种粘合树脂。由于粘合剂8很少施加在光纤覆盖部分2的部分上,因此拉力被施加在抵抗拉力较弱的除去光纤涂层的裸露光纤部分3上。因此,当把拉力沿着纵向方向施加在光纤1上或者光纤被在后端弯折时,光纤1容易在裸露光纤部分3处断裂。And it is also known that if a hard adhesive resin having a relatively large Young's modulus is used as the
并且,如果具有相对较小的杨氏模量的软的粘合树脂被采用作为涂在裸露光纤部分3上的粘合剂8,则即使把粘合剂9施加在光纤涂层部分上,光纤整体上对拉力的抵抗力较弱。也就是说,在通过一种或两种粘合树脂把光纤1粘合到光纤阵列4的结构中,如图6中所示难以避免由于温度改变而造成传输损耗的增加,以及难以满足在特定张力下的要求。And, if a soft adhesive resin having a relatively small Young's modulus is adopted as the adhesive 8 coated on the bare
附图说明Description of drawings
图1为用于说明根据本发明的一个实施例的一种光纤阵列的示意图;FIG. 1 is a schematic diagram illustrating an optical fiber array according to an embodiment of the present invention;
图2A-2C为用于说明本发明中所用的接合具有不同模场直径的光纤的形式的示意图;2A-2C are schematic diagrams illustrating forms of splicing optical fibers with different mode field diameters used in the present invention;
图3A-3C为示出通过熔化而形成的光纤接合部具有一个膨胀部分的一个例子的示意图;3A-3C are schematic diagrams showing an example in which an optical fiber splice formed by melting has an expanded portion;
图4为示出在本发明中所用的管状保护部件的一个例子的示意图;FIG. 4 is a schematic view showing an example of a tubular protective member used in the present invention;
图5A和5B为示出在本发明中所用的模制保护部件的一个例子的示意图;以及5A and 5B are schematic diagrams showing an example of a molded protection member used in the present invention; and
图6为用于说明现有的光纤阵列的结构的示意图。FIG. 6 is a schematic diagram for explaining the structure of a conventional optical fiber array.
具体实施方式Detailed ways
现在参照图1和2A-2C描述本发明的优选实施例。图1示出本发明的光纤阵列的一个基本实施例。图2A-2C示出用于接合具有不同的模场直径的光纤的各种形式。在这些图中,参考标号1表示光纤,2表示光纤涂层部分,3表示裸露光纤部分,3a和3b表示裸露光纤,4表示光纤阵列,5表示阵列基片,5a表示光纤对齐部分,5b表示基座部分,6表示加压器部件,7表示V形槽,10表示接合部分,10a表示膨胀部分,11表示第一粘合剂,12表示第二粘合剂,13表示第三粘合剂,20a和20b表示包层部分,21a和21b表示芯线部分,以及22a和22b表示模场转换部分。A preferred embodiment of the present invention will now be described with reference to Figures 1 and 2A-2C. Figure 1 shows a basic embodiment of an optical fiber array of the present invention. 2A-2C illustrate various forms for splicing optical fibers having different mode field diameters. In these figures,
如图1中所示的光纤阵列4的形状与图6中所示的相类似。但是,光纤阵列4包括阵列基片5和加压器部件6。阵列基片5包括在其前部的光纤对齐部分5a以及在其后部的具有平坦向上表面的基座部分5b。光纤对齐部分5a具有V形槽7,用于放置除去光纤涂层的裸露光纤部分3。The shape of the
在阵列基片5上的裸露光纤部分3具有除去光纤涂层的裸露光纤,以及与裸露光纤3a不同种类的裸露光纤3b,如图2A-2C所示。裸露光纤3b接合到裸露光纤3a的顶端部。裸露光纤3a例如是一种标准单模光纤,并且具有包层部分20a和芯线部分21a。芯线部分21a的模场直径大约为10微米。裸露光纤3b例如是具有高密度添加在芯线部分21b中的掺杂剂的一种非标准光纤,并且具有包围芯线部分21b的包层部分20b。芯线部分21b的模场直径大约为5微米。The
裸露光纤3a和裸露光纤3b之间的接合部10通过把裸露光纤3a与裸露光纤3b实际相接而形成,或者通过熔化该裸露光纤3a和3b而形成。为了防止由于在接合部处的模场直径不同而造成接合损耗,通过额外加热使该接合部10受到TEC处理。通过TEC处理,在裸露光纤3a、3b的芯线部分21a、21b中的掺杂剂被热扩散到包层部分20a、20b,以形成模场转换部分22a、22b,从而使得这两个模场直径相一致或接近相等。The
图2A示出裸露光纤3a和3b相邻并接合的情况。在这种情况中,裸露光纤3b的中间部分预先受到TEC处理,然后TEC部分的中部被清理和/或抛光,从而使裸露光纤3b的接合端与裸露光纤3a的模场直径相一致。图2B和2C示出裸露光纤3a和裸露光纤3b被熔化接合的情况,并且在熔化接合之后通过额外的加热使该接合部10受到TEC处理。TEC处理在日本专利No.2618500中公开。在熔化接合中,存在一种情况,其中接合部10的外径没有裸露光纤外径那样的膨胀部分,如图2B中所示。还存在一种情况,其中接合部10的外径具有裸露光纤外径的膨胀部分10a,如图2C中所示。Fig. 2A shows a situation where bare
回到图1,下面将描述用于把光纤1接合到阵列基片5上的结构。在图1中,光纤1的裸露光纤部分3具有裸露光纤3a和裸露光纤3b,其中接合部没有膨胀部分,如图2A或2B中所示。在本例中,裸露光纤部分3安装在光纤对齐部分5a上,从而接合部10被置于阵列基片5的V形槽7中,并且被加压器部件6所压住和定位。接合部10被接合在V形槽7中,由粘合剂所增强和保护。光纤覆盖部分2的顶端部安装在阵列基片5的底座部分5B上,并且V形槽7和光纤覆盖部分2的后端之间的裸露光纤部分悬置在阵列基片5上。接合部10不被加压器部件6压在V形槽中。Referring back to Fig. 1, the structure for splicing the
由V形槽7和加压器部件6所定位的裸露光纤部分3被第一粘合剂11所粘合。光纤覆盖部分2的顶端部分被第二粘合剂12接合在底座部分5b上。在第一和第二粘合剂之间的裸露光纤部分3被第三粘合剂13所接合。第一粘合剂11是在硬化之后具有500Mpa(兆帕)或更大的杨氏模量以及在硬化之前具有10Pa.s(帕.秒)或更小的粘滞度的相对较硬的粘合剂。第二粘合剂12与第一粘合剂11相类似,是在硬化之后具有500Mpa或更大的杨氏模量以及在硬化之前具有大于10Pa.s的粘滞度的相对较硬的粘合剂。并且,第三粘合剂13是在硬化之后具有小于500Mpa的杨氏模量的比第一粘合剂11更软的相对较软的粘合树脂。The
第一粘合剂11具有相对较小的粘滞度,从而裸露光纤部分3容易在V形槽中对齐并且可以由加压器部件6正确定位,它将连接到PLC。由于它在变硬之后的杨氏模量较大,因此裸露光纤部分3可以被粘合剂固牢地接合。如果第二粘合剂12具有太小的粘滞度,则当把它施加在光纤覆盖部分2的上端部时会流走,因此它具有比要牢固施加在光纤覆盖部分2上的第一粘合剂11更大的粘滞度。由于它在变硬之后的杨氏模量大于第一粘合剂11,因此光纤覆盖部分2的顶端部分可以牢固地接合到阵列基片5的后端部分。The
相应地,在由第一粘合剂11接合裸露光纤部分3过程中,可以避免应力集中在光纤覆盖部分2的粘合部分上,以对抗在光纤1的纵向方向上的拉力。并且,在由第二粘合剂12接合光纤覆盖部分2过程中,光纤1的移动受到限制,并且没有应力集中在裸露光纤部分3的粘合部分上。因此第一粘合剂11和第二粘合剂12可以提供足够的承受力,足以对抗在光纤1的纵向方向上的拉力。Accordingly, during the bonding of the
第三粘合剂13被施加在第一粘合剂和第二粘合剂之间的裸露光纤部分3上,以保护和接合该裸露光纤部分,但是它具有比第一和第二粘合剂更小的杨氏模量。相应地,在较低温度下,第三粘合剂13的热收缩减小,在裸露光纤部分3中造成较小的变形,并且防止传输损耗的增加。A
图3A至3C为示出图2C中所示的膨胀部分10a出现在裸露光纤3a和裸露光纤3b的接合部分上的示意图。在图3A至3B中,与图1中相同或类似的部件由相同的标号所表示,并且不进行描述。3A to 3C are schematic diagrams showing that the swollen portion 10a shown in FIG. 2C appears on the joint portion of the bare optical fiber 3a and the bare
在图3A的例子中,接合部分10悬置在V形槽7外部的基座5b上,被施加有第三粘合剂13,并且接合基座部分5b上。裸露光纤3b仅仅安装在V形槽7中被第一粘合剂11所定位和接合。接合部分10被更软的第三粘合剂13所保护和增强。In the example of FIG. 3A , the engaging
在图3B的例子中,阵列基片5具有形成在V形槽7的中部的凹陷部分7a。接合部分10被置于凹陷部分7a中。凹陷部分7a的上部不被加压器部件6所压住。接合部分10的两侧被支承在V形槽中。接合部分10被第三粘合剂13所保护和增强。与图3A的例子相反,在本例中,接合部分10在V形槽中保持得更直,并且由粘合剂粘合的更牢固。In the example of FIG. 3B, the
在图3C的例子中,阵列基片5具有形成在V形槽7的中部的凹陷部分7a。加压器部件6具有凹陷部分6a,其形成在加压器部件6上与凹陷部分7a相对的位置处。因此,接合部分10被置于凹陷部分6a和7a之间的间隙中。接合部分10被凹陷部分6a和7a支承在该间隙中,由施加在V形槽7中的第一粘合剂11所保护和增强。与图3A和3B的例子相反,在本例中,接合部分10被V形槽7和加压器部件6定位在两侧上,并且被第一粘合剂11所接合,具有较大的抵抗拉力的强度。In the example of FIG. 3C, the
如图3A至3C的例子所示,阵列基片5的后边缘部分可以形成为锥形或弧形的平滑表面5e(由虚线所表示),改善光纤1与阵列基片5的后边缘之间的接触状态。因此,光纤1不容易受到阵列基片5后边缘的破坏,或者不容易在光纤阵列4下过度弯折,减少断裂或防止传输损耗增加。无论是否悬置在基座5a上和/或由粘合剂所增强,最好不把该接合点与底座部分相接触,因为该接合点通常在拉伸强度上较弱。3A to 3C example shown, the rear edge portion of the
图4和5A-5B为示出通过使用保护部件来增强光纤与阵列基片的后边缘的接触的例子的示意图。图4示出采用管子作为保护部件的一个例子。图5A示出通过对光纤涂层部分和裸露光纤部分注模而形成保护部件的一个例子。图5B示出通过对光纤涂层部分注模而形成保护部件的一个例子。在这些图中,参考标号14和15表示保护部件。其它部件由与图1中所用相同的参考标号所表示,并且不进行描述。4 and 5A-5B are diagrams showing examples of enhancing the contact of optical fibers with the rear edge of the array substrate by using a protective member. Fig. 4 shows an example of using a pipe as a protective member. FIG. 5A shows an example of forming a protective member by injection molding a coated portion of an optical fiber and a portion of a bare optical fiber. FIG. 5B shows an example of forming a protective member by injection molding a coating portion of an optical fiber. In these figures,
与图3A中所示相同,在图4和5A-5B中,裸露光纤3a和裸露光纤3b之间的接合部分10被悬置在V形槽7后方的基座部分5b上,被第三粘合剂13所覆盖,并且由粘合剂13固定在基座部分5b上。但是,如图1、3B和3C中所示的结构或形式也可以应用于本实施例。Same as shown in FIG. 3A, in FIGS. 4 and 5A-5B, the
在图4中,管状保护部件14被提供在阵列基片5的后边缘5c上延伸的光纤涂层部分上,从而防止光纤1直接与阵列基片5的后边缘5c相接触。形成管状保护部分14,然后插入光纤1,由粘合剂固定到光纤覆盖部分2上,并且安装在阵列基片5上。但是,该处理可以反向:在把管状保护部件14通过粘合剂固定在阵列基片5的后端部分之后,然后可以通过保护部件14的管子插入该光纤。In FIG. 4 , a tubular protective member 14 is provided on the fiber coating portion extending on the rear edge 5 c of the
管状保护部件14由例如橡胶、硅酮或者尼龙这样的聚合物的柔软、可弯折材料所形成。保护部件14与光纤覆盖部分2的顶端相距微小的距离(例如,大约0.5毫米至2.0毫米),从而不被保护部件14所覆盖的光纤覆盖部分2可以附着到阵列基片5上。保护部分14具有从阵列基片5的后端延伸的一定长度(例如,最好为3毫米至5毫米)。该保护部件14被放置用于通过把其顶端置于与阵列基片5的基底部分5b上的台阶部分5d的肩部相邻而固定。The tubular protective member 14 is formed of a soft, bendable material such as a polymer such as rubber, silicone or nylon. The protective member 14 is spaced a slight distance (for example, about 0.5 mm to 2.0 mm) from the top of the
通过施加粘合剂而填充保护部件14和光纤覆盖部分2之间的部分或整个间隙部分而把保护部件14与光纤1整体接合。该粘合剂可以与第二粘合剂相同或不同。保护部件14可以分别附加到每个光纤上或者整体附加到所有光纤上,或者附加到光纤带上。The protective member 14 is integrally bonded to the
在图4的结构中,与图1的情况相类似,由V形槽7所定位的裸露光纤部分3被第一粘合剂11所固定。光纤覆盖部分2的上端部由第二粘合剂12固定到基座部分5b上。第一和第二粘合剂之间的裸露光纤部分3由第三粘合剂13所固定。第一粘合剂11是在硬化之后具有大于500Mpa的杨氏模量以及在硬化之前具有10Pa.s或更小的粘滞度的相对较硬的粘合剂。第二粘合剂12与第一粘合剂11相类似,是在硬化之后具有大于500Mpa的杨氏模量以及在硬化之前具有10Pa.s或大于第一粘合剂11的粘滞度的更大粘滞度的相对较硬的粘合剂。并且,第三粘合剂13是在具有小于500Mpa的杨氏模量的比第一粘合剂11更软的相对较软的粘合树脂。In the structure of FIG. 4 , the bare
用于把光纤覆盖部分2接合在阵列基片5上的第二粘合剂12被施加覆盖在从保护部件14的顶端部凸起的光纤覆盖部分2的一部分上以及安装在阵列基片5上的保护部件14上的一部分上。因此,防止在光纤1的纵向方向上的拉力直接施加在接合于V形槽7中的裸露光纤部分3上,如图1的情况所示。The
保护部件14被设置为在阵列基片5的后边缘5c上延伸,并且作为防止光纤1与阵列基片5直接接触的衬垫。并且,光纤1不容易受到阵列基片5的后边缘的破坏,或者不容易在光纤阵列4下过度弯折,减少断裂或者减小传输损耗,而不需要把阵列基片5的后边缘制作为一个平滑的表面,如图3A-3C中所示。The protective member 14 is provided to extend on the rear edge 5 c of the
在图5A的一个例子中,使用模子来形成保护部件15,以覆盖光纤1的光纤覆盖部分2的端部以及裸露光纤部分3的一部分。提供保护部件15以在阵列基片5的后边缘5c上延伸,防止光纤1直接与阵列基片5的后边缘5c相接触。In an example of FIG. 5A , a mold is used to form the
在图5B的一个例子中,使用模子来形成保护部件15,以覆盖用于光纤1的光纤覆盖部分2的端部的外围,从而光纤涂层部分的顶端从保护部件15上略微凸起(例如,大约为0.5毫米至2毫米的高度)。保护部件15在阵列基片5的后边缘5c上延伸,以防止光纤1与阵列基片5的后边缘5c直接接触。In an example of FIG. 5B, a mold is used to form the
保护部件15由例如橡胶、硅酮或尼龙这样的柔软、可弯折材料所制成。保护部件15与光纤覆盖部分2之间最好具有良好的粘性和较大的断裂伸长率。该保护部件15被形成为具有从阵列基片5的后端延伸的特定长度(例如,最好约为3毫米至5毫米)。该凸起部分15a最好为锥形,以防止弯折的应力施加在光纤上。并且,保护部件15被定位,用于通过把其顶端设置为与阵列基片5的底座部分5b上的台阶部分5d的肩部相邻而固定。The
在图5A和5B的结构中,与图1的情况相类似,由V形槽7所定位的裸露光纤部分3被第一粘合剂11所接合。光纤覆盖部分2的顶端部由第二粘合剂12接合在底座部分5b上。第一和第二粘合剂之间的裸露光纤部分3由第三粘合剂所接合。第一粘合剂11是在硬化之后具有大于500Mpa的杨氏模量以及在硬化之前具有10Pa.s或更小的粘滞度的相对较硬的粘合剂。第二粘合剂12与第一粘合剂11相类似,是在硬化之后具有大于500Mpa的杨氏模量以及在硬化之前具有10Pa.s或大于第一粘合剂11的粘滞度的更大粘滞度的相对较硬的粘合剂。并且,第三粘合剂13是在具有小于500Mpa的杨氏模量的比第一粘合剂11更软的相对较软的粘合树脂。In the structures of FIGS. 5A and 5B , the bare
用于把光纤覆盖部分2接合在阵列基片5上的第二粘合剂12被施加覆盖安装在图5A中的阵列基片5上的保护部件15。并且,第二粘合剂12被施加覆盖从保护部件15的顶端部凸起的光纤覆盖部分2的一部分上以及安装在图5B中的阵列基片5上的保护部件15上的一部分上。因此,防止在光纤1的纵向方向上的拉力直接施加在接合于V形槽7中的裸露光纤部分3上,如图1的情况所示。The
保护部件15被设置为在阵列基片5的后边缘5c上延伸,并且作为防止光纤1与阵列基片5直接接触的衬垫。并且,光纤1不容易受到阵列基片5的后边缘的破坏,或者不容易在光纤阵列4下过度弯折,减少断裂或者减小传输损耗,而不需要把阵列基片5的后边缘制作为一个平滑的表面,如图3A-3C中所示。但是,即使当采用保护部件14或15时,阵列基片5的后边缘可以由锥状或弧状的平滑表面所形成,与图3A-3C的情况相同。从图1至图5A,示出一种光纤,但是本发明不限于光纤。即,光纤可以固定到基片上以形成本发明中的光纤阵列。The
从上文描述可以看出,利用本发明,可以在光纤阵列中包含具有不同模场直径的不同光纤的接合部分。因此,光纤容易导入光通信单元内的小空间中,从而可以使该单元小型化。并且,提供保护部件以防止光纤与光纤阵列的后边缘相接触,从而减少断裂或防止传输损耗增加。另外,采用在硬化之后的杨氏模量不同或者在硬化之前的粘滞度不同的三种粘合剂把光纤接合到光纤阵列上,从而该光纤足够坚固以对抗拉力,并且可以防止由于温度改变而造成传输损耗的增加。As can be seen from the above description, with the present invention, it is possible to include spliced portions of different optical fibers having different mode field diameters in an optical fiber array. Therefore, the optical fiber is easily introduced into a small space inside the optical communication unit, so that the unit can be miniaturized. Also, a protective member is provided to prevent the optical fiber from contacting the rear edge of the optical fiber array, thereby reducing breakage or preventing an increase in transmission loss. In addition, the optical fiber is spliced to the optical fiber array using three types of adhesives that differ in Young's modulus after hardening or in viscosity before hardening, so that the optical fiber is strong enough to resist pulling force and can prevent damage caused by temperature changes. resulting in increased transmission loss.
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JP2002036753A JP3748065B2 (en) | 2002-02-14 | 2002-02-14 | Optical fiber array |
JP036753/2002 | 2002-02-14 |
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US (1) | US7021842B2 (en) |
EP (1) | EP1336882B1 (en) |
JP (1) | JP3748065B2 (en) |
CN (1) | CN1246713C (en) |
CA (1) | CA2394258C (en) |
DE (1) | DE60212562D1 (en) |
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-
2002
- 2002-02-14 JP JP2002036753A patent/JP3748065B2/en not_active Expired - Fee Related
- 2002-07-19 CA CA002394258A patent/CA2394258C/en not_active Expired - Fee Related
- 2002-08-08 CN CN02127749.4A patent/CN1246713C/en not_active Expired - Fee Related
- 2002-08-09 DE DE60212562T patent/DE60212562D1/en not_active Expired - Lifetime
- 2002-08-09 EP EP02017769A patent/EP1336882B1/en not_active Expired - Lifetime
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Publication number | Publication date |
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CA2394258A1 (en) | 2003-08-14 |
EP1336882B1 (en) | 2006-06-21 |
JP3748065B2 (en) | 2006-02-22 |
EP1336882A3 (en) | 2004-11-17 |
CA2394258C (en) | 2006-11-21 |
EP1336882A2 (en) | 2003-08-20 |
JP2003241020A (en) | 2003-08-27 |
CN1438773A (en) | 2003-08-27 |
US7021842B2 (en) | 2006-04-04 |
US20030152343A1 (en) | 2003-08-14 |
DE60212562D1 (en) | 2006-08-03 |
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